TWI544866B - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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TWI544866B
TWI544866B TW100146430A TW100146430A TWI544866B TW I544866 B TWI544866 B TW I544866B TW 100146430 A TW100146430 A TW 100146430A TW 100146430 A TW100146430 A TW 100146430A TW I544866 B TWI544866 B TW I544866B
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heat
dissipating
equalizing
dissipation
electronic
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TW100146430A
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TW201325420A (en
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黃順治
毛黛娟
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技嘉科技股份有限公司
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散熱裝置 Heat sink

本發明係關於一種散熱裝置,特別是一種具有雙層均熱件堆疊結構之散熱裝置。 The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device having a stack structure of double-layer soaking members.

隨著網路傳輸之流量需求日益增加,同時需搭配三維(3D)立體動畫或高畫質影像之各類軟體廣為盛行,為處理上述之需求,諸如網路主機、雲端伺服器等許多電腦配備之運算量進而不斷提升,在不停要求運算速度及運算量的同時,相對地,電腦主機所需求之散熱效果也越發被使用者所重視及要求,各式協助散熱之裝置也因應而生。 With the increasing demand for traffic on the network, various softwares that need to be equipped with three-dimensional (3D) stereo animation or high-definition video are widely used to handle the above-mentioned needs, such as web hosting, cloud server and many other computers. The amount of computing equipment is continuously improved. While the computing speed and the amount of calculation are constantly required, the heat dissipation effect required by the computer host is increasingly valued and demanded by the user, and various devices for assisting heat dissipation are also produced. .

目前應用於電腦主機或電子裝置之散熱裝置種類繁多,且針對不同的電子零組件採用不同的散熱裝置,舉例來說,針對中央處理器(CPU)或圖形處理器(GPU),因其硬體表面積相對較小,且不論中央處理器或圖形處理器之運算量皆非常高,而中央處理器/圖形處理器的溫度亦會隨著大量廢熱的產生而不斷攀升,因此目前多半採用散熱風扇作為主要散熱裝置,直接裝設於中央處理器/圖形處理器上,且搭配散熱鰭片將中央處理器/圖形處理器所產生之廢熱分散,並經由散熱風扇的吹送,將廢熱透過氣流吹送帶走,以便達到散熱效能。 Currently, there are a wide variety of heat sinks for computer mainframes or electronic devices, and different heat sinks are used for different electronic components, for example, for a central processing unit (CPU) or a graphics processing unit (GPU), due to its hardware. The surface area is relatively small, and the computational complexity of the central processing unit or the graphics processor is very high, and the temperature of the central processing unit/graphics processor is also rising with the generation of a large amount of waste heat. Therefore, most of the current cooling fans are used. The main heat sink is directly mounted on the central processing unit/graphics processor, and the heat dissipation fins are used to disperse the waste heat generated by the central processing unit/graphic processor, and the waste heat is blown away by the air blowing. In order to achieve heat dissipation.

另一方面,針對硬體表面積相對較大之電子零組件,例如主機板或硬碟,因為無法如中央處理器或圖形處理器直接裝設散熱風扇,因此目前多半採用均熱板式的散熱裝置,透過均熱板傳導 主機板或硬碟產生之廢熱且平均分散於均熱板面上,並搭配散熱風扇之吹拂,將廢熱帶走,以達到散熱目的。 On the other hand, for electronic components with relatively large hard surface area, such as motherboards or hard disks, since it is not possible to directly install a cooling fan like a central processing unit or a graphics processor, most of them currently use a heat sink type heat sink. Conducting through the soaking plate The waste heat generated by the motherboard or the hard disk is evenly distributed on the surface of the soaking plate, and is blown with the cooling fan to remove the waste water to achieve the purpose of heat dissipation.

然而,目前市面上常見的均熱板式的散熱模組多採用單一的均熱板,單一均熱板受限於目前電子裝置內部空間有限的設計,僅能透過大面積平均傳導之傳熱方式進行散熱,其散熱效果存在有其侷限性。 However, the common soaking plate type heat dissipation modules currently on the market mostly use a single heat equalizing plate. The single soaking plate is limited by the current limited space design of the electronic device, and can only be transmitted through a large area average conduction heat transfer mode. Heat dissipation, its heat dissipation effect has its limitations.

為解決此問題,目前習知的解決方式是採用均熱板搭配熱管的傳熱方式,以期提昇散熱效果,然而熱管傳熱面積僅限於其圓周直徑,傳熱效果不彰,且若是設置過多數量的熱管亦會阻礙氣流通過,反而降低散熱效果,因此縱然搭配有熱管的單一均熱板散熱模組仍無法達到理想的散熱功效。 In order to solve this problem, the conventional solution is to use a heat transfer method of a heat equalizing plate and a heat pipe to improve the heat dissipation effect. However, the heat transfer area of the heat pipe is limited to the circumferential diameter thereof, and the heat transfer effect is not good, and if the number is set too much, The heat pipe will also block the airflow, but reduce the heat dissipation effect. Therefore, even a single heat-sink thermal module with a heat pipe can not achieve the desired heat dissipation effect.

鑒於以上的問題,本發明在於提供一種具有雙層均熱件堆疊結構之散熱裝置,藉以解決習用單一均熱件結構之散熱裝置無法提供電子裝置有效散熱的問題。 In view of the above problems, the present invention provides a heat dissipating device having a double-layer heat equalizer stack structure, thereby solving the problem that the heat dissipating device of the conventional single heat sink structure cannot provide effective heat dissipation of the electronic device.

本發明揭露一種散熱裝置,安裝於具有發熱元件之電子裝置,散熱裝置包含一第一均熱件以及一第二均熱件,其中第一均熱件具有一第一散熱部及一第一導熱部,第一導熱部由第一散熱部的邊緣彎折延伸。第二均熱件則具有一第二散熱部及一第二導熱部,第二導熱部由第二散熱部的邊緣彎折延伸,第二散熱部係貼合於發熱元件上,且第二導熱部與第一導熱部相連結。 The invention discloses a heat dissipating device, which is mounted on an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member and a second heat equalizing member, wherein the first heat equalizing member has a first heat dissipating portion and a first heat conducting portion. The first heat conducting portion is bent and extended by the edge of the first heat radiating portion. The second heat sinking member has a second heat dissipating portion and a second heat conducting portion. The second heat conducting portion is bent and extended by the edge of the second heat dissipating portion, and the second heat dissipating portion is attached to the heat generating component, and the second heat conducting portion is attached. The portion is coupled to the first heat transfer portion.

本發明另外揭露一種散熱裝置,安裝於具有發熱元件之電子裝置,散熱裝置包含一第一均熱件、一第二均熱件以及一第三均 熱件。其中,第二均熱件貼合於發熱元件上,同時第三均熱件具有一第三散熱部及二第三導熱部,二第三導熱部分別由第三散熱部的邊緣彎折延伸,第三均熱件以二第三導熱部分別與第一均熱件及第二均熱件相連結。 The invention further discloses a heat dissipating device mounted on an electronic device having a heating element, the heat dissipating device comprising a first heat equalizing member, a second heat equalizing member and a third Hot parts. Wherein, the second heat equalizing member is attached to the heating element, and the third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, and the second heat conducting portions are respectively bent and extended by the edge of the third heat dissipating portion. The third heat equalizer is coupled to the first heat spreader and the second heat spreader by the second heat transfer portion.

本發明另外揭露一種散熱裝置,安裝具有發熱元件之電子裝置,散熱裝置包含一第一均熱件、一第二均熱件以及一第一散熱鰭片組。其中,第一均熱件具有一第一散熱部及一第一導熱部,第一導熱部由第一散熱部的邊緣彎折延伸。第二均熱件與第一均熱件相對設置,第二均熱件具有一第二散熱部及一第二導熱部,第二導熱部由第二散熱部的邊緣彎折延伸,第二散熱部係貼合於發熱元件上,且第二導熱部與第一導熱部相連結。第一散熱鰭片組設置於第一均熱件與第二均熱件之間,且第一散熱鰭片組分別與第一散熱部及第二散熱部相連結,令第二散熱部、第一散熱鰭片組及第一散熱部構成一導熱路徑。 The invention further discloses a heat dissipating device, which is mounted with an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member, a second heat equalizing member and a first heat dissipating fin set. The first heat spreader has a first heat dissipation portion and a first heat conduction portion, and the first heat conduction portion is bent and extended by an edge of the first heat dissipation portion. The second heat equalizing member is disposed opposite to the first heat equalizing member, the second heat equalizing member has a second heat dissipating portion and a second heat conducting portion, and the second heat conducting portion is bent and extended by the edge of the second heat dissipating portion, and the second heat dissipating portion The portion is attached to the heat generating component, and the second heat conducting portion is coupled to the first heat conducting portion. The first heat dissipation fin group is disposed between the first heat dissipation member and the second heat dissipation member, and the first heat dissipation fin group is respectively coupled to the first heat dissipation portion and the second heat dissipation portion, so that the second heat dissipation portion and the second heat dissipation portion A heat sink fin group and the first heat sink portion form a heat conduction path.

本發明另外揭露一種散熱裝置,安裝於具有發熱元件之電子裝置,散熱裝置包含一第一均熱件、一第二均熱件、一第三均熱件以及一第一散熱鰭片組。其中,第二均熱件與第一均熱件相對設置,且第二均熱件係貼合於發熱元件上。第三均熱件具有一第三散熱部及二第三導熱部,二第三導熱部分別由第三散熱部的邊緣彎折延伸,第三均熱件以二第三導熱部分別與第一均熱件及第二均熱件相連結。第一散熱鰭片組設置於第一均熱件與第二均熱件之間,且第一散熱鰭片組分別與第一均熱件及第二均熱件相連結,令第二均熱件、第一散熱鰭片組及第一均熱件構成一導熱路 徑。 The invention further discloses a heat dissipating device mounted on an electronic device having a heating element. The heat dissipating device comprises a first heat equalizing member, a second heat equalizing member, a third heat equalizing member and a first heat dissipating fin set. Wherein, the second heat equalizer is disposed opposite to the first heat spreader, and the second heat spreader is attached to the heat generating component. The third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, wherein the second heat conducting portions are respectively bent and extended by the edge of the third heat dissipating portion, and the third heat equalizing member is respectively separated by the second heat conducting portion and the first The heat equalizer and the second heat equalizer are connected. The first heat dissipation fin set is disposed between the first heat spreader and the second heat spreader, and the first heat sink fin group is respectively coupled to the first heat spreader and the second heat spreader to make the second heat sink The first heat sink fin group and the first heat sink member form a heat conduction path path.

本發明之功效在於,透過複數個均熱件的疊合,以形成雙層均熱件結構之散熱裝置,使電子裝置內部的電子零組件及發熱元件產生之廢熱傳導到散熱裝置中,並透過複數均熱件的疊合,形成快速導熱路徑,將廢熱平均散佈,無論在散熱面積或者傳熱速度上,相較於習知之單一均熱件結構,都有顯著的提昇和改善。同時搭配散熱鰭片、熱管及散熱風扇之設置,達到最佳之散熱效果。 The effect of the invention is that the heat dissipation device of the double-layer heat equalizer structure is formed by the superposition of the plurality of heat equalizers, so that the waste heat generated by the electronic components and the heat generating components inside the electronic device is transmitted to the heat sink and transmitted through The superposition of the plurality of heat equalizers forms a rapid heat conduction path, and the waste heat is evenly distributed, and the heat dissipation area or the heat transfer speed is significantly improved and improved compared with the conventional single heat sink structure. At the same time, it is equipped with cooling fins, heat pipes and cooling fans to achieve the best heat dissipation.

有關本發明的特徵、實作與功效,茲配合圖式作最佳實施例詳細說明如下。 The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

本發明所揭露之散熱裝置包含第一實施例至第十實施例等不同的裝置實施例,本發明所揭露各實施例之散熱裝置亦包含不同元件之設置。本發明所揭露散熱裝置不同的裝置實施例皆應用於一具有發熱元件101之一電子裝置,其中電子裝置設置有包含但不限於電腦主機板、硬碟等面積較大之電子零組件10,發熱元件101為上述電子零組件10上任一發熱之元件,以電腦主機板為例,發熱元件101可為中央處理器(Central Processing Unit,CPU)、圖形處理器(Graphics Processing Unit,GPU)或其他在運作過程中容易產生廢熱之不同元件,因其產生的廢熱,使設置有此類發熱元件101之電子零組件10處於高溫的狀態。 The heat dissipating device disclosed in the present invention includes different device embodiments, such as the first embodiment to the tenth embodiment, and the heat dissipating device of the embodiments disclosed in the present invention also includes different components. The device embodiments of the heat dissipating device disclosed in the present invention are all applied to an electronic device having a heating element 101. The electronic device is provided with an electronic component 10 including a large area such as a computer motherboard or a hard disk. The component 101 is an element of any of the above-mentioned electronic components 10. Taking the computer motherboard as an example, the heating component 101 can be a central processing unit (CPU), a graphics processing unit (GPU), or the like. The different components of the waste heat are easily generated during operation, and the electronic components 10 provided with such heat generating components 101 are in a high temperature state due to the waste heat generated.

在第一實施例中,請參考第1圖所示第一實施例具有散熱裝置之電子裝置及其散熱配件之組合圖,並請同時參考第2圖之立 體圖、第3圖之側視圖及第4圖之熱傳導示意圖,本實施例揭露一種散熱裝置,係裝設於一電子裝置內部,散熱裝置包含一第一均熱件201、一第二均熱件202以及一散熱風扇30,其中,第一均熱件201及第二均熱件202之材質包含但不限於銅、銅合金、鋁合金等導熱係數較高之金屬或金屬合金,熟悉本領域技藝之人可依據本發明之精神,依照需求採用不同材質製作第一均熱件201及第二均熱件202。另外,本實施例所揭露的第一均熱件201及第二均熱件202的型態可以如圖式所繪製的板件型態,而將第一均熱件201及第二均熱件202製造成均熱板型態,但並不以此為限。 In the first embodiment, please refer to the combination diagram of the electronic device with the heat sink and the heat dissipating component of the first embodiment shown in FIG. 1 , and please refer to FIG. 2 simultaneously. The heat dissipation device is installed in an electronic device, and the heat dissipation device includes a first heat equalizer 201 and a second heat sink. The material of the first heat equalizing member 201 and the second heat equalizing member 202 includes, but is not limited to, a metal or a metal alloy having a high thermal conductivity such as copper, copper alloy or aluminum alloy, which is familiar with the field. The skilled person can make the first heat equalizer 201 and the second heat equalizer 202 by using different materials according to the requirements of the present invention. In addition, the types of the first heat-receiving member 201 and the second heat-sinking member 202 disclosed in this embodiment may be in the form of a plate drawn as shown in the figure, and the first heat-sinking member 201 and the second heat-sinking member are 202 is manufactured into a uniform hot plate type, but is not limited thereto.

第一均熱件201及第二均熱件202內部分別具有一毛細結構2013、2023及一工作流體2014、2024,其毛細結構可包括但不限於溝槽、銅網粉末燒結、複合結構熱管(溝槽+銅粉燒結/銅網+銅粉燒結)等結構,而工作流體則包括但不限於水、甲醇或丙酮等類之冷卻液。工作流體2014、2024藉由毛細結構2013、2023的帶動,並因為二均熱件201、202的受熱關係,而於二均熱件201、202內部往復流動,以達到較佳的散熱效能。 The first heat equalizing member 201 and the second heat equalizing member 202 respectively have a capillary structure 2013, 2023 and a working fluid 2014, 2024, and the capillary structure thereof may include, but is not limited to, a groove, a copper mesh powder sintering, and a composite structure heat pipe ( Structures such as grooves + copper powder sintering / copper mesh + copper powder sintering, and working fluids include, but are not limited to, water, methanol or acetone. The working fluids 2014 and 2024 are driven by the capillary structures 2013 and 2023, and reciprocally flow inside the two heat equalizing members 201 and 202 due to the heated relationship of the two heat equalizing members 201 and 202 to achieve better heat dissipation performance.

第一均熱件201為具有一第一散熱部2011及一第一導熱部2012的一體成型構造,因此第一導熱部2012是由第一散熱部2011的邊緣彎折延伸。第二均熱元件202則為具有一第二散熱部2021及一第二導熱部2022的一體成型構造,因此第二導熱部2022則由第二散熱部2021的邊緣彎折延伸,且第二散熱部2021係貼合於發熱元件101上,第二導熱部2022與第一導熱部2012相連結。 值得注意的是,第一導熱部2012與第二導熱部2022的連接方式包含但不限於經由錫焊、銀焊或離子擴散之焊接方式相連結。另外,散熱風扇30鄰近設置於第一均熱件201與第二均熱件202的一側,並產生一氣流對第一均熱件201與第二均熱件202吹送。 The first heat equalizer 201 has an integrally formed structure having a first heat radiating portion 2011 and a first heat conducting portion 2012. Therefore, the first heat conducting portion 2012 is bent and extended by the edge of the first heat radiating portion 2011. The second heat equalizing element 202 is an integrally formed structure having a second heat dissipating portion 2021 and a second heat conducting portion 2022. Therefore, the second heat conducting portion 2022 is bent and extended by the edge of the second heat dissipating portion 2021, and the second heat dissipating portion The portion 2021 is bonded to the heat generating element 101, and the second heat transfer portion 2022 is coupled to the first heat transfer portion 2012. It should be noted that the connection manner of the first heat transfer portion 2012 and the second heat transfer portion 2022 includes, but is not limited to, soldering by soldering, silver soldering or ion diffusion. In addition, the heat dissipation fan 30 is disposed adjacent to one side of the first heat equalizer 201 and the second heat equalizer 202, and generates an air flow to blow the first heat equalizer 201 and the second heat equalizer 202.

本發明所揭露第一實施例之散熱方式,依據前述之散熱裝置結構,電子零組件10及其上發熱元件101所產生之廢熱,經由貼合於發熱元件101之第二散熱部2021傳導至第二均熱件202,第二均熱件202經由毛細結構2023及工作流體2024之凝結及蒸發作用,將廢熱傳導至第二導熱部2022,第二導熱部則藉由與第一導熱部2012之連結,將廢熱進一步傳導至第一均熱件201,並透過第一均熱件201內部毛細結構2013及工作流體2014之凝結及蒸發作用,將廢熱傳導至第一散熱部2011。 According to the heat dissipation method of the first embodiment of the present invention, the waste heat generated by the electronic component 10 and the upper heat generating component 101 thereof is transmitted to the second heat radiating portion 2021 bonded to the heat generating component 101 according to the heat sink structure. The second heat equalizer 202 and the second heat equalizer 202 conduct the waste heat to the second heat conducting portion 2022 via the condensation and evaporation of the capillary structure 2023 and the working fluid 2024, and the second heat conducting portion is coupled to the first heat conducting portion 2012. The waste heat is further transmitted to the first heat equalizer 201, and the waste heat is transmitted to the first heat radiating portion 2011 through the condensation and evaporation of the internal capillary structure 2013 and the working fluid 2014 of the first heat equalizer 201.

經由上述的散熱裝置結構,得以將熱能分散至第一均熱件201及第二均熱件201,以增加散熱裝置之散熱面積,並配合散熱風扇30對第一均熱件201與第二均熱件202吹送之氣流,將發熱元件101產生之廢熱藉由氣流帶走,以降低電子裝置內部之電子零組件10及其上發熱元件101之溫度,達到散熱之效果。 Through the heat dissipating device structure, the heat energy is dispersed to the first heat equalizing member 201 and the second heat equalizing member 201 to increase the heat dissipating area of the heat dissipating device, and the first heat equalizing member 201 and the second unit are matched with the cooling fan 30. The air stream blown by the heat member 202 carries away the waste heat generated by the heat generating component 101 by the airflow to reduce the temperature of the electronic component 10 inside the electronic device and the heat generating component 101 thereon to achieve the heat dissipation effect.

在第二實施例中,請參考第5圖所示第二實施例具有散熱裝置之電子裝置及其散熱配件之組合圖,並請同時參考第6圖之立體圖、第7圖之側視圖及第8圖之熱傳導示意圖。 In the second embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the second embodiment shown in FIG. 5, and refer to the perspective view of FIG. 6, the side view of the seventh figure, and the Figure 8 shows the heat transfer diagram.

本實施例所揭露之散熱裝置,除第一實施例之第一均熱件201、第二均熱件202以及散熱風扇30外,尚包括有複數個熱管40,設置於第二散熱部2021且貼合於發熱元件101側面,熱管 40並與發熱元件101相接觸。熱管40內部亦類同於第一均熱件201及第二均熱件202內部的毛細結構401及工作流體402。 The heat dissipating device disclosed in the embodiment includes a plurality of heat pipes 40 disposed in the second heat dissipating portion 2021 in addition to the first heat equalizing member 201, the second heat equalizing member 202, and the heat dissipating fan 30 of the first embodiment. Fitted to the side of the heating element 101, the heat pipe 40 is in contact with the heat generating component 101. The heat pipe 40 is also similar to the capillary structure 401 and the working fluid 402 inside the first heat equalizer 201 and the second heat equalizer 202.

第二實施例之散熱方式大致與第一實施例類同,惟其不同點在於本實施例增設之熱管40,有助於將發熱元件101產生之廢熱,藉由熱管40內毛細結構401及工作流體402之凝結及蒸發作用,更有效地傳導至第二散熱部2021,再經由如第一實施例所述之熱傳導路徑將熱散出,達到較佳之散熱效果。 The heat dissipation mode of the second embodiment is substantially the same as that of the first embodiment, except that the heat pipe 40 added in the embodiment contributes to the waste heat generated by the heat generating component 101, and the capillary structure 401 and the working fluid in the heat pipe 40. The condensation and evaporation of the 402 are more effectively conducted to the second heat dissipating portion 2021, and the heat is dissipated through the heat conduction path as described in the first embodiment to achieve a better heat dissipation effect.

在第三實施例中,請參考第9圖所示第三實施例具有散熱裝置之電子裝置及其散熱配件之組合圖,並請同時參考第10圖之立體圖、第11圖之側視圖及第12圖之熱傳導示意圖。 In the third embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the third embodiment shown in FIG. 9, and refer to the perspective view of FIG. 10, the side view of the eleventh figure, and the Figure 12 shows the heat transfer diagram.

本實施例所揭露之散熱裝置,除第一實施例之第一均熱件201、第二均熱件202以及散熱風扇30外,更包含有第一散熱鰭片組50,設置於第一均熱件201與第二均熱件202之間,且第一散熱鰭片組50分別與第一散熱部2011及第二散熱部2021相連結。 In addition to the first heat equalizer 201, the second heat equalizer 202, and the heat dissipation fan 30 of the first embodiment, the heat dissipating device disclosed in the embodiment further includes a first heat sink fin group 50, which is disposed on the first The first heat dissipation fin group 50 is coupled to the first heat dissipation portion 2011 and the second heat dissipation portion 2021.

第三實施例之散熱方式大致與第一實施例類同,惟其不同點在於本實施例增設之第一散熱鰭片組50,使發熱元件101產生之廢熱,除經由第一實施例所述之熱傳導路徑散熱外,亦可透過第一散熱鰭片組50與第一散熱部2011及第二散熱部2021之連結關係,形成另一熱導路徑,第一散熱部2011及第二散熱部2021即可透過與第一散熱鰭片組50之連結關係,將廢熱傳導到第一散熱鰭片組50,有效將熱分散,同時第一散熱鰭片組50內之鰭片亦可增加散熱面積,配合散熱風扇30之吹拂,將第一散熱鰭片組 50內鰭片周圍之熱氣流散出,達到較佳之散熱效果。 The heat dissipation mode of the third embodiment is substantially the same as that of the first embodiment, except that the first heat dissipation fin set 50 added in the embodiment causes the waste heat generated by the heat generating component 101, except that it is described in the first embodiment. In addition to the heat dissipation of the heat conduction path, another thermal conduction path may be formed through the connection relationship between the first heat dissipation fin group 50 and the first heat dissipation portion 2011 and the second heat dissipation portion 2021. The first heat dissipation portion 2011 and the second heat dissipation portion 2021 are Through the connection relationship with the first heat dissipation fin group 50, the waste heat is transmitted to the first heat dissipation fin group 50, and the heat is effectively dispersed, and the fins in the first heat dissipation fin group 50 can also increase the heat dissipation area. The blowing fan 30 blows the first heat sink fin group The heat flow around the inner fins of the 50 fins is dissipated to achieve a better heat dissipation effect.

在第四實施例中,請參考第13圖所示第四實施例具有散熱裝置之電子裝置及其散熱配件之組合圖,並請同時參考第14圖之立體圖、第15圖之側視圖及第16圖之熱傳導示意圖。 In the fourth embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the fourth embodiment shown in FIG. 13 , and referring to the perspective view of FIG. 14 and the side view and the Figure 16 shows the heat transfer diagram.

本實施例所揭露之散熱裝置,除第一實施例之第一均熱件201、第二均熱件202以及散熱風扇30外,更組合第二實施例及第三實施例之結構,同時設置有複數個熱管40及第一散熱鰭片組50,其設置位置及與其他元件之相對關係請參考第二實施例及第三實施例,發明人不在此贅述。第四實施例之散熱方式則結合第一實施例、第二實施例及第三實施例之特徵,除經由熱管40將熱更有效地導入散熱裝置之第二散熱部2021內,亦可透過第一散熱鰭片組50之設置增加散熱面積及熱傳導路徑,達到較佳之散熱效果。 In addition to the first heat equalizing member 201, the second heat equalizing member 202, and the heat radiating fan 30 of the first embodiment, the heat dissipating device disclosed in the embodiment further combines the structures of the second embodiment and the third embodiment, and simultaneously sets There are a plurality of heat pipes 40 and a first heat dissipation fin set 50. The relative positions of the heat pipes 40 and the first heat dissipation fins 50 are referred to the second embodiment and the third embodiment, and the inventors will not repeat them here. The heat dissipation method of the fourth embodiment combines the features of the first embodiment, the second embodiment, and the third embodiment, and the heat is more efficiently introduced into the second heat dissipation portion 2021 of the heat dissipation device via the heat pipe 40, and The arrangement of a heat dissipation fin set 50 increases the heat dissipation area and the heat conduction path to achieve a better heat dissipation effect.

在第五實施例中,請參考第17圖所示第五實施例具有散熱裝置之電子裝置及其散熱配件之組合圖,並請同時參考第18圖之立體圖、第19圖之側視圖及第20圖之熱傳導示意圖。 In the fifth embodiment, please refer to the combination diagram of the electronic device having the heat dissipating device and the heat dissipating component thereof in the fifth embodiment shown in FIG. 17, and referring to the perspective view of FIG. 18, the side view of the 19th drawing, and the Figure 20 shows the heat transfer diagram.

本實施例所揭露之散熱裝置,除第四實施例之第一均熱件201、第二均熱件202散熱風扇30、熱管40及第一散熱鰭片組50外,更包含有一第二散熱鰭片組60,第二散熱鰭片組60設置於第一散熱部2011遠離101發熱元件之一側面上。 The heat dissipating device disclosed in the embodiment further includes a second heat dissipating device, in addition to the first heat equalizing member 201, the second heat equalizing member 202, the heat dissipating fan 30, the heat pipe 40 and the first heat dissipating fin group 50 of the fourth embodiment. The fin group 60 and the second heat dissipation fin group 60 are disposed on a side of the first heat dissipation portion 2011 away from the one of the heat generating elements 101.

第五實施例之散熱方式,除第四實施例之特點外,更藉由第二散熱鰭片組與第一散熱部2011連結之設置,將第一散熱部2011之熱傳導至第二散熱鰭片組60,更進一步利用第二散熱鰭片組60 之鰭片擴張散熱面積,並藉由散熱風扇30之吹拂,有效地進行將熱空氣帶走,達到散熱功效。值得注意的是,第五實施例所揭露之散熱裝置,其散熱效果較第一至第四實施例為佳。 In the heat dissipation mode of the fifth embodiment, in addition to the features of the fourth embodiment, the heat of the first heat dissipation portion 2011 is transmitted to the second heat dissipation fin by the arrangement of the second heat dissipation fin group and the first heat dissipation portion 2011. Group 60, further utilizing the second heat sink fin set 60 The fins expand the heat dissipation area, and by the blowing of the cooling fan 30, the hot air is effectively carried away to achieve the heat dissipation effect. It should be noted that the heat dissipating device disclosed in the fifth embodiment has better heat dissipation effect than the first to fourth embodiments.

在第六實施例中,請參考第21圖所示第六實施例具有散熱裝置之電子裝置及其散熱配件之側視圖,並請同時參考第22圖之熱傳導示意圖。 In the sixth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof in the sixth embodiment shown in FIG. 21, and refer to the heat conduction diagram of FIG. 22 at the same time.

本實施例揭露一種散熱裝置,係裝設於一電子裝置內部,散熱裝置包含一第一均熱件201、一第二均熱件202、一第三均熱件203以及一散熱風扇30。本實施例之第一均熱件201、第二均熱件202之材質,以及散熱風扇30之設置位置皆與第一實施例相類同,惟其不同之處在於第六實施例中第二均熱件202直接貼合於發熱元件101,且第六實施例增加了第三均熱件203。 The heat dissipating device is disposed in an electronic device. The heat dissipating device includes a first heat equalizing member 201, a second heat equalizing member 202, a third heat equalizing member 203, and a heat dissipating fan 30. The materials of the first heat equalizer 201 and the second heat equalizer 202 of the present embodiment, and the arrangement positions of the heat dissipating fan 30 are the same as those of the first embodiment, except that the second embodiment is the sixth embodiment. The heat member 202 is directly attached to the heat generating component 101, and the sixth embodiment adds the third heat spreader 203.

本實施例之第三均熱件203為具有一第三散熱部2031及二第三導熱部2032、2033的一體成型構造,因此二第三導熱部2032、2033分別由第三散熱部2031的邊緣彎折延伸。第六實施例以二第三導熱部2032、2033分別與第一均熱件201及第二均熱件202相連結之結構,取代第一實施例中第第一均熱件201與第二均熱件201以第一導熱部2012與第二導熱部2022之連結結構。 The third heat equalizing member 203 of the embodiment has an integrally formed structure having a third heat dissipating portion 2031 and two third heat conducting portions 2032 and 2033. Therefore, the second and third heat conducting portions 2032 and 2033 are respectively edged by the third heat dissipating portion 2031. Bend and extend. In the sixth embodiment, the second heat conducting portions 2032 and 2033 are respectively coupled to the first heat equalizing member 201 and the second heat equalizing member 202, instead of the first first heat equalizing member 201 and the second portion in the first embodiment. The heat member 201 has a connection structure of the first heat transfer portion 2012 and the second heat transfer portion 2022.

其中,第三均熱件203之二第三導熱部2032、2033與第一均熱件201及第二均熱件202之連結方式類同於第一實施例中第二導熱部2022與第一導熱部2012之連結方式,發明人不在此贅述。 The third heat conducting portion 2032, the second heat conducting portion 2032, 2033 and the first heat equalizing member 201 and the second heat equalizing member 202 are connected in the same manner as the second heat conducting portion 2022 and the first in the first embodiment. The manner in which the heat transfer unit 2012 is connected will not be described herein.

此外,第三均熱件203之材質亦類同於第一均熱件201及第二均熱件202,惟值得注意的是,第三均熱件203可採用熱傳導 係數相對高於第一均熱件201及第二均熱件202之材質製作,以達到較佳之熱傳導效果。 In addition, the material of the third heat equalizing member 203 is similar to that of the first heat equalizing member 201 and the second heat equalizing member 202. However, it is worth noting that the third heat equalizing member 203 can adopt heat conduction. The coefficient is relatively higher than that of the first heat equalizer 201 and the second heat equalizer 202 to achieve better heat conduction.

舉例說明,若第一均熱件201及第二均熱件202之材質為鋁合金(Aluminum alloy),則表面積較小之第三均熱件203則可採用熱傳導係數較高但價格較昂貴之銅為材質,如此相較於全部採用銅為材質之均熱件可以節省成本,並同時達到較佳之熱傳導效果。同時第三均熱件203內亦具有毛細結構2034及工作流體2035,其毛細結構及工作流體之種類類同於第一均熱件201及第二均熱件202(請參考第一實施例之說明),發明人亦不在此贅述。 For example, if the first heat equalizing member 201 and the second heat equalizing member 202 are made of an aluminum alloy, the third heat equalizing member 203 having a smaller surface area may have a higher heat transfer coefficient but is more expensive. Copper is a material that can save cost and achieve better heat transfer at the same time compared to all copper-based heat spreaders. At the same time, the third heat equalizing member 203 also has a capillary structure 2034 and a working fluid 2035, and the types of the capillary structure and the working fluid are similar to the first heat equalizing member 201 and the second heat equalizing member 202 (please refer to the first embodiment). Note) The inventors will not repeat them here.

依據前述之散熱裝置結構,本發明所揭露第六實施例之散熱方式,電子零組件10及其上發熱元件101所產生之廢熱,傳導至貼合於發熱元件101之第二均熱件202,第二均熱件202經由毛細結構2023及工作流體2024之凝結及蒸發作用,將熱傳導至與第三均熱件203連結之一端,第三均熱件203則藉由與第二均熱件202連結之第三導熱部2033,再將熱進一步傳導至第三均熱件203內,並透過第三均熱件203內部毛細結構2034及工作流體2035之凝結及蒸發作用,將熱通過第三散熱部2031傳導至另一第三導熱部2032。而後,再經由第三導熱部2032與第一均熱件201之連結,將熱傳導至第一均熱件201內,並藉由內部之毛細結構2013及工作流體2014,將熱傳導並分散至第一均熱件201整體。 According to the heat dissipating device structure of the present invention, the heat dissipation method of the sixth embodiment of the present invention, the waste heat generated by the electronic component 10 and the upper heating element 101 thereof is transmitted to the second heat equalizing member 202 attached to the heating element 101, The second heat equalizer 202 conducts heat to one end of the third heat equalizer 203 via condensation and evaporation of the capillary structure 2023 and the working fluid 2024, and the third heat spreader 203 is coupled to the second heat spreader 202. The connected third heat conducting portion 2033 further conducts heat to the third heat equalizing member 203, and transmits heat through the third heat dissipating through the condensation and evaporation of the internal capillary structure 2034 and the working fluid 2035 of the third heat equalizing member 203. The portion 2031 is conducted to the other third heat conducting portion 2032. Then, through the connection of the third heat conducting portion 2032 and the first heat equalizing member 201, the heat is conducted into the first heat equalizing member 201, and the heat is transmitted and dispersed to the first through the internal capillary structure 2013 and the working fluid 2014. The heat equalizer 201 is integral.

經由上述之裝置結構及散熱方式,將熱分散至第一均熱件201、第二均熱件202及第三均熱件203,以增加散熱裝置之散熱 面積,並配合散熱風扇30對第一均熱件201、第二均熱件202以及第三均熱件203吹送之氣流,將發熱元件101產生之廢熱藉由氣流帶走,以降低電子裝置內部之電子零組件10及其上發熱元件101之溫度,達到散熱之效果。 The heat is dispersed to the first heat equalizer 201, the second heat equalizer 202, and the third heat equalizer 203 through the device structure and the heat dissipation method described above to increase the heat dissipation of the heat sink. The air flow blown by the heat radiating fan 101 to the first heat equalizing member 201, the second heat equalizing member 202, and the third heat equalizing member 203, and the waste heat generated by the heat generating component 101 is taken away by the airflow to reduce the internality of the electronic device. The temperature of the electronic component 10 and the heat generating component 101 thereon achieves the effect of heat dissipation.

在第七實施例中,請參考第23圖所示第七實施例具有散熱裝置之電子裝置及其散熱配件之側視圖及第8圖之熱傳導示意圖。 In the seventh embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of FIG. 8 in the seventh embodiment shown in FIG.

本實施例所揭露之散熱裝置大致上類同於第六實施例,惟其不同之處在於第七實施例設置有與第二實施例相類似的複數個熱管40,設置於第二均熱件202且貼合於發熱元件101側面,熱管40之內部結構請參考第二實施例之陳述。第七實施例之散熱方式大致與第六實施例類同,惟其不同點在於本實施例增設之熱管40,有助於將發熱元件101產生之廢熱,藉由熱管30內毛細結構401及工作流體402之凝結及蒸發作用,更有效地傳導至第二均熱件202,再經由如第六實施例所述之熱傳導路徑將熱散出,達到較佳之散熱效果。 The heat dissipating device disclosed in this embodiment is substantially similar to the sixth embodiment except that the seventh embodiment is provided with a plurality of heat pipes 40 similar to those of the second embodiment, and is disposed on the second heat equalizing member 202. And attached to the side of the heating element 101, the internal structure of the heat pipe 40, please refer to the statement of the second embodiment. The heat dissipation mode of the seventh embodiment is substantially the same as that of the sixth embodiment, except that the heat pipe 40 added in the embodiment contributes to the waste heat generated by the heat generating component 101, and the capillary structure 401 and the working fluid in the heat pipe 30. The condensation and evaporation of 402 is more effectively conducted to the second heat equalizer 202, and the heat is dissipated through the heat conduction path as described in the sixth embodiment to achieve a better heat dissipation effect.

在第八實施例中,請參考第25圖所示第八實施例具有散熱裝置之電子裝置及其散熱配件之側視圖及第26圖之熱傳導示意圖。 In the eighth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of Fig. 26 of the eighth embodiment shown in Fig. 25.

本實施例所揭露之散熱裝置大致上類同於第六實施例,惟其不同點在於本實施例增設與第三實施例類似之第一散熱鰭片組50,使發熱元件101產生之廢熱,除第六實施例所述之熱傳導路徑外,亦可透過第一散熱鰭片組50與第一均熱件201及第二均熱件202之連結關係,形成另一熱導路徑,將廢熱由第一散熱部2011及第二散熱部2021傳導到第一散熱鰭片組50,有效將熱分散, 同時第一散熱鰭片組50亦可增加散熱面積,配合散熱風扇30之吹拂,將第一散熱鰭片組50內鰭片周圍之熱氣流散出,達到較佳之散熱效果。 The heat dissipating device disclosed in this embodiment is substantially the same as the sixth embodiment except that the first heat dissipating fin set 50 similar to the third embodiment is added to the embodiment to cause waste heat generated by the heating element 101. In addition to the heat conduction path described in the sixth embodiment, the first heat dissipation fin set 50 and the first heat spreader 201 and the second heat spreader 202 may be connected to form another heat conduction path, and the waste heat is A heat dissipation portion 2011 and a second heat dissipation portion 2021 are conducted to the first heat dissipation fin group 50 to effectively disperse heat. At the same time, the first heat dissipation fin group 50 can also increase the heat dissipation area, and the heat dissipation around the fins in the first heat dissipation fin group 50 can be dissipated by the blowing of the heat dissipation fan 30 to achieve better heat dissipation effect.

在第九實施例中,請參考第27圖所示第九實施例具有散熱裝置之電子裝置及其散熱配件之側視圖及第28圖之熱傳導示意圖。 In the ninth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of Fig. 28 of the ninth embodiment shown in Fig. 27.

本實施例所揭露之散熱裝置,除第六實施例之第一均熱件201、第二均熱件202、第三均熱件203以及散熱風扇30外,更組合第七實施例及第八實施例之結構,同時設置有複數個熱管40及第一散熱鰭片組50,其設置位置及相對關係請參考第四實施例,發明人不在此贅述。第八實施例之散熱方式則結合第六實施例、第七實施例及第八實施例之特點,除經由熱管40將熱更有效地導入散熱裝置,亦可透過第一散熱鰭片組50之設置增加散熱面積及熱傳導路徑,達到較佳之散熱效果。 In addition to the first heat equalizer 201, the second heat equalizer 202, the third heat equalizer 203, and the heat radiating fan 30 of the sixth embodiment, the heat dissipating device disclosed in the embodiment further combines the seventh embodiment and the eighth For the structure of the embodiment, a plurality of heat pipes 40 and a first heat dissipation fin set 50 are provided at the same time. For the arrangement position and relative relationship, please refer to the fourth embodiment, and the inventors will not repeat them here. The heat dissipation mode of the eighth embodiment is combined with the features of the sixth embodiment, the seventh embodiment and the eighth embodiment, and the heat is more efficiently introduced into the heat dissipation device via the heat pipe 40, and the first heat dissipation fin group 50 can also be transmitted. Set the heat dissipation area and heat conduction path to achieve better heat dissipation.

在第十實施例中,請參考第29圖所示第十實施例具有散熱裝置之電子裝置及其散熱配件之側視圖及第30圖之熱傳導示意圖。 In the tenth embodiment, please refer to the side view of the electronic device having the heat sink and the heat dissipating component thereof and the heat conduction diagram of FIG. 30 in the tenth embodiment shown in FIG.

本實施例所揭露之散熱裝置,除第九實施例之第一均熱件201、第二均熱件202、第三均熱件203、散熱風扇30、熱管40及第一散熱鰭片組50外,更包含有一第二散熱鰭片組60,第二散熱鰭片組60設置於第一均熱件201遠離101發熱元件之一側面上。 The heat dissipating device disclosed in this embodiment includes the first heat equalizing member 201, the second heat equalizing member 202, the third heat equalizing member 203, the heat dissipating fan 30, the heat pipe 40, and the first heat dissipating fin group 50 of the ninth embodiment. In addition, a second heat dissipation fin set 60 is further disposed, and the second heat dissipation fin set 60 is disposed on a side of the first heat spreader 201 away from the heat generating component of 101.

第十實施例之散熱方式,除第九實施例之特點外,再藉由第二散熱鰭片組60之設置,將第一均熱件201之熱傳導至第二散熱鰭片組60,更進一步增加散熱面積,並藉由散熱風扇30之吹拂, 有效地進行散熱。值得注意的是,第十實施例所揭露之散熱裝置,其散熱效果亦較第六至第十實施例為佳。 The heat dissipation mode of the tenth embodiment, in addition to the features of the ninth embodiment, further transfers the heat of the first heat spreader 201 to the second heat sink fin set 60 by the arrangement of the second heat sink fin set 60, further Increasing the heat dissipation area and blowing it by the cooling fan 30, Effectively dissipate heat. It should be noted that the heat dissipation device disclosed in the tenth embodiment has better heat dissipation effect than the sixth to tenth embodiments.

上述本發明不同實施例所揭露透過複數個均熱件的疊合設置形成之雙層均熱件結構的散熱裝置,使電子裝置中發熱元件產生之廢熱經由均熱件及設置於其上之熱管傳導到散熱裝置中,再透過均熱件彼此的疊合,形成快速導熱路徑,將熱平均散佈於均熱件,無論在散熱面積或者傳熱速度上,相較於習知之單一均熱板結構,都有顯著的提昇和改善。同時搭配散熱鰭片及散熱風扇之設置,達到最佳之散熱效果。 The heat dissipating device of the double-layer heat equalizer structure formed by the overlapping arrangement of the plurality of heat equalizing members exposes the waste heat generated by the heating element in the electronic device via the heat equalizing member and the heat pipe disposed thereon Conducted into the heat sink, and then through the superimposed heat sinks to form a fast heat conduction path, the heat is evenly distributed on the heat equalizer, regardless of the heat dissipation area or heat transfer speed, compared to the conventional single heat spreader structure , there are significant improvements and improvements. At the same time, it is equipped with cooling fins and cooling fan to achieve the best heat dissipation.

雖然本發明之實施例揭露如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明之精神和範圍內,舉凡依本發明申請範圍所述之形狀、構造、特徵及數量當可做些許之變更,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the number of modifications may be made, and the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to the specification.

10‧‧‧電子零組件 10‧‧‧Electronic components

101‧‧‧發熱元件 101‧‧‧heating components

201‧‧‧第一均熱件 201‧‧‧First heating element

2011‧‧‧第一散熱部 2011‧‧‧First heat dissipation department

2012‧‧‧第一導熱部 2012‧‧‧First Thermal Conductor

202‧‧‧第二均熱件 202‧‧‧Second heating element

2021‧‧‧第二散熱部 2021‧‧‧second heat sink

2022‧‧‧第二導熱部 2022‧‧‧Second heat conduction department

203‧‧‧第三均熱件 203‧‧‧ third heating element

2031‧‧‧第三散熱部 2031‧‧‧ Third heat sink

2032、2033‧‧‧第三導熱部 2032, 2033‧‧‧ third heat transfer department

30‧‧‧散熱風扇 30‧‧‧ cooling fan

40‧‧‧熱管 40‧‧‧heat pipe

50‧‧‧第一散熱鰭片組 50‧‧‧First heat sink fin set

60‧‧‧第二散熱鰭片組 60‧‧‧Second heat sink fin set

2013、2023、2034、401‧‧‧毛細結構 2013, 2023, 2034, 401‧‧ ‧ capillary structure

2014、2024、2035、402‧‧‧工作流體 2014, 2024, 2035, 402‧‧‧ working fluid

第1圖為第一實施例具有散熱裝置之電子裝置及其散熱配件之組合圖。 Fig. 1 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the first embodiment.

第2圖為第一實施例具有散熱裝置之電子裝置及其散熱配件之立體圖。 Fig. 2 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the first embodiment.

第3圖為第一實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Fig. 3 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the first embodiment.

第4圖為第一實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Fig. 4 is a schematic view showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the first embodiment.

第5圖為第二實施例具有散熱裝置之電子裝置及其散熱配件之組合圖。 Fig. 5 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the second embodiment.

第6圖為第二實施例具有散熱裝置之電子裝置及其散熱配件之立體圖。 Figure 6 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

第7圖為第二實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 7 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

第8圖為第二實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 8 is a schematic diagram showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the second embodiment.

第9圖為第三實施例具有散熱裝置之電子裝置及其散熱配件之組合圖。 Figure 9 is a combination view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

第10圖為第三實施例具有散熱裝置之電子裝置及其散熱配件之立體圖。 Figure 10 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

第11圖為第三實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 11 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

第12圖為第三實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 12 is a schematic view showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the third embodiment.

第13圖為第四實施例具有散熱裝置之電子裝置及其散熱配件之組合圖。 Figure 13 is a combination view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

第14圖為第四實施例具有散熱裝置之電子裝置及其散熱配件之立體圖。 Figure 14 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

第15圖為第四實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 15 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the fourth embodiment.

第16圖為第四實施例具有散熱裝置之電子裝置及其散熱配件之 熱傳導示意圖。 Figure 16 is a fourth embodiment of an electronic device having a heat sink and a heat dissipating component thereof Schematic diagram of heat conduction.

第17圖為第五實施例具有散熱裝置之電子裝置及其散熱配件之組合圖。 Figure 17 is a combination diagram of an electronic device having a heat sink and a heat dissipating component thereof in the fifth embodiment.

第18圖為第五實施例具有散熱裝置之電子裝置及其散熱配件之立體圖。 Figure 18 is a perspective view of the electronic device having the heat sink and the heat dissipating component thereof in the fifth embodiment.

第19圖為第五實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Fig. 19 is a side view showing the electronic device having the heat sink and the heat dissipating member thereof in the fifth embodiment.

第20圖為第五實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 20 is a schematic view showing the heat conduction of the electronic device having the heat sink and the heat dissipating component thereof in the fifth embodiment.

第21圖為第六實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 21 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the sixth embodiment.

第22圖為第六實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 22 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the sixth embodiment.

第23圖為第七實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 23 is a side view of the electronic device having the heat sink and the heat dissipating component of the seventh embodiment.

第24圖為第七實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 24 is a schematic view showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the seventh embodiment.

第25圖為第八實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 25 is a side view of an electronic device having a heat sink and a heat dissipating component thereof according to the eighth embodiment.

第26圖為第八實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 26 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the eighth embodiment.

第27圖為第九實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 27 is a side view of the electronic device having the heat sink and the heat dissipating component of the ninth embodiment.

第28圖為第九實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 28 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the ninth embodiment.

第29圖為第十實施例具有散熱裝置之電子裝置及其散熱配件之側視圖。 Figure 29 is a side view of the electronic device having the heat sink and the heat dissipating component thereof in the tenth embodiment.

第30圖為第十實施例具有散熱裝置之電子裝置及其散熱配件之熱傳導示意圖。 Figure 30 is a schematic diagram showing the heat conduction of the electronic device having the heat dissipating device and the heat dissipating component thereof in the tenth embodiment.

10‧‧‧電子零組件 10‧‧‧Electronic components

101‧‧‧發熱元件 101‧‧‧heating components

201‧‧‧第一均熱件 201‧‧‧First heating element

2011‧‧‧第一散熱部 2011‧‧‧First heat dissipation department

2012‧‧‧第一導熱部 2012‧‧‧First Thermal Conductor

202‧‧‧第二均熱件 202‧‧‧Second heating element

2021‧‧‧第二散熱部 2021‧‧‧second heat sink

2022‧‧‧第二導熱部 2022‧‧‧Second heat conduction department

30‧‧‧散熱風扇 30‧‧‧ cooling fan

Claims (13)

一種散熱裝置,安裝於一電子裝置,該電子裝置具有一發熱元件,該散熱裝置包含:一第一均熱件,具有一第一散熱部及一第一導熱部,該第一導熱部由該第一散熱部的邊緣彎折延伸;一第二均熱件,具有一第二散熱部及一第二導熱部,該第二導熱部由該第二散熱部的邊緣彎折延伸,該第二散熱部係貼合於該發熱元件上,且該第二導熱部與該第一導熱部相連結;一第一散熱鰭片組,設置於該第一均熱件與該第二均熱件之間;以及一散熱風扇,鄰近設置於該第一均熱件與該第二均熱件的一側,該散熱風扇產生一氣流對該第一均熱件與該第二均熱件吹送。 A heat dissipating device is mounted on an electronic device, the electronic device having a heating element, the heat dissipating device comprising: a first heat equalizing member having a first heat dissipating portion and a first heat conducting portion, wherein the first heat conducting portion is An edge of the first heat dissipating portion is bent and extended; a second heat equalizing member has a second heat dissipating portion and a second heat conducting portion, and the second heat conducting portion is bent and extended by an edge of the second heat dissipating portion, the second The heat dissipating portion is attached to the heating element, and the second heat conducting portion is coupled to the first heat conducting portion; a first heat dissipating fin group is disposed on the first heat equalizing member and the second heat equalizing member And a cooling fan adjacent to one side of the first heat equalizing member and the second heat equalizing member, the heat radiating fan generates a gas flow to blow the first heat equalizing member and the second heat equalizing member. 如請求項第1項所述之散熱裝置,其中該第一散熱鰭片組分別與該第一散熱部及該第二散熱部相連結,且該第二散熱部、該第一散熱鰭片組及該第一散熱部構成一導熱路徑。 The heat dissipation device of claim 1, wherein the first heat dissipation fin group is coupled to the first heat dissipation portion and the second heat dissipation portion, and the second heat dissipation portion and the first heat dissipation fin group And the first heat dissipation portion constitutes a heat conduction path. 如請求項第1項所述之散熱裝置,其中更包含一第二散熱鰭片組,設置於該第一散熱部遠離該發熱元件之一側面上。 The heat dissipating device of claim 1, further comprising a second heat dissipating fin set disposed on a side of the first heat dissipating portion away from the heat generating component. 如請求項第1項所述之散熱裝置,其中更包含複數個熱管,設置於該第二散熱部貼合於該發熱元件之側面上,該等熱管與該發熱元件相接觸。 The heat dissipating device of claim 1, further comprising a plurality of heat pipes disposed on the side of the heat generating component, wherein the heat pipes are in contact with the heat generating component. 如請求項第4項所述之散熱裝置,其中,該等熱管內更分別具有一毛細結構及一工作流體。 The heat dissipating device of claim 4, wherein the heat pipes further have a capillary structure and a working fluid. 如請求項第1項所述之散熱裝置,其中該第一均熱件與該第二均熱件內更分別具有一毛細結構及一工作流體。 The heat dissipating device of claim 1, wherein the first heat equalizing member and the second heat equalizing member respectively have a capillary structure and a working fluid. 一種散熱裝置,適用安裝於一電子裝置,該電子裝置具有一發熱元件,該散熱裝置包含:一第一均熱件; 一第二均熱件,貼合於該發熱件上;一第三均熱件,具有一第三散熱部及二第三導熱部,該二第三導熱部分別由該第三散熱部的邊緣彎折延伸,該第三均熱件以該二第三導熱部分別與該第一均熱件及該第二均熱件相連結;一第一散熱鰭片組,設置於該第一均熱件與該第二均熱件之間;以及一散熱風扇,鄰近設置於該第一均熱件與該第二均熱件的一側,該散熱風扇產生一氣流對該第一均熱件與該第二均熱件吹送。 A heat dissipating device is suitable for being mounted on an electronic device, the electronic device having a heating element, the heat dissipating device comprising: a first heat equalizing member; a second heat equalizing member is attached to the heat generating member; a third heat equalizing member has a third heat dissipating portion and two third heat conducting portions, wherein the two third heat conducting portions are respectively edged by the third heat dissipating portion The first heat-dissipating member is respectively connected to the first heat-sinking member and the second heat-sinking member; a first heat-dissipating fin group is disposed on the first heat-sinking portion And a heat dissipating fan adjacent to one side of the first heat equalizing member and the second heat equalizing member, the cooling fan generating an air flow to the first heat equalizing member The second heat equalizer is blown. 如請求項第7項所述之散熱裝置,其中該第一散熱鰭片組分別與該第一均熱件及該第二均熱件相連結,且該第二均熱件、該第一散熱鰭片組及該第一均熱件構成一導熱路徑。 The heat dissipation device of claim 7, wherein the first heat dissipation fin set is coupled to the first heat spreader and the second heat spreader, and the second heat spreader and the first heat sink The fin set and the first heat equalizer form a heat conduction path. 如請求項第7項所述之散熱裝置,其中更包含一第二散熱鰭片組,設置於該第一均熱件遠離該發熱元件之一側面上。 The heat sink of claim 7, further comprising a second heat sink fin disposed on a side of the first heat sink away from the heat generating component. 如請求項第7項所述之散熱裝置,其中,該第三均熱件之材質的熱傳導係數相對高於該第一均熱件及該第二均熱件之材質的熱傳導係數。 The heat dissipation device of claim 7, wherein the material of the third heat equalizer has a heat transfer coefficient higher than a heat transfer coefficient of the materials of the first heat spreader and the second heat spreader. 如請求項第7項所述之散熱裝置,其中更包含複數個熱管,設置於該第二散熱部貼合於該發熱元件之側面上,該等熱管與該發熱元件相接觸。 The heat dissipating device of claim 7, further comprising a plurality of heat pipes disposed on the side of the heat generating component, wherein the heat pipes are in contact with the heat generating component. 如請求項第11項所述之散熱裝置,其中,該等熱管內更分別具有一毛細結構及一工作流體。 The heat dissipating device of claim 11, wherein the heat pipes further have a capillary structure and a working fluid. 如請求項第7項所述之散熱裝置,其中,該第一均熱件、該第二均熱件及該第三均熱件內更分別具有一毛細結構及一工作流體。 The heat dissipating device of claim 7, wherein the first heat equalizing member, the second heat equalizing member and the third heat equalizing member each have a capillary structure and a working fluid.
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