US20100089555A1 - Liquid-cooling type thermal module - Google Patents

Liquid-cooling type thermal module Download PDF

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Publication number
US20100089555A1
US20100089555A1 US12257808 US25780808A US2010089555A1 US 20100089555 A1 US20100089555 A1 US 20100089555A1 US 12257808 US12257808 US 12257808 US 25780808 A US25780808 A US 25780808A US 2010089555 A1 US2010089555 A1 US 2010089555A1
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Prior art keywords
heat
cooling
liquid
dissipating
end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12257808
Inventor
Chih-peng Chen
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A liquid-cooling type thermal module includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred to the remote liquid cooling unit via the heat-dissipating end to be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried away from the system without stagnating around the heat-producing element, enabling the thermal module to provide excellent heat dissipating effect.

Description

    FIELD OF THE INVENTION
  • [0001]
    The present invention relates to a liquid-cooling type thermal module, and more particularly to a thermal module that employs a heat pipe as a heat conducting medium and uses a liquid cooling unit to cool the heat pipe and dissipate heat.
  • BACKGROUND OF THE INVENTION
  • [0002]
    While an electronic device operates at constantly increased high speed, electronic elements inside the electronic device also produce a large amount of heat during the operation thereof. In general, a heat sink or a radiating fin assembly is arranged on the electronic elements to provide increased heat-dissipating area and thereby enhanced heat-dissipating efficiency. However, the heat sink or the radiating fin assembly can only radiates heat and provides very limited heat-dissipating effect. In order to solve the above problem, liquid-cooling type thermal modules have been developed for providing better heat-dissipating effect.
  • [0003]
    Please refer to FIG. 1, which shows a conventional water-cooling type thermal module 1 including a dissipating unit 11, a pump 14, a first water pipe 12, a heat sink 13, and a second water pipe 15. The dissipating unit 11 has an inner receiving space (not shown), a flow way (not shown), a water outlet (not shown), and a water inlet 111. A fluid is filled in the receiving space. The pump 14 is connected to the water outlet of the dissipating unit 11 to pressurize the fluid, so that the fluid flows in the receiving space and the flow way. The heat sink 13 has a hollow case with a water inlet 132 and a water outlet 131 provided on a top thereof. The hollow case has a bottom defining a contact face 133 for contacting with at least one heat-producing source (not shown) to absorb heat produced by the heat-producing source. The heat sink 13 has an internal receiving space (not shown) communicating with the water inlet 132 and the water outlet 131. The fluid can flow in the receiving space of the heat sink 13 to circulate between the heat sink 13 and the dissipating unit 11, so that the heat absorbed by the heat sink 13 can be carried away from the heat sink 13 by the fluid. The first water pipe 12 is connected at an end to the pump 14 and at the other end to the water inlet 132 on the heat sink 13. The second water pipe 15 is connected at an end to the water inlet 111 on the dissipating unit 11 and at the other end to the water outlet 131 on the heat sink 13. When the pump 14 operates, the fluid is driven to flow in and circulate between the above components of the thermal module 1 for dissipating heat. However, since joints between the internal components of the electronic device are not always watertight, the fluid tends to leak to cause damage to the electronic device. Moreover, the components of the conventional water-cooling type thermal module 1 are complicate to occupy a large room and can not be easily installed. Therefore, the conventional thermal module 1 requires a relatively high manufacturing cost.
  • [0004]
    In conclusion, the conventional water-cooling thermal module has the following disadvantages: (1) having complicated components; (2) uneasy to install; (3) being subject to water leak; (4) occupying a relatively large room; and (5) requiring relatively high manufacturing cost.
  • SUMMARY OF THE INVENTION
  • [0005]
    A primary object of the present invention is to provide a liquid-cooling type thermal module, which has simple structure and eliminates the problem of fluid leak.
  • [0006]
    Another object of the present invention is to provide a liquid-cooling type thermal module that can be easily assembled.
  • [0007]
    A further object of the present invention is to provide a liquid-cooling type thermal module that is able to effectively remove heat produced by a heat-producing element from a system and thereby prevent heat from accumulating in the system.
  • [0008]
    To achieve the above and other objects, the liquid-cooling type thermal module according to the present invention includes a liquid cooling unit and at least one heat pipe. The heat pipe has a heat-absorbing end and a heat-dissipating end. The heat-absorbing end is connected to at least one heat-producing element. The heat-producing element is located inside a system while the liquid cooling unit is located outside the system. The heat pipe connects the heat-producing element to the liquid cooling unit. The heat-dissipating end of the heat pipe is connected to the liquid cooling unit located outside the system. Heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred by the heat pipe to the remote heat-dissipating end via the heat-dissipating end and be dissipated. With the heat pipe being used as a medium for conducting heat, the problem of fluid leak can be eliminated, and the heat produced by the heat-producing element can be effectively carried by the heat pipe away from the system without accumulating therein, enabling the thermal module to provide excellent heat dissipating effect.
  • [0009]
    With the above arrangements, the liquid-cooling type thermal module of the present invention has the following advantages: (1) having simple structure; (2) eliminating the problem of fluid leak; (3) easy to assemble without occupying too much room; and (4) preventing heat from accumulating in the case of an electronic device.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0010]
    The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
  • [0011]
    FIG. 1 is an assembled perspective view of a conventional water-cooling type thermal module;
  • [0012]
    FIG. 2 is an assembled perspective view of a liquid-cooling type thermal module according to a first embodiment of the present invention;
  • [0013]
    FIG. 3 is a cutaway view of a liquid cooling unit for the liquid-cooling type thermal module of FIG. 2; and
  • [0014]
    FIG. 4 is an assembled perspective view of a liquid-cooling type thermal module according to a second embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • [0015]
    Please refer to FIGS. 2 and 3. A liquid-cooling type thermal module according to a first embodiment of the present invention includes a liquid cooling unit 2 and at least one heat pipe 3. The heat pipe 3 has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 has a flat configuration and is connected to and bearing on at least one heat-producing element 41. The heat-producing element 41 is located inside a system 4 while the liquid cooling unit 2 is located outside the system 4. The heat pipe 3 is extended from the liquid cooling unit 2 into the system 4 with the heat-absorbing end 31 bearing on the heat-producing element 41 and the heat-dissipating end 32 connected to the liquid cooling unit 2. Heat produced by the heat-producing element 41 is absorbed by the heat pipe 3 at the heat-absorbing end 31 and then transferred via the heat-dissipating end 32 to the liquid cooling unit 2, and is finally dissipated into ambient air. Since the heat pipe 3 is able to absorb and exactly transfer heat to the remote liquid cooling unit 2 for dissipation, the heat produced by the heat-producing element 41 would not stagnate around the heat-producing element 41, but can be effectively removed from an interior of the system 4.
  • [0016]
    The liquid cooling unit 2 includes a plurality of radiating fins 22 protruded from one side of the liquid cooling unit 2. The radiating fins 22 are connected to at least one cooling fan 5. The liquid cooling unit 2 further includes a pump 21 and internally defines a dissipating space 23 and a flow way 24 communicating with the pump 21. A type of fluid is filled in the dissipating space 23. The pump 21 drives the fluid to flow in the dissipating space 23 and thereby cool the heat-dissipating end 32 of the heat pipe 3.
  • [0017]
    FIG. 4 is an assembled perspective view of a liquid-cooling type thermal module according to a second embodiment of the present invention. Please refer to FIGS. 3 and 4. It is noted parts that are the same in the first and the second embodiment are denoted by the same reference numerals herein. As in the first embodiment, the liquid-cooling type thermal module 2 in the second embodiment is connected to a system 4 for dissipating heat produced by at least one heat-producing element 41 located inside the system 4. The liquid-cooling type thermal module 2 of the second embodiment includes a liquid cooling unit 2 located outside the system 4. The liquid cooling unit 2 is connected to the heat-producing element 41 via at least one heat pipe 3. The liquid cooling unit 2 defines an internal dissipating space 23 and a flow way 24, and includes a pump 21 communicable with the flow way 24. A type of fluid is filled in the dissipating space 23. The pump 21 drives the fluid to flow in the dissipating space 23.
  • [0018]
    In the second embodiment, the heat pipe 3 also has a heat-absorbing end 31 and a heat-dissipating end 32. The heat-absorbing end 31 is bearing on the heat-producing element 41. When the heat-producing element 41 produces heat, the heat-absorbing end 31 of the heat pipe 3 absorbs and transfers the produced heat to the remote heat-dissipating end 32. The heat-dissipating end 32 is inserted into the dissipating space 23 of the liquid cooling unit 2, which is located outside the system 4, so that the fluid in the dissipating space 23 can cool the heat-dissipating end 32 to achieve the purpose of dissipating heat.
  • [0019]
    In the present invention, by using the heat pipe 3 as a medium for conducting heat, the heat produced by the heat-producing element 41 can be exactly transferred to an outer side of the system 4 without accumulating therein. Moreover, with the heat pipe 3 being used as the medium of conducting heat, the problem of fluid leak is eliminated and damage to electronic components inside the system 4 caused by the fluid leak can be prevented.
  • [0020]
    In the second embodiment, the heat-absorbing end 31 of the heat pipe 3 is further connected to at least one heat sink 6. The heat sink 6 is attached to the heat-producing element 41 to give the heat-producing element 41 an increased heat-dissipating area.
  • [0021]
    The system 4 can be a case of an electronic device, a telecommunication cabinet, a computer case, or an LED lamp lens. In the illustrated embodiments of the present invention, the system 4 is a computer case.
  • [0022]
    The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (12)

  1. 1. A liquid-cooling type thermal module, comprising a liquid cooling unit and at least one heat pipe; the heat pipe having a heat-absorbing end and a heat-dissipating end, the heat-absorbing end being connected to at least one heat-producing element, and the heat-dissipating end being connected to the liquid cooling unit, whereby heat produced by the heat-producing element is absorbed by the heat-absorbing end and transferred by the heat pipe to the liquid cooling unit via the heat-dissipating end to be dissipated.
  2. 2. The liquid-cooling type thermal module as claimed in claim 1, wherein the heat-producing element is located inside a system while the liquid cooling unit is located outside the system, and the heat pipe is extended into the system to connect the heat-producing element to the liquid cooling unit.
  3. 3. The liquid-cooling type thermal module as claimed in claim 1, wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space.
  4. 4. The liquid-cooling type thermal module as claimed in claim 1, wherein at least one cooling fan is mounted to one side of the liquid cooling unit.
  5. 5. The liquid-cooling type thermal module as claimed in claim 1, wherein the heat-absorbing end has a flat configuration for bearing on the heat-producing element.
  6. 6. The liquid-cooling type thermal module as claimed in claim 1, wherein the heat-absorbing end is connected to at least one heat sink, and the heat sink is attached to the heat-producing element.
  7. 7. The liquid-cooling type thermal module as claimed in claim 3, wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump.
  8. 8. The liquid-cooling type thermal module as claimed in claim 3, wherein the heat-dissipating end is inserted into the dissipating space.
  9. 9. The liquid-cooling type thermal module as claimed in claim 1, wherein the liquid cooling unit includes a plurality of radiating fins protruded from one side of the liquid cooling unit.
  10. 10. The liquid-cooling type thermal module as claimed in claim 2, wherein the liquid cooling unit internally defines a dissipating space and includes a pump, a type of fluid being filled in the dissipating space, and the pump driving the fluid to flow in the dissipating space.
  11. 11. The liquid-cooling type thermal module as claimed in claim 2, wherein the system is selected from the group consisting of a case of an electronic device, a telecommunication cabinet, a computer case, and an LED lamp lens.
  12. 12. The liquid-cooling type thermal module as claimed in claim 10, wherein the liquid cooling unit further internally defines at least one flow way in the dissipating space, and the flow way being communicable with the pump.
US12257808 2008-10-14 2008-10-24 Liquid-cooling type thermal module Abandoned US20100089555A1 (en)

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TW097218342 2008-10-14
TW97218342 2008-10-14

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100296250A1 (en) * 2009-05-22 2010-11-25 Chiu-Mao Huang Heat dissipation device for communication chassis
US20110304981A1 (en) * 2010-06-15 2011-12-15 Hon Hai Precision Industry Co., Ltd. Computer server system and computer server thereof
US20130000873A1 (en) * 2011-06-29 2013-01-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation system
US20140083652A1 (en) * 2011-05-24 2014-03-27 Nec Corporation Sealed casing

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273100A (en) * 1979-02-16 1981-06-16 W. R. Grace & Co. Passive solar heating and cooling panels
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US6434001B1 (en) * 1997-04-22 2002-08-13 Intel Corporation Heat exchanger for a portable computing device and docking station
US6725682B2 (en) * 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US20040123978A1 (en) * 2002-12-25 2004-07-01 Kabushiki Kaisha Toshiba Air-applying device having a case with an air inlet port, a cooling unit having the air-applying device, and an electronic apparatus having the air-applying device
US20050039887A1 (en) * 2001-11-27 2005-02-24 Parish Overton L. Stacked low profile cooling system and method for making same
US20070034355A1 (en) * 2005-08-10 2007-02-15 Cooler Master Co.,Ltd. Heat-dissipation structure and method thereof
US20080264608A1 (en) * 2007-04-30 2008-10-30 Trentent Tye Cooling mechanism comprising a heat pipe and water block
US7631686B2 (en) * 2005-08-25 2009-12-15 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Liquid cooling device
US7926553B2 (en) * 2005-03-07 2011-04-19 Asetek A/S Cooling system for electronic devices, in particular, computers

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273100A (en) * 1979-02-16 1981-06-16 W. R. Grace & Co. Passive solar heating and cooling panels
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US6434001B1 (en) * 1997-04-22 2002-08-13 Intel Corporation Heat exchanger for a portable computing device and docking station
US6725682B2 (en) * 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US20050039887A1 (en) * 2001-11-27 2005-02-24 Parish Overton L. Stacked low profile cooling system and method for making same
US20040123978A1 (en) * 2002-12-25 2004-07-01 Kabushiki Kaisha Toshiba Air-applying device having a case with an air inlet port, a cooling unit having the air-applying device, and an electronic apparatus having the air-applying device
US7926553B2 (en) * 2005-03-07 2011-04-19 Asetek A/S Cooling system for electronic devices, in particular, computers
US20070034355A1 (en) * 2005-08-10 2007-02-15 Cooler Master Co.,Ltd. Heat-dissipation structure and method thereof
US7631686B2 (en) * 2005-08-25 2009-12-15 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Liquid cooling device
US20080264608A1 (en) * 2007-04-30 2008-10-30 Trentent Tye Cooling mechanism comprising a heat pipe and water block

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100296250A1 (en) * 2009-05-22 2010-11-25 Chiu-Mao Huang Heat dissipation device for communication chassis
US8004842B2 (en) * 2009-05-22 2011-08-23 Asia Vital Components Co., Ltd. Heat dissipation device for communication chassis
US20110304981A1 (en) * 2010-06-15 2011-12-15 Hon Hai Precision Industry Co., Ltd. Computer server system and computer server thereof
US20140083652A1 (en) * 2011-05-24 2014-03-27 Nec Corporation Sealed casing
US20130000873A1 (en) * 2011-06-29 2013-01-03 Hon Hai Precision Industry Co., Ltd. Heat dissipation system

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Legal Events

Date Code Title Description
AS Assignment

Owner name: ASIA VITAL COMPONENTS CO., LTD.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, CHIH-PENG;REEL/FRAME:021733/0471

Effective date: 20081020