CN210838441U - Heat dissipation device applied to semiconductor laser - Google Patents
Heat dissipation device applied to semiconductor laser Download PDFInfo
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- CN210838441U CN210838441U CN201922056432.5U CN201922056432U CN210838441U CN 210838441 U CN210838441 U CN 210838441U CN 201922056432 U CN201922056432 U CN 201922056432U CN 210838441 U CN210838441 U CN 210838441U
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Abstract
The utility model discloses a heat dissipation device applied to a semiconductor laser, which belongs to the technical field of laser heat dissipation and comprises a radiator cover, a laser module, M refrigerating sheets, heat conduction components, heat dissipation substrates, N heat dissipation fins and fans, wherein the number of the heat conduction components is the same as that of the M refrigerating sheets, and the radiator cover is provided with an air inlet, an air outlet and a hollow part; the laser module is arranged in the hollow part; the M refrigerating pieces are arranged in the hollow part, each refrigerating piece is provided with a refrigerating end and a heating end, and each refrigerating piece is connected with the laser module through the refrigerating end; the heat conduction component is arranged in the hollow part, and one end of each heat conduction component is connected with the heating end; the heat dissipation substrate is connected with the other end of each heat conduction component; the N radiating fins are connected with the radiating substrate and arranged at the air inlet; the fan is arranged at the air outlet. The utility model discloses the improvement radiating effect has been reached, the technological effect of being convenient for maintain.
Description
Technical Field
The utility model belongs to the technical field of the laser instrument heat dissipation, in particular to be applied to heat abstractor of semiconductor laser.
Background
The service life and the power of the semiconductor laser module are closely related to the temperature of a chip in the laser, and when the laser module works at high temperature for a long time, the service life of the laser is exponentially reduced; meanwhile, the output power of the laser module is also obviously reduced, and the power is unstable, so that how to well solve the heat dissipation of the semiconductor laser is of great significance for improving the performance of the laser.
In the existing technology applied to heat dissipation of semiconductor lasers, the heat dissipation modes of a laser module mainly include air cooling heat dissipation and water cooling heat dissipation, the air cooling heat dissipation is realized by forcibly cooling a radiator through a fan, but the heat dissipation effect of the air cooling heat dissipation mode is poor, and the heat dissipation requirement of a low-power laser can only be met. The water cooling heat dissipation adopts a micro-channel heat sink liquid cooling circulation mode, and achieves the purpose of temperature control by controlling the flow rate of circulating water in a heat sink pipeline. However, the water-cooling heat dissipation has the disadvantages of large volume, low temperature control precision and inconvenient later maintenance.
In summary, the existing technology applied to heat dissipation of semiconductor lasers has the technical problems of poor heat dissipation effect and inconvenient maintenance.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that there is the radiating effect poor in the radiating technique of semiconductor laser, and it is not convenient to maintain.
In order to solve the technical problem, the utility model provides a be applied to heat abstractor of semiconductor laser, wherein, semiconductor laser includes the laser module, the device includes: the radiator cover is provided with an air inlet, an air outlet and a hollow part, and the laser module is arranged in the hollow part; the M refrigerating pieces are arranged in the hollow part, each refrigerating piece is provided with a refrigerating end and a heating end, and each refrigerating piece is connected with the laser module through the refrigerating end so as to transfer heat of the laser module to the heating end through the refrigerating end; m is a positive integer; the number of the heat conducting components is the same as that of the M refrigerating fins, the heat conducting components are arranged in the hollow part, and one end of each heat conducting component is connected with the heating end; a heat dissipating substrate connected to the other end of each of the heat conductive members to transfer heat to the heat dissipating substrate through the heat conductive member, the heat dissipating substrate being disposed in the hollow portion; the N radiating fins are connected with the radiating substrate to absorb heat of the radiating substrate, and the radiating fins are arranged at the air inlet; the N is a positive integer; and the fan is arranged at the air outlet so as to form an exhaust channel for radiating the radiating fins.
Further, the heat conductive member includes: one end of each heat pipe is connected with the corresponding heating end, and the other end of each heat pipe is connected with the heat dissipation substrate.
Furthermore, the other ends of the plurality of heat pipes are uniformly distributed on the heat dissipation substrate.
Further, the heat-dissipating substrate includes: the number of the installation grooves is the same as that of the other ends of the plurality of heat pipes, and the other end of each heat pipe is arranged in the corresponding installation groove.
Furthermore, a refrigerating fluid is arranged in the heat pipe.
Further, each of the refrigeration sheets connected with the laser module through the refrigeration end comprises: each refrigeration piece with be provided with heat conduction silicone grease between the laser module, each refrigeration piece passes through heat conduction silicone grease with the laser module is laminated mutually.
Furthermore, the air outlet surface of the fan deviates from the direction of the air inlet so as to discharge the heat of the radiating fins from the air outlet.
Furthermore, each heat dissipation fin is parallel to the air outlet surface of the fan.
Furthermore, the N radiating fins are arranged on the same plane, and any two radiating fins are parallel to each other.
Further, the laser module is located between the heat dissipation fins and the fan.
Has the advantages that:
the utility model provides a be applied to semiconductor laser's heat abstractor, through with the laser module setting inside the well kenozooecium of radiator guard. M refrigeration pieces set up in the inside of well kenozooecium, the refrigeration end and the laser module of each refrigeration piece are connected to the heat of transmission laser module is to the heating end of refrigeration piece. One end of each heat conducting member is connected to the heating end, and the other end of each heat conducting member is connected to the heat dissipating substrate to transfer heat to the heat dissipating substrate through the heat conducting member, and the heat dissipating substrate and the heat conducting member are disposed inside the hollow portion of the radiator cover. Meanwhile, the N radiating fins are connected with the radiating substrate to absorb the heat of the radiating substrate, the radiating fins are arranged at the air inlet of the radiator cover, and the fan is arranged at the air outlet of the radiator cover to form an exhaust channel for radiating the radiating fins. When opening the fan like this, outside colder gas gets into from the air intake department of radiator cover, flows through and discharges from the air outlet behind the heat radiation fin, has then improved and has carried out radiating effect to semiconductor laser, the maintenance of being convenient for. Thereby the technical effects of improving the heat dissipation effect and facilitating the maintenance are achieved.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an overall structure schematic diagram of a heat dissipation device applied to a semiconductor laser according to an embodiment of the present invention.
Detailed Description
The utility model discloses a be applied to heat abstractor of semiconductor laser, through setting up laser module 200 inside well kenozooecium 130 of radiator cover 100. The M refrigerating fins 300 are disposed inside the hollow portion 130, and the refrigerating end of each refrigerating fin 300 is connected to the laser module 200 to transfer heat of the laser module 200 to the heating end of the refrigerating fin 300. One end of each heat conduction member 400 is connected to the heating end, and the other end of each heat conduction member 400 is connected to the heat dissipation substrate 500 to transfer heat to the heat dissipation substrate 500 through the heat conduction member 400, and the heat dissipation substrate 500 and the heat conduction member 400 are disposed inside the hollow portion 130 of the radiator cover 100. Meanwhile, the N heat dissipation fins 600 are connected to the heat dissipation substrate 500 to absorb heat of the heat dissipation substrate 500, the heat dissipation fins 600 are disposed at the air inlet 110 of the heat sink cover 100, and the fan 700 is disposed at the air outlet 120 of the heat sink cover 100 to form an exhaust channel for dissipating heat of the heat dissipation fins 600. Thus, when the fan 700 is turned on, the external cold air enters from the air inlet 110 of the radiator cover 100, flows through the heat dissipation fins 600 and then is discharged from the air outlet 120, so that the heat dissipation effect of the semiconductor laser is improved, and the maintenance is facilitated. Thereby the technical effects of improving the heat dissipation effect and facilitating the maintenance are achieved.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art belong to the protection scope of the present invention; the "and/or" keyword "referred to in this embodiment represents sum or two cases, in other words, a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, representing: only A does not include B; only B does not include A; including A and B.
Also, in embodiments of the invention, when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.
Referring to fig. 1, an embodiment of the present invention provides a heat dissipation device applied to a semiconductor laser, where the heat dissipation device applied to the semiconductor laser includes: the radiator cover 100, the laser module 200, the M cooling fins 300, the heat conducting members 400, the heat radiating substrates 500, the N heat radiating fins 600, and the fan 700, which are the same as the M cooling fins 300 in number, are now described in detail with reference to the radiator cover 100, the laser module 200, the M cooling fins 300, the heat conducting members 400, the heat radiating substrates 500, the N heat radiating fins 600, and the fan 700, which are the same as the M cooling fins 300 in number, respectively:
for the radiator cover 100:
the radiator cover 100 is provided with an intake vent 110, an outlet vent 120, and a hollow portion 130.
Specifically, the hollow portion 130 of the radiator cover 100 has a space for accommodating the laser module 200, the M cooling fins 300, the heat conductive member 400, the heat sink substrate 500, and the heat sink fins 600, which will be described below. The inlet vent 110 and the outlet vent 120 of the radiator cover 100 are oppositely disposed at both ends of the hollow portion 130. It will be understood by those skilled in the art that, in the embodiment of the present invention, the shape of the radiator cover 100 is not limited, and the radiator cover 100 may be a rectangular parallelepiped or a square. It is only necessary to realize the shape of the radiator cover 100 that can include the following laser module 200, the M cooling fins 300, the heat conductive member 400, the heat dissipation substrate 500, and the heat dissipation fins 600. In the present invention, the shape of the radiator cover 100 is preferably a concave rectangular parallelepiped, that is, in six faces of the rectangular parallelepiped, as shown in fig. 1, the left side face is the air inlet 110, the right side face is the air outlet 120, the front side face, the rear side face and the lower side face form a concave groove, the upper side face corresponding to the lower side face is an opening, and the shape of the upper side face is matched with the following heat dissipation substrate 500, that is, a passage from the air inlet 110 to the air outlet 120 is formed in the radiator cover 100 by hermetically connecting the following heat dissipation substrate 500 and the upper side face. The gas can enter the interior of the hollow portion 130 from the inlet opening 110 of the radiator cover 100 and then be discharged from the interior of the hollow portion 130 through the outlet opening 120, or the gas can enter the interior of the hollow portion 130 from the outlet opening 120 of the radiator cover 100 and then be discharged from the interior of the hollow portion 130 through the inlet opening 110. It can be understood by those skilled in the art that, in the embodiment of the present invention, the shape of the air inlet 110 and the air outlet 120 is not limited, the air inlet 110 may be square, circular, etc., and only the following heat dissipation fins 600 are required to be disposed at the air inlet 110, the air can pass through the surface of the heat dissipation fins 600, the air outlet 120 may also be square, circular, etc., only the following fan 700 is required to be disposed at the air outlet 120, and the air can pass through the fan 700. When the following laser module 200, M cooling fins 300, heat conducting member 400, heat dissipating substrate 500, and heat dissipating fins 600 have a failure, the following laser module 200, M cooling fins 300, heat conducting member 400, heat dissipating substrate 500, and heat dissipating fins 600 can be repaired or replaced by removing the radiator cover 100, thereby facilitating maintenance.
For the laser module 200:
the laser module 200 is disposed in the hollow portion 130. Wherein the laser module 200 is located between the heat dissipation fins 600 and the fan 700 described below.
Specifically, the laser module 200 is disposed inside the hollow portion 130 of the radiator cover 100, and the laser module 200 generates a large amount of heat during operation. The type and size of the laser module 200 are not limited, and the laser module 200 may be a laser module that is available in the prior art according to the actual working requirement, and only needs to be able to place the laser module 200 inside the hollow portion 130 of the radiator cover 100. If the volume of the laser module 200 is small, the volume of the heat sink cover 100 can be reduced. If the laser module 200 has a large volume, the heat sink cover 100 may have a large volume. By disposing the laser module 200 between the heat dissipating fins 600 and the fan 700, the gas flowing in from the heat dissipating fins 600 at the air inlet 110 can dissipate the heat of the laser module 200, and the gas flowing through the laser module 200 is exhausted from the fan 700 at the air outlet 120. This facilitates heat dissipation from the laser module 200.
For M refrigeration fins 300:
the M refrigeration pieces 300 are arranged in the hollow part 130, each refrigeration piece 300 is provided with a refrigeration end and a heating end, and each refrigeration piece 300 is connected with the laser module 200 through the refrigeration end so as to transfer heat of the laser module 200 to the heating end through the refrigeration end; and M is a positive integer. Wherein, each of the refrigeration sheets 300 connected with the laser module 200 through the refrigeration end includes: each refrigeration piece 300 with be provided with heat conduction silicone grease between the laser module 200, each refrigeration piece 300 passes through heat conduction silicone grease with the laser module 200 laminates to each other.
Specifically, the M refrigeration fins 300 may be 1 refrigeration fin 300, 2 refrigeration fins 300, 3 refrigeration fins 300, 4 refrigeration fins 300, 5 refrigeration fins 300, and the like. The quantity of refrigeration piece 300 is confirmed according to the area size of the face of generating heat of laser module 200, the area of the face of generating heat of laser module 200 is when great, can improve the radiating effect through the quantity that increases refrigeration piece 300, for example when the face of generating heat of laser module 200 is great, with 4 refrigeration pieces 300 the refrigeration end inseparable on the face of generating heat of laser module 200, come to all paste refrigeration piece 300 with the face of generating heat of laser module 200, 4 refrigeration pieces 300's refrigeration end absorbs the heat of the face of generating heat of laser module 200 simultaneously, can dispel the heat to laser module 200 very fast. When the heating surface of the laser module 200 is small, the refrigerating end of 1 refrigerating plate 300 is closely attached to the heating surface of the laser module 200, the heat of the heating surface of the laser module 200 is absorbed through the refrigerating end of 1 refrigerating plate 300, and the laser module 200 can be quickly cooled. The heat-conducting silicone grease is prepared by adding materials with excellent heat resistance and heat-conducting property into organic silicone serving as a main raw material, and is used for heat conduction and heat dissipation of electronic components such as a power amplifier, a transistor, an electronic tube, a CPU and the like, so that the stability of the electrical properties of electronic instruments, meters and the like is ensured. The refrigerating end of the refrigerating plate 300 and the heating surface of the laser module 200 are tightly attached by adopting heat-conducting silicone grease, the refrigerating plate 300 can refrigerate the heating surface of the laser module 200 at the refrigerating end after being electrified, then heat generated in refrigeration is transferred to the heating end from the refrigerating end of the refrigerating plate 300, as the heating end of the refrigerating plate 300 is connected with a heat-radiating substrate 500 described below, the heating end of the refrigerating plate 300 is connected with a heat pipe 410 in a heat-conducting component 400 described below, the heat pipe 410 is connected with the heat-radiating substrate 500, after heat is transferred to the heating end from the refrigerating end of the refrigerating plate 300, the heat in the heating end of the refrigerating plate 300 is absorbed by the heat-radiating substrate 500, and then the heat in the laser module 200 is transferred to the heat-radiating substrate 500.
For a number of heat-conducting members 400 equal to the number of M of said cooling fins 300:
the heat conduction members 400 are the same as the number of the M cooling fins 300, the heat conduction members 400 are disposed in the hollow portion 130, and one end of each heat conduction member 400 is connected to the heating end. Wherein the heat conductive member 400 includes: one end of each of the heat pipes 410 is connected to the corresponding heating end, and the other end of each of the heat pipes 410 is connected to the heat dissipation substrate 500. The other ends of the plurality of heat pipes 410 are uniformly distributed on the heat-dissipating substrate 500. The number of the installation grooves 510 is the same as that of the other ends of the plurality of heat pipes 410, and the other end of each heat pipe 410 is disposed in the corresponding installation groove 510. A refrigerant fluid 4101 is disposed in the heat pipe 410.
Specifically, the number of the heat-conducting members 400 corresponds to the number of the refrigeration sheets 300, for example, when the number of the refrigeration sheets 300 is 2, the number of the heat-conducting members 400 is 2, and 2 heat-conducting members 400 are respectively disposed on 2 refrigeration sheets 300, that is, 1 heat-conducting member 400 is disposed on 1 refrigeration sheet 300. Each heat conducting member 400 includes a plurality of heat pipes 410, and the plurality of heat pipes 410 means 1 heat pipe 410, 2 heat pipes 410, 3 heat pipes 410, 4 heat pipes 410, and the like. For example, 3 heat pipes 410 are respectively disposed on 2 refrigeration fins 300, that is, 3 heat pipes 410 are disposed on one refrigeration fin 300, one end of each of the 3 heat pipes 410 is connected to the refrigeration fin 300, and the other end of each of the 3 heat pipes 410 is connected to a heat dissipation substrate 500, and then heat in the refrigeration fin 300 is transferred from one end of each of the heat pipes 410 to the other end thereof, and then transferred to the heat dissipation substrate 500. Another cooling plate 300 is also provided with 3 heat pipes 410, one end of each of the 3 heat pipes 410 is connected to the cooling plate 300, and the other end of each of the 3 heat pipes 410 is connected to a heat dissipation substrate 500, so that heat in the cooling plate 300 is transferred from one end of each of the heat pipes 410 to the other end thereof, and then transferred to the heat dissipation substrate 500. For example, the refrigerant fluid 4101 in the heat pipe 410 absorbs heat and is gasified near one end of the cooling plate 300, the gas is liquefied while flowing to one end near the heat dissipation substrate 500, and the liquefied refrigerant fluid 4101 flows to one end near the cooling plate 300, so that the heat is transferred from one end of the heat pipe 410 to the other end.
It should be noted that the other end of the heat pipe 410 and the heat dissipation substrate 500 described below are tightly connected together by using a heat conductive silicone grease. The heat-conducting silicone grease is prepared by adding materials with excellent heat resistance and heat-conducting property into organic silicone serving as a main raw material, and is used for heat conduction and heat dissipation of electronic components such as a power amplifier, a transistor, an electronic tube, a CPU and the like, so that the stability of the electrical properties of electronic instruments, meters and the like is ensured. The other ends of the plurality of heat pipes 410 are uniformly distributed on the following heat dissipation substrate 500, that is, the other ends of the plurality of heat pipes 410 are distributed on the following heat dissipation substrate 500 at equal intervals, the intervals between the other ends of two adjacent heat pipes 410 are equal, and the other ends of the plurality of heat pipes 410 are uniformly distributed on the following heat dissipation substrate 500, so that the heat in the other ends of the plurality of heat pipes 410 is uniformly transferred to the heat dissipation substrate 500, thereby achieving the technical effects of realizing uniform heat dissipation and improving the heat dissipation efficiency.
For the heat-dissipating substrate 500:
a heat dissipating substrate 500 is connected to the other end of each of the heat conductive members 400 to transfer heat to the heat dissipating substrate 500 through the heat conductive members 400, and the heat dissipating substrate 500 is disposed inside the hollow portion 130.
Specifically, the heat dissipation substrate 500 and the other ends of the plurality of heat pipes 410 are closely connected together by the heat conductive silicone grease to absorb heat in the plurality of heat pipes 410. The heat sink substrate 500 is disposed inside the hollow portion 130 of the heat sink cover 100 and located at an upper side of the heat sink substrate 500, and the heat sink substrate 500 is closely connected to the N heat sink fins 600 to transfer heat in the heat sink substrate 500 to the N heat sink fins 600, and then to discharge the heat to the air through the N heat sink fins 600. The other ends of the plurality of heat pipes 410 may be embedded in the heat dissipation substrate 500, for example, semicircular grooves are formed at the other ends of the plurality of heat pipes 410 and the heat dissipation substrate 500, and the semicircular grooves milled at the embedded heat pipes 410 can sufficiently contact the other ends of the plurality of heat pipes 410 with the heat dissipation substrate 500, so that heat at the other ends of the plurality of heat pipes 410 can be rapidly transferred to the heat dissipation substrate 500. The heat pipe 410 can be embedded in the semicircular groove of the heat dissipation substrate, and after the heat pipe is tightly attached to the inner surface of the semicircular groove of the heat dissipation substrate through brazing, the surface of the heat dissipation substrate embedded with the heat pipe 410 is milled flat by a high-speed plane milling machine. The shape of the semicircular groove is matched with the shape of the plurality of heat pipes 410, so that the other ends of the plurality of heat pipes 410 and the heat dissipation fins 600 can be tightly attached to each other. The number of the semicircular grooves may be the same as the number of the heat pipes 410, and the semicircular grooves are uniformly distributed on the heat dissipation substrate, so that after the plurality of heat pipes 410 are embedded into the semicircular grooves, the plurality of heat pipes 410 can be uniformly distributed on the heat dissipation substrate.
For N cooling fins 600:
the N heat dissipation fins 600 are connected to the heat dissipation substrate 500 to absorb heat of the heat dissipation substrate 500, and the heat dissipation fins 600 are disposed at the air inlet 110. Wherein N is a positive integer; the N heat dissipation fins 600 are disposed on the same plane, and any two heat dissipation fins 600 are parallel to each other.
Specifically, the heat sink 600 is attached to the heat-generating surface by a metal with good thermal conductivity, light weight and easy processing, and dissipates heat in a complex heat exchange mode. After the heat sink substrate 500 and each of the heat sink fins 600 contact each other, the heat in the heat sink substrate 500 can be transferred to the heat sink fins 600. The N heat dissipation fins 600 refer to 1 heat dissipation fin 600, 2 heat dissipation fins 600, 3 heat dissipation fins 600, 4 heat dissipation fins 600, 5 heat dissipation fins 600, and the like. The number of the heat dissipation fins 600 and the heat dissipation requirement are determined, for example, when the heat generated in the laser module 200 is large, the number of the heat dissipation fins 600 may also be increased to improve the heat dissipation effect. By fixedly mounting the radiator fins 600 at the inlet opening 110 of the radiator cover 100, the plurality of radiator fins 600 are parallel to each other at the inlet opening 110 and are located in the same plane. When the air enters from the air inlet 110, the plurality of heat dissipation fins 600 have the largest heat dissipation area, and the plurality of heat dissipation fins 600 are in contact with the air in time, so that the heat dissipation effect is improved.
For the fan 700:
the fan 700 is disposed at the air outlet 120 to form an exhaust passage for dissipating heat of the heat dissipation fins 600. The air outlet surface 710 of the fan 700 faces away from the air inlet 110, so as to exhaust the heat of the heat dissipation fin 600 from the air outlet 120. Each of the heat dissipation fins 600 is parallel to the air outlet surface 710 of the fan 700.
Specifically, the number of the fans 700 may be several, and the number of the fans 700 means 1 fan 700, 2 fans 700, 3 fans 700, and the like. The number of the fans 700 is determined according to the heat dissipation requirement, for example, when the heat generated in the laser module 200 is larger, the number of the fans 700 is increased, so as to achieve faster heat dissipation. The fan 700 is fixedly disposed at the air outlet 120 of the heat sink cover 100, and the air outlet surface 710 of the fan 700 is a direction of air flowing through the fan 700. By making each of the heat dissipating fins 600 parallel to the air outlet surface 710 of the fan 700, the air can reach the air outlet surface 710 of the fan 700 through the shortest path after flowing through the heat dissipating fins 600, and then the heat absorbed by the heat dissipating fins 600 is exhausted from the air outlet surface 710 of the fan 700. Therefore, the quick heat dissipation can be realized, and the heat dissipation effect is improved.
It should be noted that the direction of the air flowing through the radiator fins 600 may be toward the fan 700 or away from the fan 700. Assuming that when the blades of the fan 700 rotate clockwise, air enters from the inlet 110 and is discharged from the outlet 120, and when the blades of the fan 700 rotate counterclockwise, air enters from the outlet 120 and is discharged from the inlet 110. When the blades in the fan 700 rotate clockwise, the air firstly flows through the heat dissipation fins 600, absorbs heat in the heat dissipation fins 600 to cool the heat dissipation fins 600, and then flows through the laser module 200, the M cooling fins 300 and the heat conducting member 400 to be discharged from the air outlet 120; when the blades of the fan 700 rotate counterclockwise, the air flows through the air outlet 120, then flows through the laser module 200, the M cooling fins 300, and the heat conducting member 400, and is discharged from the absorption heat dissipation fins 600 located at the air inlet 110. The utility model discloses preferably gaseous from getting into from air outlet 120, discharge from air intake 110, fan 700 is to outer convulsions promptly. This can further improve the heat dissipation effect.
The utility model provides a be applied to heat abstractor of semiconductor laser, through setting up laser module 200 inside well kenozooecium 130 of radiator cover 100. The M refrigerating fins 300 are disposed inside the hollow portion 130, and the refrigerating end of each refrigerating fin 300 is connected to the laser module 200 to transfer heat of the laser module 200 to the heating end of the refrigerating fin 300. One end of each heat conduction member 400 is connected to the heating end, and the other end of each heat conduction member 400 is connected to the heat dissipation substrate 500 to transfer heat to the heat dissipation substrate 500 through the heat conduction member 400, and the heat dissipation substrate 500 and the heat conduction member 400 are disposed inside the hollow portion 130 of the radiator cover 100. Meanwhile, the N heat dissipation fins 600 are connected to the heat dissipation substrate 500 to absorb heat of the heat dissipation substrate 500, the heat dissipation fins 600 are disposed at the air inlet 110 of the heat sink cover 100, and the fan 700 is disposed at the air outlet 120 of the heat sink cover 100 to form an exhaust channel for dissipating heat of the heat dissipation fins 600. Thus, when the fan 700 is turned on, the external cold air enters from the air inlet 110 of the radiator cover 100, flows through the heat dissipation fins 600 and then is discharged from the air outlet 120, so that the heat dissipation effect of the semiconductor laser is improved, and the maintenance is facilitated. Thereby the technical effects of improving the heat dissipation effect and facilitating the maintenance are achieved.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (10)
1. A heat abstractor for semiconductor laser, wherein, semiconductor laser includes the laser module, its characterized in that, the device includes:
the radiator cover is provided with an air inlet, an air outlet and a hollow part, and the laser module is arranged in the hollow part;
the M refrigerating pieces are arranged in the hollow part, each refrigerating piece is provided with a refrigerating end and a heating end, and each refrigerating piece is connected with the laser module through the refrigerating end so as to transfer heat of the laser module to the heating end through the refrigerating end; m is a positive integer;
the number of the heat conducting components is the same as that of the M refrigerating fins, the heat conducting components are arranged in the hollow part, and one end of each heat conducting component is connected with the heating end;
a heat dissipating substrate connected to the other end of each of the heat conductive members to transfer heat to the heat dissipating substrate through the heat conductive member, the heat dissipating substrate being disposed in the hollow portion;
the N radiating fins are connected with the radiating substrate to absorb heat of the radiating substrate, and the radiating fins are arranged at the air inlet; the N is a positive integer;
and the fan is arranged at the air outlet so as to form an exhaust channel for radiating the radiating fins.
2. The heat dissipating device applied to a semiconductor laser as claimed in claim 1, wherein the heat conducting member comprises:
one end of each heat pipe is connected with the corresponding heating end, and the other end of each heat pipe is connected with the heat dissipation substrate.
3. The heat dissipating device as claimed in claim 2 applied to a semiconductor laser, wherein:
the other ends of the plurality of heat pipes are uniformly distributed on the heat dissipation substrate.
4. The heat dissipating device applied to a semiconductor laser as claimed in claim 3, wherein the heat dissipating substrate comprises:
the number of the installation grooves is the same as that of the other ends of the plurality of heat pipes, and the other end of each heat pipe is arranged in the corresponding installation groove.
5. The heat dissipating device as claimed in claim 4 applied to a semiconductor laser, wherein:
and a refrigerating fluid is arranged in the heat pipe.
6. The heat dissipating device as claimed in claim 1 applied to a semiconductor laser, wherein:
each refrigeration piece with be provided with heat conduction silicone grease between the laser module, each refrigeration piece passes through heat conduction silicone grease with the laser module is laminated mutually.
7. The heat dissipating device as claimed in claim 6 applied to a semiconductor laser, wherein:
the air outlet surface of the fan deviates from the direction of the air inlet so as to discharge the heat of the radiating fins from the air outlet.
8. The heat dissipating device applied to a semiconductor laser as claimed in claim 7, wherein:
each radiating fin is parallel to the air outlet surface of the fan.
9. The heat dissipating device for a semiconductor laser as claimed in claim 8, wherein:
the N radiating fins are arranged on the same plane, and any two radiating fins are parallel to each other.
10. The heat dissipating device applied to a semiconductor laser as claimed in claim 9, wherein:
the laser module is located between the heat dissipation fins and the fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922056432.5U CN210838441U (en) | 2019-11-25 | 2019-11-25 | Heat dissipation device applied to semiconductor laser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922056432.5U CN210838441U (en) | 2019-11-25 | 2019-11-25 | Heat dissipation device applied to semiconductor laser |
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| CN210838441U true CN210838441U (en) | 2020-06-23 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112652946A (en) * | 2020-12-25 | 2021-04-13 | 浙江热刺激光技术有限公司 | Heat dissipation system and air-cooled semiconductor laser |
| CN115183194A (en) * | 2022-08-05 | 2022-10-14 | 北京中星讯达科技有限公司 | A high-power laser lighting device and design method |
-
2019
- 2019-11-25 CN CN201922056432.5U patent/CN210838441U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112652946A (en) * | 2020-12-25 | 2021-04-13 | 浙江热刺激光技术有限公司 | Heat dissipation system and air-cooled semiconductor laser |
| CN115183194A (en) * | 2022-08-05 | 2022-10-14 | 北京中星讯达科技有限公司 | A high-power laser lighting device and design method |
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