JP2010067660A - Electronic device and component for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce power consumption required for cooling an electronic device by improving the efficiency of heat dissipation without increasing the volume of a component, and also reduce noise thereof, in the electronic device such as a server computer and the component for the same. <P>SOLUTION: A component 10 for an electronic device includes a substrate 70 mounted with each electronic component 71 that generates heat, and a container 11, 12 storing a substrate 70 and formed so as to allow cooling air to be introduced thereinto. A heat transfer device 13 is provided on the container 11 in order to increase a heat transfer speed in an in-plane direction of the container 11. The container 11 and each electronic component 71 are brought into thermal contact with each other by a heat transfer member 15. Further, the component is configured to provide a fin 14 extending from the container 11 to the inside of the container. As the heat transfer device 13, it is devised to use a heat pipe, a circulating heat pipe, a self-excited vibration type heat pipe, and a liquid-cooled device or the like that forcibly circulates cooling liquid by a pump. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to the structure of an electronic device such as a server computer and its components.

  In recent years, blade servers with high integration and extensibility have attracted attention as electronic devices such as server computers. A plurality of components called blades are housed in the enclosure of the blade server. Each blade accommodates a board on which elements necessary as a computer such as a CPU (microprocessor), a memory, and an HDD (hard disk drive) are mounted. By inserting the necessary number of blades into the blade server enclosure, a server of a desired scale can be constructed. A power supply module for supplying power to each blade and a blower fan module for cooling the blade are provided on the housing side, and each blade shares these modules. For this reason, the blade which accommodates a board | substrate can be reduced in size, and many CPUs can be integrated in a narrow space.

  For example, as shown in FIG. 1, such a blade is covered with a box-shaped metal container 100. As shown in FIG. 2, a box-shaped metal container 100 includes a lid (top plate) 110 and a box 111 that are detachably provided, and a substrate 120 on which electronic components such as a CPU are mounted is a box. 111 is fixed inside.

  In the conventional blade substrate 120, as shown in FIG. 2, a relatively large CPU heat sink 121 is independently provided for a CPU having a large heat generation amount of 50 to 150 W. In addition, a heat spreader 123 and a chip set heat sink 122 are separately attached to a memory module (DIMM) and a chip set, each having a heat generation amount of about 10 W, respectively.

  Further, the CPU that generates the largest amount of heat and requires a high cooling capacity is arranged on the front side (reference numeral F side), which is the windward side, in the blade so that it can be cooled by wind with a low temperature.

In addition, in a wireless device provided with a means for forced air cooling with an air flow, an electronic component with a small amount of heat generation is arranged on the windward side of the board, and a device with a large amount of heat generation is arranged on the leeward side (for example, Patent Document 1). Moreover, there exists what dissipates the heat | fever of the electronic component which generate | occur | produces with a heat pipe, and dissipates heat from a frame (for example, patent document 2). Further, there is known a structure in which a heat radiating fin is provided in a duct provided in a housing and the heat radiating fin and the CPU are connected by a heat pipe (for example, Patent Document 3).
JP-A-11-224898 Japanese Patent Laid-Open No. 11-121958 JP 2002-210773 A “Technical Information New Heat Transport Technology Heat Lane”, [online], TS Heattronics Co., Ltd. [Search May 12, 2008], Internet <URL: http://www.tsheatronics.co.jp/technology/index .html>

  In recent years, there has been a demand for higher performance of blade servers, and accordingly, the amount of heat generated by electronic components such as CPUs has increased. For this reason, the blade server described above is not sufficiently cooled, and there is a risk of malfunction or failure.

  Therefore, an object of the present invention is to improve heat dissipation efficiency without increasing the volume of components in electronic devices such as server computers and their components.

  The above-described object is to provide a board on which an electronic component that generates heat is mounted, a container that accommodates the board and is capable of introducing a cooling air flow therein, and transfers heat from the electronic part to the container. And a heat transport device that diffuses heat transferred to the container to one surface of the container at a speed faster than the heat conduction speed of the container.

  According to the above-described component, the heat transport device that quickly diffuses heat is provided on one surface of the container, and the container and the electronic component that generates heat are in thermal contact via the heat transfer member. Thereby, the heat of an electronic component can be quickly radiated from the container side with a large surface area, and the heat radiation efficiency by the airflow which flows through the inside of a container can be improved rather than before. As a result, heat dissipation efficiency can be improved without increasing the volume of the component, the number of rotations of the air cooling fan can be suppressed, and power consumption and noise reduction required for cooling the electronic device can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(Embodiment)
1. Blade server (electronic equipment)
The blade server according to the embodiment of the present invention will be described below with reference to FIG. FIG. 3A is a perspective view showing the blade server according to the embodiment of the present invention, and FIG. 3B is a rear view of the blade server according to the embodiment of the present invention.

  As shown in FIG. 3A, the blade server 80 according to the embodiment includes a box-shaped casing 81, and air cooling is performed on the back side of the casing 81 (the right rear side in FIG. 3A). A fan module 82, a network blade 85, and a power supply module 86 are provided. Further, a blade (component) 10 is accommodated on the front side of the housing 81 (the left front side in FIG. 3A). The air cooling fan module 82 generates wind (air flow) from the front side toward the back side in the blade 10. The network blade 85 connects each blade 10 and an external LAN (Local Area Network). The power supply module 86 supplies power to the air cooling fan module 82, the network blade 85, each blade 10, and the like. Although not particularly illustrated, on the back side of each blade 10 of the housing 81, a substrate called a backplane provided with connectors for connecting each blade 10 and the device on the housing 81 side is disposed. Each blade 10 and the equipment on the side of the casing 81 are electrically connected by this backplane.

2. Blade Hereinafter, the blade 10 will be described with reference to FIGS. 4 to 7. 4A is a top view of the top plate of the blade, and FIG. 4B is a bottom view thereof. FIG. 5 is a view of the top plate of the blade as viewed from the front side. FIG. 6 is a cross-sectional view taken along the line II in FIG. FIG. 7 is a schematic diagram showing a blade. In FIG. 4, the side indicated by the symbol F is the front side of the blade, and the side indicated by the symbol R is the back side (the same applies to the other drawings).

  As shown in FIG. 7, the blade 10 includes a container including a top plate 11 and a box 12 and a substrate 70. The substrate 70 is fixed to the box body 12 side. On the substrate 70, in addition to the CPU 71, electronic components such as a memory module and a chip set are mounted, although not particularly shown. Further, although not shown in the figure, the box body 12 is formed with vent holes for introducing a cooling air flow on the front side and the back side.

  A heat pipe 13 is arranged on the outer surface (upper surface) of the top plate 11 of the present embodiment as shown in FIG. The heat pipe 13 is arranged to extend in the longitudinal direction of the top plate 11 and to extend in the width direction. With the heat pipe 13, the top plate 11 has high thermal conductivity in the in-plane direction. . The heat pipe 13 is a metal pipe having a capillary structure on the inner wall of the pipe. The inside of the heat pipe 13 is decompressed, and a small amount of water or alternative chlorofluorocarbon is enclosed.

  As schematically shown in FIG. 7, the top plate 11 is in thermal contact with the CPU 71 having a large calorific value (for example, about 50 to 150 W) and the heat conducting member 15. As the heat transfer member 15, for example, a plate-shaped heat receiving plate 16 (see Modification 1 and FIG. 10) that makes surface contact with a package of a CPU 71, which will be described later, or a CPU heat sink 74 that makes surface contact with the top plate 11. A thermally connected heat transfer plate 77 (see Modification 2 and FIG. 13) or the like can be used.

  As shown in FIGS. 4B, 5, and 6, fins 14 extending in the longitudinal direction are formed on the inner surface (bottom surface) of the top plate 11. The height of the fin 14 is formed to be as large as possible within a range that does not come into contact with the electronic component mounted on the substrate 70. For this reason, as shown in FIG. 6, the height of the fin 14 is locally different. For example, the height of the fin 14 is low in the upper part of a tall electronic component such as a memory module (not shown), and the height of the fin 14 is large in the upper part of the short electronic component. . Thereby, the fins 14 can be disposed without waste in the space inside the container of the blade 10, and the surface area of the fins 14 can be increased without increasing the volume of the blade 10, thereby improving the heat radiation efficiency.

  The top plate 11 and the fin 14 are made of a material having a high thermal conductivity such as Cu or Al, or a material having a high thermal conductivity such as a carbon fiber dispersed in Cu or Al to improve the thermal conductivity. Composite metals can be used.

  The wind (air flow) by the air cooling fan module 82 provided in the above-described casing 81 is along the valley portion between the fins 14 in the blade 10 from the front side (reference numeral F side in FIG. 4) to the back side (see FIG. 4). 4 toward the R side).

  Since one end of the heat pipe 13 is in thermal contact with the CPU 71, when the temperature of the CPU 71 rises, the liquid inside the heat pipe 13 is evaporated and vaporized. At this time, heat is taken into the heat pipe 13 as latent heat. The vaporized vapor moves to a portion on the low temperature side, where it is cooled and returned to a liquid to release latent heat of condensation. Since the liquid condensed on the low temperature side in the heat pipe 13 returns to the original place (high temperature side) by capillary action, the heat pipe 13 continuously and efficiently transfers the heat of the CPU 71 to the entire surface of the top plate 11. The heat transmitted to the top plate 11 is transmitted to the fins 14 and is discharged out of the blade 10 together with the airflow flowing through the groove portion between the fins 14.

  As described above, in the blade 10, the electronic component (CPU 71) having a large calorific value is in thermal contact with the top plate 11 with low thermal resistance, and the heat transmitted to the top plate 11 is stretched over the top plate 11. The heat pipe 13 quickly diffuses in the plane of the top plate 11. Then, heat can be radiated from the large-area fin 14 formed so as to fill the space inside the blade 10. For this reason, the heat dissipation efficiency of the blade 10 is improved as compared with the conventional art, and an increase in the rotational speed of the air cooling fan can be suppressed. Thereby, reduction of the power consumption required for cooling by the blade server 80 and reduction in noise can be achieved.

  In the above-described example, an example in which the CPU 71 is in thermal contact with the top plate 11 has been described. However, the present embodiment is not limited to this. For example, electronic components that require heat dissipation, such as memory modules and chip sets, may be in thermal contact with the top plate 11. As a result, it is possible to suppress the occurrence of failure by suppressing the temperature rise of electronic components that require heat dissipation.

(Modification 1)
Hereinafter, the blade 20 according to the first modification of the embodiment will be described with reference to FIGS. 8 to 10. FIG. 8A is a top view of the top plate of the component according to Modification 1 of the embodiment of the present invention, and FIG. 8B is a bottom view thereof. FIG. 9 is a top view showing a blade according to Modification 1 of the embodiment of the present invention. FIG. 10 is a schematic diagram illustrating components according to the first modification of the embodiment of the present invention.

  As illustrated in FIG. 10, the blade 20 according to the first modification accommodates a substrate 75 on which electronic components such as a CPU 71 are mounted in a container including the top plate 11 and the box body 12. The configuration of the box 12 is the same as that of the blade 10 described above.

  A heat pipe 13 is disposed on the outer surface of the top plate 11 of Modification 1, and fins 14 are formed on the inner surface (bottom surface). In the first modification, the heat receiving plate 16 is provided on the fin 14 of the top plate 11 (on the lower side in FIG. 10) and corresponding to the CPU 71. The heat receiving plate 16 is made of a metal plate having excellent thermal conductivity, such as copper or aluminum. As shown in FIG. 10, one end of the heat pipe 13 is joined to the back side surface (upper surface in FIG. 10) of the heat receiving plate 16. When the top plate 11 is assembled to the box 12, the heat receiving plate 16 is in surface contact with the package of the CPU 71 as indicated by the arrow in FIG. 10. Thereby, the top plate 11 and the CPU 71 are brought into thermal contact with each other through the heat receiving plate 16 and the heat pipe 13. As described above, by using the heat receiving plate 16, the CPU 71 and the top plate 11 can be easily brought into thermal contact simply by assembling the top plate 11.

  In the first modification, electronic components having a larger amount of heat generation on the substrate 75 are arranged on the leeward side. That is, as shown in FIG. 9, the CPU 71 having a large heat generation amount of 50 to 150 W is arranged on the back side, and the memory module 73 and the chip set 72 having a heat generation amount of about 10 W are arranged on the windward side. As a result, the memory module 73 and the chip set 72 can be cooled by wind having a low temperature, the temperature rise due to the influence of the CPU 71 can be prevented, and the occurrence of failure can be suppressed.

  The arrangement of the heat pipes 13 and the amount of heat transport may be adjusted so that the temperature of the top plate 11 is higher on the back side and lower on the front side. Thereby, the temperature of the wind which cools the memory module 73 and the chip set 72 can be kept low, and the temperature rise of an electronic component can be suppressed.

  Alternatively, the heat receiving plate 16 and the heat pipe 13 may be used to bring the top plate 11 into thermal contact with an electronic component such as the chip set 72 or the memory module 73 that requires heat dissipation. As a result, electronic components that require heat dissipation can be efficiently cooled, and failure due to temperature rise can be suppressed.

(Modification 2)
Hereinafter, a second modification of the embodiment will be described with reference to FIGS. FIG. 11 is a bottom view of the top plate of the component according to the second modification of the embodiment of the present invention. FIG. 12 is a top view showing a component substrate according to Modification 2 of the embodiment of the present invention. FIG. 13 is a schematic diagram illustrating components according to the second modification of the embodiment of the present invention.

  As shown in FIG. 11, the top plate 11 of Modification 2 is provided with fins 14 on the inner surface (bottom surface). However, in the modification 2, the fin 14 is not formed in the part above the heat-transfer plate 77 mentioned later, but it is formed so that the heat-transfer plate 77 and the top plate 11 can be in direct surface contact. A heat pipe 13 is arranged on the outer surface of the top plate 11 as shown by a broken line in FIG. One end of the heat pipe 13 extending in the longitudinal direction is disposed on a portion where the top plate 11 and the heat transfer plate 77 are in contact with each other.

  As shown in FIG. 12, in the board 75 of the second modification, the CPU 71 having a large heat generation amount is arranged on the leeward side as in the first modification, and the memory module 73 and the chip set 72 having a smaller heat generation amount than the CPU 71 are provided. Are arranged on the windward side of the substrate 75. Thereby, since the electronic component with a comparatively small calorific value can be cooled with an air flow having a lower temperature than the conventional one, the temperature rise of the electronic component can be suppressed and the occurrence of failure can be prevented.

  As shown in FIG. 13, a CPU heat sink 74 is bonded on the CPU 71. Further, a heat transfer plate 77 is provided on the CPU 74. The heat transfer plate 77 and the base portion of the CPU heat sink 74 (the portion serving as the base end of the fin) are connected by a heat pipe 76.

  When the top plate 11 is assembled to the box 12, the heat transfer plate 77 and the top plate 11 move as shown by the arrows in FIG. In this way, the CPU 71 and the top plate 11 are brought into thermal contact with each other via the CPU heat sink 74 and the heat transfer plate 77 (and the heat pipe 76). The air flow by the air-cooling fan module 82 passes through the gaps between the fins 14 and the gaps between the fins of the CPU heat sink 74 from the front side (the side indicated by reference numeral F in FIGS. 11 and 12) to the back side (FIGS. 11 and 12). To the side indicated by the symbol R).

  The heat generated by the CPU 71 is transmitted to the CPU heat sink 74 and is cooled by the air flow. Further, the heat that cannot be cooled by the CPU heat sink 77 is transmitted to the top plate 11 through the heat pipe 76 and the heat transfer plate 77. The heat pipe 13 provided on the top plate 11 is transmitted over the entire surface of the top plate 11 and is radiated from the fins 14 provided on the top plate 11.

  As described above, even in the blade 30 according to the second modified example, the top plate 11 is assembled to the box body 12, thereby making it possible to achieve thermal contact between the electronic component (CPU 71) that generates a large amount of heat and the top plate 11. Since heat is dissipated by the fins 14 provided in the container, the cooling efficiency is improved as compared with the conventional case, and the power consumption required for cooling the blade server can be reduced and the noise can be reduced.

  Also in this modification, a heat transfer plate 77 may be provided on a heat sink or the like of an electronic component that needs to dissipate, such as the chip set 72 or the memory module 73, so as to be in thermal contact with the top plate 11. Thereby, electronic components other than CPU71 can also be cooled efficiently.

(Modification 3)
Hereinafter, Modification 3 of the embodiment will be described with reference to FIGS. 14 and 15. FIG. 14 is a top view showing the top plate of the component according to the third modification of the embodiment of the present invention. FIG. 15: is a front view which shows the top plate of the component which concerns on the modification 3 of embodiment of this invention.

  In Modification 3, instead of the heat pipe 13 of Modification 1, a circulation type heat pipe 23 is attached to the top plate 11. As shown in FIG. 14, in Modification 3, a circulation type heat pipe 23 is disposed on the outer surface of the top plate 11. Further, fins 14 are formed on the inner surface (bottom surface) of the top plate 11. A heat receiving plate 16 is provided on the fin 14 (on the lower side in FIG. 15) and corresponding to the CPU, and the heat receiving plate 16 is in surface contact with the CPU package.

  The circulating heat pipe 23 is formed in a loop shape as shown in FIG. As shown in FIG. 15, a part of the circulation type heat pipe 23 is joined to the back side surface of the heat receiving plate 16. A liquid is sealed in the circulation heat pipe 23, and bubbles are generated by being heated at a portion joined to the heat receiving plate 16. As a result, a flow of the working medium circulating between the high temperature heat receiving plate 16 side and the low temperature top plate 11 side is generated in the circulation type heat pipe 23, and heat is transported to the low temperature top plate 11 side. Thereby, the thermal conductivity of the top plate 11 can be increased, and the heat dissipation efficiency of the blade can be improved.

(Modification 4)
Hereinafter, Modification 4 of the embodiment will be described with reference to FIGS. 16 to 18. FIG. 16 is a top view showing the top plate of the component according to Modification 4 of the embodiment of the present invention. 17 is a cross-sectional view taken along the line II-II in FIG. 18 is a cross-sectional view taken along line III-III in FIG.

  In Modification 4, instead of the heat pipe 13 on the top plate 11 side of the blade 30 in Modification 2, a self-excited vibration heat pipe 33 is used. As shown by a broken line portion in FIG. 16, a self-excited vibration heat pipe 33 is embedded in the top plate 11. The self-excited vibration heat pipe 23 is embedded so as to meander the top plate 11.

  As shown in FIG. 17, fins 14 similar to those of the second modification are formed on the inner surface (bottom surface) of the top plate 11. The top plate 11 of the modification 4 is not formed with fins 14 in the portion of the III-III line above the heat transfer plate 77 as in the case of the modification 2, and the heat transfer plate 77 and the top plate 11 Is formed so as to be in direct surface contact (see Modification 2, FIGS. 11 and 13).

  In the modified example 4, the heat transmitted to the top plate 11 is diffused over the entire surface of the top plate 11 by the self-excited vibration heat pipe 23. At this time, bubbles and liquid are alternately present inside the meandering self-oscillating heat pipe 23 in a closed state. The liquid in the self-excited vibration heat pipe 23 generates steam bubbles intermittently due to the amount of heat absorbed by the high temperature portion where the top plate 11 and the heat transfer plate 77 are in contact. Thereby, the temperature and the vapor pressure in the self-excited vibration heat pipe 23 are increased. On the other hand, on the low temperature part side (reference numeral F side), a temperature drop and a pressure drop of the steam bubbles in the self-excited vibration heat pipe 23 occur due to the cooling action. Due to the pressure difference between the high temperature part and the low temperature part, the liquid and bubble portions alternately closing the self-excited vibration heat pipe 23 vibrate and circulate in the self-excited vibration heat pipe 23 while vibrating. . Thereby, latent heat and sensible heat are transported simultaneously, and a high heat transport capability is obtained.

  As described above, according to the modified example 4, the thermal conductivity of the top plate 11 is improved, and the heat dissipation efficiency of the blade can be improved by the heat dissipation by the fins 14.

(Modification 5)
Hereinafter, Modification 5 of the embodiment will be described with reference to FIGS. 19 and 20. FIG. 19 is a top view showing the top plate of the component according to the fifth modification of the embodiment of the present invention. 20 is a cross-sectional view taken along line IV-IV in FIG.

  In the fifth modification, a coolant flow path 43 is provided in the top plate 11 in place of the heat pipe 13 of the second modification. As shown by a broken line portion in FIG. 19, a coolant flow path 43 is provided in the top plate 11 of the fifth modification. The flow path 43 is disposed so as to meander in the top plate 11. A pump (not shown) is connected to the flow path 43, and the coolant flows through the flow path 43 by this pump.

  As shown in FIG. 20, fins 14 for heat dissipation are provided on the inner surface (bottom surface) side of the top plate 11. Thermal contact between the top plate 11 and an electronic component such as a CPU that generates a large amount of heat is achieved by using a CPU heat sink 74, a heat transfer plate 77, and a heat pipe 76 as shown in Modification 2 (see FIG. 13). be able to.

  Thus, the flow path 43 is formed in the top plate 11, and a cooling fluid flows through the inside. And since the heat transmitted to the top plate 11 is quickly diffused over the entire top plate 11 and radiated by the fins 14, the heat dissipation efficiency of the blade can be increased.

  Hereinafter, various aspects of the present invention will be collectively described as supplementary notes.

(Appendix 1) a board on which electronic components that generate heat are mounted;
A container configured to accommodate the substrate and to be able to introduce a cooling airflow therein;
A heat transfer member for transferring heat of the electronic component to the container;
An electronic component comprising: a heat transport device that diffuses heat transferred to the container to one surface of the container at a speed faster than a heat conduction speed of the container.

  (Additional remark 2) The component for electronic devices of Additional remark 1 further provided with the radiation fin extended inside the said container.

  (Additional remark 3) The component for electronic devices of Additional remark 2 characterized by the above-mentioned. The said thermal radiation fin is formed in the height which does not contact the said board | substrate and the components on the said board | substrate.

  (Supplementary note 4) The supplementary note 1 is characterized in that an electronic component having a larger heat generation amount is disposed on the substrate such that the electronic component having a larger heat generation amount is located on the downstream side of the air flow. The component for electronic devices of any one of thru | or 3.

  (Additional remark 5) The said container is provided with the box holding the said board | substrate, and the top plate formed removably from the said main body, The said heat transfer member transmits the heat | fever of the said electronic component to the said top plate. The electronic device component as set forth in appendix 1, wherein:

  (Supplementary note 6) The electronic device component according to supplementary note 1, wherein the heat transfer member is a plate-shaped heat receiving plate in surface contact with the package of the electronic component.

  (Supplementary note 7) The electronic device component according to supplementary note 1, wherein the heat transfer member is a heat transfer plate in thermal contact with a heat sink disposed on the electronic component.

  (Supplementary note 8) The supplementary note 1 is characterized in that the heat transport device is any one of a heat pipe, a loop heat pipe, a self-excited vibration heat pipe, and a liquid cooling device for forcibly circulating a coolant with a pump. The electronic component described.

(Supplementary Note 9) A board on which an electronic component that generates heat is mounted, a container that accommodates the board and is capable of introducing a cooling air flow therein, and transfers heat of the electronic part to the container One or more components comprising: a heat transfer member; and a heat transport device that diffuses heat transferred to the container to one side of the container at a rate faster than the heat conduction rate of the container;
A housing containing the one or more components;
And an air-cooling fan module for generating an air flow inside the container of the component.

  (Additional remark 10) The said container is provided with the box holding the said board | substrate, and the top plate formed so that it can be removed from the said main body, The said heat transfer member transmits the heat | fever of the said electronic component to the said top plate. Item 9. The electronic device according to appendix 9, wherein

FIG. 1 is a perspective view showing an external appearance of a conventional blade server. FIG. 2 is a schematic diagram showing the inside of the housing of a conventional blade server. FIG. 3A is a perspective view showing a blade server according to the embodiment of the present invention, and FIG. 3B is a rear view showing the blade server according to the embodiment of the present invention. 4A is a top view of the top plate of the blade, and FIG. 4B is a bottom view thereof. FIG. 5 is a view of the top plate of the blade as viewed from the front side. FIG. 6 is a cross-sectional view taken along the line II of FIG. FIG. 7 is a schematic diagram showing a blade. Fig.8 (a) is a top view of the top plate of the component which concerns on the modification 1 of embodiment of this invention, FIG.8 (b) is the bottom view. FIG. 9 is a top view showing a blade according to Modification 1 of the embodiment of the present invention. FIG. 10 is a schematic diagram illustrating components according to the first modification of the embodiment of the present invention. FIG. 11 is a bottom view of the top plate of the component according to the second modification of the embodiment of the present invention. FIG. 12 is a top view showing a component substrate according to Modification 2 of the embodiment of the present invention. FIG. 13 is a schematic diagram illustrating components according to the second modification of the embodiment of the present invention. FIG. 14 is a top view showing a top plate of components according to the third modification of the embodiment of the present invention. FIG. 15: is a front view which shows the top plate of the component which concerns on the modification 3 of embodiment of this invention. FIG. 16 is a top view showing a top plate of a component according to the fourth modification of the embodiment of the present invention. 17 is a cross-sectional view taken along the line II-II in FIG. 18 is a cross-sectional view taken along line III-III in FIG. 18 is a cross-sectional view taken along line III-III in FIG. FIG. 19 is a top view showing a top plate of components according to the fifth modification of the embodiment of the present invention. 20 is a cross-sectional view taken along line IV-IV in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Blade, 11 ... Top plate, 13 ... Heat pipe, 14 ... Radiation fin, 15 ... Heat transfer member, 16 ... Heat receiving plate, 23 ... Circulating heat pipe, 33 ... Self-excited vibration heat pipe, 43 ... Flow path 70, 75 ... Substrate, 71 ... CPU, 72 ... Chip set heat sink, 73 ... Memory module (DIMM), 74 ... CPU heat sink, 76 ... Heat pipe, 77 ... Heat transfer plate, 80 ... Blade server, 81 ... Housing, 82: Air cooling fan module, 85 ... Network blade, 86 ... Power supply module, 100 ... Blade server, 110 ... Top plate, 111 ... Box, 120 ... Substrate, 121 ... CPU heat sink, 122 ... Chip set heat sink, 123 ... Heat spreader.

Claims (5)

A board with electronic components that generate heat,
A container configured to accommodate the substrate and to be able to introduce a cooling airflow therein;
A heat transfer member for transferring heat of the electronic component to the container;
An electronic component comprising: a heat transport device that diffuses heat transferred to the container to one surface of the container at a speed faster than a heat conduction speed of the container.   Furthermore, the component for electronic devices of Claim 1 provided with the radiation fin extended inside from the said container.   The electronic device component according to claim 2, wherein the radiating fin is formed at a height that does not contact the substrate and components on the substrate.   4. The board according to claim 1, wherein an electronic part having a larger heat generation amount is arranged on a downstream side of the air flow with respect to an electronic part having a heat generation amount equal to or greater than a predetermined amount. The component for electronic devices of any one of Claims. A substrate on which an electronic component that generates heat is mounted; a container that accommodates the substrate and is capable of introducing a cooling air flow therein; and a heat transfer member that transmits heat of the electronic component to the container One or more components comprising: a heat transport device that diffuses heat transferred to the container to one side of the container at a rate faster than the heat conduction rate of the container;
A housing containing the one or more components;
And an air-cooling fan module for generating an air flow inside the container of the component.

Images