CN207690784U - Power module and air conditioner - Google Patents
Power module and air conditioner Download PDFInfo
- Publication number
- CN207690784U CN207690784U CN201820036717.5U CN201820036717U CN207690784U CN 207690784 U CN207690784 U CN 207690784U CN 201820036717 U CN201820036717 U CN 201820036717U CN 207690784 U CN207690784 U CN 207690784U
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- CN
- China
- Prior art keywords
- power module
- radiator
- encapsulating housing
- storage tank
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of power module and air conditioner, the power module include：(PCC) power；Encapsulating housing is packaged on (PCC) power；Pin is electrically connected with (PCC) power, and stretches out encapsulating housing setting；Radiator, radiator are concavely provided with storage tank, and encapsulating housing is at least partially arranged in storage tank, and pin stretches out storage tank setting.The utility model is by the heat generated in the power module course of work by being accommodated on the encapsulating housing to radiator in storage tank, to which heat is radiated to by radiator in air, increase the contact area of encapsulating housing and radiator, be conducive to improve the rate of heat dispation of power module when being radiated to solve single plane, radiating efficiency is low, it is easy to cause heat dissipation and burns power module not in time, the utility model also solves cooling fin and the problem of power module is not easy to position, influence efficiency of assembling.
Description
Technical field
The utility model is related to electronic circuit technology field, more particularly to a kind of power module and air conditioner.
Background technology
Power module, i.e. power (Intelligent Power Module) are a kind of by power electronics and integrated circuit
The power drive class product that technology combines is generally used on the electric-controlled plates of equipment such as driving wind turbine, compressor.Power module is transported
Temperature rise ratio during row is more serious, and in order to ensure power module normal operation, power module is mostly in power module shell
The plane of side external heat radiation piece, shell and cooling surface contacts is radiating surface.
But it is above-mentioned in such a way that single plane is radiated, radiating efficiency is low；And it is not easy to position in assembly, shadow
Ring efficiency of assembling.
Utility model content
The main purpose of the utility model is a kind of power module of proposition and air conditioner, it is intended to solve single plane and be dissipated
When hot, radiating efficiency is low, the problem of being easy to cause heat dissipation not in time and burn power module.
To achieve the above object, the utility model proposes a kind of power module, the power module includes：
(PCC) power；
Encapsulating housing is packaged on the (PCC) power；
Pin is electrically connected with the (PCC) power, and stretches out the encapsulating housing setting；
Radiator, the radiator are concavely provided with storage tank, and the encapsulating housing is at least partially arranged at the storage tank
Interior, the pin stretches out the storage tank setting.
Preferably, the encapsulating housing is placed in completely in the storage tank.
Preferably, the thickness that the encapsulating housing is in the part outside the storage tank is the encapsulating housing thickness
0.1~0.2 times.
Preferably, the appearance and size of the storage tank is more than the appearance and size of the encapsulating housing.
Preferably, the encapsulating housing is provided between at least forming the wall surface of the storage tank slot bottom with the radiator
Heat-conducting medium.
Preferably, the encapsulating housing and the radiator are respectively provided between forming all wall surfaces of the storage tank
State heat-conducting medium.
Preferably, the heat-conducting medium is heat-conducting silicone grease/heat conductive silica gel.
Preferably, the radiator includes radiator body and multiple radiator shutters, and multiple radiator shutter intervals are set
It is placed in the side of the radiator body.
Preferably, multiple radiator shutters are arranged side by side along the length direction of the radiator body, and adjacent two institute
It states and forms radiating groove between blade, the depth of radiating groove corresponding with the encapsulating housing position is less than and the encapsulating shell position
Set the depth for the radiating groove being staggered.
The utility model also proposes a kind of air conditioner, including power module as described above；The power module includes：Work(
Rate component；Encapsulating housing is packaged on the (PCC) power；Pin is electrically connected with the (PCC) power, and stretches out the encapsulation
Shell is arranged；Radiator, the radiator are concavely provided with storage tank, and the encapsulating housing is at least partially arranged at the storage tank
Interior, the pin stretches out the storage tank setting.
The utility model power module by be arranged radiator, and radiator corresponds to power module installation position and greatly
It is small, the storage tank being adapted to power module is opened up, then power module is accommodated in storage tank, cell wall and the power mould of storage tank
Block fitting setting, to increase the contact area of power module namely encapsulating housing and radiator, by the power module course of work
The heat of middle generation is by being accommodated on the encapsulating housing to radiator in storage tank, to which heat to be radiated to by radiator
In air, increase the contact area of encapsulating housing and radiator, is conducive to the rate of heat dispation for improving power module.The utility model
When solving single plane and being radiated, radiating efficiency is low, the problem of being easy to cause heat dissipation not in time and burn power module.
It is understood that due to being provided with storage tank on a heat sink in the utility model, in encapsulating housing and heat dissipation
When device assembles, radiator is mounted in storage tank, is easily installed, the utility model also solves cooling fin and power mould
Block is not easy the problem of positioning, influencing efficiency of assembling.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model power module；
Fig. 2 is the structural schematic diagram of another embodiment of the utility model power module.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 10 | Encapsulating housing | 22 | Radiator body |
| 20 | Radiator | 23 | Radiator shutter |
| 21 | Storage tank | 30 | Pin |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
If it is to be appreciated that related in the utility model embodiment directionality instruction (such as upper and lower, left and right, it is preceding,
Afterwards ...), then directionality instruction be only used for explain it is opposite between each component under a certain particular pose (as shown in the picture)
Position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes correspondingly.
If, should " first ", " the in addition, relate to the description of " first ", " second " etc. in the utility model embodiment
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.In addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Personnel can be implemented as basis, will be understood that this technical side when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection domain of the requires of the utility model.
The utility model proposes an a kind of power modules.
The power module is suitable for the frequency converter of driving motor and various inverters, to realize frequency control, metallurgy
The functions such as machinery, electric propulsion, servo-drive.It is particularly suitable for the motor work of the compressors such as driving air-conditioning, refrigerator.It is applying
When in convertible frequency air-conditioner, since in most cases its algorithm has been cured frequency conversion drive substantially, resist to save volume, improve
Interference performance mitigates the automatically controlled version design efforts would in periphery, and master controller, i.e. MCU can be integrated on a wiring board, form work(
Rate module.When power module works, power component fever is than more serious, therefore, once power module heat dissipation is not in time, or
Heat dissipation effect is poor, will lead to that the operating temperature of MCU is excessively high and breaks down so that and MCU is easy the control signal of output error,
The upper and lower bridge arm of control inverter bridge simultaneously turns on, and causes short circuit.And currently, power module mostly uses greatly in power module shell
Side external heat radiation piece, by the heat generated in power module operational process to external radiation by way of single side heat dissipation.However,
When power module heat production is more, in such a way that single plane is radiated, radiating efficiency is low, is easy to cause heat dissipation not in time
And power module is burnt, and in assembly, cooling fin and power module are not easy to position, and influence efficiency of assembling.
To solve the above-mentioned problems, referring to figs. 1 to Fig. 2, in one embodiment of the utility model, which includes：
(PCC) power (not shown)；
Encapsulating housing 10 is packaged on the (PCC) power；
Pin 30 is electrically connected with the (PCC) power, and is stretched out the encapsulating housing 10 and be arranged；
Radiator 20, the radiator 20 are concavely provided with storage tank 21, and the encapsulating housing 10 is at least partially arranged at institute
It states in storage tank 21, the pin 30 stretches out the setting of the storage tank 21.
In the present embodiment, encapsulating housing 10 may be used the materials such as epoxy resin, aluminium oxide, conductive filler material and be made,
When making encapsulating housing 10, can the materials such as epoxy resin, aluminium oxide, boron nitride or aluminium nitride be subjected to batch mixing, then
10 material of encapsulating housing mixed is heated；After cooling, 10 material of the encapsulating housing is crushed, then is molded with ingot grain
10 material of encapsulating housing is carried out roll forming by technique, to form the encapsulating housing 10.
(PCC) power includes power device and main control chip, and power device can be gallium nitride (GaN) power device, Si bases
Power device or SiC base power devices, the present embodiment preferably use gallium nitride (GaN) power device.The quantity of power device can
Think one, or it is multiple, it may include four power devices when being set as multiple, can also include six
The power device, six power devices form inverter circuit, to apply in inverter, frequency converter, refrigeration equipment, metallurgy
In the electrical equipments such as mechanical equipment, electric traction equipment, especially in frequency conversion household electrical appliance.When intelligent power module works,
Main control chip exports corresponding pwm control signal, to control corresponding power device conduction and cut-off, thus output driving electric energy,
With loaded work pieces such as driving motors.
Radiator 20 may be used the preferable highly heat-conductive material of the heat dissipation effects such as aluminum, aluminium alloy and be made.
Gull wing type pin 30 or direct plugging-in pin 30 may be used to realize in pin 30, and the present embodiment is preferably direct plugging-in
Pin 30, pin 30 are welded on low heat conductive insulating substrate, the pad locations on the corresponding installation position of circuit-wiring layer, and are passed through
Metal wire is realized with power component, main control chip and is electrically connected.
It is understood that the power module further includes circuit board, insulating layer and for realizing the (PCC) power
The circuit-wiring layer of middle electronic component electrical connection, the insulating layer are set in circuit board, circuit-wiring layer formed with absolutely
In edge layer, the electronic component in pin 30 and (PCC) power is correspondingly arranged on the installation position of circuit-wiring layer, and passes through scolding tin
Equal conductive materials are electrically connected with circuit-wiring layer realization, form current loop.When power module works, heat is through circuit board
On conduction to pin 30 and encapsulating housing 10, to be radiated by circuit board, encapsulating housing 10 and pin 30.
Radiator 20 may be used the preferable highly heat-conductive material of the heat dissipation effects such as aluminum, aluminium alloy and be made.Radiator 20 is right
The position and size that power module is installed are answered, opens up the storage tank 21 being adapted to power module, then power module is accommodated in
It sets in slot 21, the cell wall of storage tank 21 is bonded setting with power module, to increase power module namely encapsulating housing 10 and heat dissipation
The contact area of device 20 is arranged such so that during power module, main control chip exports corresponding pwm control signal, with control
Corresponding power device conduction and cut-off is made, to output driving electric energy, when with loaded work pieces such as driving motors, main control chip, work(
The heat that rate element generates is conducted through circuit board to pin 30 and encapsulating housing 10, then encapsulated shell 10 conducts heat
To radiator 20, to which heat is radiated to by radiator 20 in air.
The utility model power module corresponds to the position of power module installation by the way that radiator 20 is arranged, and in radiator 20
And size, the storage tank 21 being adapted to power module is opened up, then power module is accommodated in storage tank 21, the slot of storage tank 21
Wall is bonded setting with power module, to increase the contact area of power module namely encapsulating housing 10 and radiator 20, by work(
The heat generated in rate module routine is by being accommodated on the encapsulating housing 10 to radiator 20 in storage tank 21, thus will
Heat is radiated to by radiator 20 in air, and the contact area of encapsulating housing 10 and radiator 20 is increased, and is conducive to improve work(
The rate of heat dispation of rate module.When the utility model solves single plane and radiated, radiating efficiency is low, is easy to cause heat dissipation not
The problem of burning power module in time.
It is understood that due to being provided with storage tank 21 on radiator 20 in the utility model, in encapsulating housing 10
When being assembled with radiator 20, radiator 20 is mounted in storage tank 21, is easily installed, the utility model also solves scattered
The problem of backing and power module are not easy to position, influence efficiency of assembling.
Referring to figs. 1 to Fig. 2, in a preferred embodiment, the encapsulating housing 10 can be placed in the storage tank completely
In 21 or encapsulating housing 10 can be partly accommodated in storage tank 21, when 10 part of encapsulating housing is accommodated in storage tank 21
When, the thickness that the encapsulating housing 10 is in the part outside the storage tank 21 is the 0.1~0.2 of 10 thickness of the encapsulating housing
Times.
In the present embodiment, can the actual designs need such as type, the model of power module be set according to power module pin 30
It asks, encapsulating housing 10 is accommodated in whole or in part in storage tank 21, when encapsulating housing 10 is accommodated in completely in storage tank 21
When, pin 30 stretches out the setting of the storage tank 21, and mutually not close to encapsulating housing 10 is accommodated in completely in storage tank 21, can be with
The contact area for further increasing storage tank 21 cell wall and encapsulating housing 10, to improve the rate of heat dispation of power module.
When the setting of 10 part of encapsulating housing when, be arranged at this point, pin 30 stretches out encapsulating housing 10, so set, can be with
When power module being avoided to be fixedly mounted on circuit boards, power module pin 30 is too short and the case where can not installing occurs.
Referring to figs. 1 to Fig. 2, in a preferred embodiment, in order to further increase between radiator 20 and encapsulating housing 10
Contact area, while improving the rate of heat dispation of power module, this implementation also encapsulating housing 10 and 21 contact surface of storage tank it
Between heat-conducting medium is set.
In the present embodiment, only the wall surface of 21 slot bottom of the storage tank can be formed in encapsulating housing 10 and the radiator 20
Between be provided with heat-conducting medium or encapsulating housing 10 and the radiator 20 is formed between all wall surfaces of the storage tank 21
It is both provided with the heat-conducting medium.Wherein, heat-conducting silicone grease/heat conductive silica gel etc., which may be used, in above-mentioned heat-conducting medium has thermal conduction characteristic
Material realize.
It is understood that when filling heat-conducting medium between 21 contact surface of encapsulating housing 10 and storage tank, the appearance
The appearance and size for setting slot 21 is greater than the appearance and size of the encapsulating housing 10, and the appearance and size of storage tank 21 compares encapsulating shell
Big 0.5~the 1.0mm of appearance and size of body 10.So set, so as in encapsulating housing 10 and 20 assembling process of radiator, it can
Fill heat-conducting medium in the gap that storage tank 21 and encapsulating housing 10 generate so that encapsulating housing 10 and 20 one of radiator at
Type is arranged, while also helping the rate of heat dispation for accelerating encapsulating housing 10.
Referring to figs. 1 to Fig. 2, in a preferred embodiment, the radiator 20 includes radiator body 22 and multiple heat dissipations
Blade 23, multiple radiator shutters 23 are arranged at intervals at the side of the radiator body 22.
In the present embodiment, by the way that multiple radiator shutters 23 are arranged on radiator body 22, to increase radiator 20 and sky
The contact area of gas, namely when radiator 20 works, increase the contact area of the heat and air on radiator 20, to accelerate
The rate of heat dispation of radiator 20.The material that radiator 20 can also be reduced simultaneously avoids cooling fin because material application is excessive, causes
Cost is excessively high.
With reference to Fig. 2, further, in upper embodiment, length of the multiple radiator shutters 23 along the radiator body 22
It spends direction to be arranged side by side, and radiating groove is formed between adjacent two blade, heat dissipation corresponding with 10 position of the encapsulating housing
The depth of slot is less than the depth for the radiating groove being staggered with 10 position of the encapsulating housing.
It is understood that the radiating groove by the way that different depth is arranged, can further speed up the heat dissipation speed of radiator 20
Rate improves the radiating efficiency of power module.
The utility model also proposes that a kind of air conditioner, the air conditioner include power module as described above.The power mould
The detailed construction of block can refer to above-described embodiment, and details are not described herein again；It is understood that due in the utility model air conditioner
In used above-mentioned power module, therefore, the embodiment of the utility model air conditioner includes above-mentioned power module whole embodiments
Whole technical solutions, and the technique effect reached is also identical, and details are not described herein.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
Under every utility model in the utility model is conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of power module, which is characterized in that the power module includes：
(PCC) power；
Encapsulating housing is packaged on the (PCC) power；
Pin is electrically connected with the (PCC) power, and stretches out the encapsulating housing setting；
Radiator, the radiator are concavely provided with storage tank, and the encapsulating housing is at least partially arranged in the storage tank, institute
It states pin and stretches out the storage tank setting.
2. power module as described in claim 1, which is characterized in that the encapsulating housing is placed in the storage tank completely
It is interior.
3. power module as described in claim 1, which is characterized in that the encapsulating housing is in the part outside the storage tank
Thickness be 0.1~0.2 times of the encapsulating housing thickness.
4. power module as described in claim 1, which is characterized in that the appearance and size of the storage tank is more than the encapsulating shell
The appearance and size of body.
5. the power module as described in Claims 1-4 any one, which is characterized in that the encapsulating housing at least with it is described
Radiator is provided with heat-conducting medium between forming the wall surface of the storage tank slot bottom.
6. power module as claimed in claim 5, which is characterized in that the encapsulating housing forms the appearance with the radiator
It sets and is both provided with the heat-conducting medium between all wall surfaces of slot.
7. power module as claimed in claim 6, which is characterized in that the heat-conducting medium is heat-conducting silicone grease/heat conductive silica gel.
8. the power module as described in claims 1 to 3 any one, which is characterized in that the radiator includes radiator sheet
Body and multiple radiator shutters, multiple radiator shutters are arranged at intervals at the side of the radiator body.
9. power module as claimed in claim 8, which is characterized in that multiple radiator shutters are along the radiator body
Length direction is arranged side by side, and forms radiating groove between adjacent two blade, heat dissipation corresponding with the encapsulating housing position
The depth of slot is less than the depth for the radiating groove being staggered with the encapsulating housing position.
10. a kind of air conditioner, which is characterized in that include the power module as described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820036717.5U CN207690784U (en) | 2018-01-09 | 2018-01-09 | Power module and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820036717.5U CN207690784U (en) | 2018-01-09 | 2018-01-09 | Power module and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207690784U true CN207690784U (en) | 2018-08-03 |
Family
ID=62990637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820036717.5U Active CN207690784U (en) | 2018-01-09 | 2018-01-09 | Power module and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207690784U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276173A (en) * | 2018-12-04 | 2020-06-12 | 十铨科技股份有限公司 | Water-cooled solid state hard disk device |
-
2018
- 2018-01-09 CN CN201820036717.5U patent/CN207690784U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111276173A (en) * | 2018-12-04 | 2020-06-12 | 十铨科技股份有限公司 | Water-cooled solid state hard disk device |
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