CN112130644A - Optical module heat dissipation equipment and server - Google Patents
Optical module heat dissipation equipment and server Download PDFInfo
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- CN112130644A CN112130644A CN202010850992.2A CN202010850992A CN112130644A CN 112130644 A CN112130644 A CN 112130644A CN 202010850992 A CN202010850992 A CN 202010850992A CN 112130644 A CN112130644 A CN 112130644A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 68
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 230000005679 Peltier effect Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 230000014759 maintenance of location Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 8
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 238000005265 energy consumption Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- 239000004830 Super Glue Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an optical module heat dissipation device and a server, wherein the device comprises: the thermoelectric refrigerator is provided with a hot end and a cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified; the power supply terminal is connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator; one side of the cold end radiating substrate is attached to the optical module, the surface of the other side of the cold end radiating substrate is provided with a limiting structure, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side of the cold end in the internal space; and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space. The invention can provide high-efficiency refrigeration for the optical module, so that the cooling is not limited by the ambient temperature, and the invention has no energy consumption and noise and does not influence the overall layout of server hardware.
Description
Technical Field
The present invention relates to the field of heat dissipation, and in particular, to an optical module heat dissipation device and a server.
Background
The optical module is generally arranged at the downstream of the single-board air duct, the incoming air is heated by the upstream CPU, and the temperature of the air reaching the optical module is basically the hottest air in the device, and some air may even exceed 60 ℃. The typical commercial-grade light module specification has an upper limit of 70 ℃, so it is difficult to control the light module to not exceed 70 ℃ in the case that the incoming air temperature exceeds 60 ℃. There are now 3 conventional solutions: 1. the use of an industrial grade optical module at 85 ℃ results in a cost doubling; 2. the use of more powerful fans, which leads to a drastic increase in the system energy consumption and noise; 3. the optical module is placed at the upstream of the air duct, but the position setting of the optical module obviously needs to serve the whole layout of the server and cannot be called, so that only special user scenes are available.
Aiming at the problem that the commercial-grade optical module in the prior art is difficult to ventilate and dissipate heat, no effective solution is available at present.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide an optical module heat dissipation device and a server, which can provide refrigeration for an optical module, so that cooling is not limited by an ambient temperature, and the device has no energy consumption and no noise, and does not affect the overall layout of server hardware.
In view of the above object, a first aspect of the embodiments of the present invention provides an optical module heat sink, including:
the thermoelectric refrigerator is provided with a hot end and a cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified;
a power supply terminal connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator;
the cold end radiating substrate is arranged by being attached to the optical module on one side, a limiting structure is arranged on the surface of the other side, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side in the internal space;
and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space.
In some embodiments, a plurality of PN junctions connected in series are arranged between the hot end and the cold end, and a plurality of metal conductors for guiding current from the P material to the N material are respectively attached to the hot end, and a plurality of metal conductors for guiding current from the N material to the P material are respectively attached to the cold end; thermoelectric coolers transfer heat from the cold side to the hot side based on the peltier effect under the influence of multiple PN junctions.
In some embodiments, the cold-end heat dissipation substrate and the cold end of the thermoelectric refrigerator and the hot end heat radiator and the hot end of the thermoelectric refrigerator are fixed by high-temperature glue.
In some embodiments, the limiting structure is a protrusion disposed around and defining the inner space, the protrusion being integrally formed with the cold-end heat-dissipating substrate body; the shape of the interior space defined by the protrusion matches the shape of the cold side of the thermoelectric cooler.
In some embodiments, the protrusion is provided with an opening through which a power line of the power supply terminal is connected to the thermoelectric cooler.
In some embodiments, the limiting structure is a groove formed on the other side surface of the cold-end heat dissipation substrate, and the shape of the inner space defined by the groove is matched with the shape of the cold end of the thermoelectric refrigerator.
In some embodiments, the edge of the recess is provided with an opening through which a power supply line of the power supply terminal is connected to the thermoelectric cooler.
In some embodiments, the optical module being cooled is a commercial grade optical module having an operating temperature range of no more than 70 degrees.
A second aspect of an embodiment of the present invention provides a server, including:
a processor;
an optical module;
the air duct is used for radiating heat of the processor and the optical module; and
optical module heat sink comprising:
the thermoelectric refrigerator is provided with a hot end and a cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified;
a power supply terminal connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator;
the cold end radiating substrate is arranged by being attached to the optical module on one side, a limiting structure is arranged on the surface of the other side, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side in the internal space;
and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the radiating fins are arranged close to the ventilation duct, and the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the ventilation duct.
In some embodiments, the processor is disposed proximate to an upstream portion of the air duct; the optical module and the optical module heat dissipation device are arranged close to the downstream of the air duct.
The invention has the following beneficial technical effects: according to the optical module heat dissipation device and the server provided by the embodiment of the invention, the thermoelectric refrigerator is used and is provided with the hot end and the cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified; the power supply terminal is connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator; one side of the cold end radiating substrate is attached to the optical module, the surface of the other side of the cold end radiating substrate is provided with a limiting structure, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side of the cold end in the internal space; the hot end radiator is in heat conduction contact with the hot end on one side, and the radiating fins are arranged on the surface on the other side, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space, so that high-efficiency refrigeration can be provided for the optical module, the cooling is not limited by the ambient temperature, the energy consumption is avoided, the noise is avoided, and the overall layout of server hardware is not influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical module heat dissipation apparatus provided in the present invention;
FIG. 2 is a schematic diagram of a thermoelectric cooler of a light module heat sink provided by the present invention;
fig. 3 is a front view of a light module heat sink provided in the present invention;
fig. 4 is a side view of an optical module heat sink provided in the present invention;
fig. 5 is a top view of an optical module heat sink provided in the present invention;
fig. 6 is a schematic structural diagram of a server provided in the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In view of the above-mentioned objects, a first aspect of the embodiments of the present invention provides an embodiment of an optical module heat sink capable of providing efficient cooling for an optical module. Fig. 1 is a schematic structural diagram of an optical module heat sink device provided in the present invention.
The optical module heat dissipation device, as shown in fig. 1, includes:
the thermoelectric refrigerator 1 is provided with a hot end and a cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified;
a power supply terminal 2 connected to the thermoelectric refrigerator 1 through a power supply line to supply power to the thermoelectric refrigerator 1;
a cold end radiating substrate 3, one side of which is attached to the optical module, and the surface of the other side of which is provided with a limiting structure 5, wherein the limiting structure 5 defines an internal space at least partially accommodating the thermoelectric refrigerator 1, and the cold end is in heat conduction contact with the surface of the other side in the internal space;
and a hot end radiator 4, one side of which is in heat conduction contact with the hot end, and the other side of which is provided with radiating fins, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space.
In some embodiments, a plurality of PN junctions connected in series are arranged between the hot end and the cold end, and a plurality of metal conductors for guiding current from the P material to the N material are respectively attached to the hot end, and a plurality of metal conductors for guiding current from the N material to the P material are respectively attached to the cold end; the thermoelectric refrigerator 1 transfers heat from the cold side to the hot side by the action of a plurality of PN junctions based on the peltier effect.
In some embodiments, the cold-side heat sink substrate 3 and the cold side of the thermoelectric refrigerator 1, and the hot-side heat sink 4 and the hot side of the thermoelectric refrigerator 1 are fixed by high-temperature glue.
In some embodiments, the limiting structure 5 is a protrusion disposed around and defining the inner space, and the protrusion is integrally formed with the cold-end heat-dissipating substrate 3 body; the shape of the interior space defined by the projections matches the shape of the cold side of the thermoelectric refrigerator 1.
In some embodiments, the protrusion is provided with an opening through which the power supply line of the power supply terminal 2 is connected to the thermoelectric cooler 1.
In some embodiments, the limiting structure 5 is a groove formed on the other side surface of the cold-end heat dissipation substrate 3, and the shape of the inner space defined by the groove matches the shape of the cold end of the thermoelectric refrigerator 1.
In some embodiments, the edge of the recess is provided with an opening through which the power supply line of the power supply terminal 2 is connected to the thermoelectric cooler 1.
In some embodiments, the optical module being cooled is a commercial grade optical module having an operating temperature range of no more than 70 degrees.
The following further illustrates embodiments of the invention in terms of specific examples.
The thermoelectric refrigerator is a TEC refrigeration unit, and the working principle of the thermoelectric refrigerator is shown in figure 2: the hot end and the cold end are formed by connecting the PN junctions in series, the cold end is attached to the heating device to achieve the refrigerating effect, the height and the number of the PN junctions can be freely defined, and the heat of the hot end is taken away by air through the radiator.
The assembly of the optical module heatsink and the optical module is shown in fig. 3, 4, and 5. Because 3 parts all have light weight, the parts are bonded by high-temperature strong glue. And a limiting structure, such as a square groove, is arranged on the cold end heat dissipation substrate, high-temperature super glue is coated on the bottom surface of the cold end heat dissipation substrate in advance, the TEC is placed in the square groove for bonding, a notch is formed in one side of the square groove, a power line and a terminal of the TEC are led out, then the high-temperature super glue is coated on the bottom surface of the hot end heat dissipation substrate and is bonded on the TEC to form a sandwich structure, and the whole TEC refrigerating heat dissipation device is mounted. The whole TEC refrigerating radiator and the optical module are installed by adopting a universal buckling mechanism of the optical module radiator.
Therefore, the radiator has a refrigeration function, the temperature of the optical module can be reduced to be lower than that of flowing air, and the application range of the optical module is expanded.
As can be seen from the above embodiments, the optical module heat dissipation device provided in the embodiments of the present invention has a hot end and a cold end that are arranged opposite to each other by using a thermoelectric refrigerator, and transfers heat from the cold end to the hot end when the device is powered on; the power supply terminal is connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator; one side of the cold-end radiating substrate is attached to the optical module, the surface of the other side of the cold-end radiating substrate is provided with a limiting structure, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is fixed to the surface of the other side in the internal space; one side of the hot end radiator is fixed to the hot end, and the radiating fins are arranged on the other side surface of the hot end radiator, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space, so that high-efficiency refrigeration can be provided for the optical module, the cooling is not limited by the ambient temperature, the energy consumption is avoided, the noise is avoided, and the overall layout of server hardware is not influenced.
In view of the above object, according to a second aspect of the embodiments of the present invention, an embodiment of a server capable of providing high-efficiency cooling for an optical module is provided. The server shown in fig. 6 includes:
a processor;
an optical module;
the air duct is used for radiating heat of the processor and the optical module; and
optical module heat sink comprising:
the thermoelectric refrigerator is provided with a hot end and a cold end which are oppositely arranged, and heat is transferred from the cold end to the hot end when the thermoelectric refrigerator is electrified;
a power supply terminal connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator;
the cold end radiating substrate is arranged by being attached to the optical module on one side, a limiting structure is arranged on the surface of the other side, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side in the internal space;
and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the radiating fins are arranged close to the ventilation duct, and the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the ventilation duct.
In some embodiments, the processor is disposed proximate to an upstream portion of the air duct; the optical module and the optical module heat dissipation device are arranged close to the downstream of the air duct. Referring to fig. 6, the embodiment of the present invention can provide heat dissipation for the optical module without changing the layout of server hardware, and the cooling effect can reduce the temperature of the optical module to be lower than the temperature of the streaming air, thereby expanding the application range of the optical module.
As can be seen from the foregoing embodiments, the server provided in the embodiments of the present invention, by using the thermoelectric refrigerator, has the hot side and the cold side which are arranged opposite to each other, and transfers heat from the cold side to the hot side when the server is powered on; the power supply terminal is connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator; one side of the cold end radiating substrate is attached to the optical module, the surface of the other side of the cold end radiating substrate is provided with a limiting structure, the limiting structure limits an internal space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side of the cold end in the internal space; the hot junction radiator, one side heat conduction contact hot junction, be provided with the fin on the opposite side surface, wherein the fin is close to the air duct setting to the technical scheme that the array orientation of fin is set up to the air current direction that is on a parallel with the air duct can provide high-efficient refrigeration for the optical module, makes the cooling not restricted by ambient temperature, and does not have the energy consumption noiselessness, does not influence the overall layout of server hardware.
It should be particularly noted that the above-mentioned embodiment of the server adopts the embodiment of the optical module heat sink to specifically describe the working process, and those skilled in the art can easily think that these modules are applied to other embodiments of the server of the optical module heat sink.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of an embodiment of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (10)
1. An optical module heatsink device, comprising:
a thermoelectric refrigerator having a hot side and a cold side disposed opposite to each other, the thermoelectric refrigerator transferring heat from the cold side to the hot side when energized;
a power supply terminal connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator;
the cold end radiating substrate is attached to the optical module on one side, a limiting structure is arranged on the surface of the other side, the limiting structure defines an inner space for at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side in the inner space;
and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the arrangement direction of the radiating fins is set to be parallel to the airflow direction of the nearby external space.
2. The apparatus of claim 1, wherein a plurality of PN junctions connected in series are disposed between the hot side and the cold side, and a plurality of metal conductors for conducting current from P material to N material are respectively attached to the hot side and a plurality of metal conductors for conducting current from N material to P material are respectively attached to the cold side; the thermoelectric refrigerator transfers heat from the cold side to the hot side under the action of the plurality of PN junctions based on the Peltier effect.
3. The apparatus of claim 1 wherein said cold side heat sink substrate and said cold side of said thermoelectric refrigerator and said hot side heat sink and said hot side of said thermoelectric refrigerator are affixed using high temperature glue.
4. The apparatus of claim 1 wherein said retention structure is a protrusion disposed around and defining said interior space, said protrusion being integrally formed with said cold end heat sink base plate body; the shape of the interior space defined by the protrusion matches the shape of the cold end of the thermoelectric cooler.
5. The apparatus of claim 4 wherein the protrusion is provided with an opening through which the power line of the power terminal is connected to the thermoelectric cooler.
6. The apparatus of claim 1 wherein said limiting structure is a groove formed on said other side surface of said cold-side heat sink substrate, said interior space defined by said groove having a shape that mates with a cold-side shape of said thermoelectric refrigerator.
7. The apparatus of claim 6, wherein an edge of the recess is provided with an opening through which the power line of the power terminal is connected to the thermoelectric cooler.
8. The apparatus of claim 1, wherein the heat-dissipated light module is a commercial grade light module having an operating temperature range of no more than 70 degrees.
9. A server, comprising:
a processor;
an optical module;
a ventilation duct for radiating heat for the processor and the optical module; and
optical module heat sink comprising:
a thermoelectric refrigerator having a hot side and a cold side disposed opposite to each other, the thermoelectric refrigerator transferring heat from the cold side to the hot side when energized;
a power supply terminal connected to the thermoelectric refrigerator through a power line to supply power to the thermoelectric refrigerator;
a cold end heat dissipation substrate, one side of which is attached to the optical module, and the surface of the other side of which is provided with a limiting structure, wherein the limiting structure defines an internal space at least partially accommodating the thermoelectric refrigerator, and the cold end is in heat conduction contact with the surface of the other side in the internal space;
and one side of the hot end radiator is in heat conduction contact with the hot end, and the other side surface of the hot end radiator is provided with radiating fins, wherein the radiating fins are arranged close to the ventilation duct, and the arrangement direction of the radiating fins is parallel to the airflow direction of the ventilation duct.
10. The apparatus of claim 9, wherein the processor is disposed proximate to and upstream of the air duct; the optical module and the optical module heat dissipation equipment are arranged close to the downstream of the air duct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850992.2A CN112130644A (en) | 2020-08-21 | 2020-08-21 | Optical module heat dissipation equipment and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010850992.2A CN112130644A (en) | 2020-08-21 | 2020-08-21 | Optical module heat dissipation equipment and server |
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| Publication Number | Publication Date |
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| CN112130644A true CN112130644A (en) | 2020-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010850992.2A Withdrawn CN112130644A (en) | 2020-08-21 | 2020-08-21 | Optical module heat dissipation equipment and server |
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| CN (1) | CN112130644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113759480A (en) * | 2021-09-27 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Optical module heat abstractor |
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2020
- 2020-08-21 CN CN202010850992.2A patent/CN112130644A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113759480A (en) * | 2021-09-27 | 2021-12-07 | 苏州浪潮智能科技有限公司 | Optical module heat abstractor |
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Application publication date: 20201225 |