JP2006012874A - Cooling device of semiconductor element - Google Patents

Cooling device of semiconductor element Download PDF

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Publication number
JP2006012874A
JP2006012874A JP2004183277A JP2004183277A JP2006012874A JP 2006012874 A JP2006012874 A JP 2006012874A JP 2004183277 A JP2004183277 A JP 2004183277A JP 2004183277 A JP2004183277 A JP 2004183277A JP 2006012874 A JP2006012874 A JP 2006012874A
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heat
cooling
heat exchanger
heat pipe
semiconductor element
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Japanese (ja)
Inventor
Masao Nakano
雅夫 中野
Akira Ikeda
明 池田
Hiromasa Ashitani
博正 芦谷
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004183277A priority Critical patent/JP2006012874A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies

Abstract

<P>PROBLEM TO BE SOLVED: To provide the cooling device of a semiconductor element by which the heat of a plurality of semiconductor elements are moved to the cooling device of a refrigerant circulation type by heat pipes, and much heat can efficiently be radiated since there is a limit to the cooling of a plurality of the semiconductor elements of high heat generation in combination of a heatsink and a fan as in a conventional case. <P>SOLUTION: Cooling plates 3 and heat pipes 4 are installed in a plurality of the semiconductor elements 1 of high heat generation for cooling them. A heat exchanger 5, a radiator 7 and a pump 8 are connected by piping, and the heat pipes 4 are thermally connected to the heat exchanger 5 of the cooling device where a refrigerant circulates. The heat of a plurality of the semiconductor elements 1 can efficiently be radiated. Since the respective heat pipes 4 are independent, they can easily be handled. Thus, the highly reliable cooling device of the semiconductor element 1 can be obtained which does not adversely affect the other semiconductor element 2 even if it breaks down. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、電子装置において高発熱となる半導体素子の冷却装置に関し、特に複数の半導体素子に繋いだ複数のヒートパイプと、冷媒を用いた冷却回路とを連結した、効率が高くて取り扱いが容易な半導体素子の冷却装置に関するものである。   TECHNICAL FIELD The present invention relates to a cooling device for a semiconductor element that generates high heat in an electronic device, and in particular, a plurality of heat pipes connected to a plurality of semiconductor elements and a cooling circuit using a refrigerant are connected with high efficiency and easy to handle. The present invention relates to a semiconductor device cooling apparatus.

従来、この種の放熱装置としては空冷式のものがある（例えば、特許文献１参照）。   Conventionally, as this type of heat dissipation device, there is an air-cooling type (see, for example, Patent Document 1).

図７は、従来のサーバの断面図である。図７において、ＰＣサーバ１０１は、筐体１０８内にフレッシュエアを導入するための吸気口１０９、排気口１１０と、排気口１１０の近傍に設けられた冷却ファン１１１と、冷却ファン１１１によって筐体１０８内に導入されるフレッシュエアを、エアの流れの上流側の領域、つまり上流域にある基板１０４上の発熱部品１０２と、下流側の領域、つまり下流域にある発熱部品１０３とに分散して供給できるように、偏風部１１２を有するダクトケース１１３とを具備する。これにより、上流域にある発熱部品１０２は、吸気口１０９の下段から吸気されたフレッシュエアによって冷却され、一方、下流域にある発熱部品１０３は、吸気口１０９の上段から吸気された、発熱部品１０２に触れていないフレッシュエアによって冷却される。同図のように、発熱量の小さい半導体の素子の冷却ではファン冷却器でも十分冷却されていた。   FIG. 7 is a cross-sectional view of a conventional server. In FIG. 7, the PC server 101 includes an intake port 109 and an exhaust port 110 for introducing fresh air into the housing 108, a cooling fan 111 provided in the vicinity of the exhaust port 110, and the cooling fan 111. The fresh air introduced into 108 is dispersed into the heat generating component 102 on the substrate 104 in the upstream region of the air flow, that is, the upstream region, and the heat generating component 103 in the downstream region, that is, the downstream region. And a duct case 113 having a draft portion 112. Thus, the heat generating component 102 in the upstream area is cooled by the fresh air sucked from the lower stage of the intake port 109, while the heat generating component 103 in the downstream area is sucked from the upper stage of the intake port 109. Cooled by fresh air not touching 102. As shown in the figure, the cooling of the semiconductor element with a small calorific value was sufficiently cooled by the fan cooler.

また、発熱部品の熱をヒートパイプにより伝達して外部に放出するものがある（例えば、特許文献２参照）。   In addition, there is one that transmits heat of a heat generating component through a heat pipe and releases it to the outside (see, for example, Patent Document 2).

図８は、従来のコンピュータの一部破断した斜視図である。図８において、コンピュータ２０１は筐体２０６内部の熱を電源２０４の吹き出し部２０９から外部に放出するように送風する電源ファンを備え、中央演算処理装置２０２などの発熱部品の熱を、電源ファンの下流に設けられたヒートシンク２１２までヒートパイプ２０５により伝達して放出し、電源ファンからの風によりコンピュータ２０１の外部に放出する。
特開２００１−１８９５８４号公報 特開２０００−２５０６６０号公報 FIG. 8 is a partially broken perspective view of a conventional computer. In FIG. 8, a computer 201 includes a power supply fan that blows heat inside the housing 206 so as to be released to the outside from the blowing unit 209 of the power supply 204, and the heat of a heat-generating component such as the central processing unit 202 is transmitted to the power supply fan. The heat pipe 205 transmits the heat sink 212 to the heat sink 212 provided on the downstream side, and the air is discharged from the power supply fan to the outside of the computer 201.
JP 2001-189484 A JP 2000-250660 A

従来のように、ヒートシンクとファンの組み合わせや、その上にヒートパイプを利用した構成では、冷却を空冷式に依存する以上は高発熱の半導体素子の冷却に対して冷却能力的に限界に近づいて来ていた。   As in the past, the combination of a heat sink and a fan, and a configuration using a heat pipe on top of it, approaching the limit in terms of cooling capacity for cooling a semiconductor element with high heat generation, as long as it depends on the air cooling system for cooling. was already arrived.

本発明はこのような従来の課題を解決するものであり、複数のヒートパイプと冷媒循環式の冷却回路を組み合わせて効率良く放熱でき、取り扱いが容易な冷却装置を提供することを目的とするものである。   SUMMARY OF THE INVENTION The present invention solves such a conventional problem, and an object of the present invention is to provide a cooling device that can efficiently dissipate heat and can be easily handled by combining a plurality of heat pipes and a refrigerant circulation cooling circuit. It is.

この課題を解決するために、請求項１にかかる発明の半導体素子の冷却装置は、基板に設けられ、発熱体である複数の半導体素子と、前記半導体素子を冷却するためにそれぞれに設けられた冷却板と、前記冷却板とピートパイプで繋がれた熱交換器とを備え、前記熱交換器と、ファンにより冷却される放熱器と、ポンプとを配管で接続して内部に冷媒が循環する冷却回路を構成したもので、この構成によりそれぞれの半導体素子の熱を効率良く放熱でき、またそれぞれのヒートパイプが独立しているため取り扱いが容易であり、故障
しても他の半導体素子に影響を与えない信頼性の高い冷却装置が得られる。 In order to solve this problem, a semiconductor device cooling device according to a first aspect of the present invention is provided on a substrate, and is provided to each of a plurality of semiconductor devices which are heating elements and to cool the semiconductor devices. A cooling plate and a heat exchanger connected to the cooling plate by a peat pipe are provided, and the heat exchanger, a radiator cooled by a fan, and a pump are connected by piping to circulate the refrigerant inside. Constructs a cooling circuit, which can efficiently dissipate the heat of each semiconductor element, and because each heat pipe is independent, it is easy to handle, and even if it fails, it affects other semiconductor elements A highly reliable cooling device that does not give the heat resistance is obtained.

また、請求項２の発明は、冷却板を銅材で構成し、前記冷却板にヒートパイプの形状に相当する穴を設け、ヒートパイプを前記穴にグリースといっしょに挿入したもので、それぞれのヒートパイプは冷却板からの取り外しが容易になるとともに、接合部の熱伝導性を向上できる。   In the invention of claim 2, the cooling plate is made of a copper material, a hole corresponding to the shape of the heat pipe is provided in the cooling plate, and the heat pipe is inserted into the hole together with grease. The heat pipe can be easily detached from the cooling plate and can improve the thermal conductivity of the joint.

また、請求項３の発明は、熱交換器に、冷媒を流す内部空間と、ヒートパイプの形状に相当する穴とを個別に設け、前記ヒートパイプを前記穴にグリースと共に挿入したもので、それぞれのヒートパイプは熱交換器からの取り外しが容易になるとともに、接合部の熱伝導性を向上できる。   In the invention of claim 3, the heat exchanger is provided with an internal space through which the refrigerant flows and a hole corresponding to the shape of the heat pipe, and the heat pipe is inserted into the hole together with grease. The heat pipe can be easily removed from the heat exchanger and can improve the thermal conductivity of the joint.

また、請求項４の発明は、冷却板にヒートパイプの形状に相当する穴を設け、ヒートパイプを圧入勘合したもので、さらに伝熱性能を向上することができる。   In the invention of claim 4, a hole corresponding to the shape of the heat pipe is provided in the cooling plate, and the heat pipe is press-fitted into the cooling plate, and the heat transfer performance can be further improved.

また、請求項５の発明は、熱交換器の内部空間にヒートパイプを挿入し、前記ヒートパイプを前記熱交換器に気密的に固定したもので、それぞれのヒートパイプ４が直接冷媒と熱交換するために効率が良い。   In the invention of claim 5, a heat pipe is inserted into the internal space of the heat exchanger, and the heat pipe is hermetically fixed to the heat exchanger, and each heat pipe 4 directly exchanges heat with the refrigerant. Efficient to do.

また、請求項６の発明は、熱交換器の内部空間内に挿入されたヒートパイプにフィンを形成したもので、伝熱面積が増えることにより熱交換効率がさらに向上する。   In the invention of claim 6, fins are formed on the heat pipe inserted into the internal space of the heat exchanger, and the heat exchange efficiency is further improved by increasing the heat transfer area.

また、請求項７の発明は、熱交換器の内部空間に、連通穴を設けた仕切り板を設けて複数の仕切り空間を形成し、前記仕切り空間にヒートパイプをそれぞれ挿入して気密的に固定したもので、熱交換器の強度が強くなり、コストの廉価な材料からの製造が可能となる。   According to the invention of claim 7, a partition plate provided with communication holes is provided in the internal space of the heat exchanger to form a plurality of partition spaces, and heat pipes are respectively inserted into the partition spaces to be hermetically fixed. As a result, the strength of the heat exchanger is increased, and it is possible to manufacture from a low-cost material.

また、請求項８の発明は、冷却回路に使用される冷媒が、熱交換器の内部空間で２相状態となるもので、熱交換器内の温度を均一に保つことができるため、多くの半導体素子をほぼ同じ温度に冷却することが可能となる。   In the invention of claim 8, since the refrigerant used in the cooling circuit is in a two-phase state in the internal space of the heat exchanger, and the temperature in the heat exchanger can be kept uniform, The semiconductor element can be cooled to substantially the same temperature.

また、請求項９の発明は、放熱器とポンプと熱交換器とをその順番で接続し、前記放熱器と前記ポンプとは前記熱交換器よりも下に配設し、前記放熱器は上部に冷媒の入口を設けて下部に出口を設けたもので、冷媒の蒸気が発生した場合のガス噛みによるポンプ性能の低下を避けることができ、信頼性の高い構成を得ることができる。   The invention of claim 9 connects a radiator, a pump, and a heat exchanger in that order, and the radiator and the pump are disposed below the heat exchanger, and the radiator is an upper part. A refrigerant inlet is provided in the lower part and an outlet is provided in the lower part, so that it is possible to avoid a decrease in pump performance due to gas biting when refrigerant vapor is generated, and to obtain a highly reliable configuration.

以上のように、本発明の半導体素子の冷却装置は、発熱体である複数の半導体素子を冷却するために設けたそれぞれのヒートパイプと、熱交換器、放熱器およびポンプを繋ぎ冷媒が循環する冷却回路とを熱的に連結したもので、この構成によりそれぞれの半導体素子の熱を効率良く放熱でき、またそれぞれのヒートパイプが独立しているため取り扱いが容易であり、故障しても他の半導体素子に影響を与えない信頼性の高い冷却装置が得られる。   As described above, the semiconductor element cooling apparatus according to the present invention connects each heat pipe provided to cool a plurality of semiconductor elements, which are heating elements, with a heat exchanger, a radiator, and a pump to circulate the refrigerant. This is a thermal connection with the cooling circuit. With this configuration, the heat of each semiconductor element can be efficiently dissipated, and each heat pipe is independent, so it is easy to handle. A highly reliable cooling device that does not affect the semiconductor element can be obtained.

また、請求項１０の発明は、熱交換器の冷媒の出口は下部に設けたもので、液冷媒が流れるようにして循環効率の低下を防ぐことができる。   In the invention of claim 10, the refrigerant outlet of the heat exchanger is provided in the lower part, and the circulation efficiency can be prevented from decreasing by allowing the liquid refrigerant to flow.

以下に、本発明の実施の形態について図面を参照しながら説明する。   Embodiments of the present invention will be described below with reference to the drawings.

（実施の形態１）
図１は、本発明の実施の形態１における半導体の冷却装置の模式図で、複数の基板（サーバ）が枠体に収められた状態を示す。図１において、複数の半導体素子１がサーバ枠体内の６台の基板２に設置されている。高発熱体である半導体素子１を冷却するための冷却板３がそれぞれの半導体素子１の上に熱的に密着して設置されている。それぞれの冷却板３にはヒートパイプ４が接合されており、それぞれのヒートパイプ４の他端は熱交換器５の内部空間９に挿入されて熱交換器５に気密的にろう付け接合されている。熱交換器５は、ファン６で冷却される放熱器７とポンプ８とともに配管で接続されて冷却回路を構成し、冷却回路内には冷媒が封入されている。 (Embodiment 1)
FIG. 1 is a schematic diagram of a semiconductor cooling device according to Embodiment 1 of the present invention, and shows a state where a plurality of substrates (servers) are housed in a frame. In FIG. 1, a plurality of semiconductor elements 1 are installed on six substrates 2 in a server frame. A cooling plate 3 for cooling the semiconductor element 1 that is a high heating element is disposed on each semiconductor element 1 in close thermal contact. A heat pipe 4 is joined to each cooling plate 3, and the other end of each heat pipe 4 is inserted into the internal space 9 of the heat exchanger 5 and airtightly brazed to the heat exchanger 5. Yes. The heat exchanger 5 is connected by a pipe together with a radiator 7 cooled by a fan 6 and a pump 8 to form a cooling circuit, and a refrigerant is sealed in the cooling circuit.

かかる構成によれば、サーバ枠体内に設置されたそれぞれの高発熱半導体素子１の熱が冷却板３に伝わり、冷却板３に接合されたヒートパイプ４により熱交換器５に集められる。熱交換器５に集められた熱は熱交換器内の冷媒と熱交換を行い、ポンプ８により放熱器７に送られ、ファン６により放熱することができる。なお、ポンプ８は放熱器７の後に配設することにより、冷媒が凝縮されてガス噛みのない効率がよい運転ができる。   According to this configuration, the heat of each highly heat-generating semiconductor element 1 installed in the server frame is transmitted to the cooling plate 3 and collected in the heat exchanger 5 by the heat pipe 4 joined to the cooling plate 3. The heat collected in the heat exchanger 5 exchanges heat with the refrigerant in the heat exchanger, is sent to the radiator 7 by the pump 8, and can be radiated by the fan 6. The pump 8 is disposed after the radiator 7 so that the refrigerant is condensed and an efficient operation without gas biting can be performed.

また、この構成によればそれぞれの高発熱な半導体素子の冷却はそれぞれのヒートパイプで独立して行われるため、取り扱いが容易であり、１つのヒートパイプが故障しても他の半導体素子の冷却に影響を及ぼさないため、信頼性の高いシステムを得ることができる。   Also, according to this configuration, each high heat-generating semiconductor element is cooled independently by each heat pipe, so that it is easy to handle and even if one heat pipe fails, the other semiconductor elements can be cooled. Therefore, a highly reliable system can be obtained.

図２は本発明の実施の形態１における冷却板３とヒートパイプの接合断面図である。図２において、冷却板３は熱伝導率の良い銅材で構成されており、ヒートパイプ形状に相当する穴があけられ、その穴にヒートパイプ４がグリースと共に挿入されて密接に接合されている。この構成によれば、それぞれのヒートパイプは取り外しが容易であり、冷却装置のサーバ枠体への設置、取り外しが容易にできる。また、接合部にはグリースが介在しているため熱伝導の良い構成となっている。   FIG. 2 is a cross-sectional view of joining of the cooling plate 3 and the heat pipe in Embodiment 1 of the present invention. In FIG. 2, the cooling plate 3 is made of a copper material having good thermal conductivity, and a hole corresponding to a heat pipe shape is formed, and the heat pipe 4 is inserted together with grease into the hole and closely joined. . According to this configuration, each heat pipe can be easily removed, and the cooling device can be easily installed and removed from the server frame. Moreover, since grease is interposed in the joint portion, the structure has good heat conduction.

接合部にグリースを用いているが、さらに伝熱性能を向上するために圧入勘合を行っても良い。   Although grease is used for the joint, press fitting may be performed to further improve the heat transfer performance.

図３（ａ）は本発明の実施の形態１における熱交換器の断面図で、図３（ｂ）は同じく熱交換器の平面図である。図３において、熱交換器５に内部空間９と複数のヒートパイプ４との接合穴が構成されている。その接合穴にヒートパイプ４がグリースと共に挿入されて密接している。この構成によればそれぞれのヒートパイプは熱交換器５からの取り外しが容易となり、冷却装置のサーバ枠体への設置、取り外しが容易にできる。また、接合部にはグリースが介在しているため熱伝導の良い構成となっている。   Fig.3 (a) is sectional drawing of the heat exchanger in Embodiment 1 of this invention, FIG.3 (b) is a top view of a heat exchanger similarly. In FIG. 3, the heat exchanger 5 is formed with joint holes between the internal space 9 and the plurality of heat pipes 4. The heat pipe 4 is inserted into the joint hole together with grease so as to be in close contact. According to this configuration, each heat pipe can be easily detached from the heat exchanger 5, and the cooling device can be easily installed and removed from the server frame. Moreover, since grease is interposed in the joint portion, the structure has good heat conduction.

冷却回路内を循環する冷媒には、水などの液体であれば特に限定するものではないが、ＨＦＣ冷媒、アンモニアやプロパン等の自然冷媒を使用して、ヒートパイプ４との熱交換時に冷媒が２相状態になるように構成すれば、冷媒の潜熱による熱交換となって熱交換器５内の温度を均一に保つことができるため、多くの半導体素子をほぼ同じ温度に冷却することが可能となる。この場合には、ヒートパイプ４が常に液冷媒に接触するように構成することが望ましい。また、熱交換器５の冷媒の出口は、循環効率が低下しないために液冷媒が流れるように下部の設けることが望ましい。   The refrigerant circulating in the cooling circuit is not particularly limited as long as it is a liquid such as water, but a natural refrigerant such as HFC refrigerant or ammonia or propane is used, and the refrigerant is used during heat exchange with the heat pipe 4. If it is configured to be in a two-phase state, the temperature in the heat exchanger 5 can be kept uniform by heat exchange due to the latent heat of the refrigerant, so that many semiconductor elements can be cooled to substantially the same temperature It becomes. In this case, it is desirable that the heat pipe 4 is always in contact with the liquid refrigerant. Moreover, it is desirable to provide the outlet of the refrigerant of the heat exchanger 5 so that the liquid refrigerant flows so that the circulation efficiency does not decrease.

図４は、本発明の実施の形態１における半導体素子の冷却装置の設置模式図である。図４において、基板２や冷却板３、および熱交換器５の設置されている枠体の下方に、放熱器７およびポンプ８が設置されている枠体が設置されている。また、熱交換器５からの出口配管は、放熱器７の上部の配管に繋がり、放熱器７の下部に出口配管が設置されてポン
プ８に繋がっている。 FIG. 4 is an installation schematic diagram of the cooling device for the semiconductor element in the first embodiment of the present invention. In FIG. 4, a frame body in which the radiator 7 and the pump 8 are installed is installed below the frame body in which the substrate 2, the cooling plate 3, and the heat exchanger 5 are installed. The outlet pipe from the heat exchanger 5 is connected to the upper pipe of the radiator 7, and the outlet pipe is installed at the lower part of the radiator 7 to connect to the pump 8.

この構成によれば、冷却回路内に冷媒の蒸気が発生した場合、熱交換器５の内部空間９内に蒸気が溜まり、下方の放熱器７およびポンプ８には液冷媒が流れる。また、停止時にもポンプに冷媒が溜まるため、ガス噛みによるポンプ性能の低下を避けることができ、信頼性の高い構成を得ることができる。   According to this structure, when the vapor | steam of a refrigerant | coolant generate | occur | produces in a cooling circuit, a vapor | steam accumulates in the internal space 9 of the heat exchanger 5, and a liquid refrigerant flows into the heat radiator 7 and the pump 8 below. In addition, since the refrigerant accumulates in the pump even when stopped, it is possible to avoid a decrease in pump performance due to gas biting and to obtain a highly reliable configuration.

（実施の形態２）
図５は本発明の実施の形態２における熱交換器の断面図である。図５において、熱交換器５の内部空間９に複数のヒートパイプ４が挿入され、気密的にろう付け固定されている。また、挿入されたそれぞれのヒートパイプの先端に複数のフィン１０が形成されている。この構成によれば、それぞれのヒートパイプ４が直接冷媒と熱交換するために効率が良いとともに、ヒートパイプ４に取り付けられたフィンにより、より効率の良い熱交換ができる。 (Embodiment 2)
FIG. 5 is a cross-sectional view of a heat exchanger according to Embodiment 2 of the present invention. In FIG. 5, a plurality of heat pipes 4 are inserted into the internal space 9 of the heat exchanger 5 and are airtightly brazed and fixed. A plurality of fins 10 are formed at the tip of each inserted heat pipe. According to this configuration, each heat pipe 4 directly exchanges heat with the refrigerant, so that the efficiency is high, and more efficient heat exchange can be performed by the fins attached to the heat pipe 4.

（実施の形態３）
図６は本発明の実施の形態３における熱交換器の断面図である。図６において、熱交換器５の内部空間９に連通穴１１を設けた仕切り板１０を複数個設置し、それぞれの仕切り空間にヒートパイプを差し込み熱交換器５にろう付け固定した構成となっている。この構成によれば仕切り板で区切られている為、熱交換器の強度が強くなり、コストの廉価なパイプからの構成が可能となる。 (Embodiment 3)
FIG. 6 is a cross-sectional view of a heat exchanger according to Embodiment 3 of the present invention. In FIG. 6, a plurality of partition plates 10 provided with communication holes 11 are installed in the internal space 9 of the heat exchanger 5, heat pipes are inserted into the respective partition spaces, and the heat exchanger 5 is brazed and fixed. Yes. According to this structure, since it is divided by the partition plate, the strength of the heat exchanger is increased, and a structure from a low-cost pipe is possible.

本発明の実施の形態１における半導体素子の冷却装置の模式図Schematic diagram of a semiconductor element cooling device according to the first embodiment of the present invention. 本発明の実施の形態１における冷却板とヒートパイプの接合断面図Cross-sectional view of joining of cooling plate and heat pipe in Embodiment 1 of the present invention 本発明の実施の形態１における熱交換器の断面図Sectional drawing of the heat exchanger in Embodiment 1 of this invention 本発明の実施の形態１における半導体素子の冷却装置の設置模式図Schematic installation of a cooling device for a semiconductor element in Embodiment 1 of the present invention 本発明の実施の形態２における熱交換器の断面図Sectional drawing of the heat exchanger in Embodiment 2 of this invention 本発明の実施の形態３における熱交換器の断面図Sectional drawing of the heat exchanger in Embodiment 3 of this invention 従来のサーバの断面図Cross-sectional view of a conventional server 従来のコンピュータの一部破断した斜視図Partially broken perspective view of a conventional computer

符号の説明Explanation of symbols

１ 半導体素子
２ 基板
３ 冷却板
４ ヒートパイプ
５ 熱交換器
６ ファン
７ 放熱器
８ ポンプ
９ 内部空間
１０ フィン
１１ 連通穴 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Board | substrate 3 Cooling plate 4 Heat pipe 5 Heat exchanger 6 Fan 7 Radiator 8 Pump 9 Internal space 10 Fin 11 Communication hole

Claims (10)

基板に設けられ、発熱体である複数の半導体素子と、前記半導体素子を冷却するためにそれぞれに設けられた冷却板と、前記冷却板とヒートパイプで繋がれた熱交換器とを備え、前記熱交換器と、ファンにより冷却される放熱器と、ポンプとを配管で接続して内部に冷媒が循環する冷却回路を構成したことを特徴とする半導体素子の冷却装置。 A plurality of semiconductor elements which are provided on the substrate and are heating elements; a cooling plate provided for cooling each of the semiconductor elements; and a heat exchanger connected to the cooling plate by a heat pipe, A semiconductor device cooling apparatus comprising a cooling circuit in which a heat exchanger, a radiator cooled by a fan, and a pump are connected by piping to circulate refrigerant therein. 冷却板を銅材で構成し、前記冷却板にヒートパイプの形状に相当する穴を設け、ヒートパイプを前記穴にグリースといっしょに挿入したことを特徴とする請求項１記載の半導体素子の冷却装置。 2. The cooling of a semiconductor device according to claim 1, wherein the cooling plate is made of a copper material, a hole corresponding to the shape of a heat pipe is provided in the cooling plate, and the heat pipe is inserted into the hole together with grease. apparatus. 熱交換器に、冷媒を流す内部空間と、ヒートパイプの形状に相当する穴とを個別に設け、前記ヒートパイプを前記穴にグリースと共に挿入したことを特徴とする請求項１記載の半導体素子の冷却装置。 2. The semiconductor element according to claim 1, wherein an internal space through which a refrigerant flows and a hole corresponding to a shape of a heat pipe are individually provided in the heat exchanger, and the heat pipe is inserted into the hole together with grease. Cooling system. 冷却板にヒートパイプの形状に相当する穴を設け、ヒートパイプを圧入勘合したことを特徴とする請求項１記載の半導体素子の冷却装置。 2. A cooling device for a semiconductor device according to claim 1, wherein a hole corresponding to the shape of the heat pipe is provided in the cooling plate, and the heat pipe is press-fitted into the cooling plate. 熱交換器の内部空間にヒートパイプを挿入し、前記ヒートパイプを前記熱交換器に気密的に固定したことを特徴とする請求項１記載の半導体素子の冷却装置。 2. The cooling device for a semiconductor device according to claim 1, wherein a heat pipe is inserted into an internal space of the heat exchanger, and the heat pipe is hermetically fixed to the heat exchanger. 熱交換器の内部空間内に挿入されたヒートパイプにフィンを形成したことを特徴とする請求項５記載の半導体素子の冷却装置。 6. The semiconductor device cooling apparatus according to claim 5, wherein fins are formed on a heat pipe inserted into the internal space of the heat exchanger. 熱交換器の内部空間に、連通穴を設けた仕切り板を設けて複数の仕切り空間を形成し、前記仕切り空間にヒートパイプをそれぞれ挿入して気密的に固定したことを特徴とする請求項１記載の半導体素子の冷却装置。 2. A partition plate provided with communication holes is provided in the internal space of the heat exchanger to form a plurality of partition spaces, and heat pipes are respectively inserted into the partition spaces and are hermetically fixed. The cooling device of a semiconductor element of description. 冷却回路に使用される冷媒は、熱交換器の内部空間で２相状態となることを特徴とする請求項１記載の半導体素子の冷却装置。 The cooling device for a semiconductor element according to claim 1, wherein the refrigerant used in the cooling circuit is in a two-phase state in the internal space of the heat exchanger. 放熱器とポンプと熱交換器とをその順番で接続し、前記放熱器と前記ポンプとは前記熱交換器よりも下に配設し、前記放熱器は上部に冷媒の入口を設けて下部に出口を設けたことを特徴とする請求項１記載の半導体素子の冷却装置。 A radiator, a pump, and a heat exchanger are connected in that order, and the radiator and the pump are arranged below the heat exchanger, and the radiator is provided with a refrigerant inlet at the top and at the bottom. The cooling device for a semiconductor device according to claim 1, wherein an outlet is provided. 熱交換器の冷媒の出口は下部に設けたことを特徴とする請求項１記載の半導体素子の冷却装置。 2. The cooling device for a semiconductor element according to claim 1, wherein the refrigerant outlet of the heat exchanger is provided at a lower portion.
JP2004183277A 2004-06-22 2004-06-22 Cooling device of semiconductor element Pending JP2006012874A (en)

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JP2007273774A (en) * 2006-03-31 2007-10-18 Fuji Electric Systems Co Ltd Capacitor cooling structure and power converter
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US7529089B2 (en) * 2007-03-16 2009-05-05 Cooler Master Co., Ltd Heat-dissipating device connected in series to water-cooling circulation system
JPWO2012059975A1 (en) * 2010-11-01 2014-05-12 富士通株式会社 Loop heat pipe and electronic device using the same
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Publication number Priority date Publication date Assignee Title
JP2007273774A (en) * 2006-03-31 2007-10-18 Fuji Electric Systems Co Ltd Capacitor cooling structure and power converter
US7529089B2 (en) * 2007-03-16 2009-05-05 Cooler Master Co., Ltd Heat-dissipating device connected in series to water-cooling circulation system
KR100823989B1 (en) 2007-05-04 2008-04-22 빛샘전자주식회사 Cooling apparatus and train drived electric power including the same
JPWO2012059975A1 (en) * 2010-11-01 2014-05-12 富士通株式会社 Loop heat pipe and electronic device using the same
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US9696096B2 (en) 2010-11-01 2017-07-04 Fujitsu Limited Loop heat pipe and electronic equipment using the same
CN104930889B (en) * 2014-03-19 2017-01-25 海尔集团公司 Heat exchanger and semi-conductor wine cabinet
CN104930889A (en) * 2014-03-19 2015-09-23 海尔集团公司 Heat exchanger and semi-conductor wine cabinet
CN107664454A (en) * 2016-07-29 2018-02-06 双鸿科技股份有限公司 The electronic installation of this loop hot-pipe of loop hot-pipe and application
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