CN104930889B - Heat exchanger and semi-conductor wine cabinet - Google Patents

Heat exchanger and semi-conductor wine cabinet Download PDF

Info

Publication number
CN104930889B
CN104930889B CN201410102908.3A CN201410102908A CN104930889B CN 104930889 B CN104930889 B CN 104930889B CN 201410102908 A CN201410102908 A CN 201410102908A CN 104930889 B CN104930889 B CN 104930889B
Authority
CN
China
Prior art keywords
described
plane
heat
heat pipe
transfer block
Prior art date
Application number
CN201410102908.3A
Other languages
Chinese (zh)
Other versions
CN104930889A (en
Inventor
马坚
肖长亮
慕志光
张进
杨艳
王定远
孙科
Original Assignee
海尔集团公司
青岛海尔特种电冰柜有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海尔集团公司, 青岛海尔特种电冰柜有限公司 filed Critical 海尔集团公司
Priority to CN201410102908.3A priority Critical patent/CN104930889B/en
Publication of CN104930889A publication Critical patent/CN104930889A/en
Application granted granted Critical
Publication of CN104930889B publication Critical patent/CN104930889B/en

Links

Abstract

The invention provides a heat exchanger and a semi-conductor wine cabinet. The heat exchanger comprises a heat exchanging block exchanging heat with cold source or heat source, a plurality of independent heat pipes, two ends of each which are sealed, wherein cold media is sealed in each heat pipe; a first end of each heat pipe is embedded into the heat exchanging block in a pres fit embedding way; and the at least part embedded into the heat exchanging block is a flat pipe. With the heat exchanging block embedded into the heat exchanger in a press fit way, so stable connection can be achieved; the embedded part is the flat pipe, so heat exchanging efficiency can be further improved; and besides, the invention further discloses a semi-conductor wine cabinet utilizing the heat exchanger.

Description

A kind of heat exchanger and quasiconductor wine cabinet

Technical field

The present invention relates to refrigeration plant, more particularly to a kind of heat exchanger and the quasiconductor wine using this heat exchanger Cabinet.

Background technology

The heat pipe of heat exchanger and the heat transfer block that are used for refrigeration plant in prior art normally only adopt screw or welding Mode connects, and easily loosens between the heat pipe of this heat exchanger and heat transfer block, and the two contact point is less thus causes heat exchange Less efficient.And, in the prior art, it is not suitable for the heat exchanger of quasiconductor wine cabinet.

Additionally, meeting when the compressor of compressor wine cabinet of the prior art and other mechanical moving elements (as blower fan) run Produce mechanical vibration and send noise more than 40 decibels, in the relatively quiet place such as parlor, this mechanical vibration and noise Become apparent from, easily cause discomfort to consumer, affect Consumer's Experience.Further, since the temperature of the vaporizer of compressor wine cabinet Fluctuation is big, and therefore in wine cabinet, easy frosting is so that wine cabinet temperature is unstable.

In order to solve the above problems, in recent years, those skilled in the art are proposed one kind and are realized using semiconductor chilling plate The quasiconductor wine cabinet of refrigeration.Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.Its advantage is not motion portion Part, can apply in some limited space, reliability requirement is high and needs to reduce the occasion of cold-producing medium pollution.According to quasiconductor material Peltier (peltier) effect of material, when the galvanic couple that unidirectional current is connected into by two kinds of different semi-conducting materials, in galvanic couple Two ends can absorb heat respectively and release heat, such that it is able to realize the purpose freezed.Quasiconductor wine cabinet uses quasiconductor system The cold end of cold is freezed so that wine in-cabinet temperature is stable, overcomes the temperature fluctuation that compressor cooling mode causes big Defect, and do not use compressor cooling, considerably reduce noise, mechanical vibration are also relatively small.Generally, for list The hot junction of semiconductor chilling plate of layer can produce 30 to 50 DEG C of the temperature difference with freezing, therefore can using single layer of semiconductor cooling piece To be readily available 5-20 DEG C of wine cabinet temperature.It also has the advantage that structure is simple, and part is few, easy to maintenance;Mechanical Drive disk assembly, thus not produce abrasion, life-span length;Noise is low, and vibration is few;Without chiller refrigeration, environmental protection;Efficiency high, consumption Electricity low (in below 100w, power consumption only has the half of compression refrigeration equipment and absorption refrigerating equipment).

Although the vibration of quasiconductor wine cabinet and noise are less, because it generally adopts the heat to semiconductor chilling plate for the blower fan End radiating, due to can produce loud noise and mechanical vibration in blower fan work, quasiconductor wine cabinet therefore of the prior art is still no Method reaches low noise, low vibration or even zero noise, the effect of zero vibration.

Content of the invention

One object of the present invention is intended to overcome at least one defect of the refrigeration plant of prior art, provides a kind of heat pipe Firmly be connected with heat transfer block, the heat exchanger of high efficient heat exchanging and quasiconductor wine cabinet.

The present invention one further objective is that noise and the vibration that will reduce when quasiconductor wine cabinet runs.

In order to realize said one or multiple purpose, the invention provides a kind of heat exchanger, comprising: heat transfer block, configuration Become and low-temperature receiver or thermal source heat exchange;Many separate heat pipes, every described heat pipe closed at both ends and the closing of described inside heat pipe There is coolant;Wherein, the first end of every described heat pipe is embedded in described heat transfer block by the embedded method of pressing;Described heat pipe At least embed described heat transfer block part be flat tube.

Alternatively, described many separate heat pipes at least include: the first heat pipe, after stretching out from described heat transfer block, prolong Extend the first plane, along straight-line extension in described first plane, and be bent to second plane vertical with described first plane, Along straight-line extension to the second end of described first heat pipe in described second plane;Second heat pipe, after stretching out from described heat transfer block, Extend to the first plane, along straight-line extension in described first plane, and be bent to and described first plane, described second plane The 3rd all vertical plane, along straight-line extension to the second end of described second heat pipe in described 3rd plane;3rd heat pipe, from After described heat transfer block stretches out, extend to the first plane, along straight-line extension in described first plane, and be bent to and described second The parallel fourth plane of plane, along straight-line extension to the second end of described 3rd heat pipe in described fourth plane.

Alternatively, described many separate heat pipes also include at least one other heat pipes, other heat pipes described in every After stretching out from described heat transfer block, extend to described first plane, along straight-line extension in described first plane, and be bent to described Second plane or the 3rd plane or fourth plane, along straight-line extension to its second end in the plane being bent to.

Alternatively, described first heat pipe in described first plane along linearly extended path and described first heat pipe in institute Along linearly extended path, vertical projection in the horizontal plane is mutually perpendicular to and is in the outer of described heat transfer block in plane to state second The same side of end face;Described second heat pipe in described first plane along linearly extended path with described second heat pipe described In 3rd plane, along linearly extended path, vertical projection in the horizontal plane is mutually perpendicular to and is in the outer end of described heat transfer block The same side in face;Described 3rd heat pipe in described first plane along linearly extended path and described 3rd heat pipe described the In four planes, along linearly extended path, vertical projection in the horizontal plane is mutually perpendicular to and is in the outer face of described heat transfer block The same side.

Alternatively, described first heat pipe is partly parallel to described 3rd heat pipe the 4th what the second rectilinear in planes extended The part that rectilinear in planes extends.

Alternatively, when described heat transfer block is configured to low-temperature receiver heat exchange, described coolant is r134a or r600a.

Alternatively, when described heat transfer block is configured to thermal source heat exchange, described coolant is water.

In order to realize said one or multiple purpose, present invention also offers a kind of quasiconductor wine cabinet, described quasiconductor wine Cabinet includes above-mentioned heat exchanger.

Alternatively, described low-temperature receiver is the cold end of semiconductor chilling plate, the described heat transfer block described cold end of laminating;Described 3rd is flat Face be the inner bag of described quasiconductor wine cabinet upper surface be located plane, described first plane, described second plane, the described 4th Plane is respectively the plane that any three sides adjacent with described upper surface of the inner bag of described quasiconductor wine cabinet are located.

Alternatively, described thermal source is the hot junction of semiconductor chilling plate, the described hot junction of described heat transfer block laminating;Described 3rd is flat Face be the shell of described quasiconductor wine cabinet upper surface be located plane, described first plane, described second plane, the described 4th Plane is respectively the plane that any three sides adjacent with described upper surface of the shell of described quasiconductor wine cabinet are located.

Alternatively, described heat transfer block is copper billet;Described inner bag is aluminum liner.

Alternatively, described heat transfer block is copper billet;Described shell is aluminium shell.

The heat exchanger of the present invention embeds heat transfer block due to the method embedded by pressing, and therefore the two being capable of the company of consolidating Connect, and because embedded part is flat tube, so that heat exchange efficiency is improved further.

Further, the heat pipe of the heat exchanger of the present invention is due to having special shape so that the heat exchange area of heat pipe Larger and be evenly distributed, therefore, it is possible to largely improve heat exchange efficiency.

Further, because at least four faces and the heat pipe uniform contact of the inner bag of quasiconductor wine cabinet is so that quasiconductor system The cold that cold cold end produces can efficiently, be uniformly scattered onto inner bag, and blower fan need not be set in it by semiconductor chilling plate Cold end provide cold spread;In the same manner, because the heat that the hot junction of semiconductor chilling plate produces can efficiently, uniformly dissipate Cloth is to shell, and using blower fan, need not be radiated in the hot junction of semiconductor chilling plate;So need not set in quasiconductor wine cabinet Put blower fan, reduce noise and vibration, improve Consumer's Experience.

According to the detailed description to the specific embodiment of the invention below in conjunction with accompanying drawing, those skilled in the art will be brighter The above-mentioned and other purposes of the present invention, advantages and features.

Brief description

Describe some specific embodiments of the present invention hereinafter with reference to the accompanying drawings by way of example, and not by way of limitation in detail. In accompanying drawing, identical reference denotes same or similar part or part.It should be appreciated by those skilled in the art that these Accompanying drawing is not necessarily drawn to scale.In accompanying drawing:

Fig. 1 is the heat transfer block heat pipe interior with being embedded in it of heat exchanger according to an embodiment of the invention along described The sectional view of the radial direction of heat pipe;

Fig. 2 is that the cold end that heat exchanger shown in use Fig. 1 according to an embodiment of the invention is semiconductor chilling plate is entered The structural representation of the quasiconductor wine cabinet of row heat exchange;

Fig. 3 is that the hot junction that heat exchanger shown in use Fig. 1 according to an embodiment of the invention is semiconductor chilling plate is entered The structural representation of the quasiconductor wine cabinet of row heat exchange;

Fig. 4 is the heat exchange of the heat exchanger of hot junction heat exchange with semiconductor chilling plate according to an embodiment of the invention Block, heat pipe, the attachment structure schematic diagram in semiconductor chilling plate hot junction.

Used in accompanying drawing, reference is as follows:

101 heat transfer blocks,

102 first heat pipes,

103 second heat pipes,

104 the 3rd heat pipes,

105 the 4th heat pipes,

201 first planes,

202 second planes,

203 the 3rd planes,

204 fourth plane,

205 inner bags,

206 shells,

The hot junction of 401 semiconductor chilling plates,

402 heat exchange fins.

Specific embodiment

Fig. 1 is the heat transfer block heat pipe interior with being embedded in it of heat exchanger according to an embodiment of the invention along heat pipe Radial direction sectional view.As seen from Figure 1, this heat exchanger may include heat transfer block 101 and the separate heat pipe of Duo Gen.Often Root heat pipe closed at both ends and inside heat pipe is closed with coolant.In the embodiment shown in fig. 1, the first end of every heat pipe can be passed through The embedded method of pressing is embedded in heat transfer block 101, to improve the firmness that the two connects;And at least embedded heat transfer block of heat pipe 101 part is flat tube.Because the heat exchange efficiency of flat tube is higher than pipe, therefore, the heat exchange efficiency of heat pipe and heat transfer block 101 Also it is improved.

In one embodiment of the invention, what heat pipe was embedded into heat transfer block 101 partly can run through the two of heat transfer block 101 End, so while improving the firmness that the two connects further, also increases the contact area of the two, improves heat exchange effect Rate.

Fig. 2 is that the cold end that heat exchanger shown in use Fig. 1 according to an embodiment of the invention is semiconductor chilling plate is entered The structural representation of the quasiconductor wine cabinet of row heat exchange.Can be seen that in an embodiment of the present invention in conjunction with Fig. 1, Fig. 2, many phases Mutually independent heat pipe at least may include the first heat pipe 102 to the 3rd heat pipe 104.Wherein, the first heat pipe 102 is stretched from heat transfer block 101 After going out, extend to the first plane 201, along straight-line extension in the first plane 201, and be bent to vertical with the first plane 201 Second plane 202, along straight-line extension to the second end of the first heat pipe 102 in the second plane 202;Second heat pipe 103 is from heat exchange After block 101 stretches out, extend to the first plane 201, along straight-line extension in the first plane 201, and be bent to and the first plane 201st, the 3rd all vertical plane 203 of the second plane 202, along straight-line extension to the of the second heat pipe 103 in the 3rd plane 203 Two ends;After 3rd heat pipe 104 stretches out from heat transfer block 101, extend to the first plane 201, prolong along straight line in the first plane 201 Stretch, and be bent to the fourth plane 204 parallel with the second plane 202, along straight-line extension to the 3rd heat pipe in fourth plane 204 104 the second end.

In one embodiment of the invention, many separate heat pipes may also include at least one other heat pipes, example The 4th heat pipe 105 as shown in Figure 1 and Figure 2.After every other heat pipe stretches out from heat transfer block 101, may extend to the first plane 201, Along straight-line extension in the first plane 201, and it is bent to the second plane 202 or the 3rd plane 203 or fourth plane 204, curved Roll over to plane in along straight-line extension to its second end.In one embodiment of the invention, the first heat pipe 102 is in the second plane In 202 linearly extended partly can parallel to the 3rd heat pipe 104 in fourth plane 204 linearly extended part.Second heat Pipe 103 in the 3rd plane 203 linearly extended part can also parallel to the 4th heat pipe 105 in the 3rd plane 203 straight line The part extending.

In another embodiment of the present invention, every heat pipe can be along the linearly extended path of the first plane 201 and its edge The path that another plane and straight line extends vertical projection in the horizontal plane be mutually perpendicular to and be in heat transfer block 101 outer face same Side.Specifically, the first heat pipe 102 can be flat second with the first heat pipe 102 along linearly extended path in the first plane 201 Along linearly extended path, vertical projection in the horizontal plane is mutually perpendicular to and is in the outer face of heat transfer block 101 in face 202 The same side;Second heat pipe 103 can be with the second heat pipe 103 in the 3rd plane 203 along linearly extended path in the first plane 201 Interior along linearly extended path vertical projection in the horizontal plane be mutually perpendicular to and be in heat transfer block 101 outer face same Side;3rd heat pipe 104 in the first plane 201 along linearly extended path can with the 3rd heat pipe 104 in fourth plane 204 edge Linearly extended path vertical projection in the horizontal plane be mutually perpendicular to and be in heat transfer block 101 outer face the same side;The Four heat pipes 105 in the first plane 201 along linearly extended path can with the 4th heat pipe 105 in the 3rd plane 203 along straight line The path vertical projection in the horizontal plane extending be mutually perpendicular to and be in heat transfer block 101 outer face the same side.

In the embodiment shown in Figure 2, can be by this heat exchanger application in quasiconductor wine cabinet, this quasiconductor wine cabinet can Shape for cuboid or approximate cuboid.In some embodiments of the invention, the first heat pipe 102, the second heat pipe 103 are partly After one sided linear of the inner bag 205 of conductor wine cabinet extends, the upper surface being folded into the inner bag 205 of quasiconductor wine cabinet continues directly Line extends;3rd heat pipe 104, the 4th heat pipe 105, after the extension of this sided linear, are folded into this side with inner bag 205 and interior The upper surface of gallbladder 205 is perpendicular and two sided linear that be parallel to each other extend.In other words, the 3rd plane 203 is quasiconductor wine The plane that the upper surface of the inner bag 205 of cabinet is located, the first plane 201, the second plane 202, fourth plane 204 are respectively quasiconductor The plane that any three sides adjacent with upper surface of the inner bag 205 of wine cabinet are located.In the process, heat pipe is fitted in inner bag 205 surface, the two close contact, to reach more preferable radiating effect.Because the temperature difference at heat pipe two ends is typically within 1 DEG C, and Its one end laminating inner bag 205, the other end is freezed by the cold end of semiconductor chilling plate, and therefore it can absorb inner bag 205 well Heat, reduce the purpose of inner bag 205 temperature.Now, the inner bag 205 of wine cabinet can be aluminum liner 205, so that more preferably Ground heat transfer;Heat transfer block 101 can be copper billet or aluminium block, preferably copper billet, with increase heat exchange efficiency and reduce be subject to corrode

In other embodiments of the present invention, heat transfer block 101 can be cold with the semiconductor chilling plate of quasiconductor wine cabinet End laminating, that is, it is used for and low-temperature receiver heat exchange.Now the coolant in heat pipe can be r134a or r600a, and it is with respect to existing perfusion Carbon dioxide gass body technique is more reliable, is more prone to realize for production.In other embodiments of the invention, heat exchanger Heat transfer block 101 can be conducted heat with other low-temperature receivers.

Fig. 3 is that the hot junction that heat exchanger shown in use Fig. 1 according to an embodiment of the invention is semiconductor chilling plate is entered The structural representation of the quasiconductor wine cabinet of row heat exchange.In the embodiment shown in fig. 3, the structure of heat exchanger and above-described embodiment Heat exchanger structure similar.

In the embodiment shown in fig. 3, can be by heat exchanger application in quasiconductor wine cabinet, this quasiconductor wine cabinet is length Cube or the shape of approximate cuboid.One side of the first heat pipe 102, the second heat pipe 103 shell 206 in quasiconductor wine cabinet After straight-line extension, the upper surface being folded into the shell 206 of quasiconductor wine cabinet continues straight-line extension;3rd heat pipe 104, the 4th heat pipe 105 after this sided linear extends, and is folded into this side with inner bag 205 and the upper surface of shell 206 is perpendicular and mutually flat Two sided linear of row extend.In other words, the 3rd plane 203 is the flat of the upper surface place of the inner bag 205 of quasiconductor wine cabinet Face, the first plane 201, the second plane 202, fourth plane 204 are respectively the adjacent with upper surface of the shell 206 of quasiconductor wine cabinet The plane that is located of any three sides.In the process, heat pipe is fitted in the surface of shell 206, and the two close contact, to reach To more preferable radiating effect.Now, the shell 206 of wine cabinet can be aluminium shell 206, and its radiating efficiency is higher, therefore, it is possible to relatively The fast heat carrying out heat pipe transmission is dispersed in environment.Heat transfer block 101 can be copper billet or aluminium block, preferably copper billet, to increase Heat exchange efficiency and reduce be subject to corrode.

In one embodiment of the invention, can be by the hot junction of heat exchanger and the semiconductor chilling plate of quasiconductor wine cabinet Laminating, that is, it is used for and thermal source heat exchange.Now the coolant in heat pipe can be water, and this design makes the operation when irrigating coolant Simply, with low cost.In other embodiments of the invention, the heat transfer block 101 of heat exchanger can be conducted heat with other thermals source.

Fig. 4 is the heat exchange of the heat exchanger of hot junction heat exchange with semiconductor chilling plate according to an embodiment of the invention Block, heat pipe, the attachment structure schematic diagram in semiconductor chilling plate hot junction.In the embodiment shown in fig. 4, half with quasiconductor wine cabinet The heat transfer block 101 of hot junction 401 laminating of conductor cooling piece is also provided with heat exchange fin 402, with heat pipe by heat transfer To quasiconductor wine cabinet shell 206 while, from heat exchange fin 402, heat transfer block 101 is delivered to the hot junction of semiconductor chilling plate A part of heat distributed, play the effect of auxiliary heat dissipation.

In conjunction with Fig. 1-Fig. 4 it can be seen that in the above-described embodiments, it is the changing of being radiated of cold end of semiconductor chilling plate During semiconductor chilling plate can be clamped in by hot block 101 and the heat transfer block 101 being radiated with the hot junction for semiconductor chilling plate Between, wherein it is in inner side for the heat transfer block 101 that the cold end of semiconductor chilling plate is radiated, be that the hot junction of semiconductor chilling plate is entered The heat transfer block 101 of row radiating is in outside.Three's row becomes complete thermal transfer devices, can be by quasiconductor wine cabinet The heat transfer that the wine cabinet space that gallbladder 205 row becomes produces is to the shell 206 of quasiconductor wine cabinet.Specifically, quasiconductor wine cabinet is interior The heat that the wine cabinet space that gallbladder 205 is formed produces can be delivered to semiconductor chilling plate by heat exchanger as shown in Figure 2 Cold end;And the hot junction 401 of semiconductor chilling plate is passed to by the cold end of semiconductor chilling plate;It is delivered to the heat of semiconductor chilling plate The heat at end 401 can be delivered to the shell 206 of quasiconductor wine cabinet, final quasiconductor wine by heat exchanger as shown in Figure 3 The shell 206 of cabinet transfers heat in surrounding.

This scheme makes the cold end of semiconductor chilling plate pass through the inner bag that a heat exchanger connects quasiconductor wine cabinet 205, also make the hot junction 401 of semiconductor chilling plate connect the shell 206 of quasiconductor wine cabinet by another heat exchanger, not only Have the advantages that simple and compact for structure, part is few, low cost, easy to maintenance, and the special form of the heat pipe due to this heat exchanger Shape so that heat pipe can efficiently, equably inner bag 205 and shell 206 heat-shift with quasiconductor wine cabinet, thus need not use Blower fan carries out to wine cabinet space air-cooled and is radiated such that it is able to wine is greatly lowered in the hot junction 401 of semiconductor chilling plate The noise of cabinet and mechanical vibration, improve Consumer's Experience.

So far, although those skilled in the art will appreciate that detailed herein illustrate and describe the multiple of the present invention and show Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure Determine or derive other variations or modifications of many meeting the principle of the invention.Therefore, the scope of the present invention is it is understood that and recognize It is set to and cover other variations or modifications all these.

Claims (11)

1. a kind of heat exchanger is it is characterised in that include:
Heat transfer block, is configured to and low-temperature receiver or thermal source heat exchange;
Many separate heat pipes, every described heat pipe closed at both ends and described inside heat pipe is closed with coolant;Described many Separate heat pipe at least includes: the first heat pipe, after stretching out from described heat transfer block, extends to the first plane, described first Along straight-line extension in plane, and it is bent to second plane vertical with described first plane, along straight line in described second plane Extend to the second end of described first heat pipe;Second heat pipe, after stretching out from described heat transfer block, extends to the first plane, described Along straight-line extension in first plane, and it is bent to threeth plane all vertical with described first plane, described second plane, in institute State in the 3rd plane along straight-line extension to the second end of described second heat pipe;3rd heat pipe, after stretching out from described heat transfer block, extends To the first plane, along straight-line extension in described first plane, and it is bent to the fourth plane parallel with described second plane, Along straight-line extension to the second end of described 3rd heat pipe in described fourth plane;
Wherein, the first end of every described heat pipe is embedded in described heat transfer block by the embedded method of pressing;Described heat pipe The part at least embedding described heat transfer block is flat tube.
2. heat exchanger according to claim 1 it is characterised in that
Described many separate heat pipes also include at least one other heat pipes, and described in every, other heat pipes are from described heat transfer block After stretching out, extend to described first plane, along straight-line extension in described first plane, and be bent to described second plane or Three planes or fourth plane, along straight-line extension to its second end in the plane being bent to.
3. heat exchanger according to claim 2 it is characterised in that
Described first heat pipe in described first plane along linearly extended path and described first heat pipe in described second plane Interior along linearly extended path vertical projection in the horizontal plane be mutually perpendicular to and be in described heat transfer block outer face same Side;
Described second heat pipe in described first plane along linearly extended path and described second heat pipe in described 3rd plane Interior along linearly extended path vertical projection in the horizontal plane be mutually perpendicular to and be in described heat transfer block outer face same Side;
Described 3rd heat pipe in described first plane along linearly extended path and described 3rd heat pipe in described fourth plane Interior along linearly extended path vertical projection in the horizontal plane be mutually perpendicular to and be in described heat transfer block outer face same Side.
4. heat exchanger according to claim 3 it is characterised in that
Described first heat pipe is partly parallel to described 3rd heat pipe straight line in fourth plane what the second rectilinear in planes extended The part extending.
5. heat exchanger according to claim 4 it is characterised in that
When described heat transfer block is configured to low-temperature receiver heat exchange, described coolant is r134a or r600a.
6. heat exchanger according to claim 4 it is characterised in that
When described heat transfer block is configured to thermal source heat exchange, described coolant is water.
7. a kind of quasiconductor wine cabinet is it is characterised in that include the heat exchanger described in any one of claim 1-6.
8. quasiconductor wine cabinet according to claim 7 it is characterised in that
Described low-temperature receiver is the cold end of semiconductor chilling plate, the described heat transfer block described cold end of laminating;
Described 3rd plane is the plane that is located of upper surface of the inner bag of described quasiconductor wine cabinet, described first plane, described the Two planes, described fourth plane are respectively any three sides adjacent with described upper surface of the inner bag of described quasiconductor wine cabinet The plane being located.
9. quasiconductor wine cabinet according to claim 7 it is characterised in that
Described thermal source is the hot junction of semiconductor chilling plate, the described hot junction of described heat transfer block laminating;
Described 3rd plane is the plane that is located of upper surface of the shell of described quasiconductor wine cabinet, described first plane, described the Two planes, described fourth plane are respectively any three sides adjacent with described upper surface of the shell of described quasiconductor wine cabinet The plane being located.
10. quasiconductor wine cabinet according to claim 8 it is characterised in that
Described heat transfer block is copper billet;
Described inner bag is aluminum liner.
11. quasiconductor wine cabinets according to claim 9 it is characterised in that
Described heat transfer block is copper billet;
Described shell is aluminium shell.
CN201410102908.3A 2014-03-19 2014-03-19 Heat exchanger and semi-conductor wine cabinet CN104930889B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410102908.3A CN104930889B (en) 2014-03-19 2014-03-19 Heat exchanger and semi-conductor wine cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410102908.3A CN104930889B (en) 2014-03-19 2014-03-19 Heat exchanger and semi-conductor wine cabinet

Publications (2)

Publication Number Publication Date
CN104930889A CN104930889A (en) 2015-09-23
CN104930889B true CN104930889B (en) 2017-01-25

Family

ID=54118168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410102908.3A CN104930889B (en) 2014-03-19 2014-03-19 Heat exchanger and semi-conductor wine cabinet

Country Status (1)

Country Link
CN (1) CN104930889B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106288895B (en) * 2016-09-19 2019-02-22 上海珊泽精密金属制品有限公司 Inlay the radiator and preparation method thereof of heat pipe

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1172937A (en) * 1996-07-29 1998-02-11 三洋电机株式会社 Cooling storage storehouse
JPH10267572A (en) * 1997-03-19 1998-10-09 Fujikura Ltd Heat pipe retaining structure
JP2006012874A (en) * 2004-06-22 2006-01-12 Matsushita Electric Ind Co Ltd Cooling device of semiconductor element
JP2006269634A (en) * 2005-03-23 2006-10-05 Fujikura Ltd Heat sink with fan
JP2009270750A (en) * 2008-05-05 2009-11-19 Cpumate Inc Flattening method of heat pipe evaporating section buried in radiator and radiator with heat pipe
CN102221153A (en) * 2011-06-09 2011-10-19 中山伟强科技有限公司 High-power light-emitting diode (LED) lamp
CN102595711A (en) * 2012-01-17 2012-07-18 中山伟强科技有限公司 LED lighting system based on network operation and control and high-power LED lamp
CN202918641U (en) * 2012-11-16 2013-05-01 东莞汉旭五金塑胶科技有限公司 Heat pipe radiator
CN103438741A (en) * 2013-08-29 2013-12-11 中山市久能光电科技有限公司 Radiator

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1172937A (en) * 1996-07-29 1998-02-11 三洋电机株式会社 Cooling storage storehouse
JPH10267572A (en) * 1997-03-19 1998-10-09 Fujikura Ltd Heat pipe retaining structure
JP2006012874A (en) * 2004-06-22 2006-01-12 Matsushita Electric Ind Co Ltd Cooling device of semiconductor element
JP2006269634A (en) * 2005-03-23 2006-10-05 Fujikura Ltd Heat sink with fan
JP2009270750A (en) * 2008-05-05 2009-11-19 Cpumate Inc Flattening method of heat pipe evaporating section buried in radiator and radiator with heat pipe
CN102221153A (en) * 2011-06-09 2011-10-19 中山伟强科技有限公司 High-power light-emitting diode (LED) lamp
CN102595711A (en) * 2012-01-17 2012-07-18 中山伟强科技有限公司 LED lighting system based on network operation and control and high-power LED lamp
CN202918641U (en) * 2012-11-16 2013-05-01 东莞汉旭五金塑胶科技有限公司 Heat pipe radiator
CN103438741A (en) * 2013-08-29 2013-12-11 中山市久能光电科技有限公司 Radiator

Also Published As

Publication number Publication date
CN104930889A (en) 2015-09-23

Similar Documents

Publication Publication Date Title
CN203810612U (en) Small semiconductor air conditioner
JP6336123B2 (en) Rotary series magnetic refrigeration system
CN201751573U (en) Wind machine with refrigerating system
CN204535494U (en) A kind of many pedestals position heat exchanger
CN105737439B (en) A kind of air-conditioning system using solar energy and thermoelectricity supercooling apparatus
MY162123A (en) Cooling system
US10386085B2 (en) Semiconductor-based air conditioning device
CN101566415B (en) Energy-conserving refrigerator
CN104320953B (en) Secondary water-loop server cabinet cooling system
CN204157201U (en) A kind of intermediate water loop server cabinet cooling system
CN203810826U (en) Refrigerator
CN101619879B (en) Heat radiator with air pump separate type thermosiphon for machine room or machine cabinet
US10619951B2 (en) Phase transition suppression heat transfer plate-based heat exchanger
US8841803B2 (en) Superconducting rotating machine having cooler for rotator
WO2017215168A1 (en) Cooling system of working medium contact type for high-power device, and working method thereof
CN201532052U (en) Semiconductor refrigeration system
CN105310816A (en) Medical semiconductor cold and hot compress machine and cold and hot compress technology thereof
US20130291564A1 (en) Thermoelectric cooling systems
US20110198057A1 (en) Heat dissipation apparatus for data center
CN102573420B (en) Embedded cabinet air-conditioning refrigeration system
CN103648252B (en) Cooling system for electrical device
CN205509228U (en) Laser instrument heat dissipation refrigerating plant
CN105201788B (en) The device that a kind of application freezer compressor heat thermo-electric generation cools
CN201206919Y (en) Refrigeration and heat-production device
CN203943523U (en) A kind of semiconductor refrigerating drinking water apparatus

Legal Events

Date Code Title Description
PB01 Publication
C06 Publication
SE01 Entry into force of request for substantive examination
C10 Entry into substantive examination
GR01 Patent grant
C14 Grant of patent or utility model