CN215264349U - Heat dissipation system for projection equipment and projection equipment - Google Patents

Abstract

The utility model relates to a cooling system and projection equipment for projection equipment, cooling system is including pasting the base plate of locating projection equipment's LED banks, paste the heating panel of locating the base plate, with the heat pipe that the heating panel contact set up, the first radiator of being connected with the heat pipe, sealing washer and TEC chip, wherein, the sealing washer sets up between base plate and heating panel to enclose and close and form installation space, the TEC chip is located installation space, and one side and the substrate connection of TEC chip, the opposite side is connected with the heating panel. The TEC chip is utilized to improve the light efficiency of the projection equipment and improve the color expression. The sealing ring is clamped between the substrate and the heat dissipation plate to seal the TEC chip, so that the TEC chip is isolated from the outside, the condensation phenomenon is effectively avoided, the parts of the projection equipment are prevented from being damaged, and the use performance of the projection equipment is ensured.

Description

Heat dissipation system for projection equipment and projection equipment

Technical Field

The present disclosure relates to the field of projection technologies, and in particular, to a heat dissipation system for a projection apparatus and a projection apparatus.

Background

With the rapid development of intelligent projection technology, the requirements of consumers on the brightness and color expression of projection devices are higher and higher. The light efficiency of the existing projection device is significantly reduced along with the increase of the temperature, and a plurality of light sources are generally arranged in the projection device, wherein the light sources are sensitive to the temperature to different degrees, so that the color expression of the projection device is reduced after the projection device is used for a period of time. Therefore, it is desirable to provide a heat dissipation system that can provide better heat dissipation for temperature sensitive light sources without affecting the performance of the overall projection device.

SUMMERY OF THE UTILITY MODEL

An object of the present disclosure is to provide a heat dissipation system for a projection apparatus and a projection apparatus, so as to at least partially solve the above problems.

In order to achieve the above object, the present disclosure provides a cooling system for projection apparatus, the cooling system includes the paste locate projection apparatus's LED banks's base plate, with the heating panel that the base plate is connected, with the heat pipe that the heating panel contact set up, with first radiator, sealing washer and the TEC chip that the heat pipe is connected, wherein, the sealing washer sets up the base plate with between the heating panel to enclose and form installation space, the TEC chip is located installation space, just one side of TEC chip with the base plate is connected, the opposite side with the heating panel is connected.

Optionally, the LED lamp set is installed on a machine body of the projection device, the LED lamp set includes a first light source and a second light source, the first light source and the second light source are disposed on the same side of the machine body, and the heat dissipation plate includes a first heat dissipation plate corresponding to the first light source and a second heat dissipation plate corresponding to the second light source;

the first heat dissipation plate and the second heat dissipation plate form an integrated structure and are connected with the first radiator through the same heat pipe, the thickness of the first heat dissipation plate is smaller than that of the second heat dissipation plate, and the first heat dissipation plate and the second heat dissipation plate are parallel and level to one side surface, back to the sealing ring, of the second heat dissipation plate.

Optionally, a groove structure is formed on the sealing ring, a hollow portion used for being sleeved on the periphery of the TEC chip is formed at the bottom of the groove structure, and a groove wall of the groove structure is used for being sleeved on the periphery of the substrate and enabling a side surface of the substrate close to the TEC chip to abut against the bottom of the groove.

Optionally, a mounting frame for accommodating the substrate is disposed on the body of the projection apparatus, and an edge of the sealing ring is used to abut against an edge of the mounting frame, so that the TEC chip accommodated in the hollow portion of the sealing ring is attached to the substrate.

Optionally, the inner wall of the sealing ring is provided with a protective layer, and the circumferential direction of the TEC chips is attached to the protective layer.

Optionally, a wire passing hole for the lead wire of the TEC chip to pass through is formed in the sealing ring, and a wire releasing gap communicated to the wire passing hole is formed in a side surface of the sealing ring, so as to guide the lead wire to the wire passing hole from the side surface of the sealing ring.

Optionally, heat conducting layers are respectively arranged between the TEC chip and the substrate, and between the TEC chip and the heat dissipation plate.

Optionally, the heat dissipation plate includes a first edge and a second edge that are connected to each other and form an included angle, at least a portion of the first edge is connected to the sealing ring, and the second edge extends to a position between a body of the projection apparatus and a body fan.

Optionally, the heat dissipation system further includes a second heat sink, and a side of the second side facing away from the body is connected to the second heat sink.

According to a second aspect of the present disclosure, there is also provided a projection apparatus, including a body, an LED lamp set disposed on the body, and a heat dissipation system mounted to the body, where the heat dissipation system is the heat dissipation system provided by the present disclosure.

By the technical scheme, the temperature of the LED lamp bank during working can be effectively reduced by utilizing the Peltier effect of the TEC chip, the light effect of the projection equipment is improved, and the color expression is improved. And, with TEC chip set up in the sealing washer back with heating panel and base plate contact, tightly clamp between base plate and heating panel through the sealing washer, and realize sealed to TEC chip for TEC chip keeps apart with the external world, has effectively avoided the condensation phenomenon that external steam got into and leads to, prevents projection equipment's spare part damage, has guaranteed projection equipment's performance.

Additional features and advantages of the disclosure will be set forth in the detailed description which follows.

Drawings

The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:

fig. 1 is a schematic structural diagram of a projection apparatus provided in an exemplary embodiment of the present disclosure;

FIG. 2 is an exploded view of a projection device provided in accordance with an exemplary embodiment of the present disclosure, with portions of the structure omitted;

FIG. 3 is a schematic diagram of a projection device according to another exemplary embodiment of the present disclosure;

FIG. 4 is a schematic view of a seal ring provided in an exemplary embodiment of the present disclosure;

FIG. 5 is a partial cross-sectional view of a projection device provided in an exemplary embodiment of the present disclosure;

FIG. 6 is a partial cross-sectional view of a projection device provided in accordance with another exemplary embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a TEC chip mated with a sealing ring according to an exemplary embodiment of the present disclosure;

FIG. 8 is a schematic view of a projection device provided in an exemplary embodiment of the present disclosure with a portion of the structure omitted;

fig. 9 is a schematic diagram of a chip provided with a protective layer at the periphery thereof according to an exemplary embodiment of the disclosure.

Description of the reference numerals

10-a first radiator, 20-a heat pipe, 31-a first substrate, 32-a second substrate, 33-a third substrate, 34-a fourth substrate, 41-a first heat dissipation plate, 411-a first edge, 412-a second edge, 42-a second heat dissipation plate, 50-a sealing ring, 500-a protective layer, 51-a groove bottom, 511-a hollow part, 52-a groove wall, 53-a wire through hole, 54-a wire releasing gap, 60-a TEC chip, 61-a lead, 70-a machine body, 71-a mounting frame, 72-a machine body fan, 80-a second radiator and 90-a first light source.

Detailed Description

The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.

In the present disclosure, unless otherwise stated, the use of the directional terms such as "upper and lower" is defined according to the normal use state of the projection device, and specifically, referring to the drawing direction of fig. 8, "inner and outer" are with respect to the self-outline of the corresponding component. In addition, the terms "first, second, and the like" used in the embodiments of the present disclosure are for distinguishing one element from another, and have no order or importance. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated.

Referring to fig. 1 to 3, the present disclosure provides a heat dissipation system for a projection device, where the projection device includes a body 70, and an LED lamp set is disposed on the body 70, and the LED lamp set may include a first light source (e.g., an R lamp), a second light source (e.g., a G lamp), a third light source (e.g., a B lamp), and a fourth light source (e.g., a BP lamp), so as to form a light effect of the projection device. The heat dissipation system may include a substrate, a heat dissipation plate connected to the substrate, a heat pipe 20 disposed in contact with the heat dissipation plate, and a first heat sink 10 connected to the heat pipe 20. Each lamp of the LED lamp set may be attached to a substrate, such as a copper substrate, and as an example, in fig. 5 and 6, the first light source 90 may be attached to the first substrate 31, the second light source is disposed on the second substrate 32, the third light source is disposed on the third substrate 33, and the fourth light source is disposed on the fourth substrate 34. The side of the copper substrate far away from the LED lamp set is attached with a heat dissipation plate, for example, a copper plate, each heat dissipation plate is connected with a heat pipe 20, and the plurality of heat pipes 20 are connected to the same first heat sink 10. When the temperature rises in the working process of the LED lamp bank, heat is transferred to the substrate, then is transferred to the heat dissipation plate through the substrate, and is transferred to the first radiator 10 through the heat pipe 20, so that the heat dissipation effect of the LED lamp bank is realized.

The heat dissipation system may further include a sealing ring 50 and a TEC (thermal Electric Cooler) chip 60, for example, the sealing ring 50 may be disposed between the first substrate 31 corresponding to the first light source of the LED lamp set and the first heat dissipation plate 41, the sealing ring 50 is disposed between the substrate and the heat dissipation plate to form an installation space, the TEC chip 60 is located in the installation space, and one side of the TEC chip 60 is connected to the substrate and the other side is connected to the heat dissipation plate. Hereinafter, the sealing ring 50 and the TEC chip 60 are provided at positions corresponding to the first light source, for example. When the TEC chip 60 is powered on to work, a certain temperature difference is forcibly formed between two surfaces of the TEC chip 60 due to the peltier effect, so that one side of the TEC chip 60 is a cold surface, and the other side of the TEC chip 60 is a hot surface, the cold surface of the TEC chip 60 is in contact with the first substrate 31, and the hot surface is in contact with the first heat dissipation plate 41, and the TEC chip 60 carries heat of the first substrate 31 to the hot surface in the working process and is dissipated to the first heat sink 10 through the first heat dissipation plate 41 via the heat pipe 20.

The temperature difference between the cold side and the hot side of the TEC chip 60 depends on the current and the heat consumption of the corresponding heat source (i.e., the first substrate 31), and generally, the maximum temperature difference between the cold side and the hot side can reach 60 ℃. Since the TEC chip 60 consumes a certain amount of electric power to be converted into the heat dissipation power of the TEC chip 60 itself, and this heat dissipation power also needs to be dissipated through the first heat sink 10, when the TEC chip 60 is used, the first heat sink 10 on the hot side needs to process a larger amount of heat than when the TEC chip 60 is not used. In the embodiment of the disclosure, in order to control the heat of the TEC chip 60 and control the temperature of the first substrate 31, the selected TEC chip 60 can reduce the working temperature of the first light source by 20 to 30 ℃, so as to improve the light efficiency of the light source of the first light source by 15 to 25%, thereby improving the brightness of the whole projection apparatus and bringing better color expression. However, since the temperature of the first substrate 31 is already close to or even lower than the ambient temperature after being reduced by 20 ℃ to 30 ℃, there is a risk that the TEC chips 60 and the first substrate 31 will be exposed to condensation after a long period of use. Due to this, in the embodiment of the disclosure, the sealing ring 50 is disposed to be pressed between the first heat dissipation plate 41 and the body 70 to prevent the TEC chip 60 and the first substrate 31 from contacting with the outside.

By the technical scheme, the Peltier effect of the TEC chip 60 is utilized to effectively reduce the working temperature of the LED lamp bank, improve the lighting effect of the projection equipment and improve the color expression. And, set up TEC chip 60 in sealing washer 50 back and with heating panel and base plate contact, through the tight clamp between base plate and heating panel of sealing washer 50, and realize the sealed to TEC chip 60 for TEC chip 60 is kept apart with the external world, has effectively avoided the condensation phenomenon that external steam got into and leads to, prevents projection equipment's spare part damage, has guaranteed projection equipment's performance.

Wherein, sealing washer 50 can be made by the rubber material, silica gel material, aerogel material or other thermal conductivity coefficient low and have certain compressibility's material to make, also can make for the cotton material of bubble, perhaps also can set up the bubble cotton for the outer layer of rubber circle to strengthen sealed effect. The packing 50 may be compression-mounted to the body 70 by the first heat dissipation plate 41, and a mounting hole may be formed on the packing 50 to be mounted to the body 70 by a fastener. The seal ring 50 may also be directly pre-assembled on the housing 70, for example, adhered to the housing 70, and supplied as a product assembly with the housing 70, so as to reduce the assembling workload of the projection apparatus.

According to an embodiment of the present disclosure, referring to fig. 1 and 2, the first light source and the second light source may be disposed on the same side of the body 70, the first heat dissipation plate 41 of the first light source and the second heat dissipation plate 42 of the second light source may be formed as an integrated structure and connected to the first heat sink 10 through the same heat pipe 20, the thickness of the first heat dissipation plate 41 is smaller than that of the second heat dissipation plate 42, and the first heat dissipation plate 41 and the second heat dissipation plate 42 are flush with each other on a side surface facing away from the sealing ring 50. In the embodiment of the present disclosure, by adopting the manner of reducing the thickness of the first heat dissipation plate 41, a space is provided for the installation of the TEC chip 60 and the sealing ring 50, so as to install the TEC chip 60 without additionally increasing the occupied space and improve the heat dissipation effect of the first light source, and meanwhile, one side end surface of the integrated heat dissipation plate structure is configured as a plane, so that the integrated heat dissipation plate structure can be connected to the first heat sink 10 through the same heat pipe 20, thereby reducing the material cost.

According to another embodiment of the present disclosure, referring to fig. 3, the first heat dissipation plate 41 and the second heat dissipation plate 42 may also be separately provided, in which case, the thicknesses of the two heat dissipation plates may be the same, that is, after the TEC chip 60 and the sealing ring 50 are mounted, the first heat dissipation plate 41 may be farther from the body 70 than the second heat dissipation plate 42. The two heat dissipation plates can be respectively connected to the first heat sink 10 through one heat pipe 20, so that the influence of the heat of the second light source on the operation of the TEC chip 60 can be avoided, the TEC chip 60 can operate in a lower current state, and the refrigeration efficiency of the TEC chip 60 is improved. In addition, the first heat dissipation plate 41 and the second heat dissipation plate 42 are both configured as a planar structure, so that the processing is simpler and more convenient, and compared with the aforementioned integrated structure, the second heat dissipation plate 42 in this case can be made thinner, so that the heat transfer resistance can be reduced, the heat dissipation effect on the second is improved, and the material cost can be saved.

In the embodiment of the present disclosure, referring to fig. 4 and 5, a groove structure may be formed on the sealing ring 50, a hollow portion 511 configured to be sleeved on the periphery of the TEC chip 60 is formed on a groove bottom 51 of the groove structure, and a groove wall 52 of the groove structure is configured to be sleeved on the periphery of the first substrate 31 of the first light source, so that a side surface of the first substrate 31 close to the TEC chip 60 abuts against the groove bottom 51. The sealing ring 50 can be elastically sleeved on the periphery of the first substrate 31, so that the sealing ring can be installed and fastened between the first substrate and the second substrate, and the sealing effect is better. After the sealing ring 50 is sleeved on the first substrate 31, the edge of the sealing ring 50 is tightly pressed against the body 70, so that the sealing ring 50 is stably mounted. Here, the hollow portion 511 may be contoured to elastically fit over the TEC chip 60 to secure the mounting tightness, and the thickness of the hollow portion 511 may be set to be slightly greater than that of the TEC chip 60 so that the TEC chip 60 can contact the first substrate 31 and the first heat dissipation plate 41 on the cold and hot sides, respectively, after the sealing ring 50 is compressed.

In another embodiment, referring to fig. 6, a mounting frame 71 for accommodating the first substrate 31 may be disposed on the body 70, and an edge of the sealing ring 50 is used to abut against an edge of the mounting frame 71, so that the TEC chip 60 accommodated in the hollow portion 511 of the sealing ring 50 is attached to the first substrate 31. When the seal ring 50 is pressed against the mounting frame 71, the mounting frame 71 can provide support for the seal ring 50, so that the seal ring 50 can be clamped and sealed between the first heat dissipation plate 41 and the mounting frame 71. This arrangement ensures that the outermost edge of the seal ring 50 is in contact with the mounting frame 71 and not in contact with the first substrate 31, which can better ensure the sealing effect against the first substrate 31 and make the system more reliable and more operable for assembly.

In the embodiment of the present disclosure, referring to fig. 9, the inner wall of the sealing ring 50 may be provided with a protective layer 500, and the TEC chips 60 may be attached to the protective layer 500 in the circumferential direction. The protective layer 500 can protect the TEC chip 60 from being damaged by the excessive pressure of the sealing ring 50. The protective layer 500 may be a steel ring or other similar structure capable of protecting the TEC chips 60. The inner contour of the protective layer 500 may match the outer contour of the TEC chip 60, or the inner contour of the protective layer 500 may be slightly smaller than the outer contour of the TEC chip 60, so that the TEC chip 60 is firmly mounted.

In order to ensure the sealing effect, in the embodiment of the present disclosure, the sealing ring 50 may be respectively sealed with the body 70, the first substrate 31 and the first heat dissipation plate 41 by dispensing. That is, the edge positions of the seal ring 50 adjacent to the respective parts after mounting are dispensed to improve the sealing effect. As in the embodiment of fig. 5, the dispensing process may be performed at the edge position where the sealing ring 50 contacts the first substrate 31 after the sealing ring is sleeved on the first substrate. When the scheme shown in the embodiment of fig. 6 is used, since the outer edge of the sealing ring 50 is in contact with the mounting frame 71, in this embodiment, the dispensing process can be omitted.

Referring to fig. 7, the sealing ring 50 may further include a wire passing hole 53 through which a wire 61 of the TEC chip 60 passes, and a wire releasing gap 54 connected to the wire passing hole 53 may be formed on a side surface of the sealing ring 50 to guide the wire 61 from the side surface of the sealing ring 50 to the wire passing hole 53. When the TEC chip 60 is placed in the sealing ring 50, such as in the hollow portion 511, the wire 61 may be advanced to the edge of the wire releasing gap 54 corresponding to the sealing ring 50, and then the wire 61 is guided from the edge to the middle area of the sealing ring 50 to the wire passing hole 53. Wherein the wire 61 is squeezed under the variable characteristics of the sealing ring 50 in the wire releasing gap 54, and the sealing ring 50 at the wire releasing gap 54 is restored to the original state after the wire 61 enters the wire passing hole 53. Here, the payoff gap 54 is understood to be such that the sealing ring 50 breaks at this location, rather than such that the sealing ring 50 opens out with a gap. In the embodiment of the present disclosure, in order to ensure the sealing effect, a dispensing process may be performed at the wire passing hole 53 and the wire releasing gap 54 after the installation of the lead 61 is completed. In other embodiments, in order to ensure the sealing property, the wire hole and the wire releasing gap may not be provided, and due to the variable property of the sealing ring 50, only the conducting wire 61 may be led out from between the sealing ring 50 and the first substrate 31 or the first heat dissipation plate 41, and finally, the dispensing sealing may be performed in the area where the conducting wire 61 is led out. This avoids compromising the integrity of the seal ring 50 and thus the sealing effect.

In the embodiment of the present disclosure, heat conduction layers, such as heat conduction layers made of a heat conduction interface material, may be disposed between the TEC chip 60 and the first substrate 31 and between the TEC chip 60 and the first heat dissipation plate 41. On one hand, the thermal interface material can reduce thermal contact resistance and improve heat dissipation performance, and on the other hand, due to certain viscosity, the sliding of the TEC chips 60 on the surfaces of the first substrate 31 and the first heat dissipation plate 41 can be avoided, and no additional fixing design needs to be performed on the TEC chips 60.

According to an embodiment of the present disclosure, the first heat sink plate 41 may include a first side 411 and a second side 412 connected to each other and forming an included angle, referring to fig. 8, at least a portion of the first side 411 is connected to the sealing ring 50, and the second side 412 may extend to a position between the body 70 and the body fan 72 of the projection apparatus. The first heat dissipation plate 41 can dissipate heat through the heat pipe 20 and the first heat sink 10, and can also dissipate heat through the body fan 72 below the body 70, so that the space below the body 70 is effectively utilized on the premise of improving the heat dissipation effect, and the whole volume of the projection device is not increased. The body 70 may be made of a metal material, the second side 412 may be connected to the body 70 through a heat conducting interface material or a reflow soldering manner, so as to transfer heat to the body 70, and a heat conducting fin with a certain height may be further disposed below the body 70, so as to improve a heat dissipation effect. The second side 412 may have the same structure as the first plate 411, and both of them are configured as copper substrates, and the second side 412 may also be made of a flat uniform temperature plate or a heat pipe.

Further, the heat dissipation system may further include a second heat sink 80, a side of the second side 412 facing away from the body 70 is connected to the second heat sink 80, the second heat sink 80 may be an aluminum extruded heat sink, and the second heat sink 80 and the second side 412 may be connected by a heat conducting interface material or reflow soldering, and may be fixed below the body 70 by a fastener. The second heat sink 80 may be disposed above the fan 72, so as to make full use of the airflow at the air inlet of the fan to achieve efficient heat dissipation. This arrangement of the first heat dissipation plate 41 can dissipate heat for the TEC chip 60 without increasing the heat dissipation area of the first heat sink 10.

According to the second aspect of the present disclosure, a projection apparatus is further provided, which includes a machine body 70, an LED lamp set disposed on the machine body 70, and a heat dissipation system mounted to the machine body 70, wherein the heat dissipation system is the above-mentioned heat dissipation system. The projection device has all the advantages of the heat dissipation system, and the details are not repeated herein.

The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.

It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.

In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.

Claims (10)

1. The utility model provides a cooling system for projection apparatus, characterized in that, cooling system is including pasting locate projection apparatus's LED banks's base plate, with the heating panel that the base plate is connected, with heat pipe (20) that the heating panel contact set up, with first radiator (10), sealing washer (50) and TEC chip (60) that heat pipe (20) are connected, wherein, sealing washer (50) set up the base plate with between the heating panel to enclose and form installation space, TEC chip (60) are located installation space, just one side of TEC chip (60) with the base plate is connected, the opposite side with the heating panel is connected.

2. The heat dissipation system of claim 1, wherein the LED lamp set is mounted on a body (70) of the projection apparatus, the LED lamp set includes a first light source and a second light source, the first light source and the second light source are disposed on the same side of the body (70), and the heat dissipation plate includes a first heat dissipation plate (41) corresponding to the first light source and a second heat dissipation plate (42) corresponding to the second light source;

the first heat dissipation plate (41) and the second heat dissipation plate (42) are formed into an integrated structure and are connected with the first radiator (10) through the same heat pipe (20), the thickness of the first heat dissipation plate (41) is smaller than that of the second heat dissipation plate (42), and the first heat dissipation plate (41) and the second heat dissipation plate (42) are flush with each other on the surface of one side back to the sealing ring (50).

3. The heat dissipation system as claimed in claim 1, wherein the sealing ring (50) has a groove structure formed thereon, a hollow portion (511) is formed on a bottom (51) of the groove structure and is configured to be sleeved on an outer periphery of the TEC chip (60), and a groove wall (52) of the groove structure is configured to be sleeved on an outer periphery of the substrate, such that a side surface of the substrate close to the TEC chip (60) abuts against the bottom (51).

4. The heat dissipation system of claim 1, wherein a mounting frame (71) for accommodating the substrate is disposed on the body (70) of the projection apparatus, and an edge of the sealing ring (50) is configured to abut against an edge of the mounting frame (71), so that the TEC chip (60) accommodated in the hollow portion (511) of the sealing ring (50) is attached to the substrate (31).

5. The heat dissipation system of claim 1, wherein the inner wall of the sealing ring (50) is provided with a protective layer (500), and the TEC chips (60) are circumferentially attached to the protective layer (500).

6. The heat dissipation system according to claim 1, wherein a wire passing hole (53) for passing a wire (61) of the TEC chip (60) is provided in the sealing ring (50), and a wire releasing gap (54) connected to the wire passing hole (53) is formed in a side surface of the sealing ring (50) for guiding the wire (61) to the wire passing hole (53) from the side surface of the sealing ring (50).

7. The heat dissipating system of claim 1, wherein a thermally conductive layer is disposed between the TEC chip (60) and the substrate, and between the TEC chip (60) and the heat dissipating plate.

8. The heat dissipation system of claim 1, wherein the heat dissipation plate comprises a first edge (411) and a second edge (412) connected to form an included angle, at least a portion of the first edge (411) is connected to the sealing ring (50), and the second edge (412) extends to be located between a body (70) and a body fan (72) of the projection apparatus.

9. The heat dissipation system of claim 8, further comprising a second heat sink (80), wherein a side of the second side (412) facing away from the body (70) is connected to the second heat sink (80).

10. A projection device, comprising a body (70), a LED light set disposed on the body (70), and a heat dissipation system mounted to the body (70), the heat dissipation system being in accordance with any one of claims 1-9.

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