TW202022301A - Water-cooling solid-state drive - Google Patents

Water-cooling solid-state drive Download PDF

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Publication number
TW202022301A
TW202022301A TW107143426A TW107143426A TW202022301A TW 202022301 A TW202022301 A TW 202022301A TW 107143426 A TW107143426 A TW 107143426A TW 107143426 A TW107143426 A TW 107143426A TW 202022301 A TW202022301 A TW 202022301A
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Taiwan
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cover
water
chip
solid state
cooled
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TW107143426A
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Chinese (zh)
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張錦峰
林鴻烈
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十銓科技股份有限公司
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Publication of TW202022301A publication Critical patent/TW202022301A/en

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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406Reducing the influence of the temperature
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406Reducing the influence of the temperature
    • G11B33/1426Reducing the influence of the temperature by cooling plates, e.g. fins

Abstract

A water-cooling solid-state drive includes: a solid-state drive main body having a chip; a water-cooling device having a case member and a heat conducting glue, wherein the case member has a top cover and a bottom cover, a sealed accommodating space allowing a cooling liquid to be statically disposed is formed through being surrounded by the top cover and the bottom cover, the bottom cover is a heat dissipation sheet, and the heat conducting glue is disposed between the bottom cover and the chip. With the above-mentioned structure, thermal energy generated by the chip can be transferred via the heat conducting glue to the heat dissipation sheet which is adopted as the bottom cover, and then the thermal energy is transferred from the bottom cover to the cooling liquid in the accommodating space for performing heat dissipation.

Description

水冷式固態硬碟裝置Water-cooled solid state drive device

本發明相關於一種固態硬碟,特別是相關於一種水冷式固態硬碟裝置。The present invention relates to a solid state hard disk, and particularly relates to a water-cooled solid state hard disk device.

相較於傳統的硬碟(HDD),固態硬碟因沒有運轉的機械元件,而具有較能抵抗物理衝擊、較快的存取時間、較低的延遲等的優點。近年來,隨著價格的下降,固態硬碟逐漸被電腦使用者所接受。Compared with traditional hard disk drives (HDD), solid-state hard disks have the advantages of being more resistant to physical shock, faster access time, and lower latency because they have no mechanical components to operate. In recent years, with the decline in prices, solid-state hard drives have gradually been accepted by computer users.

其中,M.2固態硬碟基於NVMe規範並使用PCIe匯流排,使得傳輸速度數倍於以往,固態硬碟更能夠發揮其優異的性能。然而,優異的性能也帶來不可忽視的發熱問題。在長時間大量讀寫過程中所產生大量的熱量集中在體積小巧的主控與NAND晶片,會導致過熱而觸發保護機制,使得性能下降甚至是壽命縮短。Among them, the M.2 solid-state drive is based on the NVMe specification and uses the PCIe bus, which makes the transmission speed several times faster than before, and the solid-state drive can exert its excellent performance. However, excellent performance also brings about heat generation problems that cannot be ignored. A large amount of heat generated during a large number of reads and writes for a long time is concentrated in the compact main control and NAND chips, which will cause overheating and trigger the protection mechanism, which will reduce the performance or even shorten the life.

為了解決過熱問題,習知的固態硬碟會採用空冷或水冷的方式。其中,習知水冷式的固態硬碟外接有水冷管而連通到幫浦,並依靠流動的冷卻液將熱量帶離熱源。然而,這類的水冷系統需額外提供電力到幫浦,並且在擁擠的機殼內部安裝水冷系統難度很高而難以運用。In order to solve the overheating problem, the conventional solid-state hard disk will be air-cooled or water-cooled. Among them, the conventional water-cooled solid state hard disk is connected with a water-cooled pipe connected to the pump, and relies on the flowing cooling liquid to take heat away from the heat source. However, this type of water-cooling system needs to provide additional power to the pump, and it is very difficult to install the water-cooling system inside a crowded casing.

因此,本發明的目的即在提供一種水冷式固態硬碟裝置,透過冷卻液進行冷卻,而無需費心地安裝幫浦、水冷管等元件設置。Therefore, the object of the present invention is to provide a water-cooled solid-state hard disk device that is cooled by cooling liquid without the need to install pumps, water cooling pipes and other components.

本發明為解決習知技術之問題所採用之技術手段係提供一種水冷式固態硬碟裝置,包含:一固態硬碟本體,包括一晶片;一水冷裝置,接觸於該晶片,該水冷裝置包括一盒體及一導熱膠,該盒體包括一上蓋及一底蓋,該上蓋及該底蓋圍繞形成一密封的容置空間以供冷卻液靜置,該底蓋為一散熱片,該導熱膠設置於該底蓋與該晶片之間,該導熱膠覆蓋於該固態硬碟本體的面積大於該晶片的上表面的面積,該底蓋及該容置空間的底表面積大於該晶片的上表面的面積。The technical means adopted by the present invention to solve the problems of the prior art is to provide a water-cooled solid-state hard disk device, comprising: a solid-state hard disk body including a chip; a water-cooling device contacting the chip, the water-cooling device including a A box body and a thermally conductive glue. The box body includes an upper cover and a bottom cover. The upper cover and the bottom cover form a sealed accommodating space for the cooling fluid to stand still. The bottom cover is a heat sink. The thermally conductive glue Set between the bottom cover and the chip, the area of the thermally conductive glue covering the solid hard disk body is larger than the area of the upper surface of the chip, and the bottom surface area of the bottom cover and the accommodating space is larger than that of the upper surface of the chip area.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,更包括冷卻液,容置於該容置空間中。In an embodiment of the present invention, a water-cooled solid-state hard disk device is provided, which further includes a cooling liquid and is accommodated in the accommodating space.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,其中該盒體設有一開孔以及對應於該開孔的一蓋體,該開孔連通該容置空間及該盒體的外部。In an embodiment of the present invention, a water-cooled solid state drive device is provided, wherein the box body is provided with an opening and a cover corresponding to the opening, and the opening is connected to the accommodating space and the box body. external.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,該上蓋為可透光。In one embodiment of the present invention, a water-cooled solid-state hard disk device is provided, and the upper cover is transparent.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,更包括一夾具,該夾具與該水冷裝置夾持該固態硬碟主體。In an embodiment of the present invention, a water-cooled solid state drive device is provided, which further includes a clamp, and the clamp and the water-cooled device clamp the solid state drive body.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,更包括一散熱鰭片,設置於該盒體的外表面。In an embodiment of the present invention, a water-cooled solid state drive device is provided, which further includes a heat dissipation fin disposed on the outer surface of the box body.

在本發明的一實施例中係提供一種水冷式固態硬碟裝置,其中該盒體包括一固定件及一密封環,該固定件固定該上蓋及該底蓋,該密封環夾於該上蓋與底蓋之間而使該容置空間為密封。In an embodiment of the present invention, a water-cooled solid state drive device is provided, wherein the box body includes a fixing member and a sealing ring, the fixing member fixes the upper cover and the bottom cover, and the sealing ring is clamped between the upper cover and the bottom cover. The accommodating space is sealed between the bottom covers.

經由本發明的水冷式固態硬碟裝置所採用之技術手段,固態硬碟本體是透過靜置於容置空間的水冷液進行被動式散熱,而無需費心設置習知的水冷系統中的幫浦、水箱、水冷管……等元件,也無需提供幫浦所需的電能。詳細而言,晶片發出的熱能透過導熱膠傳遞到作為散熱片的底蓋,再由底蓋將熱能傳遞到容置空間中的冷卻液以進行散熱Through the technical means adopted by the water-cooled solid-state hard disk device of the present invention, the solid-state hard disk body is passively dissipated by the water-cooled liquid placed in the accommodating space, without the need to bother to install the pumps and water tanks in the conventional water-cooling system , Water-cooled pipe... and other components, do not need to provide the power required by the pump. In detail, the heat energy emitted by the chip is transferred to the bottom cover as a heat sink through the thermally conductive glue, and then the heat energy is transferred from the bottom cover to the cooling liquid in the containing space for heat dissipation.

以下根據第1圖至第5圖,而說明本發明的實施方式。該說明並非為限制本發明的實施方式,而為本發明之實施例的一種。Hereinafter, the embodiments of the present invention will be described based on Figs. 1 to 5. This description is not intended to limit the embodiments of the present invention, but is one of the examples of the present invention.

如第1圖及第2圖所示,依據本發明的第一實施例的一水冷式固態硬碟裝置100,包含:一固態硬碟本體1,包括一晶片11;一水冷裝置2,接觸於晶片11,水冷裝置2包括一盒體21及一導熱膠22,盒體21包括一上蓋211及一底蓋212,上蓋211及底蓋212圍繞形成一密封的容置空間S以供冷卻液C靜置,底蓋212為一散熱片,導熱膠22設置於底蓋212與晶片11之間,導熱膠22覆蓋於固態硬碟本體1的面積大於晶片11的上表面的面積,底蓋212及容置空間S的底表面積大於晶片11的上表面的面積。As shown in Figures 1 and 2, a water-cooled solid-state drive device 100 according to a first embodiment of the present invention includes: a solid-state drive body 1 including a chip 11; and a water-cooled device 2 in contact with The chip 11, the water cooling device 2 includes a box body 21 and a thermally conductive glue 22. The box body 21 includes an upper cover 211 and a bottom cover 212. The upper cover 211 and the bottom cover 212 surround a sealed accommodating space S for the cooling liquid C Stand still, the bottom cover 212 is a heat sink, the thermally conductive glue 22 is arranged between the bottom cover 212 and the chip 11, the area of the thermally conductive glue 22 covering the solid hard disk body 1 is larger than the area of the upper surface of the chip 11, the bottom cover 212 and The bottom surface area of the accommodating space S is larger than the upper surface area of the wafer 11.

詳細而言,晶片11包含有主控晶片及NAND快閃記憶體。晶片11發出的熱能透過導熱膠22傳遞到作為散熱片的底蓋212,再由底蓋212將熱能傳遞到容置空間S中的冷卻液C。In detail, the chip 11 includes a master chip and a NAND flash memory. The heat energy emitted by the chip 11 is transferred to the bottom cover 212 as a heat sink through the thermally conductive adhesive 22, and the bottom cover 212 transfers the heat energy to the cooling liquid C in the accommodating space S.

其中,導熱膠22為片狀的矽膠,用以填補晶片11與底蓋212之間的縫隙。導熱膠22提供晶片11與底蓋212之間傳導熱能的路徑。如第3圖所示,導熱膠22覆蓋於固態硬碟本體1的範圍大於晶片11的上表面的範圍,以能較完整地傳遞晶片11之熱能。在本實施例中,水冷式固態硬碟裝置100是透過一夾具3將而將固態硬碟本體1與盒體21進行固定。而在其他實施例中,導熱膠22也可以是具有黏性的導熱膏,晶片11與底蓋212是透過導熱膏的黏性而進行固定,而無需夾具3的設置。Among them, the thermal conductive glue 22 is a sheet of silicon glue, which is used to fill the gap between the chip 11 and the bottom cover 212. The thermally conductive glue 22 provides a path for conducting heat between the chip 11 and the bottom cover 212. As shown in FIG. 3, the range of the thermal conductive glue 22 covering the solid state hard disk body 1 is larger than the range of the upper surface of the chip 11, so that the heat energy of the chip 11 can be transferred more completely. In this embodiment, the water-cooled solid state drive device 100 fixes the solid state drive body 1 and the box body 21 through a clamp 3. In other embodiments, the thermal conductive glue 22 can also be a thermal conductive paste with adhesiveness, and the chip 11 and the bottom cover 212 are fixed through the viscosity of the thermal conductive paste, without the need of the fixture 3.

底蓋212為鋁合金材料,具有良好的導熱係數。再者,如第3圖所示,底蓋212的底表面積大於晶片11的上表面的面積,以將熱能分散並傳遞到容置空間S中的冷卻液C。The bottom cover 212 is made of aluminum alloy and has good thermal conductivity. Furthermore, as shown in FIG. 3, the bottom surface area of the bottom cover 212 is larger than the area of the upper surface of the wafer 11 to disperse and transfer the thermal energy to the cooling liquid C in the accommodating space S.

如第2圖所示,在本實施例中,容置空間S為容置有冷卻液C。而在其他實施例中,冷卻液C也可以是由使用者自行從盒體21外部添加至容置空間S中。As shown in Figure 2, in this embodiment, the accommodating space S contains the cooling liquid C. In other embodiments, the cooling liquid C can also be added to the accommodating space S from the outside of the box 21 by the user.

盒體21的上蓋211為可透光且與冷卻液C為不反應的材料,以使得容置空間S中的冷卻液C為可見。在本實施例中,上蓋211的材料為PC。The upper cover 211 of the box body 21 is a material that is light-transmissive and non-reactive with the cooling liquid C, so that the cooling liquid C in the accommodating space S is visible. In this embodiment, the material of the upper cover 211 is PC.

如第2圖所示,依據本發明的第一實施例的水冷式固態硬碟裝置100,其中盒體21包括一固定件213及一密封環214。固定件213為螺絲,以將上蓋211與底蓋212進行固定。密封環214夾於上蓋211與底蓋212之間而使容置空間S為密封。密封環214的材料為丁腈橡膠(NBR),而利用NBR的高彈性、氣密性好、耐熱性好等特性密封容置空間S。As shown in FIG. 2, according to the water-cooled solid state disk device 100 of the first embodiment of the present invention, the box body 21 includes a fixing member 213 and a sealing ring 214. The fixing member 213 is a screw to fix the upper cover 211 and the bottom cover 212. The sealing ring 214 is sandwiched between the upper cover 211 and the bottom cover 212 to seal the containing space S. The material of the sealing ring 214 is nitrile rubber (NBR), and the accommodating space S is sealed by the characteristics of NBR, such as high elasticity, good air tightness, and good heat resistance.

如第3圖所示,依據本發明的第二實施例的水冷式固態硬碟裝置100a,其結構與第一實施例的水冷式固態硬碟裝置100大致相同,差別在於:盒體21設有連通容置空間S及盒體21的外部的開孔H,以及對應於開孔H的一蓋體215,以供使用者能打開蓋體215並自行添加及補充所選用的冷卻液C。使用者也能透過透光的上蓋211而觀察容置空間S中的冷卻液C之存量。As shown in Figure 3, the structure of the water-cooled solid state drive device 100a according to the second embodiment of the present invention is substantially the same as that of the water-cooled solid state drive device 100 of the first embodiment. The difference is that the box 21 is provided with An opening H communicating with the accommodating space S and the outside of the box body 21, and a cover 215 corresponding to the opening H, so that the user can open the cover 215 and add and replenish the selected cooling liquid C by themselves. The user can also observe the amount of cooling liquid C in the accommodating space S through the upper cover 211 which is transparent.

如第4圖所示,依據本發明的第三實施例的水冷式固態硬碟裝置100b,其結構與第一實施例的水冷式固態硬碟裝置100大致相同,差別在於:盒體21的外表面設有散熱鰭片4。散熱鰭片4為鋁合金材料,具有良好的導熱係數,以協助盒體21之散熱而提高水冷裝置2的散熱效果。As shown in Figure 4, the water-cooled solid-state drive device 100b according to the third embodiment of the present invention has substantially the same structure as the water-cooled solid-state drive device 100 of the first embodiment. The difference lies in: the outside of the box 21 The surface is provided with radiating fins 4. The heat dissipation fins 4 are made of aluminum alloy material and have good thermal conductivity to assist the heat dissipation of the box body 21 and improve the heat dissipation effect of the water cooling device 2.

以上之敘述以及說明僅為本發明之較佳實施例之說明,對於此項技術具有通常知識者當可依據以下所界定申請專利範圍以及上述之說明而作其他之修改,惟此些修改仍應是為本發明之發明精神而在本發明之權利範圍中。The above descriptions and descriptions are only descriptions of the preferred embodiments of the present invention. Those with general knowledge of the technology should make other modifications based on the scope of patent applications defined below and the above descriptions, but these modifications should still be made. It is the spirit of the invention and falls within the scope of the rights of the invention.

100:水冷式固態硬碟裝置100a:水冷式固態硬碟裝置100b:水冷式固態硬碟裝置1:固態硬碟本體11:晶片2:水冷裝置21:盒體211:上蓋212:底蓋213:固定件214:密封環215:蓋體22:導熱膠3:夾具4:散熱鰭片C:冷卻液H:開孔S:容置空間100: Water-cooled solid state drive device 100a: Water-cooled solid state drive device 100b: Water-cooled solid state drive device 1: Solid state drive body 11: Chip 2: Water-cooled device 21: Box body 211: Upper cover 212: Bottom cover 213: Fixing part 214: sealing ring 215: cover 22: thermal conductive glue 3: fixture 4: radiating fin C: coolant H: opening S: accommodation space

[第1圖]為顯示根據本發明的第一實施例的水冷式固態硬碟裝置的立體示意圖; [第2圖]為顯示根據本發明的第一實施例的水冷式固態硬碟裝置的側視剖面示意圖; [第3圖]為顯示根據本發明的第一實施例的水冷式固態硬碟裝置的俯視示意圖; [第4圖]為顯示根據本發明的第二實施例的水冷式固態硬碟裝置的立體示意圖; [第5圖]為顯示根據本發明的第三實施例的水冷式固態硬碟裝置的側視剖面示意圖。[Figure 1] is a perspective view showing the water-cooled solid state drive device according to the first embodiment of the present invention; [Figure 2] is a side view showing the water-cooled solid state drive device according to the first embodiment of the present invention [Figure 3] is a schematic plan view showing a water-cooled solid state drive device according to a first embodiment of the present invention; [Figure 4] is a schematic view showing a water-cooled solid state drive according to a second embodiment of the present invention A three-dimensional schematic diagram of the disk device; [FIG. 5] is a schematic side sectional view showing a water-cooled solid state disk device according to a third embodiment of the present invention.

100:水冷式固態硬碟裝置 100: Water-cooled solid state drive device

1:固態硬碟本體 1: Solid state drive body

2:水冷裝置 2: Water cooling device

21:盒體 21: Box body

211:上蓋 211: upper cover

212:底蓋 212: bottom cover

3:夾具 3: Fixture

S:容置空間 S: accommodating space

Claims (7)

一種水冷式固態硬碟裝置,包含: 一固態硬碟本體,包括一晶片; 一水冷裝置,接觸於該晶片,該水冷裝置包括一盒體及一導熱膠,該盒體包括一上蓋及一底蓋,該上蓋及該底蓋圍繞形成一密封的容置空間以供冷卻液靜置,該底蓋為一散熱片,該導熱膠設置於該底蓋與該晶片之間,該導熱膠覆蓋於該固態硬碟本體的面積大於該晶片的上表面的面積,該底蓋及該容置空間的底表面積大於該晶片的上表面的面積。A water-cooled solid-state hard disk device includes: a solid-state hard disk body including a chip; a water-cooling device in contact with the chip, the water-cooling device including a box body and a thermal conductive glue, the box body including an upper cover and a bottom Cover, the upper cover and the bottom cover form a sealed accommodating space for the cooling liquid to stand, the bottom cover is a heat sink, the thermally conductive glue is arranged between the bottom cover and the chip, and the thermally conductive glue covers The area of the solid state hard disk body is larger than the area of the upper surface of the chip, and the bottom surface area of the bottom cover and the accommodating space is larger than the area of the upper surface of the chip. 如請求項1之水冷式固態硬碟裝置,更包括冷卻液,容置於該容置空間中。For example, the water-cooled solid state hard disk device of claim 1, further including a cooling liquid, is accommodated in the accommodating space. 如請求項1之水冷式固態硬碟裝置,其中該盒體設有一開孔以及對應於該開孔的一蓋體,該開孔連通該容置空間及該盒體的外部。For example, the water-cooled solid state disk device of claim 1, wherein the box body is provided with an opening and a cover corresponding to the opening, and the opening communicates with the accommodating space and the outside of the box body. 如請求項1至3中任一項之水冷式固態硬碟裝置,其中該上蓋為可透光。Such as the water-cooled solid state drive device of any one of claims 1 to 3, wherein the upper cover is transparent. 如請求項1至3中任一項之水冷式固態硬碟裝置,更包括一夾具,該夾具與該水冷裝置夾持該固態硬碟本體。For example, the water-cooled solid state disk device of any one of claims 1 to 3 further includes a clamp, and the clamp and the water-cooled device clamp the solid state disk body. 如請求項1至3中任一項之水冷式固態硬碟裝置,更包括一散熱鰭片,設置於該盒體的外表面。For example, the water-cooled solid state disk device of any one of claims 1 to 3 further includes a heat dissipation fin disposed on the outer surface of the box body. 如請求項1至3中任一項之水冷式固態硬碟裝置,其中該盒體包括一固定件及一密封環,該固定件固定該上蓋及該底蓋,該密封環夾於該上蓋與底蓋之間而使該容置空間為密封。For the water-cooled solid state drive device of any one of claims 1 to 3, wherein the box body includes a fixing member and a sealing ring, the fixing member fixes the upper cover and the bottom cover, and the sealing ring is clamped between the upper cover and The accommodating space is sealed between the bottom covers.
TW107143426A 2018-12-04 2018-12-04 Water-cooling solid-state drive TW202022301A (en)

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