TWM574264U - Water-cooled solid state hard disk device - Google Patents

Abstract

A water-cooled solid-state hard disk device comprises: a solid-state hard disk body comprising a wafer; a water-cooling device comprising a box body and a heat-conducting glue, the box body comprising an upper cover and a bottom cover, the upper cover and the bottom cover surrounding forming a The sealed accommodating space is for the cooling liquid to stand, the bottom cover is a heat sink, and the thermal conductive glue is disposed between the bottom cover and the wafer. With the above structure, the thermal energy emitted by the wafer is transmitted through the thermal conductive adhesive to the bottom cover as the heat sink, and the thermal energy is transferred from the bottom cover to the cooling liquid in the accommodating space for heat dissipation.

Description

Water-cooled solid state hard disk device

This creation relates to a solid state hard disk, and more particularly to a water-cooled solid state hard disk device.

Compared with the conventional hard disk (HDD), the solid state hard disk has the advantages of being more resistant to physical impact, faster access time, lower delay, etc. due to the absence of running mechanical components. In recent years, as prices have fallen, solid-state hard drives have gradually been accepted by computer users.

Among them, the M.2 solid state hard disk is based on the NVMe specification and uses the PCIe bus, so that the transmission speed is several times higher than in the past, and the solid state hard disk can perform its excellent performance. However, excellent performance also brings about heat problems that cannot be ignored. A large amount of heat generated during a large amount of reading and writing for a long time is concentrated in a small-sized main control and NAND chip, which causes overheating and triggers a protection mechanism, resulting in performance degradation or even shortened life.

In order to solve the problem of overheating, the conventional solid state hard disk adopts air cooling or water cooling. Among them, the conventional water-cooled solid-state hard disk is externally connected with a water-cooled tube and connected to the pump, and relies on flowing coolant to carry heat away from the heat source. However, such water-cooled systems require additional power to the pump, and installing a water-cooled system inside a crowded enclosure is difficult and difficult to apply.

Therefore, the purpose of this creation is to provide a water-cooled solid-state hard disk device that is cooled by a coolant without the need to install components such as pumps and water-cooled tubes.

The present invention provides a water-cooled solid-state hard disk device for solving the problems of the prior art, comprising: a solid-state hard disk body including a wafer; a water-cooling device contacting the wafer, the water-cooling device including a casing and a thermal adhesive, the casing includes an upper cover and a bottom cover, the upper cover and the bottom cover surround a sealed receiving space for the cooling liquid to be placed, the bottom cover is a heat sink, the thermal adhesive Between the bottom cover and the wafer, the thermal adhesive covers an area of the solid hard disk body that is larger than an area of the upper surface of the wafer, and a bottom surface of the bottom cover and the receiving space is larger than an upper surface of the wafer. area.

In an embodiment of the present invention, a water-cooled solid-state hard disk device is further provided, further comprising a cooling liquid disposed in the accommodating space.

In an embodiment of the present invention, a water-cooled solid-state hard disk device is provided, wherein the casing is provided with an opening and a cover corresponding to the opening, the opening communicating with the accommodating space and the casing external.

In an embodiment of the present invention, a water-cooled solid state hard disk device is provided, the upper cover being permeable to light.

In an embodiment of the present invention, a water-cooled solid-state hard disk device is provided, further comprising a clamp that clamps the solid-state hard disk body with the water-cooling device.

In an embodiment of the present invention, a water-cooled solid state hard disk device is further provided, further comprising a heat dissipating fin disposed on an outer surface of the casing.

In an embodiment of the present invention, a water-cooled solid-state hard disk device is provided, wherein the casing includes a fixing member and a sealing ring, and the fixing member fixes the upper cover and the bottom cover, and the sealing ring is clamped to the upper cover and The accommodating space is sealed between the bottom covers.

Through the technical means adopted by the water-cooled solid-state hard disk device of the present invention, the solid-state hard disk body is passively dissipated through the water-cooled liquid that is statically placed in the accommodating space, without the trouble of setting up the pump and water tank in the conventional water-cooling system. Components such as water-cooled tubes, etc., do not need to provide the power required by the pump. In detail, the thermal energy emitted by the wafer is transmitted through the thermal conductive adhesive to the bottom cover as a heat sink, and the thermal energy transmitted from the bottom cover to the accommodating space is cooled by the bottom cover for heat dissipation.

Embodiments of the present creation will be described below based on Figs. 1 to 5 . This description is not intended to limit the implementation of the present invention, but is one of the embodiments of the present invention.

As shown in FIG. 1 and FIG. 2, a water-cooled solid-state hard disk device 100 according to the first embodiment of the present invention comprises: a solid-state hard disk body 1 including a wafer 11; and a water-cooling device 2 in contact with The wafer 11 and the water-cooling device 2 include a casing 21 and a thermal adhesive 22. The casing 21 includes an upper cover 211 and a bottom cover 212. The upper cover 211 and the bottom cover 212 surround a sealed receiving space S for the coolant C. The bottom cover 212 is a heat sink, and the heat conductive adhesive 22 is disposed between the bottom cover 212 and the wafer 11. The heat conductive adhesive 22 covers the area of the solid hard disk body 1 larger than the upper surface of the wafer 11, and the bottom cover 212 and The bottom surface area of the accommodation space S is larger than the area of the upper surface of the wafer 11.

In detail, the wafer 11 includes a master wafer and a NAND flash memory. The thermal energy emitted from the wafer 11 is transmitted through the thermal conductive adhesive 22 to the bottom cover 212 as a heat sink, and the bottom cover 212 transfers the thermal energy to the cooling liquid C in the accommodating space S.

The thermal conductive adhesive 22 is a sheet-shaped silicone to fill the gap between the wafer 11 and the bottom cover 212. Thermally conductive glue 22 provides a path for conducting thermal energy between wafer 11 and bottom cover 212. As shown in FIG. 3, the thermal conductive adhesive 22 covers the range of the solid state hard disk body 1 in a range larger than the upper surface of the wafer 11, so that the thermal energy of the wafer 11 can be transmitted more completely. In the present embodiment, the water-cooled solid state hard disk device 100 is fixed by a jig 3 to fix the solid state hard disk body 1 and the casing 21. In other embodiments, the thermal adhesive 22 can also be a viscous thermal paste. The wafer 11 and the bottom cover 212 are fixed by the adhesiveness of the thermal paste without the need for the fixture 3.

The bottom cover 212 is made of an aluminum alloy material and has a good thermal conductivity. Further, as shown in FIG. 3, the bottom surface area of the bottom cover 212 is larger than the area of the upper surface of the wafer 11 to disperse and transfer the heat energy to the cooling liquid C in the accommodating space S.

As shown in FIG. 2, in the present embodiment, the accommodating space S accommodates the coolant C. In other embodiments, the coolant C may be added to the accommodating space S from the outside of the casing 21 by the user.

The upper cover 211 of the casing 21 is a material that is permeable to light and does not react with the cooling liquid C so that the cooling liquid C in the accommodating space S is visible. In the embodiment, the material of the upper cover 211 is PC.

As shown in FIG. 2, the water-cooled solid state hard disk device 100 according to the first embodiment of the present invention, wherein the casing 21 includes a fixing member 213 and a sealing ring 214. The fixing member 213 is a screw to fix the upper cover 211 and the bottom cover 212. The sealing ring 214 is sandwiched between the upper cover 211 and the bottom cover 212 to seal the accommodating space S. The material of the seal ring 214 is nitrile rubber (NBR), and the accommodating space S is sealed by the characteristics of high elasticity, good airtightness, and good heat resistance of the NBR.

As shown in FIG. 3, the water-cooled solid-state hard disk device 100a according to the second embodiment of the present invention has a structure substantially the same as that of the water-cooled solid-state hard disk device 100 of the first embodiment, with the difference that the casing 21 is provided. The opening H of the accommodating space S and the outer portion of the casing 21 and a cover 215 corresponding to the opening H are provided for the user to open the cover 215 and self-add and replenish the selected coolant C. The user can also observe the stock of the coolant C in the accommodating space S through the light-transmissive upper cover 211.

As shown in FIG. 4, the water-cooled solid-state hard disk device 100b according to the third embodiment of the present invention has a structure substantially the same as that of the water-cooled solid-state hard disk device 100 of the first embodiment, with the difference that the outer portion of the casing 21 is The surface is provided with heat dissipation fins 4. The heat dissipation fin 4 is made of an aluminum alloy material and has a good thermal conductivity to assist the heat dissipation of the casing 21 to improve the heat dissipation effect of the water cooling device 2.

The above description and description are only illustrative of the preferred embodiments of the present invention, and those having ordinary skill in the art may make other modifications in accordance with the scope of the patent application as defined below and the above description, but such modifications are still It is the creative spirit of this creation and is within the scope of this creation.

100‧‧‧Water-cooled solid state hard disk device

100a‧‧‧Water-cooled solid state hard disk device

100b‧‧‧Water-cooled solid state hard disk device

1‧‧‧Solid hard disk body

11‧‧‧ wafer

2‧‧‧Water cooling device

21‧‧‧Box

211‧‧‧Upper cover

212‧‧‧ bottom cover

213‧‧‧Fixed parts

214‧‧‧Seal ring

215‧‧‧ Cover

22‧‧‧thermal adhesive

3‧‧‧Clamp

4‧‧‧Heat fins

C‧‧‧ Coolant

H‧‧‧Opening

S‧‧‧ accommodating space

[Fig. 1] is a perspective view showing a water-cooled solid-state hard disk device according to a first embodiment of the present invention; [Fig. 2] is a side view showing a water-cooled solid-state hard disk device according to a first embodiment of the present creation FIG. 3 is a top plan view showing a water-cooled solid-state hard disk device according to a first embodiment of the present invention; [FIG. 4] is a view showing a water-cooled solid state hard according to a second embodiment of the present creation. A perspective view of a disk device; [Fig. 5] is a side cross-sectional view showing a water-cooled solid state disk device according to a third embodiment of the present invention.

Claims (7)

A water-cooled solid-state hard disk device comprising: a solid-state hard disk body comprising a wafer; a water-cooling device contacting the wafer, the water-cooling device comprising a casing and a thermal adhesive, the casing comprising an upper cover and a bottom a cover, the upper cover and the bottom cover surround a space for forming a seal for the cooling liquid to be placed, the bottom cover is a heat sink, the thermal adhesive is disposed between the bottom cover and the wafer, and the thermal adhesive is covered The solid hard disk body has an area larger than an area of the upper surface of the wafer, and the bottom cover and the accommodating space have a bottom surface area larger than an area of the upper surface of the wafer. The water-cooled solid-state hard disk device of claim 1, further comprising a cooling liquid disposed in the accommodating space. The water-cooled solid-state hard disk device of claim 1, wherein the casing is provided with an opening and a cover corresponding to the opening, the opening communicating with the accommodating space and the outside of the casing. The water-cooled solid state hard disk device of any one of claims 1 to 3, wherein the upper cover is permeable to light. The water-cooled solid-state hard disk device according to any one of claims 1 to 3, further comprising a jig that clamps the solid-state hard disk body with the water-cooling device. The water-cooled solid-state hard disk device according to any one of claims 1 to 3, further comprising a heat dissipating fin disposed on an outer surface of the casing. The water-cooled solid-state hard disk device of any one of claims 1 to 3, wherein the casing comprises a fixing member and a sealing ring, the fixing member fixing the upper cover and the bottom cover, and the sealing ring is clamped to the upper cover The accommodating space is sealed between the bottom covers.