TW202022301A - Water-cooling solid-state drive - Google Patents

Abstract

A water-cooling solid-state drive includes: a solid-state drive main body having a chip; a water-cooling device having a case member and a heat conducting glue, wherein the case member has a top cover and a bottom cover, a sealed accommodating space allowing a cooling liquid to be statically disposed is formed through being surrounded by the top cover and the bottom cover, the bottom cover is a heat dissipation sheet, and the heat conducting glue is disposed between the bottom cover and the chip. With the above-mentioned structure, thermal energy generated by the chip can be transferred via the heat conducting glue to the heat dissipation sheet which is adopted as the bottom cover, and then the thermal energy is transferred from the bottom cover to the cooling liquid in the accommodating space for performing heat dissipation.

Description

Water-cooled solid state drive device

The present invention relates to a solid state hard disk, and particularly relates to a water-cooled solid state hard disk device.

Compared with traditional hard disk drives (HDD), solid-state hard disks have the advantages of being more resistant to physical shock, faster access time, and lower latency because they have no mechanical components to operate. In recent years, with the decline in prices, solid-state hard drives have gradually been accepted by computer users.

Among them, the M.2 solid-state drive is based on the NVMe specification and uses the PCIe bus, which makes the transmission speed several times faster than before, and the solid-state drive can exert its excellent performance. However, excellent performance also brings about heat generation problems that cannot be ignored. A large amount of heat generated during a large number of reads and writes for a long time is concentrated in the compact main control and NAND chips, which will cause overheating and trigger the protection mechanism, which will reduce the performance or even shorten the life.

In order to solve the overheating problem, the conventional solid-state hard disk will be air-cooled or water-cooled. Among them, the conventional water-cooled solid state hard disk is connected with a water-cooled pipe connected to the pump, and relies on the flowing cooling liquid to take heat away from the heat source. However, this type of water-cooling system needs to provide additional power to the pump, and it is very difficult to install the water-cooling system inside a crowded casing.

Therefore, the object of the present invention is to provide a water-cooled solid-state hard disk device that is cooled by cooling liquid without the need to install pumps, water cooling pipes and other components.

The technical means adopted by the present invention to solve the problems of the prior art is to provide a water-cooled solid-state hard disk device, comprising: a solid-state hard disk body including a chip; a water-cooling device contacting the chip, the water-cooling device including a A box body and a thermally conductive glue. The box body includes an upper cover and a bottom cover. The upper cover and the bottom cover form a sealed accommodating space for the cooling fluid to stand still. The bottom cover is a heat sink. The thermally conductive glue Set between the bottom cover and the chip, the area of the thermally conductive glue covering the solid hard disk body is larger than the area of the upper surface of the chip, and the bottom surface area of the bottom cover and the accommodating space is larger than that of the upper surface of the chip area.

In an embodiment of the present invention, a water-cooled solid-state hard disk device is provided, which further includes a cooling liquid and is accommodated in the accommodating space.

In an embodiment of the present invention, a water-cooled solid state drive device is provided, wherein the box body is provided with an opening and a cover corresponding to the opening, and the opening is connected to the accommodating space and the box body. external.

In one embodiment of the present invention, a water-cooled solid-state hard disk device is provided, and the upper cover is transparent.

In an embodiment of the present invention, a water-cooled solid state drive device is provided, which further includes a clamp, and the clamp and the water-cooled device clamp the solid state drive body.

In an embodiment of the present invention, a water-cooled solid state drive device is provided, which further includes a heat dissipation fin disposed on the outer surface of the box body.

In an embodiment of the present invention, a water-cooled solid state drive device is provided, wherein the box body includes a fixing member and a sealing ring, the fixing member fixes the upper cover and the bottom cover, and the sealing ring is clamped between the upper cover and the bottom cover. The accommodating space is sealed between the bottom covers.

Through the technical means adopted by the water-cooled solid-state hard disk device of the present invention, the solid-state hard disk body is passively dissipated by the water-cooled liquid placed in the accommodating space, without the need to bother to install the pumps and water tanks in the conventional water-cooling system , Water-cooled pipe... and other components, do not need to provide the power required by the pump. In detail, the heat energy emitted by the chip is transferred to the bottom cover as a heat sink through the thermally conductive glue, and then the heat energy is transferred from the bottom cover to the cooling liquid in the containing space for heat dissipation.

Hereinafter, the embodiments of the present invention will be described based on Figs. 1 to 5. This description is not intended to limit the embodiments of the present invention, but is one of the examples of the present invention.

As shown in Figures 1 and 2, a water-cooled solid-state drive device 100 according to a first embodiment of the present invention includes: a solid-state drive body 1 including a chip 11; and a water-cooled device 2 in contact with The chip 11, the water cooling device 2 includes a box body 21 and a thermally conductive glue 22. The box body 21 includes an upper cover 211 and a bottom cover 212. The upper cover 211 and the bottom cover 212 surround a sealed accommodating space S for the cooling liquid C Stand still, the bottom cover 212 is a heat sink, the thermally conductive glue 22 is arranged between the bottom cover 212 and the chip 11, the area of the thermally conductive glue 22 covering the solid hard disk body 1 is larger than the area of the upper surface of the chip 11, the bottom cover 212 and The bottom surface area of the accommodating space S is larger than the upper surface area of the wafer 11.

In detail, the chip 11 includes a master chip and a NAND flash memory. The heat energy emitted by the chip 11 is transferred to the bottom cover 212 as a heat sink through the thermally conductive adhesive 22, and the bottom cover 212 transfers the heat energy to the cooling liquid C in the accommodating space S.

Among them, the thermal conductive glue 22 is a sheet of silicon glue, which is used to fill the gap between the chip 11 and the bottom cover 212. The thermally conductive glue 22 provides a path for conducting heat between the chip 11 and the bottom cover 212. As shown in FIG. 3, the range of the thermal conductive glue 22 covering the solid state hard disk body 1 is larger than the range of the upper surface of the chip 11, so that the heat energy of the chip 11 can be transferred more completely. In this embodiment, the water-cooled solid state drive device 100 fixes the solid state drive body 1 and the box body 21 through a clamp 3. In other embodiments, the thermal conductive glue 22 can also be a thermal conductive paste with adhesiveness, and the chip 11 and the bottom cover 212 are fixed through the viscosity of the thermal conductive paste, without the need of the fixture 3.

The bottom cover 212 is made of aluminum alloy and has good thermal conductivity. Furthermore, as shown in FIG. 3, the bottom surface area of the bottom cover 212 is larger than the area of the upper surface of the wafer 11 to disperse and transfer the thermal energy to the cooling liquid C in the accommodating space S.

As shown in Figure 2, in this embodiment, the accommodating space S contains the cooling liquid C. In other embodiments, the cooling liquid C can also be added to the accommodating space S from the outside of the box 21 by the user.

The upper cover 211 of the box body 21 is a material that is light-transmissive and non-reactive with the cooling liquid C, so that the cooling liquid C in the accommodating space S is visible. In this embodiment, the material of the upper cover 211 is PC.

As shown in FIG. 2, according to the water-cooled solid state disk device 100 of the first embodiment of the present invention, the box body 21 includes a fixing member 213 and a sealing ring 214. The fixing member 213 is a screw to fix the upper cover 211 and the bottom cover 212. The sealing ring 214 is sandwiched between the upper cover 211 and the bottom cover 212 to seal the containing space S. The material of the sealing ring 214 is nitrile rubber (NBR), and the accommodating space S is sealed by the characteristics of NBR, such as high elasticity, good air tightness, and good heat resistance.

As shown in Figure 3, the structure of the water-cooled solid state drive device 100a according to the second embodiment of the present invention is substantially the same as that of the water-cooled solid state drive device 100 of the first embodiment. The difference is that the box 21 is provided with An opening H communicating with the accommodating space S and the outside of the box body 21, and a cover 215 corresponding to the opening H, so that the user can open the cover 215 and add and replenish the selected cooling liquid C by themselves. The user can also observe the amount of cooling liquid C in the accommodating space S through the upper cover 211 which is transparent.

As shown in Figure 4, the water-cooled solid-state drive device 100b according to the third embodiment of the present invention has substantially the same structure as the water-cooled solid-state drive device 100 of the first embodiment. The difference lies in: the outside of the box 21 The surface is provided with radiating fins 4. The heat dissipation fins 4 are made of aluminum alloy material and have good thermal conductivity to assist the heat dissipation of the box body 21 and improve the heat dissipation effect of the water cooling device 2.

The above descriptions and descriptions are only descriptions of the preferred embodiments of the present invention. Those with general knowledge of the technology should make other modifications based on the scope of patent applications defined below and the above descriptions, but these modifications should still be made. It is the spirit of the invention and falls within the scope of the rights of the invention.

100: Water-cooled solid state drive device 100a: Water-cooled solid state drive device 100b: Water-cooled solid state drive device 1: Solid state drive body 11: Chip 2: Water-cooled device 21: Box body 211: Upper cover 212: Bottom cover 213: Fixing part 214: sealing ring 215: cover 22: thermal conductive glue 3: fixture 4: radiating fin C: coolant H: opening S: accommodation space

[Figure 1] is a perspective view showing the water-cooled solid state drive device according to the first embodiment of the present invention; [Figure 2] is a side view showing the water-cooled solid state drive device according to the first embodiment of the present invention [Figure 3] is a schematic plan view showing a water-cooled solid state drive device according to a first embodiment of the present invention; [Figure 4] is a schematic view showing a water-cooled solid state drive according to a second embodiment of the present invention A three-dimensional schematic diagram of the disk device; [FIG. 5] is a schematic side sectional view showing a water-cooled solid state disk device according to a third embodiment of the present invention.

100: Water-cooled solid state drive device

1: Solid state drive body

2: Water cooling device

21: Box body

211: upper cover

212: bottom cover

3: Fixture

S: accommodating space

Claims (7)

A water-cooled solid-state hard disk device includes: a solid-state hard disk body including a chip; a water-cooling device in contact with the chip, the water-cooling device including a box body and a thermal conductive glue, the box body including an upper cover and a bottom Cover, the upper cover and the bottom cover form a sealed accommodating space for the cooling liquid to stand, the bottom cover is a heat sink, the thermally conductive glue is arranged between the bottom cover and the chip, and the thermally conductive glue covers The area of the solid state hard disk body is larger than the area of the upper surface of the chip, and the bottom surface area of the bottom cover and the accommodating space is larger than the area of the upper surface of the chip. For example, the water-cooled solid state hard disk device of claim 1, further including a cooling liquid, is accommodated in the accommodating space. For example, the water-cooled solid state disk device of claim 1, wherein the box body is provided with an opening and a cover corresponding to the opening, and the opening communicates with the accommodating space and the outside of the box body. Such as the water-cooled solid state drive device of any one of claims 1 to 3, wherein the upper cover is transparent. For example, the water-cooled solid state disk device of any one of claims 1 to 3 further includes a clamp, and the clamp and the water-cooled device clamp the solid state disk body. For example, the water-cooled solid state disk device of any one of claims 1 to 3 further includes a heat dissipation fin disposed on the outer surface of the box body. For the water-cooled solid state drive device of any one of claims 1 to 3, wherein the box body includes a fixing member and a sealing ring, the fixing member fixes the upper cover and the bottom cover, and the sealing ring is clamped between the upper cover and The accommodating space is sealed between the bottom covers.

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