WO2003041472A1 - Heat dissipating module - Google Patents

Heat dissipating module Download PDF

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Publication number
WO2003041472A1
WO2003041472A1 PCT/CN2001/001532 CN0101532W WO03041472A1 WO 2003041472 A1 WO2003041472 A1 WO 2003041472A1 CN 0101532 W CN0101532 W CN 0101532W WO 03041472 A1 WO03041472 A1 WO 03041472A1
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WO
WIPO (PCT)
Prior art keywords
heat
fins
conducting
dissipating
group
Prior art date
Application number
PCT/CN2001/001532
Other languages
French (fr)
Chinese (zh)
Inventor
Jefferson Liu
Original Assignee
Jefferson Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW090212712U external-priority patent/TW572246U/en
Application filed by Jefferson Liu filed Critical Jefferson Liu
Priority to PCT/CN2001/001532 priority Critical patent/WO2003041472A1/en
Priority to US10/079,321 priority patent/US20030019610A1/en
Publication of WO2003041472A1 publication Critical patent/WO2003041472A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001—Particular heat conductive materials, e.g. superconductive elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Heat-dissipating module capable of quickly conducting heat by itself
  • the invention relates to a heat-dissipating module with self-rapid heat conduction, in particular to a heat-dissipating module with self-rapid heat conduction, which is suitable for quickly and effectively dissipating heat generated by a computer central processor or a high heat source product.
  • the heat dissipation devices used by the industry for computer central processing units (CPUs) or high heat source products are mostly contacted by the base of the heat sink made of metal with high heat transfer efficiency, and absorb and transfer the heat to the heat sink.
  • a fan is used to blow out cold air to dissipate the heat on the fins.
  • the metal base of the heat sink is There is a distance between the base and the end of the heat radiating fin. Since only the base is in contact with the heat radiating fin and the heat source (that is, the CPU), the heat absorbed by the base cannot be quickly transmitted to the end of the heat radiating fin, and the heat radiating fin The heat absorbed by the root of the fin is not the same as that of the end. The closer to the base, the more heat is absorbed by the root of the fin, and the farther away from the base, the less heat is absorbed, resulting in limited area heat dissipation.
  • the fin can only use its part close to the metal base to dissipate heat. Therefore, the heat dissipation efficiency of the known heat sink cannot really keep up with the rapidly developing CPU computing efficiency or heat dissipation requirements of high heat source products. If a new heat sink can break through the shortcomings of known heat sinks and strengthen the overall heat dissipation effect, it will greatly improve electronic products. Higher cooling requirements. Summary of invention
  • An object of the present invention is to provide a heat-dissipating module capable of quickly conducting heat by itself.
  • the heat-dissipating module can overlap two groups of heat sinks, and use a heat-conducting superconductor to rewind the two heat sinks. It can be transferred to another group of fins at high speed through a heat-conducting superconducting tube, and in conjunction with a separately provided cooling fan, the two groups of fins can blow out cold air while radiating heat at the same time, which can more effectively improve the radiating effect of the fins.
  • Another object of the present invention is to provide a heat-dissipating module with self-rapid heat conduction.
  • the heat-dissipating module composed of the two sets of heat-radiating fins and heat-conducting superconducting tubes can be recombined, and a single or a plurality of heat-dissipating modules can be combined.
  • the group of cooling fans blows cold air to the heat sinks of multiple arrays, thereby rapidly conducting and dissipating a large amount of heat.
  • the technical solution of the present invention is, 'The heat-dissipating module with self-rapid heat conduction includes:
  • Two sets of heat sinks having a base and fins connected to the base;
  • One or more sets of heat conducting superconducting pipes are connected to the heat sink near the heat source and other parts away from the heat source, so as to transfer the heat from the heat source contacting parts to other parts.
  • the heat-conducting superconduit is fastened.
  • the bottom surfaces of the bases of the two sets of heat sinks are provided with a plurality of grooves, and the heat conducting superconducting pipe is bent into a U shape.
  • One end of the u-shaped heat conducting superconducting pipe is placed in the groove of a group of heat sinks, and the other end is placed into The grooves of the other heat sink, and the fins in the two heat sinks correspond Combining a group can increase the heat dissipation area.
  • the fins of the two sets of heat sinks are staggered and combined to form a group.
  • the bottom surfaces of the bases of the two sets of heat sinks are provided with a plurality of grooves, and the heat conducting superconducting pipe is a double U shape.
  • the two free ends of the double U-shaped heat conducting superconducting pipe are placed in the grooves of a group of heat sinks.
  • the U-shaped heat-conducting superconducting tube with a free end is placed in the groove of another group of heat sinks, and the two groups of heat sinks are fins correspondingly combined into one group.
  • the heat-dissipating module with self-rapid heat conduction further includes: a heat-dissipating fan, which is assembled on the common side of the two sets of heat-dissipating fins, and blows cold air to the fins to achieve a more efficient heat-dissipating effect.
  • a heat-dissipating fan which is assembled on the common side of the two sets of heat-dissipating fins, and blows cold air to the fins to achieve a more efficient heat-dissipating effect.
  • the radiating fins and the heat dissipating module composed of the heat conducting superconducting tube may be combined in parallel.
  • the heat-dissipating module with self-rapid heat conduction may further include: a single or multiple array of heat-dissipating fans.
  • the invention can effectively and quickly transfer the heat generated by the heat source to the heat dissipation module.
  • the invention can effectively and quickly dissipate the heat generated by the heat source.
  • the present invention can also fix a plurality of heat-dissipating module combinations with self-rapid heat conduction, which can effectively expand and match the heat generated by the heat source as required.
  • FIG. 1 is a heat conduction superconduit group in which two sets of box-shaped heat sinks and a plurality of single U-shapes are used in the present invention. Combined three-dimensional exploded view;
  • FIG. 2 is a perspective view of the combined components shown in FIG. 1 and a perspective view of the assembled cooling fan;
  • FIG. 3 is an exploded perspective view of a combination of two sets of heat sink fins staggered together with a plurality of single U-shaped heat conduction superconducting ducts and a fan;
  • FIG. 4 is a perspective view after the components shown in FIG. 3 are combined; FIG.
  • FIG. 5 is an exploded perspective view of an embodiment of the present invention combining two sets of dual U-shaped heat conducting superconducting tubes and two sets of box-shaped heat sinks;
  • FIG. 6 is a perspective view after the components shown in FIG. 5 are combined;
  • FIG. 7 is a perspective view of a heat sink module composed of two sets of heat sinks and a plurality of heat conducting superconductors according to the present invention.
  • a heat-dissipating module with self-rapid heat conduction includes two groups of heat-dissipating fins 1 and a heat-conducting superconducting tube 2, wherein the heat-conducting super-conducting tube 2 adopts a freely bendable metal pipe body ( (Such as copper, aluminum, or other metal pipe bodies), and contains high-temperature superconducting compound materials with high-speed thermal conductivity inside the pipe body, such as: 4 ethyl barium copper oxide (YBC0) superconducting materials, samarium barium calcium copper oxide (TBCC0) Ultra Conductive material, mercury-barium-calcium-copper-oxygen compound (HBCC0) superconducting material, bismuth strontium-calcium-copper-oxygen compound (BSCC0) superconducting material, or other superconducting materials, and other materials that can achieve rapid heat conduction, etc.
  • YBC0 ethyl barium copper oxide
  • TBCC0 sam
  • the two ends are closed to prevent the superconducting material from leaking out of the pipe body.
  • the metal pipe body and the superconducting material contained in the metal pipe body are used to form a thermally conductive superconducting tube 2.
  • the applied principle is to use the high-speed vibration and friction generated when the molecules in the pipe body are heated, so that the thermal energy is rapidly fluctuated.
  • Heat transfer due to its rapid heat transfer, is called a thermally conductive superconductor, and the transfer time of the thermally conductive superconductor from the hot end to the cold end is very short. Therefore, the temperature difference between the hot end and the cold end is small, and the best heat conduction effect can be achieved. It is confirmed by experiments that the heat transfer rate is about five times that of copper, which is faster than that of heat sinks generally made of aluminum extrusion.
  • the heat sink 1 in the present invention is generally used to contact the CPU to absorb the generated heat. It is two sets of heat sinks 1 with exposed fins. The reason for using two sets of heat sinks 1 is that heat is transmitted to the upper heat sink. At this time, because the upper and lower heat sinks are separated, the heat does not convect up and down, so there is no heat reflow phenomenon.
  • FIG. 1 discloses a first embodiment of the present invention, which includes two sets of heat sinks 1 having exposed fins 11, wherein a plurality of grooves 12 are provided at appropriate positions of the side of the heat sink 1 near the base 10.
  • the bottom surface of the base 10 of the other group of heat sinks 10 is also provided with a plurality of grooves 12.
  • the heat-conducting superconduit 2 is bent into a single U shape, and one end of the U-shape is placed in the groove 12, and the other end is placed in the groove 12 of another group of heat sinks 1.
  • the two groups of heat sinks 1 are combined into a group corresponding to the fins 11, and the heat conducting superconduit 2 also has a fixing function of buckling the two groups of heat sinks 1 (as shown in FIG.
  • a grooved heat sink 1 is provided on the bottom surface of the base 10 for contacting a heat source such as a CPU, so that a large amount of heat can be conducted through thermal conduction
  • the tube 2 is transferred to another group of radiating fins 1, and the heat is dispersedly transferred to each fin 11.
  • the heat conducting superconducting tube 2 and the radiating fins 1 form a heat dissipation module with self-rapid heat conduction.
  • the cooling fan 3 is assembled on the common side of the two sets of heat sinks 1 and blows cold air toward the fins 11 to achieve a more efficient heat dissipation effect.
  • FIG. 3 shows a second embodiment of the present invention, which includes two sets of identical heat sinks 1.
  • the bottom surface of the base 10 of the heat sink 1 is provided with a plurality of grooves 12, which are bent into a U-shaped heat conducting superconduit 2. Both sides are respectively inserted into the grooves 12 of the two fins 1, so that the fins 11 of the two sets of fins 1 are staggered to form a group, and the heat conduction superconducting tube 2 also has a fixing function of buckling the two sets of fins 1 at the same time. (As shown in Figure 4').
  • the base 10 of the heat sink 1 can be used to contact the heat source, so that a large amount of heat can be transferred from one group of heat sinks 1 to another group of heat sinks 1 through a heat-conducting superconducting tube 2, and at the same time, the heat is dispersedly transferred to each fin 11
  • the staggered fins 11 can increase the heat dissipation area.
  • the cooling fan 3 is assembled on the common side of the two sets of cooling fins 1 and blows cold air to the fins 11 to achieve a high-efficiency cooling effect.
  • FIG. 5 shows a third embodiment of the present invention, in which a portion of the heat sink 1 is the same as the first embodiment, except that the heat conducting superconducting pipe 2 is different, and the heat conducting superconducting pipe 2 is bent into two U pairs. Shape, in which a group of heat conduction superconducting tubes 2 has a larger width and the other end has a smaller width, and the two U-shaped free ends of a larger group of heat conduction superconducting tubes 2 can be placed in a group to dissipate heat.
  • the two grooves 12 on the outermost side of the sheet, and the U-shape without the free end on the same side are also placed into the two grooves 12 on the outermost side of the other group of heat sinks, and the heat conduction superconducting tube 2 of the smaller group is also placed.
  • the two U-shaped ridges of the Chinese U-shape are placed into two grooves 12 located on the side of one group of heat sinks, while the U-shape without a free end above is simultaneously placed into two grooves located on the side of another group of heat sinks Slot 12 (as shown in Figure 6), so the base 10
  • the absorbed heat can also be quickly transferred to the fins 11 through the heat-conducting superconducting tube 2 to quickly disperse the heated portion of the heat sink 1.
  • a cooling fan 3 is provided on the side of the heat sink 1, and the heat fan 3 blows cold air to the fins 11, so that the heat absorbed by the heat sink 1 can be quickly and efficiently removed.
  • FIG. 7 shows a fourth embodiment of the present invention, which can combine the heat dissipation module composed of the heat sink 1 and the heat conducting superconducting tube 2 side by side, and install a single or multiple array of cooling fans to further improve its heat dissipation efficiency. .

Abstract

This invention relates to heat dissipating module which can quickly transmit heat, including two groups of radiator, which having bases and fins joined on bases, and more than a group of heat transmitting super conducting pipe. Two groups of radiator are stacked up. Said super conducting pipes are attached to radiators, where near heat source, and away from heat source. Two groups of radiator are fastened by super conducting pipes. Moreover heat dissipating fans are installed to blow cool air to two groups of radiator, thereby improved heat radiating efficiency. In addition, this invention can combine more groups of heat dissipating module with single or more groups of heat dissipating fans, so the heat can be quickly transmitted and spread out by heat dissipating module.

Description

具有自体可快速导热的散热模组 所属领域  Heat-dissipating module capable of quickly conducting heat by itself
本发明涉及一种具有自体可快速导热的散热模组， 尤其是一种 适用于对电脑中央处理器或高热源产品所产生的热量进行快速、 有 效散热的具有自体可快速导热的散热模組。 发明背景  The invention relates to a heat-dissipating module with self-rapid heat conduction, in particular to a heat-dissipating module with self-rapid heat conduction, which is suitable for quickly and effectively dissipating heat generated by a computer central processor or a high heat source product. Background of the invention
目前产业界针对电脑中央处理器 （CPU )或高热源产品所采用的 散热装置， 大多是通过具有高传热效率金属制成的散热片的基座接 触热源， 并将热量吸收、 传递到散热片的鳍片上， 再利用风扇吹出 冷空气将散热片上的热量散发。  At present, the heat dissipation devices used by the industry for computer central processing units (CPUs) or high heat source products are mostly contacted by the base of the heat sink made of metal with high heat transfer efficiency, and absorb and transfer the heat to the heat sink. On the fins, a fan is used to blow out cold air to dissipate the heat on the fins.
此故法对于小型 CPU所产生的小热量固然有效果， 但对于运算速 度越来越快的大型 CPU所产生的大量热量却无法有效且快速的达到散 热效果， 究其原因在于散热片的金属基座与散热鳍片末端之间存在 一段距离， 由于散热片与热源 （即 CPU )接触的部位只有基座， 故基 座所吸收的热量无法快速地传输到散热鳍片的末端， 而且散热鳍片 的根部与末端部位所吸收的热量不相同， 越接近基座的鳍片根部所 吸收的热量越多， 而越远离基座的鳍片末端所吸收的热量则越少， 于是造成面积有限的散热鳍片仅能利用其靠近金属基座的局部来散 发热量，因此，公知散热装置的散热效率实在无法赶上快速发展的 CPU 运算效率或高热源产品的散热需求。 若有全新的散热装置能突破公 知散热装置的缺点， 强化整体的散热效果， 将可大幅提高电子产品 更高的散热需求。 发明概述 Although this method is effective for small heat generated by small CPUs, it cannot effectively and quickly achieve a large amount of heat generated by large CPUs with faster and faster operation speeds. The reason is that the metal base of the heat sink is There is a distance between the base and the end of the heat radiating fin. Since only the base is in contact with the heat radiating fin and the heat source (that is, the CPU), the heat absorbed by the base cannot be quickly transmitted to the end of the heat radiating fin, and the heat radiating fin The heat absorbed by the root of the fin is not the same as that of the end. The closer to the base, the more heat is absorbed by the root of the fin, and the farther away from the base, the less heat is absorbed, resulting in limited area heat dissipation. The fin can only use its part close to the metal base to dissipate heat. Therefore, the heat dissipation efficiency of the known heat sink cannot really keep up with the rapidly developing CPU computing efficiency or heat dissipation requirements of high heat source products. If a new heat sink can break through the shortcomings of known heat sinks and strengthen the overall heat dissipation effect, it will greatly improve electronic products. Higher cooling requirements. Summary of invention
本发明的目的是提供一种具有自体可快速导热的散热模组， 其 可将两组散热片相互叠合， 利用热传导超导管回绕于两组散热片， 其中一组散热片接触热源， 使得热量可以经由热传导超导管高速地 传递到另一组散热片， 配合另外设置的散热风扇对两组散热片吹出 冷空气而同时散热， 可更有效率的提升散热片的散热效果。  An object of the present invention is to provide a heat-dissipating module capable of quickly conducting heat by itself. The heat-dissipating module can overlap two groups of heat sinks, and use a heat-conducting superconductor to rewind the two heat sinks. It can be transferred to another group of fins at high speed through a heat-conducting superconducting tube, and in conjunction with a separately provided cooling fan, the two groups of fins can blow out cold air while radiating heat at the same time, which can more effectively improve the radiating effect of the fins.
本发明的另一目的是提供一种具有自体可快速导热的散热模 组， 还可以将复数组由所述两组散热片与热传导超导管所构成的散 热模组再組合， 并配合单个或多数组散热风扇对多数组的散热片吹 出冷空气， 藉此将大量的热量快速导热及散热。  Another object of the present invention is to provide a heat-dissipating module with self-rapid heat conduction. The heat-dissipating module composed of the two sets of heat-radiating fins and heat-conducting superconducting tubes can be recombined, and a single or a plurality of heat-dissipating modules can be combined. The group of cooling fans blows cold air to the heat sinks of multiple arrays, thereby rapidly conducting and dissipating a large amount of heat.
本发明的技术方案是， '该具有自体可快速导热的散热模组， 包 括：  The technical solution of the present invention is, 'The heat-dissipating module with self-rapid heat conduction includes:
两组散热片， 其具有基座及连接在基座上的鳍片；  Two sets of heat sinks having a base and fins connected to the base;
一组以上的热传导超导管， 该热传导超导管连接在该散热片接 近接触热源的部位， 以及其它远离热源的部位， 藉以将接触热源部 位的热量传递到其它的部位， 该两组散热片被该热传导超导管扣住 固定。  One or more sets of heat conducting superconducting pipes are connected to the heat sink near the heat source and other parts away from the heat source, so as to transfer the heat from the heat source contacting parts to other parts. The heat-conducting superconduit is fastened.
所述两组散热片的基座底面均设有复数沟槽， 上述热传导超导 管弯折成 u形， 此 u形热传导超导管其中一端置入一组散热片的沟槽 内， 另一端置入另一組散热片的沟槽， 两组散热片内的鳍片相对应 组合成一组， 可增加散热面积。 The bottom surfaces of the bases of the two sets of heat sinks are provided with a plurality of grooves, and the heat conducting superconducting pipe is bent into a U shape. One end of the u-shaped heat conducting superconducting pipe is placed in the groove of a group of heat sinks, and the other end is placed into The grooves of the other heat sink, and the fins in the two heat sinks correspond Combining a group can increase the heat dissipation area.
所述两组散热片的鳍片相互交错组合成一组。  The fins of the two sets of heat sinks are staggered and combined to form a group.
所述两组散热片的基座底面均设有复数沟槽， 上述热传导超导 管为双 U形， 此双 U形热传导超导管两个自由端置入一组散热片的沟 槽内， 上面不具有自由端的 U形热传导超导管置入另一组散热片的沟 槽， 两组散热片呈鰭片相对应组合为一組。  The bottom surfaces of the bases of the two sets of heat sinks are provided with a plurality of grooves, and the heat conducting superconducting pipe is a double U shape. The two free ends of the double U-shaped heat conducting superconducting pipe are placed in the grooves of a group of heat sinks. The U-shaped heat-conducting superconducting tube with a free end is placed in the groove of another group of heat sinks, and the two groups of heat sinks are fins correspondingly combined into one group.
该具有自体可快速导热的散热模组， 还包括： 一散热风扇， 该 散热风扇组装在上述两组散热片共同的侧边， 将冷空气吹向鳍片， 以达到更高效率的散热效果。  The heat-dissipating module with self-rapid heat conduction further includes: a heat-dissipating fan, which is assembled on the common side of the two sets of heat-dissipating fins, and blows cold air to the fins to achieve a more efficient heat-dissipating effect.
所述散热片与上述热传导超导管所组成的散热模组可再并列组 合。  The radiating fins and the heat dissipating module composed of the heat conducting superconducting tube may be combined in parallel.
该具有自体可快速导热的散热模组， 还可包括： 单个或多数组 的散热风扇。  The heat-dissipating module with self-rapid heat conduction may further include: a single or multiple array of heat-dissipating fans.
本发明特点及优点包括：  The features and advantages of the present invention include:
1、 本发明可有效且快速的将热源所产生的热量有效传输至散热 模组上。  1. The invention can effectively and quickly transfer the heat generated by the heat source to the heat dissipation module.
2、 本发明可有效且快速的将热源所产生的热量有效散除。  2. The invention can effectively and quickly dissipate the heat generated by the heat source.
3、 本发明也可将复数个具有自体可快速导热的散热模组組合固 定在一起， 可有效针对热源所产生的热能视需求扩充搭配。 附图简要说明  3. The present invention can also fix a plurality of heat-dissipating module combinations with self-rapid heat conduction, which can effectively expand and match the heat generated by the heat source as required. Brief description of the drawings
图 1为本发明将两组箱形散热片与复数单 U形的热传导超导管组 合的立体分解图； FIG. 1 is a heat conduction superconduit group in which two sets of box-shaped heat sinks and a plurality of single U-shapes are used in the present invention. Combined three-dimensional exploded view;
图 2为图 1中所示元件组合后的状态， 并且配合组装散热风扇后 的立体图；  FIG. 2 is a perspective view of the combined components shown in FIG. 1 and a perspective view of the assembled cooling fan;
图 3为本发明将两组散热片的鰭片交错对合， 并配合复数单 U形 的热传导超导管与风扇组合的立体分解图；  FIG. 3 is an exploded perspective view of a combination of two sets of heat sink fins staggered together with a plurality of single U-shaped heat conduction superconducting ducts and a fan;
图 4为图 3中所示元件组合后的立体图；  FIG. 4 is a perspective view after the components shown in FIG. 3 are combined; FIG.
图 5为本发明将两组双 U形热传导超导管与两组箱形散热片组合 的实施例立体分解图；  5 is an exploded perspective view of an embodiment of the present invention combining two sets of dual U-shaped heat conducting superconducting tubes and two sets of box-shaped heat sinks;
图 6为图 5中所示各元件组合后的立体图；  FIG. 6 is a perspective view after the components shown in FIG. 5 are combined; FIG.
图 7为本发明将由两组散热片与复数热传导超导管所构成的散热 模组再组合后的立体图。  FIG. 7 is a perspective view of a heat sink module composed of two sets of heat sinks and a plurality of heat conducting superconductors according to the present invention.
附图标号说明  Reference Signs
1、 散热片 12、 沟槽 10基座 2热传导超导管 1. Heat sink 12. Groove 10 Base 2. Thermally conductive superconduit
12、 鳍片 3、 散热风扇 较佳实施例说明 12.Fin 3.Fan cooling fan
配合附图将本发明的目的及功能做详细说明。  The purpose and function of the present invention will be described in detail with reference to the drawings.
请参阅图 1所示， 本发明所提供的具有自体可快速导热的散热模 组， 包括有两组散热片 1与热传导超导管 2 , 其中热传导超导管 2 采 用可自由弯折的金属管体（例如铜、 铝或其它金属管体） ， 并在管 体的内部包含具有高速热传导性能的高温超导化合物材料， 例如： 4乙钡铜氧化合物 ( YBC0 )超导材料、 铊钡钙铜氧化合物 ( TBCC0 )超 导材料、 汞钡钙铜氧化合物 （ HBCC0 )超导材料、 铋锶钙铜氧化合物 ( BSCC0 )超导材料、 或其他超导材料， 以及可达到快速导热的其它 材料等， 并且将管体的两端封闭， 以防止所述的超导材料漏出管体。 藉由所述的金属管体与包含在其内部的超导材料构成热传导超导管 2 , 其所应用的原理， 是利用管体内的分子受热时产生的高速震荡与 摩擦， 让热能以波动方式快速热传， 因其传热快速， 故称为热传导 超导管， 且热传导超导管由热端传输至冷端的传输时间很短， 因此 热端与冷端的温差很小， 可达到最佳导热效果。 经实验证实， 其传 热的速率约为铜的五倍， 更比一般以铝挤型制成的散热片的传热速 度快。 Please refer to FIG. 1, a heat-dissipating module with self-rapid heat conduction provided by the present invention includes two groups of heat-dissipating fins 1 and a heat-conducting superconducting tube 2, wherein the heat-conducting super-conducting tube 2 adopts a freely bendable metal pipe body ( (Such as copper, aluminum, or other metal pipe bodies), and contains high-temperature superconducting compound materials with high-speed thermal conductivity inside the pipe body, such as: 4 ethyl barium copper oxide (YBC0) superconducting materials, samarium barium calcium copper oxide (TBCC0) Ultra Conductive material, mercury-barium-calcium-copper-oxygen compound (HBCC0) superconducting material, bismuth strontium-calcium-copper-oxygen compound (BSCC0) superconducting material, or other superconducting materials, and other materials that can achieve rapid heat conduction, etc. The two ends are closed to prevent the superconducting material from leaking out of the pipe body. The metal pipe body and the superconducting material contained in the metal pipe body are used to form a thermally conductive superconducting tube 2. The applied principle is to use the high-speed vibration and friction generated when the molecules in the pipe body are heated, so that the thermal energy is rapidly fluctuated. Heat transfer, due to its rapid heat transfer, is called a thermally conductive superconductor, and the transfer time of the thermally conductive superconductor from the hot end to the cold end is very short. Therefore, the temperature difference between the hot end and the cold end is small, and the best heat conduction effect can be achieved. It is confirmed by experiments that the heat transfer rate is about five times that of copper, which is faster than that of heat sinks generally made of aluminum extrusion.
本发明中散热片 1是一般用来接触于 CPU上以吸收所产生热量的 元件， 其为两组将鰭片外露的散热片 1 , 采用两组散热片 1的原因是 当热传导至上部散热片时， 因上下两组散热片分开， 热不会上下对 流， 所以不会有热回流现象。  The heat sink 1 in the present invention is generally used to contact the CPU to absorb the generated heat. It is two sets of heat sinks 1 with exposed fins. The reason for using two sets of heat sinks 1 is that heat is transmitted to the upper heat sink. At this time, because the upper and lower heat sinks are separated, the heat does not convect up and down, so there is no heat reflow phenomenon.
图 1揭示了本发明的第一实施例， 其包括两组具有外露式鳍片 11 的散热片 1， 其中一组散热片 1的侧边接近基座 10的适当位置设有复 数沟槽 12 , 另一组散热片 10 基座 10底面也设有复数沟槽 12。 所述的 热传导超导管 2弯折成单 U形状， 将此 U形的其中一端置入所述的沟槽 12内， 而另一端则置入另一组散热片 1的沟槽 12中， 让两組散热片 1 呈鳍片 11相对应地组合成一组， 而热传导超导管 2也同时具有扣住两 組散热片 1的固定作用 （如图 2所示） 。 设置沟槽的散热片 1基座 10底 面用来接触诸如 CPU等热源， 因而可以将大量的热量经由热传导超导 管 2传递到另一组散热片 1 , 再将热量分散地传递到各个鰭片 11 , 藉 由所述的热传导超导管 2与散热片 1构成一具有自体可快速导热的散 热模组。 散热风扇 3组装在两组散热片 1共同的侧边， 将冷空气吹向 鳍片 11 , 以达到更高效率的散热效果。 FIG. 1 discloses a first embodiment of the present invention, which includes two sets of heat sinks 1 having exposed fins 11, wherein a plurality of grooves 12 are provided at appropriate positions of the side of the heat sink 1 near the base 10. The bottom surface of the base 10 of the other group of heat sinks 10 is also provided with a plurality of grooves 12. The heat-conducting superconduit 2 is bent into a single U shape, and one end of the U-shape is placed in the groove 12, and the other end is placed in the groove 12 of another group of heat sinks 1. The two groups of heat sinks 1 are combined into a group corresponding to the fins 11, and the heat conducting superconduit 2 also has a fixing function of buckling the two groups of heat sinks 1 (as shown in FIG. 2). A grooved heat sink 1 is provided on the bottom surface of the base 10 for contacting a heat source such as a CPU, so that a large amount of heat can be conducted through thermal conduction The tube 2 is transferred to another group of radiating fins 1, and the heat is dispersedly transferred to each fin 11. The heat conducting superconducting tube 2 and the radiating fins 1 form a heat dissipation module with self-rapid heat conduction. The cooling fan 3 is assembled on the common side of the two sets of heat sinks 1 and blows cold air toward the fins 11 to achieve a more efficient heat dissipation effect.
图 3显示了本发明的第二实施例， 其包括两组相同的散热片 1 , 该散热片 1的基座 10底面设有复数沟槽 12 , 将弯折成 U形的热传导超 导管 2的两侧分别置入两散热片 1的沟槽 12中， 让两组散热片 1的鳍片 11相互交错地组合成一组， 而热传导超导管 2也同时具有扣住两组散 热片 1的固定作用 （如图 4所示'）。 散热片 1的基座 10可用来接触热源， 因而可以将大量的热量经由热传导超导管 2从一组散热片 1传递到另 一组散热片 1 , 并且同时将热量分散地传递到各个鰭片 11 , 且上下交 错的鳍片 11可增加散热面积。 散热风扇 3则组装在两组散热片 1共同 的侧边， 将冷空气吹向鰭片 11 , 以达到高效率的散热效果。  FIG. 3 shows a second embodiment of the present invention, which includes two sets of identical heat sinks 1. The bottom surface of the base 10 of the heat sink 1 is provided with a plurality of grooves 12, which are bent into a U-shaped heat conducting superconduit 2. Both sides are respectively inserted into the grooves 12 of the two fins 1, so that the fins 11 of the two sets of fins 1 are staggered to form a group, and the heat conduction superconducting tube 2 also has a fixing function of buckling the two sets of fins 1 at the same time. (As shown in Figure 4'). The base 10 of the heat sink 1 can be used to contact the heat source, so that a large amount of heat can be transferred from one group of heat sinks 1 to another group of heat sinks 1 through a heat-conducting superconducting tube 2, and at the same time, the heat is dispersedly transferred to each fin 11 The staggered fins 11 can increase the heat dissipation area. The cooling fan 3 is assembled on the common side of the two sets of cooling fins 1 and blows cold air to the fins 11 to achieve a high-efficiency cooling effect.
图 5显示了本发明的第三实施例， 其中散热片 1的部份与第一实 施例相同， 所不同的是热传导超导管 2 , 所述的热传导超导管 2为两 组弯折成为双 U形的形状， 其中一组热传导超导管 2的宽度较大, 而 另一端的宽度较小， 可以将较大一组的热传导超导管 2的双 U形的两 个自由端置入位于一组散热片最侧边的两个沟槽 12 , 而上面不具有 自由端的 U形也同时置入位于另一组散热片最侧边的两个沟槽 12 , 另 外将较小一组的热传导超导管 2的汉 U形的两个自由瑞置入位于一组 散热片侧边的两个沟槽 12 , .而上面不具有自由端的 U形则同时置入位 于另一组散热片侧边的两个沟槽 12 (如图 6所示） ， 因此， 基座 10所 吸收到的热量除了可以经由鰭片 11传导外， 同时也经由热传导超导 管 2快速地传递到鳍片 11 , 以快速分散散热片 1 的受热部份。 在散热 片 1的侧方则设置散热风扇 3， 此散热风扇 3对鰭片 11吹出冷空气， 因 而可以将散热片 1所吸收的热量快速、 有效率地排除。 FIG. 5 shows a third embodiment of the present invention, in which a portion of the heat sink 1 is the same as the first embodiment, except that the heat conducting superconducting pipe 2 is different, and the heat conducting superconducting pipe 2 is bent into two U pairs. Shape, in which a group of heat conduction superconducting tubes 2 has a larger width and the other end has a smaller width, and the two U-shaped free ends of a larger group of heat conduction superconducting tubes 2 can be placed in a group to dissipate heat. The two grooves 12 on the outermost side of the sheet, and the U-shape without the free end on the same side are also placed into the two grooves 12 on the outermost side of the other group of heat sinks, and the heat conduction superconducting tube 2 of the smaller group is also placed. The two U-shaped ridges of the Chinese U-shape are placed into two grooves 12 located on the side of one group of heat sinks, while the U-shape without a free end above is simultaneously placed into two grooves located on the side of another group of heat sinks Slot 12 (as shown in Figure 6), so the base 10 In addition to being conducted through the fins 11, the absorbed heat can also be quickly transferred to the fins 11 through the heat-conducting superconducting tube 2 to quickly disperse the heated portion of the heat sink 1. A cooling fan 3 is provided on the side of the heat sink 1, and the heat fan 3 blows cold air to the fins 11, so that the heat absorbed by the heat sink 1 can be quickly and efficiently removed.
图 7显示了本发明的第四实施例， 其可以将由散热片 1与热传导 超导管 2所组成的散热模组再并列组合， 并且加装单个或多数组的散 热风扇， 以进一步提升其散热效率。  FIG. 7 shows a fourth embodiment of the present invention, which can combine the heat dissipation module composed of the heat sink 1 and the heat conducting superconducting tube 2 side by side, and install a single or multiple array of cooling fans to further improve its heat dissipation efficiency. .
虽然本发明已以优选实施例说明如上， 但其并非用以限定本发 明， 任何本领域的技术人员， 在不脱离本发明的构思和范围内， 当 可作更动与修饰 ,· 因此本发明的保护范围以权利要求书所界定的范 围为准。  Although the present invention has been described with the preferred embodiments as above, it is not intended to limit the present invention. Any person skilled in the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection is subject to the scope defined by the claims.

Claims

权利要求书 Claim
1、 一种具有自体可快速导热的散热模組， 其特征在于： 包括: 两组散热片， 其具有基座及连接在基座上的鰭片；  1. A heat-dissipating module capable of rapidly conducting heat by itself, comprising: two sets of heat-radiating fins having a base and fins connected to the base;
一组以上的热传导超导管， 该热传导超导管连接在该散热片 接近接触热源的部位， 以及其它远离热源的部位， 藉以将接触热 源部位的热量传递到其它的部位， 该两组散热片被该热传导超导 管扣住固定。  One or more sets of heat conducting superconducting pipes are connected to the heat sink near the heat source and other parts away from the heat source, so as to transfer the heat from the heat source contacting parts to other parts. The heat-conducting superconduit is fastened.
2、 如权利要求 1所述的具有自体可快速导热的散热模组， 其 特征在于： 上述两组散热片的基座底面均设有复数沟槽， 上述热 传导超导管弯折成 U形， 此 U形热传导超导管其中一端置入一组散 热片的沟槽内， 另一端置入另一组散热片的沟槽， 两组散热片内 的鳍片相^"应组合成一组， 可增加散热面积。  2. The heat-dissipating module with self-rapid heat conduction according to claim 1, characterized in that: the bottom surface of the base of the two sets of heat sinks are provided with a plurality of grooves, and the heat-conducting superconducting tube is bent into a U shape, One end of the U-shaped heat-conducting superconductor is placed in the groove of a group of heat sinks, and the other end is placed in the groove of another group of heat sinks. The fins in the two groups of heat sinks should be combined into a group to increase heat dissipation. Area.
3、 如权利要求 2所述的具有自体可快速导热的散热模组， 其 特征在于： 两组散热片的鰭片相互交错组合成一组。  3. The heat-dissipating module with self-rapid heat conduction according to claim 2, characterized in that the fins of the two sets of heat-dissipating fins are staggered to form a group.
4、 如权利要求 1所述的具有自体可快速导热的散热模组， 其 特征在于： 上述两组散热片的基座底面均设有复数沟槽， 上述热 传导超导管为双 U形， 此双 U形热传导超导管两个自由端置入一组 散热片的沟槽内， 上面不具有自由端的 U形热传导超导管置入另一 组散热片的沟槽， 两组散热片呈鰭片相对应組合为一組。  4. The heat-dissipating module with self-rapid heat conduction according to claim 1, characterized in that: the bottom surface of the base of the two groups of heat sinks are provided with a plurality of grooves, and the heat-conducting superconducting pipe has a double U shape, and The two free ends of the U-shaped heat-conducting superconducting tube are placed in the grooves of a group of fins, and the U-shaped heat-conducting superconducting tube without a free end on the U-shaped heat-conducting superconducting tube is placed in the groove of another group of fins, and the two groups of fins correspond to fins. Combined into a group.
5、 如权利要求 1所述的具有自体可快速导热的散热模组， 其 特征在于： 还包括： 一散热风扇， 该散热风扇组装在上述两组散 热片共同的侧边， 将冷空气吹向鳍片， 以达到更高效率的散热效 果。 5. The heat-dissipating module with self-rapid heat conduction according to claim 1, further comprising: a heat-dissipating fan, which is assembled on a common side of the two sets of heat-dissipating fins and blows cold air toward Fins for more efficient heat dissipation fruit.
6、 如权利要求 1所述的具有自体可快速导热的散热模组， 其 特征在于： 上述散热片与上述热传导超导管所组成的散热模组可 再并列組合。  6. The heat-dissipating module with self-rapid heat conduction according to claim 1, wherein the heat-dissipating module composed of the heat-dissipating fin and the heat-conducting superconducting tube can be combined in parallel.
7、 如权利要求 1所述的具有自体可快速导热的散热模组， 其 特征在于： 还可包括： 单个或多数组的散热风扇。  7. The heat-dissipating module with self-rapid heat conduction according to claim 1, further comprising: a single or multiple array of heat-dissipating fans.
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