US20110192572A1 - Heat exchanger - Google Patents

Heat exchanger Download PDF

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Publication number
US20110192572A1
US20110192572A1 US12/700,894 US70089410A US2011192572A1 US 20110192572 A1 US20110192572 A1 US 20110192572A1 US 70089410 A US70089410 A US 70089410A US 2011192572 A1 US2011192572 A1 US 2011192572A1
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US
United States
Prior art keywords
heat sink
section
heat
radiating fins
contact section
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Abandoned
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US12/700,894
Inventor
Ching-Hsien Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asia Vital Components Co Ltd
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US12/700,894 priority Critical patent/US20110192572A1/en
Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TSAI, CHING-HSIEN
Publication of US20110192572A1 publication Critical patent/US20110192572A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates generally to a heat exchanger, and more particularly to a heat exchanger including cooling chips and a water-cooling unit combined with the cooling chips.
  • the water-cooling unit is able to greatly enhance heat dissipation efficiency of the heat exchanger.
  • heat is transferred in three manners, that is, conduction, convection and radiation.
  • conduction heat is transferred from a high-temperature place to a low-temperature place via a medium.
  • convection after heated, the density of a fluid such as air or water will change to cause circulation of the fluid.
  • radiation heat can be transferred by way of radiation without any medium.
  • Convection is the most efficient heat transfer manner to a fluid.
  • a heat sink is used to directly contact a heat source and a fan is connected to the heat sink.
  • the fan serves to guide airflow to cool the heat sink by way of forced convection.
  • the existent heat exchanger is equipped with cooling chips for enhancing heat dissipation efficiency.
  • Each cooling chip has a hot face and a cold face. The cold face is attached to a heat source for cooling the same.
  • FIGS. 1 and 2 respectively are a perspective exploded view and a perspective assembled view of a conventional heat exchanger 8 .
  • the heat exchanger 8 includes a first heat sink 81 , a second heat sink 82 , a first fan 83 , a second fan 84 and multiple cooling chips 85 .
  • the first heat sink 81 has a first contact face 811
  • the second heat sink 82 has a second contact face 821 .
  • Each cooling chip 85 has a cold face 851 and a hot face 852 respectively attaching to the first and second contact faces 811 , 821 .
  • the first and second fans 83 , 84 are respectively disposed under the first heat sink 81 and on the second heat sink 82 .
  • the first and second fans 83 , 84 serve to guide airflow 9 into the first and second heat sinks 81 , 82 .
  • the airflow 9 will flow through the first and second heat sinks 81 , 82 to be exhausted.
  • the cooling chips 85 serve to cool one of the first and second heat sinks 81 , 82 , whereby when the airflow 9 is exhausted, the airflow 9 will have a lower temperature than when it enters the heat sinks 81 , 82 .
  • only one side of the cooling chip 85 is the cold face 851 . Therefore, the cooling chips 85 can only cool one of the first and second heat sinks 81 , 82 . As a result, the heat exchange efficiency is limited.
  • a primary object of the present invention is to provide a heat exchanger with enhanced heat dissipation efficiency.
  • the heat exchanger of the present invention includes a first heat sink, a second heat sink and a water-cooling unit.
  • the first heat sink has a first contact section and multiple radiating fins. At least one cooling chip is attached to the first contact section. At least one first fan is disposed on the radiating fins.
  • the second heat sink has multiple radiating fins and a second contact section. A second fan is positioned on the radiating fins and connected thereto.
  • the second contact section is attached to a face of the cooling chip opposite to the first heat sink.
  • the water-cooling unit has a water tank section and a pipe section having a first end and a second end, which are connected to the water tank section. The pipe section is inlaid in the first contact section and the water tank section is disposed on the radiating fins of the second heat sink.
  • the water-cooling unit serves to cool the heat exchanger to enhance the cooling effect and heat exchange efficiency of the heat exchanger.
  • FIG. 1 is a perspective assembled view of a conventional heat exchanger
  • FIG. 2 is a perspective exploded view of the conventional heat exchanger
  • FIG. 3 is a perspective exploded view of a preferred embodiment of the heat exchanger of the present invention.
  • FIG. 4 is a perspective assembled view of the preferred embodiment of the heat exchanger of the present invention.
  • FIG. 5 is a perspective view showing the operation of the preferred embodiment of the heat exchanger of the present invention.
  • FIG. 6 is a sectional view showing the operation of the preferred embodiment of the heat exchanger of the present invention.
  • FIGS. 3 and 4 are a perspective exploded view and a perspective assembled view of a preferred embodiment of the heat exchanger of the present invention respectively.
  • the heat exchanger of the present invention includes a first heat sink 1 , a second heat sink 2 and a water-cooling unit 3 .
  • the first heat sink 1 has a first contact section 11 and multiple radiating fins 12 . At least one cooling chip 4 is attached to the first contact section 11 . At least one first fan 5 is disposed on the radiating fins 12 .
  • the radiating fins 12 extend from one side of the first contact section 11 in a direction away from the first contact section 11 .
  • the second heat sink 2 has multiple radiating fins 21 and a second contact section 22 .
  • a second fan 6 is positioned on upper side of the radiating fins 21 and connected thereto.
  • the second contact section 22 is attached to the other face of the cooling chip 4 opposite to the first heat sink 1 .
  • the radiating fins 21 extend from one side of the second contact section 22 in a direction away from the second contact section 22 .
  • the cooling chip 4 has a hot face 41 and a cold face 42 .
  • the hot face 41 is attached to the second contact section 22 of the second heat sink 2
  • the cold face 42 is attached to the first contact section 11 of the first heat sink 1 .
  • the water-cooling unit 3 has a water tank section 31 and a pipe section 32 .
  • the pipe section 32 has a first end 321 and a second end 322 , which are connected to the water tank section 31 .
  • the pipe section 32 is inlaid in the first contact section 11 of the first heat sink 1 .
  • the water tank section 31 is disposed on the upper side of the radiating fins 21 of the second heat sink 2 .
  • the water tank section 31 has a chamber 311 and a pump 312 (as shown in FIG. 6 ).
  • the pump 312 is disposed in the chamber 311 .
  • a heat dissipation fluid 7 is contained in the chamber 311 .
  • the pipe section 32 communicates with the chamber 311 .
  • One of the first and second ends 321 , 322 is connected to the pump 312 . Accordingly, the heat dissipation fluid 7 (as shown in FIG. 6 ) can be pumped and output by the pump 312 for performing a thermal cycle.
  • the first contact section 11 of the first heat sink 1 is formed with at least one groove 111 for receiving the pipe section 32 therein.
  • the pipe section 32 contacts the cold face 42 of the cooling chip 4 .
  • the pipe section 32 further has a heat absorption portion 323 between the first and second ends 321 , 322 of the pipe section 32 .
  • the heat absorption section 323 serves to absorb and carry away the heat of the first heat sink 1 to cool the same.
  • FIGS. 5 and 6 respectively are a perspective view and a sectional view showing the operation of the preferred embodiment of the present invention.
  • the first fan 5 serves to forcedly guide airflow 51 into the first heat sink 1 .
  • the first contact section 11 of the first heat sink 1 contacts the cold face 42 of the cooling chip 4 , whereby the cold face 42 of the cooling chip 4 serves to cool the first contact section 11 .
  • the airflow 51 forcedly guided by the first fan 5 will flow through the first sink 1 to be cooled. After cooled, the airflow 51 is exhausted from the first heat sink 1 to complete a heat exchange cycle.
  • the second contact section 22 of the second heat sink 2 contacts the hot face 41 of the cooling chip 4 .
  • the heat of the hot face 41 is dissipated via the second heat sink 2 .
  • the second fan 6 disposed on the second heat sink 2 serves to dissipate the heat of the second heat sink 2 and lower the temperature of the hot face 41 of the cooling chip 4 .
  • the heat absorption portion 323 of the pipe section 32 of the water-cooling unit 3 disposed on the second heat sink 2 extends through the first contact section 11 of the first heat sink 1 .
  • the heat dissipation fluid 7 is contained in the pipe section 32 .
  • the heat dissipation fluid 7 flows from the first end 321 of the pipe section 32 into the pump 312 .
  • the heat dissipation fluid 7 is pumped by the pump 312 to flow toward the heat absorption portion 323 of the pipe section 32 .
  • the heat dissipation fluid 7 flows through the second end 322 of the pipe section 32 back into the water-cooling unit 3 .
  • the water-cooling unit 3 serves to cool the first and second heat sinks 1 and 2 .
  • the present invention has better heat dissipation effect.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat exchanger including a first heat sink, a second heat sink and a water-cooling unit. The first heat sink has a first contact section and multiple radiating fins. At least one cooling chip is attached to the first contact section. At least one first fan is disposed on the radiating fins. The second heat sink has multiple radiating fins and a second contact section. A second fan is positioned on the radiating fins and connected thereto. The second contact section is attached to a face of the cooling chip opposite to the first heat sink. The water-cooling unit has a water tank section and a pipe section having a first end and a second end, which are connected to the water tank section. The pipe section is inlaid in the first contact section and the water tank section is disposed on the radiating fins of the second heat sink.

Description

    FIELD OF THE INVENTION
  • The present invention relates generally to a heat exchanger, and more particularly to a heat exchanger including cooling chips and a water-cooling unit combined with the cooling chips. The water-cooling unit is able to greatly enhance heat dissipation efficiency of the heat exchanger.
    • BACKGROUND OF THE INVENTION
  • It is known that heat is transferred in three manners, that is, conduction, convection and radiation. With respect to the conduction, heat is transferred from a high-temperature place to a low-temperature place via a medium. With respect to the convection, after heated, the density of a fluid such as air or water will change to cause circulation of the fluid. With respect to radiation, heat can be transferred by way of radiation without any medium.
  • Convection is the most efficient heat transfer manner to a fluid. Traditionally, a heat sink is used to directly contact a heat source and a fan is connected to the heat sink. The fan serves to guide airflow to cool the heat sink by way of forced convection.
  • The existent heat exchanger is equipped with cooling chips for enhancing heat dissipation efficiency. Each cooling chip has a hot face and a cold face. The cold face is attached to a heat source for cooling the same.
  • Please refer to FIGS. 1 and 2, which respectively are a perspective exploded view and a perspective assembled view of a conventional heat exchanger 8. The heat exchanger 8 includes a first heat sink 81, a second heat sink 82, a first fan 83, a second fan 84 and multiple cooling chips 85. The first heat sink 81 has a first contact face 811, while the second heat sink 82 has a second contact face 821. Each cooling chip 85 has a cold face 851 and a hot face 852 respectively attaching to the first and second contact faces 811, 821. The first and second fans 83, 84 are respectively disposed under the first heat sink 81 and on the second heat sink 82. The first and second fans 83, 84 serve to guide airflow 9 into the first and second heat sinks 81, 82. The airflow 9 will flow through the first and second heat sinks 81, 82 to be exhausted. The cooling chips 85 serve to cool one of the first and second heat sinks 81, 82, whereby when the airflow 9 is exhausted, the airflow 9 will have a lower temperature than when it enters the heat sinks 81, 82. However, only one side of the cooling chip 85 is the cold face 851. Therefore, the cooling chips 85 can only cool one of the first and second heat sinks 81, 82. As a result, the heat exchange efficiency is limited.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a heat exchanger with enhanced heat dissipation efficiency.
  • To achieve the above and other objects, the heat exchanger of the present invention includes a first heat sink, a second heat sink and a water-cooling unit. The first heat sink has a first contact section and multiple radiating fins. At least one cooling chip is attached to the first contact section. At least one first fan is disposed on the radiating fins. The second heat sink has multiple radiating fins and a second contact section. A second fan is positioned on the radiating fins and connected thereto. The second contact section is attached to a face of the cooling chip opposite to the first heat sink. The water-cooling unit has a water tank section and a pipe section having a first end and a second end, which are connected to the water tank section. The pipe section is inlaid in the first contact section and the water tank section is disposed on the radiating fins of the second heat sink. The water-cooling unit serves to cool the heat exchanger to enhance the cooling effect and heat exchange efficiency of the heat exchanger.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • FIG. 1 is a perspective assembled view of a conventional heat exchanger;
  • FIG. 2 is a perspective exploded view of the conventional heat exchanger;
  • FIG. 3 is a perspective exploded view of a preferred embodiment of the heat exchanger of the present invention;
  • FIG. 4 is a perspective assembled view of the preferred embodiment of the heat exchanger of the present invention;
  • FIG. 5 is a perspective view showing the operation of the preferred embodiment of the heat exchanger of the present invention; and
  • FIG. 6 is a sectional view showing the operation of the preferred embodiment of the heat exchanger of the present invention.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 3 and 4, which are a perspective exploded view and a perspective assembled view of a preferred embodiment of the heat exchanger of the present invention respectively. According to this embodiment, the heat exchanger of the present invention includes a first heat sink 1, a second heat sink 2 and a water-cooling unit 3.
  • The first heat sink 1 has a first contact section 11 and multiple radiating fins 12. At least one cooling chip 4 is attached to the first contact section 11. At least one first fan 5 is disposed on the radiating fins 12. The radiating fins 12 extend from one side of the first contact section 11 in a direction away from the first contact section 11.
  • The second heat sink 2 has multiple radiating fins 21 and a second contact section 22. A second fan 6 is positioned on upper side of the radiating fins 21 and connected thereto. The second contact section 22 is attached to the other face of the cooling chip 4 opposite to the first heat sink 1. The radiating fins 21 extend from one side of the second contact section 22 in a direction away from the second contact section 22.
  • The cooling chip 4 has a hot face 41 and a cold face 42. The hot face 41 is attached to the second contact section 22 of the second heat sink 2, while the cold face 42 is attached to the first contact section 11 of the first heat sink 1. The water-cooling unit 3 has a water tank section 31 and a pipe section 32. The pipe section 32 has a first end 321 and a second end 322, which are connected to the water tank section 31. The pipe section 32 is inlaid in the first contact section 11 of the first heat sink 1. The water tank section 31 is disposed on the upper side of the radiating fins 21 of the second heat sink 2.
  • The water tank section 31 has a chamber 311 and a pump 312 (as shown in FIG. 6). The pump 312 is disposed in the chamber 311. A heat dissipation fluid 7 is contained in the chamber 311. The pipe section 32 communicates with the chamber 311. One of the first and second ends 321, 322 is connected to the pump 312. Accordingly, the heat dissipation fluid 7 (as shown in FIG. 6) can be pumped and output by the pump 312 for performing a thermal cycle.
  • The first contact section 11 of the first heat sink 1 is formed with at least one groove 111 for receiving the pipe section 32 therein. The pipe section 32 contacts the cold face 42 of the cooling chip 4. The pipe section 32 further has a heat absorption portion 323 between the first and second ends 321, 322 of the pipe section 32. The heat absorption section 323 serves to absorb and carry away the heat of the first heat sink 1 to cool the same.
  • Please now refer to FIGS. 5 and 6, which respectively are a perspective view and a sectional view showing the operation of the preferred embodiment of the present invention. The first fan 5 serves to forcedly guide airflow 51 into the first heat sink 1. The first contact section 11 of the first heat sink 1 contacts the cold face 42 of the cooling chip 4, whereby the cold face 42 of the cooling chip 4 serves to cool the first contact section 11. The airflow 51 forcedly guided by the first fan 5 will flow through the first sink 1 to be cooled. After cooled, the airflow 51 is exhausted from the first heat sink 1 to complete a heat exchange cycle.
  • The second contact section 22 of the second heat sink 2 contacts the hot face 41 of the cooling chip 4. The heat of the hot face 41 is dissipated via the second heat sink 2. The second fan 6 disposed on the second heat sink 2 serves to dissipate the heat of the second heat sink 2 and lower the temperature of the hot face 41 of the cooling chip 4.
  • The heat absorption portion 323 of the pipe section 32 of the water-cooling unit 3 disposed on the second heat sink 2 extends through the first contact section 11 of the first heat sink 1. The heat dissipation fluid 7 is contained in the pipe section 32. The heat dissipation fluid 7 flows from the first end 321 of the pipe section 32 into the pump 312. Then the heat dissipation fluid 7 is pumped by the pump 312 to flow toward the heat absorption portion 323 of the pipe section 32. Then the heat dissipation fluid 7 flows through the second end 322 of the pipe section 32 back into the water-cooling unit 3. The water-cooling unit 3 serves to cool the first and second heat sinks 1 and 2. In comparison with the conventional device that only employs the cooling chip 4 for dissipating the heat, the present invention has better heat dissipation effect.
  • The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (7)

1. A heat exchanger comprising:
a first heat sink having a first contact section and multiple radiating fins, at least one cooling chip being attached to the first contact section, at least one first fan being disposed on the radiating fins;
a second heat sink having multiple radiating fins and a second contact section, a second fan being positioned on upper side of the radiating fins and connected thereto, the second contact section being attached to the other face of the cooling chip opposite to the first heat sink; and
a water-cooling unit having a water tank section and a pipe section, the pipe section having a first end and a second end, which are connected to the water tank section, the pipe section being inlaid in the first contact section of the first heat sink, the water tank section being disposed on the upper side of the radiating fins of the second heat sink.
2. The heat exchanger as claimed in claim 1, wherein the cooling chip has a hot face and a cold face, the hot face being attached to the second contact section of the second heat sink, while the cold face being attached to the first contact section of the first heat sink.
3. The heat exchanger as claimed in claim 1, wherein the water tank section has a chamber and a pump disposed in the chamber, a heat dissipation fluid being contained in the chamber, the pipe section communicating with the chamber, one of the first and second ends of the pipe section being connected to the pump.
4. The heat exchanger as claimed in claim 1, wherein the first contact section of the first heat sink is formed with at least one groove for receiving the pipe section therein, the pipe section contacting with the cooling chip.
5. The heat exchanger as claimed in claim 1, wherein the radiating fins of the first heat sink are disposed on one side of the first heat sink opposite to the first contact section.
6. The heat exchanger as claimed in claim 1, wherein the radiating fins of the second heat sink are disposed on one side of the second heat sink opposite to the second contact section.
7. The heat exchanger as claimed in claim 1, wherein the pipe section further has a heat absorption portion between the first and second ends.
US12/700,894 2010-02-05 2010-02-05 Heat exchanger Abandoned US20110192572A1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140328021A1 (en) * 2013-05-06 2014-11-06 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus and electronic device using the same
CN105807875A (en) * 2016-03-30 2016-07-27 韩立 Inlaid water-cooled heat sink and installing technology thereof
JP2016147034A (en) * 2015-02-12 2016-08-18 株式会社ユニバーサルエンターテインメント Power supply adapter fixture
US10935324B2 (en) * 2017-07-05 2021-03-02 Noren Products Inc. Methods for cooling the interior of an enclosure
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system
US11716829B1 (en) * 2020-03-17 2023-08-01 Apple Inc. Integrated fan and heat sink for head-mountable device

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US3006979A (en) * 1959-04-09 1961-10-31 Carrier Corp Heat exchanger for thermoelectric apparatus
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US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules
US20050241803A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
US20050241802A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid loop with flexible fan assembly
US20070051501A1 (en) * 2005-09-02 2007-03-08 Yi-Qiang Wu Heat dissipation device
US20070163270A1 (en) * 2006-01-17 2007-07-19 Cooler Master Co., Ltd Liquid cooling system with thermoeletric cooling module
US20070175610A1 (en) * 2006-01-30 2007-08-02 Yun-Yu Yeh Heat dissipating device
US20080074846A1 (en) * 2006-09-22 2008-03-27 Foxconn Technology Co., Ltd. Heat dissipation device
US20080099189A1 (en) * 2006-10-27 2008-05-01 Junwoo Suh Self-pumped cooling device

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Publication number Priority date Publication date Assignee Title
US3006979A (en) * 1959-04-09 1961-10-31 Carrier Corp Heat exchanger for thermoelectric apparatus
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
US6525934B1 (en) * 1999-04-15 2003-02-25 International Business Machines Corporation Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules
US6600649B1 (en) * 2002-05-24 2003-07-29 Mei-Nan Tsai Heat dissipating device
US20050241803A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
US20050241802A1 (en) * 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid loop with flexible fan assembly
US20070051501A1 (en) * 2005-09-02 2007-03-08 Yi-Qiang Wu Heat dissipation device
US20070163270A1 (en) * 2006-01-17 2007-07-19 Cooler Master Co., Ltd Liquid cooling system with thermoeletric cooling module
US20070175610A1 (en) * 2006-01-30 2007-08-02 Yun-Yu Yeh Heat dissipating device
US20080074846A1 (en) * 2006-09-22 2008-03-27 Foxconn Technology Co., Ltd. Heat dissipation device
US20080099189A1 (en) * 2006-10-27 2008-05-01 Junwoo Suh Self-pumped cooling device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140328021A1 (en) * 2013-05-06 2014-11-06 Hon Hai Precision Industry Co., Ltd. Heat dissipation apparatus and electronic device using the same
CN104144588A (en) * 2013-05-06 2014-11-12 鸿富锦精密工业（深圳）有限公司 Cooling device and electronic device with the same
US9265181B2 (en) * 2013-05-06 2016-02-16 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation apparatus and electronic device using the same
JP2016147034A (en) * 2015-02-12 2016-08-18 株式会社ユニバーサルエンターテインメント Power supply adapter fixture
CN105807875A (en) * 2016-03-30 2016-07-27 韩立 Inlaid water-cooled heat sink and installing technology thereof
US10935324B2 (en) * 2017-07-05 2021-03-02 Noren Products Inc. Methods for cooling the interior of an enclosure
US11716829B1 (en) * 2020-03-17 2023-08-01 Apple Inc. Integrated fan and heat sink for head-mountable device
US11503740B2 (en) * 2021-02-10 2022-11-15 Dell Products L.P. Cooling system for an information handling system

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