TWI544866B - Heat dissipation device - Google Patents

Description

Heat sink

The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a stack structure of double-layer soaking members.

With the increasing demand for traffic on the network, various softwares that need to be equipped with three-dimensional (3D) stereo animation or high-definition video are widely used to handle the above-mentioned needs, such as web hosting, cloud server and many other computers. The amount of computing equipment is continuously improved. While the computing speed and the amount of calculation are constantly required, the heat dissipation effect required by the computer host is increasingly valued and demanded by the user, and various devices for assisting heat dissipation are also produced. .

Currently, there are a wide variety of heat sinks for computer mainframes or electronic devices, and different heat sinks are used for different electronic components, for example, for a central processing unit (CPU) or a graphics processing unit (GPU), due to its hardware. The surface area is relatively small, and the computational complexity of the central processing unit or the graphics processor is very high, and the temperature of the central processing unit/graphics processor is also rising with the generation of a large amount of waste heat. Therefore, most of the current cooling fans are used. The main heat sink is directly mounted on the central processing unit/graphics processor, and the heat dissipation fins are used to disperse the waste heat generated by the central processing unit/graphic processor, and the waste heat is blown away by the air blowing. In order to achieve heat dissipation.

On the other hand, for electronic components with relatively large hard surface area, such as motherboards or hard disks, since it is not possible to directly install a cooling fan like a central processing unit or a graphics processor, most of them currently use a heat sink type heat sink. Conducting through the soaking plate The waste heat generated by the motherboard or the hard disk is evenly distributed on the surface of the soaking plate, and is blown with the cooling fan to remove the waste water to achieve the purpose of heat dissipation.

However, the common soaking plate type heat dissipation modules currently on the market mostly use a single heat equalizing plate. The single soaking plate is limited by the current limited space design of the electronic device, and can only be transmitted through a large area average conduction heat transfer mode. Heat dissipation, its heat dissipation effect has its limitations.

In order to solve this problem, the conventional solution is to use a heat transfer method of a heat equalizing plate and a heat pipe to improve the heat dissipation effect. However, the heat transfer area of the heat pipe is limited to the circumferential diameter thereof, and the heat transfer effect is not good, and if the number is set too much, The heat pipe will also block the airflow, but reduce the heat dissipation effect. Therefore, even a single heat-sink thermal module with a heat pipe can not achieve the desired heat dissipation effect.

In view of the above problems, the present invention provides a heat dissipating device having a double-layer heat equalizer stack structure, thereby solving the problem that the heat dissipating device of the conventional single heat sink structure cannot provide effective heat dissipation of the electronic device.

The invention discloses a heat dissipating device, which is mounted on an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member and a second heat equalizing member, wherein the first heat equalizing member has a first heat dissipating portion and a first heat conducting portion. The first heat conducting portion is bent and extended by the edge of the first heat radiating portion. The second heat sinking member has a second heat dissipating portion and a second heat conducting portion. The second heat conducting portion is bent and extended by the edge of the second heat dissipating portion, and the second heat dissipating portion is attached to the heat generating component, and the second heat conducting portion is attached. The portion is coupled to the first heat transfer portion.

The invention further discloses a heat dissipating device mounted on an electronic device having a heating element, the heat dissipating device comprising a first heat equalizing member, a second heat equalizing member and a third Hot parts. Wherein, the second heat equalizing member is attached to the heating element, and the third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, and the second heat conducting portions are respectively bent and extended by the edge of the third heat dissipating portion. The third heat equalizer is coupled to the first heat spreader and the second heat spreader by the second heat transfer portion.

The invention further discloses a heat dissipating device, which is mounted with an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member, a second heat equalizing member and a first heat dissipating fin set. The first heat spreader has a first heat dissipation portion and a first heat conduction portion, and the first heat conduction portion is bent and extended by an edge of the first heat dissipation portion. The second heat equalizing member is disposed opposite to the first heat equalizing member, the second heat equalizing member has a second heat dissipating portion and a second heat conducting portion, and the second heat conducting portion is bent and extended by the edge of the second heat dissipating portion, and the second heat dissipating portion The portion is attached to the heat generating component, and the second heat conducting portion is coupled to the first heat conducting portion. The first heat dissipation fin group is disposed between the first heat dissipation member and the second heat dissipation member, and the first heat dissipation fin group is respectively coupled to the first heat dissipation portion and the second heat dissipation portion, so that the second heat dissipation portion and the second heat dissipation portion A heat sink fin group and the first heat sink portion form a heat conduction path.

The invention further discloses a heat dissipating device mounted on an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member, a second heat equalizing member, a third heat equalizing member and a first heat dissipating fin set. Wherein, the second heat equalizer is disposed opposite to the first heat spreader, and the second heat spreader is attached to the heat generating component. The third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, wherein the second heat conducting portions are respectively bent and extended by the edge of the third heat dissipating portion, and the third heat equalizing member is respectively separated by the second heat conducting portion and the first The heat equalizer and the second heat equalizer are connected. The first heat dissipation fin set is disposed between the first heat spreader and the second heat spreader, and the first heat sink fin group is respectively coupled to the first heat spreader and the second heat spreader to make the second heat sink The first heat sink fin group and the first heat sink member form a heat conduction path path.

The effect of the invention is that the heat dissipation device of the double-layer heat equalizer structure is formed by the superposition of the plurality of heat equalizers, so that the waste heat generated by the electronic components and the heat generating components inside the electronic device is transmitted to the heat sink and transmitted through The superposition of the plurality of heat equalizers forms a rapid heat conduction path, and the waste heat is evenly distributed, and the heat dissipation area or the heat transfer speed is significantly improved and improved compared with the conventional single heat sink structure. At the same time, it is equipped with cooling fins, heat pipes and cooling fans to achieve the best heat dissipation.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

The heat dissipating device disclosed in the present invention includes different device embodiments, such as the first embodiment to the tenth embodiment, and the heat dissipating device of the embodiments disclosed in the present invention also includes different components. The device embodiments of the heat dissipating device disclosed in the present invention are all applied to an electronic device having a heating element 101. The electronic device is provided with an electronic component 10 including a large area such as a computer motherboard or a hard disk. The component 101 is an element of any of the above-mentioned electronic components 10. Taking the computer motherboard as an example, the heating component 101 can be a central processing unit (CPU), a graphics processing unit (GPU), or the like. The different components of the waste heat are easily generated during operation, and the electronic components 10 provided with such heat generating components 101 are in a high temperature state due to the waste heat generated.

In the first embodiment, please refer to the combination diagram of the electronic device with the heat sink and the heat dissipating component of the first embodiment shown in FIG. 1 , and please refer to FIG. 2 simultaneously. The heat dissipation device is installed in an electronic device, and the heat dissipation device includes a first heat equalizer 201 and a second heat sink. The material of the first heat equalizing member 201 and the second heat equalizing member 202 includes, but is not limited to, a metal or a metal alloy having a high thermal conductivity such as copper, copper alloy or aluminum alloy, which is familiar with the field. The skilled person can make the first heat equalizer 201 and the second heat equalizer 202 by using different materials according to the requirements of the present invention. In addition, the types of the first heat-receiving member 201 and the second heat-sinking member 202 disclosed in this embodiment may be in the form of a plate drawn as shown in the figure, and the first heat-sinking member 201 and the second heat-sinking member are 202 is manufactured into a uniform hot plate type, but is not limited thereto.

The first heat equalizing member 201 and the second heat equalizing member 202 respectively have a capillary structure 2013, 2023 and a working fluid 2014, 2024, and the capillary structure thereof may include, but is not limited to, a groove, a copper mesh powder sintering, and a composite structure heat pipe ( Structures such as grooves + copper powder sintering / copper mesh + copper powder sintering, and working fluids include, but are not limited to, water, methanol or acetone. The working fluids 2014 and 2024 are driven by the capillary structures 2013 and 2023, and reciprocally flow inside the two heat equalizing members 201 and 202 due to the heated relationship of the two heat equalizing members 201 and 202 to achieve better heat dissipation performance.

The first heat equalizer 201 has an integrally formed structure having a first heat radiating portion 2011 and a first heat conducting portion 2012. Therefore, the first heat conducting portion 2012 is bent and extended by the edge of the first heat radiating portion 2011. The second heat equalizing element 202 is an integrally formed structure having a second heat dissipating portion 2021 and a second heat conducting portion 2022. Therefore, the second heat conducting portion 2022 is bent and extended by the edge of the second heat dissipating portion 2021, and the second heat dissipating portion The portion 2021 is bonded to the heat generating element 101, and the second heat transfer portion 2022 is coupled to the first heat transfer portion 2012. It should be noted that the connection manner of the first heat transfer portion 2012 and the second heat transfer portion 2022 includes, but is not limited to, soldering by soldering, silver soldering or ion diffusion. In addition, the heat dissipation fan 30 is disposed adjacent to one side of the first heat equalizer 201 and the second heat equalizer 202, and generates an air flow to blow the first heat equalizer 201 and the second heat equalizer 202.

According to the heat dissipation method of the first embodiment of the present invention, the waste heat generated by the electronic component 10 and the upper heat generating component 101 thereof is transmitted to the second heat radiating portion 2021 bonded to the heat generating component 101 according to the heat sink structure. The second heat equalizer 202 and the second heat equalizer 202 conduct the waste heat to the second heat conducting portion 2022 via the condensation and evaporation of the capillary structure 2023 and the working fluid 2024, and the second heat conducting portion is coupled to the first heat conducting portion 2012. The waste heat is further transmitted to the first heat equalizer 201, and the waste heat is transmitted to the first heat radiating portion 2011 through the condensation and evaporation of the internal capillary structure 2013 and the working fluid 2014 of the first heat equalizer 201.

Through the heat dissipating device structure, the heat energy is dispersed to the first heat equalizing member 201 and the second heat equalizing member 201 to increase the heat dissipating area of the heat dissipating device, and the first heat equalizing member 201 and the second unit are matched with the cooling fan 30. The air stream blown by the heat member 202 carries away the waste heat generated by the heat generating component 101 by the airflow to reduce the temperature of the electronic component 10 inside the electronic device and the heat generating component 101 thereon to achieve the heat dissipation effect.

In the second embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the second embodiment shown in FIG. 5, and refer to the perspective view of FIG. 6, the side view of the seventh figure, and the Figure 8 shows the heat transfer diagram.

The heat dissipating device disclosed in the embodiment includes a plurality of heat pipes 40 disposed in the second heat dissipating portion 2021 in addition to the first heat equalizing member 201, the second heat equalizing member 202, and the heat dissipating fan 30 of the first embodiment. Fitted to the side of the heating element 101, the heat pipe 40 is in contact with the heat generating component 101. The heat pipe 40 is also similar to the capillary structure 401 and the working fluid 402 inside the first heat equalizer 201 and the second heat equalizer 202.

The heat dissipation mode of the second embodiment is substantially the same as that of the first embodiment, except that the heat pipe 40 added in the embodiment contributes to the waste heat generated by the heat generating component 101, and the capillary structure 401 and the working fluid in the heat pipe 40. The condensation and evaporation of the 402 are more effectively conducted to the second heat dissipating portion 2021, and the heat is dissipated through the heat conduction path as described in the first embodiment to achieve a better heat dissipation effect.

In the third embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the third embodiment shown in FIG. 9, and refer to the perspective view of FIG. 10, the side view of the eleventh figure, and the Figure 12 shows the heat transfer diagram.

In addition to the first heat equalizer 201, the second heat equalizer 202, and the heat dissipation fan 30 of the first embodiment, the heat dissipating device disclosed in the embodiment further includes a first heat sink fin group 50, which is disposed on the first The first heat dissipation fin group 50 is coupled to the first heat dissipation portion 2011 and the second heat dissipation portion 2021.

The heat dissipation mode of the third embodiment is substantially the same as that of the first embodiment, except that the first heat dissipation fin set 50 added in the embodiment causes the waste heat generated by the heat generating component 101, except that it is described in the first embodiment. In addition to the heat dissipation of the heat conduction path, another thermal conduction path may be formed through the connection relationship between the first heat dissipation fin group 50 and the first heat dissipation portion 2011 and the second heat dissipation portion 2021. The first heat dissipation portion 2011 and the second heat dissipation portion 2021 are Through the connection relationship with the first heat dissipation fin group 50, the waste heat is transmitted to the first heat dissipation fin group 50, and the heat is effectively dispersed, and the fins in the first heat dissipation fin group 50 can also increase the heat dissipation area. The blowing fan 30 blows the first heat sink fin group The heat flow around the inner fins of the 50 fins is dissipated to achieve a better heat dissipation effect.

In the fourth embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the fourth embodiment shown in FIG. 13 , and referring to the perspective view of FIG. 14 and the side view and the Figure 16 shows the heat transfer diagram.

In addition to the first heat equalizing member 201, the second heat equalizing member 202, and the heat radiating fan 30 of the first embodiment, the heat dissipating device disclosed in the embodiment further combines the structures of the second embodiment and the third embodiment, and simultaneously sets There are a plurality of heat pipes 40 and a first heat dissipation fin set 50. The relative positions of the heat pipes 40 and the first heat dissipation fins 50 are referred to the second embodiment and the third embodiment, and the inventors will not repeat them here. The heat dissipation method of the fourth embodiment combines the features of the first embodiment, the second embodiment, and the third embodiment, and the heat is more efficiently introduced into the second heat dissipation portion 2021 of the heat dissipation device via the heat pipe 40, and The arrangement of a heat dissipation fin set 50 increases the heat dissipation area and the heat conduction path to achieve a better heat dissipation effect.

In the fifth embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the fifth embodiment shown in FIG. 17, and referring to the perspective view of FIG. 18, the side view of the 19th drawing, and the Figure 20 shows the heat transfer diagram.

The heat dissipating device disclosed in the embodiment further includes a second heat dissipating device, in addition to the first heat equalizing member 201, the second heat equalizing member 202, the heat dissipating fan 30, the heat pipe 40 and the first heat dissipating fin group 50 of the fourth embodiment. The fin group 60 and the second heat dissipation fin group 60 are disposed on a side of the first heat dissipation portion 2011 away from the one of the heat generating elements 101.

In the heat dissipation mode of the fifth embodiment, in addition to the features of the fourth embodiment, the heat of the first heat dissipation portion 2011 is transmitted to the second heat dissipation fin by the arrangement of the second heat dissipation fin group and the first heat dissipation portion 2011. Group 60, further utilizing the second heat sink fin set 60 The fins expand the heat dissipation area, and by the blowing of the cooling fan 30, the hot air is effectively carried away to achieve the heat dissipation effect. It should be noted that the heat dissipating device disclosed in the fifth embodiment has better heat dissipation effect than the first to fourth embodiments.

In the sixth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof in the sixth embodiment shown in FIG. 21, and refer to the heat conduction diagram of FIG. 22 at the same time.

The heat dissipating device is disposed in an electronic device. The heat dissipating device includes a first heat equalizing member 201, a second heat equalizing member 202, a third heat equalizing member 203, and a heat dissipating fan 30. The materials of the first heat equalizer 201 and the second heat equalizer 202 of the present embodiment, and the arrangement positions of the heat dissipating fan 30 are the same as those of the first embodiment, except that the second embodiment is the sixth embodiment. The heat member 202 is directly attached to the heat generating component 101, and the sixth embodiment adds the third heat spreader 203.

The third heat equalizing member 203 of the embodiment has an integrally formed structure having a third heat dissipating portion 2031 and two third heat conducting portions 2032 and 2033. Therefore, the second and third heat conducting portions 2032 and 2033 are respectively edged by the third heat dissipating portion 2031. Bend and extend. In the sixth embodiment, the second heat conducting portions 2032 and 2033 are respectively coupled to the first heat equalizing member 201 and the second heat equalizing member 202, instead of the first first heat equalizing member 201 and the second portion in the first embodiment. The heat member 201 has a connection structure of the first heat transfer portion 2012 and the second heat transfer portion 2022.

The third heat conducting portion 2032, the second heat conducting portion 2032, 2033 and the first heat equalizing member 201 and the second heat equalizing member 202 are connected in the same manner as the second heat conducting portion 2022 and the first in the first embodiment. The manner in which the heat transfer unit 2012 is connected will not be described herein.

In addition, the material of the third heat equalizing member 203 is similar to that of the first heat equalizing member 201 and the second heat equalizing member 202. However, it is worth noting that the third heat equalizing member 203 can adopt heat conduction. The coefficient is relatively higher than that of the first heat equalizer 201 and the second heat equalizer 202 to achieve better heat conduction.

For example, if the first heat equalizing member 201 and the second heat equalizing member 202 are made of an aluminum alloy, the third heat equalizing member 203 having a smaller surface area may have a higher heat transfer coefficient but is more expensive. Copper is a material that can save cost and achieve better heat transfer at the same time compared to all copper-based heat spreaders. At the same time, the third heat equalizing member 203 also has a capillary structure 2034 and a working fluid 2035, and the types of the capillary structure and the working fluid are similar to the first heat equalizing member 201 and the second heat equalizing member 202 (please refer to the first embodiment). Note) The inventors will not repeat them here.

According to the heat dissipating device structure of the present invention, the heat dissipation method of the sixth embodiment of the present invention, the waste heat generated by the electronic component 10 and the upper heating element 101 thereof is transmitted to the second heat equalizing member 202 attached to the heating element 101, The second heat equalizer 202 conducts heat to one end of the third heat equalizer 203 via condensation and evaporation of the capillary structure 2023 and the working fluid 2024, and the third heat spreader 203 is coupled to the second heat spreader 202. The connected third heat conducting portion 2033 further conducts heat to the third heat equalizing member 203, and transmits heat through the third heat dissipating through the condensation and evaporation of the internal capillary structure 2034 and the working fluid 2035 of the third heat equalizing member 203. The portion 2031 is conducted to the other third heat conducting portion 2032. Then, through the connection of the third heat conducting portion 2032 and the first heat equalizing member 201, the heat is conducted into the first heat equalizing member 201, and the heat is transmitted and dispersed to the first through the internal capillary structure 2013 and the working fluid 2014. The heat equalizer 201 is integral.

The heat is dispersed to the first heat equalizer 201, the second heat equalizer 202, and the third heat equalizer 203 through the device structure and the heat dissipation method described above to increase the heat dissipation of the heat sink. The air flow blown by the heat radiating fan 101 to the first heat equalizing member 201, the second heat equalizing member 202, and the third heat equalizing member 203, and the waste heat generated by the heat generating component 101 is taken away by the airflow to reduce the internality of the electronic device. The temperature of the electronic component 10 and the heat generating component 101 thereon achieves the effect of heat dissipation.

In the seventh embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of FIG. 8 in the seventh embodiment shown in FIG.

The heat dissipating device disclosed in this embodiment is substantially similar to the sixth embodiment except that the seventh embodiment is provided with a plurality of heat pipes 40 similar to those of the second embodiment, and is disposed on the second heat equalizing member 202. And attached to the side of the heating element 101, the internal structure of the heat pipe 40, please refer to the statement of the second embodiment. The heat dissipation mode of the seventh embodiment is substantially the same as that of the sixth embodiment, except that the heat pipe 40 added in the embodiment contributes to the waste heat generated by the heat generating component 101, and the capillary structure 401 and the working fluid in the heat pipe 30. The condensation and evaporation of 402 is more effectively conducted to the second heat equalizer 202, and the heat is dissipated through the heat conduction path as described in the sixth embodiment to achieve a better heat dissipation effect.

In the eighth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of Fig. 26 of the eighth embodiment shown in Fig. 25.

The heat dissipating device disclosed in this embodiment is substantially the same as the sixth embodiment except that the first heat dissipating fin set 50 similar to the third embodiment is added to the embodiment to cause waste heat generated by the heating element 101. In addition to the heat conduction path described in the sixth embodiment, the first heat dissipation fin set 50 and the first heat spreader 201 and the second heat spreader 202 may be connected to form another heat conduction path, and the waste heat is A heat dissipation portion 2011 and a second heat dissipation portion 2021 are conducted to the first heat dissipation fin group 50 to effectively disperse heat. At the same time, the first heat dissipation fin group 50 can also increase the heat dissipation area, and the heat dissipation around the fins in the first heat dissipation fin group 50 can be dissipated by the blowing of the heat dissipation fan 30 to achieve better heat dissipation effect.

In the ninth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of Fig. 28 of the ninth embodiment shown in Fig. 27.

In addition to the first heat equalizer 201, the second heat equalizer 202, the third heat equalizer 203, and the heat radiating fan 30 of the sixth embodiment, the heat dissipating device disclosed in the embodiment further combines the seventh embodiment and the eighth For the structure of the embodiment, a plurality of heat pipes 40 and a first heat dissipation fin set 50 are provided at the same time. For the arrangement position and relative relationship, please refer to the fourth embodiment, and the inventors will not repeat them here. The heat dissipation mode of the eighth embodiment is combined with the features of the sixth embodiment, the seventh embodiment and the eighth embodiment, and the heat is more efficiently introduced into the heat dissipation device via the heat pipe 40, and the first heat dissipation fin group 50 can also be transmitted. Set the heat dissipation area and heat conduction path to achieve better heat dissipation.

In the tenth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of FIG. 30 in the tenth embodiment shown in FIG.

The heat dissipating device disclosed in this embodiment includes the first heat equalizing member 201, the second heat equalizing member 202, the third heat equalizing member 203, the heat dissipating fan 30, the heat pipe 40, and the first heat dissipating fin group 50 of the ninth embodiment. In addition, a second heat dissipation fin set 60 is further disposed, and the second heat dissipation fin set 60 is disposed on a side of the first heat spreader 201 away from the heat generating component of 101.

The heat dissipation mode of the tenth embodiment, in addition to the features of the ninth embodiment, further transfers the heat of the first heat spreader 201 to the second heat sink fin set 60 by the arrangement of the second heat sink fin set 60, further Increasing the heat dissipation area and blowing it by the cooling fan 30, Effectively dissipate heat. It should be noted that the heat dissipation device disclosed in the tenth embodiment has better heat dissipation effect than the sixth to tenth embodiments.

The heat dissipating device of the double-layer heat equalizer structure formed by the overlapping arrangement of the plurality of heat equalizing members exposes the waste heat generated by the heating element in the electronic device via the heat equalizing member and the heat pipe disposed thereon Conducted into the heat sink, and then through the superimposed heat sinks to form a fast heat conduction path, the heat is evenly distributed on the heat equalizer, regardless of the heat dissipation area or heat transfer speed, compared to the conventional single heat spreader structure , there are significant improvements and improvements. At the same time, it is equipped with cooling fins and cooling fan to achieve the best heat dissipation.

Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧Electronic components

101‧‧‧heating components

201‧‧‧First heating element

2011‧‧‧First heat dissipation department

2012‧‧‧First Thermal Conductor

202‧‧‧Second heating element

2021‧‧‧second heat sink

2022‧‧‧Second heat conduction department

203‧‧‧ third heating element

2031‧‧‧ Third heat sink

2032, 2033‧‧‧ third heat transfer department

30‧‧‧ cooling fan

40‧‧‧heat pipe

50‧‧‧First heat sink fin set

60‧‧‧Second heat sink fin set

2013, 2023, 2034, 401‧‧ ‧ capillary structure

2014, 2024, 2035, 402‧‧‧ working fluid

Fig. 1 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the first embodiment.

Fig. 2 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the first embodiment.

Fig. 3 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the first embodiment.

Fig. 4 is a schematic view showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the first embodiment.

Fig. 5 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the second embodiment.

Figure 6 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

Figure 7 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

Figure 8 is a schematic diagram showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

Figure 9 is a combination view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

Figure 10 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

Figure 11 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

Figure 12 is a schematic view showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

Figure 13 is a combination view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

Figure 14 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

Figure 15 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

Figure 16 is a fourth embodiment of an electronic device having a heat sink and a heat dissipating component thereof Schematic diagram of heat conduction.

Figure 17 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the fifth embodiment.

Figure 18 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the fifth embodiment.

Fig. 19 is a side view showing the electronic device having the heat sink and the heat dissipating member thereof in the fifth embodiment.

Figure 20 is a schematic view showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the fifth embodiment.

Figure 21 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the sixth embodiment.

Figure 22 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the sixth embodiment.

Figure 23 is a side view of the electronic device having the heat sink and the heat dissipating component of the seventh embodiment.

Figure 24 is a schematic view showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the seventh embodiment.

Figure 25 is a side view of an electronic device having a heat sink and a heat dissipating component thereof according to the eighth embodiment.

Figure 26 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the eighth embodiment.

Figure 27 is a side view of the electronic device having the heat sink and the heat dissipating component of the ninth embodiment.

Figure 28 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the ninth embodiment.

Figure 29 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the tenth embodiment.

Figure 30 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the tenth embodiment.

10‧‧‧Electronic components

101‧‧‧heating components

201‧‧‧First heating element

2011‧‧‧First heat dissipation department

2012‧‧‧First Thermal Conductor

202‧‧‧Second heating element

2021‧‧‧second heat sink

2022‧‧‧Second heat conduction department

30‧‧‧ cooling fan

Claims (13)

A heat dissipating device is mounted on an electronic device, the electronic device having a heating element, the heat dissipating device comprising: a first heat equalizing member having a first heat dissipating portion and a first heat conducting portion, wherein the first heat conducting portion is An edge of the first heat dissipating portion is bent and extended; a second heat equalizing member has a second heat dissipating portion and a second heat conducting portion, and the second heat conducting portion is bent and extended by an edge of the second heat dissipating portion, the second The heat dissipating portion is attached to the heating element, and the second heat conducting portion is coupled to the first heat conducting portion; a first heat dissipating fin group is disposed on the first heat equalizing member and the second heat equalizing member And a cooling fan adjacent to one side of the first heat equalizing member and the second heat equalizing member, the heat radiating fan generates a gas flow to blow the first heat equalizing member and the second heat equalizing member. The heat dissipation device of claim 1, wherein the first heat dissipation fin group is coupled to the first heat dissipation portion and the second heat dissipation portion, and the second heat dissipation portion and the first heat dissipation fin group And the first heat dissipation portion constitutes a heat conduction path. The heat dissipating device of claim 1, further comprising a second heat dissipating fin set disposed on a side of the first heat dissipating portion away from the heat generating component. The heat dissipating device of claim 1, further comprising a plurality of heat pipes disposed on the side of the heat generating component, wherein the heat pipes are in contact with the heat generating component. The heat dissipating device of claim 4, wherein the heat pipes further have a capillary structure and a working fluid. The heat dissipating device of claim 1, wherein the first heat equalizing member and the second heat equalizing member respectively have a capillary structure and a working fluid. A heat dissipating device is suitable for being mounted on an electronic device, the electronic device having a heating element, the heat dissipating device comprising: a first heat equalizing member; a second heat equalizing member is attached to the heat generating member; a third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, wherein the two third heat conducting portions are respectively edged by the third heat dissipating portion The first heat-dissipating member is respectively connected to the first heat-sinking member and the second heat-sinking member; a first heat-dissipating fin group is disposed on the first heat-sinking portion And a heat dissipating fan adjacent to one side of the first heat equalizing member and the second heat equalizing member, the cooling fan generating an air flow to the first heat equalizing member The second heat equalizer is blown. The heat dissipation device of claim 7, wherein the first heat dissipation fin set is coupled to the first heat spreader and the second heat spreader, and the second heat spreader and the first heat sink The fin set and the first heat equalizer form a heat conduction path. The heat sink of claim 7, further comprising a second heat sink fin disposed on a side of the first heat sink away from the heat generating component. The heat dissipation device of claim 7, wherein the material of the third heat equalizer has a heat transfer coefficient higher than a heat transfer coefficient of the materials of the first heat spreader and the second heat spreader. The heat dissipating device of claim 7, further comprising a plurality of heat pipes disposed on the side of the heat generating component, wherein the heat pipes are in contact with the heat generating component. The heat dissipating device of claim 11, wherein the heat pipes further have a capillary structure and a working fluid. The heat dissipating device of claim 7, wherein the first heat equalizing member, the second heat equalizing member and the third heat equalizing member each have a capillary structure and a working fluid.