CN107861593A - A kind of heat abstractor for computer heating element - Google Patents
A kind of heat abstractor for computer heating element Download PDFInfo
- Publication number
- CN107861593A CN107861593A CN201711325184.9A CN201711325184A CN107861593A CN 107861593 A CN107861593 A CN 107861593A CN 201711325184 A CN201711325184 A CN 201711325184A CN 107861593 A CN107861593 A CN 107861593A
- Authority
- CN
- China
- Prior art keywords
- heat
- base
- notch
- heat pipe
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of heat abstractor for computer heating element, including heat sink and heat pipe, the heat sink includes base and radiating fin, the base top surface is arranged with multiple radiating fins, the bottom surface of base offers a plurality of notch, heat pipe is separately installed with notch, the bottom surface of base is fitted with graphene heat dissipation film, and graphene heat dissipation film is connected with base with heat pipe respectively.This heat abstractor is integrally machined shaping using aluminium alloy extrusions, and heat pipe is mounted with the base of heat sink, due to the capacity of heat transmission of its capacity of heat transmission of heat pipe more than any known metal, greatly strengthen the heat-sinking capability of heat abstractor.
Description
Technical field
The present invention relates to computer technical field of heat dissipation, and in particular to a kind of radiating for computer heating element fills
Put.
Background technology
Largely integrated circuit is used in machine element.It is well known that high temperature is the formidable enemy of integrated circuit.High temperature not only can
Cause system operation unstable, service life shortens, it could even be possible to burning some parts.The heat of high temperature is caused to be not from
Outside computer, but computer-internal, or perhaps IC interior.The effect of radiator be exactly by these heat absorptions,
Then diffuse in cabinet or outside cabinet, ensure that the temperature of machine element is normal.Most radiators by and heat generating components
Surface contacts, and absorbs heat, then is transferred heat to by various methods, then cabinet
These hot-airs are passed to outside cabinet, complete the radiating of computer.The species of radiator is very more, CPU, video card, mainboard chip
Group, hard disk, cabinet, power supply even CD-ROM drive and internal memory can all need radiator, and these different radiators can not be used with, and
What is wherein most often contacted is exactly CPU radiator.According to the mode that heat is taken away from radiator, radiator can be divided into actively
Radiating and passive radiating.The former commonly air-cooled radiator, and the latter it is common be exactly fin.
Fin is a kind of device of the easy heat-generating electronic elements radiating in electrical equipment, more by aluminium alloy, brass or bronze
Tabular, sheet, splintery etc. are made, as cpu central processing unit will use sizable fin in computer, power supply in television set
Pipe, row are managed, and the power tube in amplifirer will use fin.General fin in use will be in electronic component and fin
Contact surface applies last layer heat-conducting silicone grease, the heat that component is sent more effectively is transmitted on fin, then dissipated through fin
It is dealt into surrounding air.For fin material, its heat conductivility of every kind of material be it is different, by heat conductivility from height to
Low arrangement, it is silver, copper, aluminium, steel respectively.But if with silver come make fin can be too expensive, therefore best scheme be using copper
Matter.But the existing radiator using copper material can increase the product cost of radiator, while self cooling, usual need can not be realized
Want radiator fan or liquid is cold cools, improve use cost, the effect without energy-conservation.
The content of the invention
To be solved by this invention is the deficiencies in the prior art, and it is an object of the present invention to provide a kind of be used for computer heating element
Heat abstractor.
The present invention is achieved through the following technical solutions：
A kind of heat abstractor for computer heating element, including heat sink and heat pipe, the heat sink include base
And radiating fin, the base top surface are arranged with multiple radiating fins, the bottom surface of base offers a plurality of notch, and notch is interior respectively
Heat pipe is installed, the bottom surface of base is fitted with graphene heat dissipation film, and graphene heat dissipation film is connected with base with heat pipe respectively.
Preferred scheme, the bottom surface of the base offer the notch of two linears and the notch of two Curveds, two
The notch of linear is located at the both sides of the center line of base, and the notch of two linears is parallel to each other, the notch of two Curveds
Positioned at the both sides of base centerline, the notch of two Curveds is more than the notch of two linears apart from the distance of base centerline
Apart from the distance of base centerline.
Preferred scheme, channel heat pipe, the notch of two Curveds are mounted with respectively in the notch of described two linears
Sintered heat pipe is inside mounted with respectively.
Preferred scheme, the heat pipe are connected by the notch of heat-conducting glue and base.
Preferred scheme, the heat sink are aluminum alloy material, and base and radiating fin are that aluminium alloy extrusions is integrally squeezed into
Type.
Preferred scheme, the channel heat pipe and sintered heat pipe are red copper material.
The present invention compared with prior art, has the following advantages and advantages：This heat abstractor uses aluminium alloy type
Material is integrally machined shaping, and heat pipe is mounted with the base of heat sink, because heat pipe takes full advantage of heat-conduction principle and refrigeration
The quick thermal transport property of medium, the heat of thermal objects is delivered to outside thermal source rapidly through heat pipe, its capacity of heat transmission exceedes
The capacity of heat transmission of any known metal, the heat-sinking capability of heat abstractor is greatly strengthen, while the base of this heat abstractor is also set
Graphene fin is put, graphene fin is a kind of brand-new heat conduction and heat radiation material, has unique crystal grain orientation, along two
Individual direction uniform heat conduction, laminar structured to be well adapted for any surface, shielding thermal source is consumer with being improved while component
The performance of electronic product.It is cold with regard to good radiating effect can be reached in inapplicable radiator fan or liquid.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is a kind of rearview of heat abstractor for computer heating element of the present invention；
Fig. 2 is a kind of left view of heat abstractor for computer heating element of the present invention.
Mark and corresponding parts title in accompanying drawing：
1- bases, 2- radiating fins, 3- sintered heat pipes, 4- groove heat pipes, 5- graphene fin.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and accompanying drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in figure 1, a kind of heat abstractor for computer heating element of the invention, including heat sink and heat pipe, dissipate
Hot plate includes base 1 and radiating fin 2, and the top surface of base 1 is arranged with multiple radiating fins 2, and radiating fin 2 is vertical with base 1 to be connected
Connect, the number and shape of radiating fin 2 are needed to determine according to the area or radiating of base 1.The bottom surface of base 1 offers 4
Notch, is separately installed with heat pipe in notch, 4 notches of the bottom surface of base 1, the notch of respectively two linears and two it is curved
Curved notch, the notch of two linears are located at the both sides of the center line of base 1, and the notch of two linears is parallel to each other,
The notch of two Curveds is located at the both sides of the center line of base 1, and the notch of two Curveds is big apart from the distance of the center line of base 1
In two linears notch apart from the center line of base 1 distance.Plough groove type heat is mounted with the notch of two linears respectively
Pipe 4, is mounted with sintered heat pipe 3 in the notch of two Curveds respectively, the length and diameter of channel heat pipe 4 and linear
Length, width, the depth of notch match, and sintered heat pipe 3 is to match with the notch shape of Curved, sintered heat pipe
3 and the notch of Curved be all U-shaped.The bottom surface of base 1 is fitted with graphene heat dissipation film 5, graphene heat dissipation film 5 respectively with base
1 is connected with heat pipe.
Preferred embodiment scheme, sintered heat pipe 3 and channel heat pipe 4 are connected by heat-conducting glue with the notch of base 1, are led
Hot glue can quickly be delivered to the heat on sintered heat pipe 3 and channel heat pipe 4 on base 1, reach fast cooling
Purpose.
Preferred embodiment scheme, heat sink are aluminum alloy material, and base 1 and radiating fin 2 are that aluminium alloy extrusions integrally squeezes
It is molded, production efficiency is accelerated, lowers production cost, is adapted to high-volume, large-scale production.
Preferred embodiment scheme, channel heat pipe 4 and sintered heat pipe 3 are red copper material.The heat pipe heat of red copper material passes
Lead ability and be better than aluminum alloy material, improve the radiating effect of heat pipe.
Above-described embodiment, the purpose of the present invention, technical scheme and beneficial effect are carried out further
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution and improvements done etc., all should include
Within protection scope of the present invention.
Claims (6)
1. a kind of heat abstractor for computer heating element, including heat sink and heat pipe, it is characterised in that the heat sink
Including base and radiating fin, the base top surface is arranged with multiple radiating fins, and the bottom surface of base offers a plurality of notch, groove
Intraoral to be separately installed with heat pipe, the bottom surface of base is fitted with graphene heat dissipation film, graphene heat dissipation film respectively with base and heat pipe
Connection.
A kind of 2. heat abstractor for computer heating element according to claim 1, it is characterised in that the base
Bottom surface offer the notch of two linears and the notch of two Curveds, the notch of two linears is located at the center of base
The both sides of line, the notch of two linears are parallel to each other, and the notch of two Curveds is located at the both sides of base centerline, and two curved
Curved notch is more than distance of the notch apart from base centerline of two linears apart from the distance of base centerline.
3. a kind of heat abstractor for computer heating element according to claim 2, it is characterised in that described two
Channel heat pipe is mounted with the notch of linear respectively, sintered heat pipe is mounted with respectively in the notch of two Curveds.
A kind of 4. heat abstractor for computer heating element according to claim 1, it is characterised in that the heat pipe
Connected by the notch of heat-conducting glue and base.
A kind of 5. heat abstractor for computer heating element according to claim 1, it is characterised in that the radiating
Plate is aluminum alloy material, and base and radiating fin are aluminium alloy extrusions one extrusion forming.
A kind of 6. heat abstractor for computer heating element according to claim 3, it is characterised in that the groove
Formula heat pipe and sintered heat pipe are red copper material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325184.9A CN107861593A (en) | 2017-12-13 | 2017-12-13 | A kind of heat abstractor for computer heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711325184.9A CN107861593A (en) | 2017-12-13 | 2017-12-13 | A kind of heat abstractor for computer heating element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107861593A true CN107861593A (en) | 2018-03-30 |
Family
ID=61706353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711325184.9A Withdrawn CN107861593A (en) | 2017-12-13 | 2017-12-13 | A kind of heat abstractor for computer heating element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107861593A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
| CN114496483A (en) * | 2022-02-18 | 2022-05-13 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2578982Y (en) * | 2002-09-26 | 2003-10-08 | 唐济海 | Radiator |
| CN203884123U (en) * | 2014-05-15 | 2014-10-15 | 盛宝华 | Radiator characterized by seamless splicing of heat conduction tubes |
| CN106997873A (en) * | 2016-10-27 | 2017-08-01 | 上海大学 | A kind of encapsulating structure and method for packing |
-
2017
- 2017-12-13 CN CN201711325184.9A patent/CN107861593A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2578982Y (en) * | 2002-09-26 | 2003-10-08 | 唐济海 | Radiator |
| CN203884123U (en) * | 2014-05-15 | 2014-10-15 | 盛宝华 | Radiator characterized by seamless splicing of heat conduction tubes |
| CN106997873A (en) * | 2016-10-27 | 2017-08-01 | 上海大学 | A kind of encapsulating structure and method for packing |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
| CN113048097A (en) * | 2021-04-29 | 2021-06-29 | 杭州余杭特种风机有限公司 | Centrifugal blower impeller and centrifugal blower thereof |
| CN114496483A (en) * | 2022-02-18 | 2022-05-13 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
| CN114496483B (en) * | 2022-02-18 | 2023-07-14 | 上海华湘计算机通讯工程有限公司 | High-power impedance converter |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180330 |