CN220210828U - Main control board heat dissipation shell - Google Patents
Main control board heat dissipation shell Download PDFInfo
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- CN220210828U CN220210828U CN202320718485.2U CN202320718485U CN220210828U CN 220210828 U CN220210828 U CN 220210828U CN 202320718485 U CN202320718485 U CN 202320718485U CN 220210828 U CN220210828 U CN 220210828U
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- main control
- control board
- heat
- heat dissipation
- copper
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Abstract
The utility model discloses a heat dissipation shell of a main control board, which comprises the following components: a housing; a main control board is arranged in an installation space formed by the shell; the inner wall of the shell is embedded with a plurality of copper heat pipes for radiating and cooling the main control board; a cooling medium is injected into the copper heat pipe; a gap is formed between the copper heat pipe and the main control board; the gap is filled with a heat conduction silica gel pad which isolates the copper heat pipe from the main control board and prevents air from conducting the main control board and the copper heat pipe. The main control board heat dissipation shell has the advantages of good dustproof and waterproof performance and high heat dissipation efficiency.
Description
Technical Field
The utility model relates to a heat dissipation shell of a main control board.
Background
The problem of installation space is considered to traditional main control board of using in inside robot, mostly is naked installation, and it only relies on the casing of robot to protect and seal, has the installation gap when the installation owing to the casing of robot, leads to the main control board to deposit grey easily like this, and causes the trouble because of intaking easily. The heat dissipation of the control panel is also carried out by adopting a forced convection mode, the use of electric quantity is increased by adopting the forced convection heat dissipation mode, noise is generated on the other hand, and the heat dissipation effect is not good.
Disclosure of Invention
The utility model provides a main control board heat dissipation shell for solving the technical problems, which adopts the following technical scheme:
a main control board heat dissipation housing comprising: a housing; a main control board is arranged in an installation space formed by the shell; the installation space is a sealed space; the inner wall of the shell is embedded with a plurality of copper heat pipes for radiating and cooling the main control board; a cooling medium is injected into the copper heat pipe; a gap is formed between the copper heat pipe and the main control board; the gap is filled with a heat conduction silica gel pad which isolates the copper heat pipe from the main control board and prevents air from conducting the main control board and the copper heat pipe.
Further, the housing is formed with a recess for engaging with the protrusion formed on the main control board in the installation space.
Further, a heat dissipation gap for intensively dissipating heat of the main control board to intensively transfer the dissipated heat to the heat-conducting silica gel pad is formed below the heat-conducting silica gel pad of the main control board.
Further, a plurality of copper heat pipes are embedded in the inner wall of the shell; the copper heat pipes are uniformly distributed above the main control circuit area of the main control board.
Further, a plurality of heat dissipation fins for increasing a heat dissipation area are formed on the outer side of the housing.
Further, the housing is made of an aluminum alloy material.
Further, the cooling medium is water.
Further, one end of the copper heat pipe is in threaded connection with a plugging cover for plugging the copper heat pipe.
Further, one end of the copper heat pipe is communicated to the outside of the housing.
Further, the wall thickness of the copper heat pipe is 0.3mm.
The main control board heat dissipation shell has the advantages that the shell of the main control board heat dissipation shell is of a closed structure, dust and water resistance are good, and the failure rate of products is reduced. The heat source of the main control board and the shell are matched with the heat conduction silicone grease pad with high heat conductivity and the copper heat pipe to dissipate heat, so that the heat dissipation capacity is high, the forced convection mode is not needed to be adopted to increase the heat dissipation, the noise is avoided, the energy is saved, and the influence of air on the stability of the main control board is eliminated. Meanwhile, the mounting structure of the laminating type of this scheme, main control board, heat conduction silica gel pad and casing three laminating installation promptly for the mounting structure of spare part is compact, reduces the space occupation rate of whole installation greatly.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic diagram of a heat dissipation housing of a main control board according to the present application;
the heat-conducting device comprises a shell 1, a concave part 11, heat-radiating fins 12, a main control board 2, a convex part 21, a copper heat pipe 3, a heat-conducting silica gel pad 4, a heat-radiating gap 5, a cooling medium 6 and a plugging cover (not shown).
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
As shown in fig. 1, a heat dissipation housing for a main control board of the present application includes: the main control board 2 is installed in an installation space formed by the shell 1, and the installation space is a sealed space, so that the shell 1 is waterproof and dustproof. The inner wall of the shell 1 is embedded with a copper heat pipe 3 for radiating and cooling the main control board 2, and a cooling medium 6 is injected into the copper heat pipe 3 so as to improve heat conduction and heat dissipation performance. A gap is formed between the copper heat pipe 3 and the main control board 2, the gap is filled with a heat-conducting silica gel pad 4, the copper heat pipe 3 and the main control board 2 can be isolated and air conduction between the main control board 2 and the copper heat pipe 3 is avoided through the heat-conducting silica gel pad 4, the main control board 2 can be attached to improve the heat conducting performance of the main control board 2, and in addition, the installation stability of the main control board 2 can be improved through the flexibility of the heat-conducting silica gel pad 4.
Further, a plurality of heat radiating fins are distributed on the outer surface of the housing 1, so that the contact area with air is increased by the heat radiating fins 12, and the heat radiating effect is increased by increasing the heat radiating area. The copper heat pipe 3 is embedded in the shell 1, the cooling medium 6 in the copper heat pipe 3 is water, the copper heat pipe 3 is in indirect contact with a heat source of the main control board 2 through the heat conduction silica gel pad 4, and heat can be quickly transferred to the copper heat pipe 3 through the heat conduction silica gel pad 4. The thickness of the pipe wall of the copper heat pipe 3 is 0.3mm, the shell 1 is made of an aluminum alloy material, the ductility of the pipe wall of the copper heat pipe 3 is good, and the copper heat pipe can be in seamless fit with the shell 1 made of the aluminum alloy material, so that the heat conduction and heat dissipation effects are improved.
Specifically, the natural convection heat exchange coefficient of water in the copper heat pipe 3 is between 200W/m-K and 1000W/m-K, so that the temperature rise is reduced, and the temperature difference of the shell 1 is reduced. When the copper-free heat pipe 3 is in a structure, the maximum temperature difference of the shell 1 is 30K, and when the copper-free heat pipe 3 is in a structure, the maximum temperature difference of the shell 1 is 21K. The heat conductivity coefficient of the heat-conducting silica gel pad 4 is 10W/m-K, so that the heat exchange capacity of the heat source of the main control board 2 and the shell 1 is effectively improved, and the installation gap can be prevented from being formed through the heat-conducting silica gel pad 4, thereby avoiding the reduction of the heat exchange capacity.
Therefore, the shell of the main control board heat dissipation shell is of a closed structure, so that the main control board heat dissipation shell is good in dust and water resistance, and the failure rate of products is reduced. The heat source of the main control board 2 and the shell 1 are matched with the heat conduction silicone grease pad with high heat conductivity and the copper heat pipe 3 to dissipate heat, so that the heat dissipation capacity is high, the forced convection mode is not needed to be adopted to increase the heat dissipation, the noise is avoided, the energy is saved, and the influence of air on the stability of the main control board 2 is eliminated. Meanwhile, the mounting structure of the laminating type of this scheme, namely main control board 2, heat conduction silica gel pad 4 and casing 1 three laminating installation for the mounting structure of spare part is compact, reduces the space occupation rate of whole installation greatly.
As a specific embodiment, the housing 1 is formed with the concave 11 in the installation space, the main control board 2 is formed with the convex 21, and the concave 11 is used for clamping the convex 21, so as to limit the installation position of the main control board 2, and meanwhile, the contact area of the housing 1 and the main control board 2 can be increased, and the heat conduction efficiency is improved.
As a specific embodiment, a heat dissipation gap 5 is formed below the heat conduction silica gel pad 4 of the main control board 2. The heat dissipation gap 5 can be used for allowing heat of the main control board 2 to be concentrated and tend to be dissipated into the heat dissipation gap 5, so that the dissipated heat is intensively transferred to the heat-conducting silica gel pad 4.
As a specific embodiment, the inner wall of the casing 1 is embedded with a plurality of copper heat pipes 3, and the plurality of copper heat pipes 3 are uniformly distributed above the main control circuit area of the main control board 2, so that the temperature of the whole casing 1 is uniformly distributed.
As a specific embodiment, one end of the copper heat pipe 3 is screwed with a blocking cover for blocking the copper heat pipe 3, and one end of the copper heat pipe 3 is connected to the outside of the housing 1, so as to facilitate replacement of the cooling medium 6.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be appreciated by persons skilled in the art that the above embodiments are not intended to limit the utility model in any way, and that all technical solutions obtained by means of equivalent substitutions or equivalent transformations fall within the scope of the utility model.
Claims (10)
1. A main control board heat dissipation housing comprising: a housing; a main control board is arranged in an installation space formed by the shell; it is characterized in that the method comprises the steps of,
the installation space is a sealed space;
the inner wall of the shell is embedded with a plurality of copper heat pipes for radiating and cooling the main control board;
a cooling medium is injected into the copper heat pipe;
a gap is formed between the copper heat pipe and the main control board;
the gap is filled with a heat conduction silica gel pad which isolates the copper heat pipe from the main control board and prevents air from conducting the main control board and the copper heat pipe.
2. The heat dissipation housing of a main control board of claim 1,
the housing is provided with a concave part for clamping the convex part formed by the main control board in the installation space.
3. The heat dissipation housing of a main control board of claim 1,
the main control board is positioned below the heat-conducting silica gel pad, and a heat dissipation gap for intensively dissipating heat of the main control board so as to intensively transfer the dissipated heat to the heat-conducting silica gel pad is formed below the main control board.
4. The heat dissipation housing of a main control board of claim 1,
the inner wall of the shell is embedded with a plurality of copper heat pipes;
the copper heat pipes are uniformly distributed above the main control circuit area of the main control board.
5. The heat dissipation housing of a main control board of claim 1,
the outer side of the shell is provided with a plurality of radiating fins for increasing the radiating area.
6. The heat dissipation housing of a main control board of claim 1,
the housing is made of an aluminum alloy material.
7. The heat dissipation housing of a main control board of claim 1,
the cooling medium is water.
8. The heat dissipation housing of a main control board of claim 1,
one end of the copper heat pipe is in threaded connection with a plugging cover for plugging the copper heat pipe.
9. The heat dissipation housing of a main control board of claim 8,
one end of the copper heat pipe is communicated to the outside of the shell.
10. The heat dissipation housing of a main control board of claim 1,
the pipe wall thickness of the copper heat pipe is 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320718485.2U CN220210828U (en) | 2023-03-29 | 2023-03-29 | Main control board heat dissipation shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320718485.2U CN220210828U (en) | 2023-03-29 | 2023-03-29 | Main control board heat dissipation shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220210828U true CN220210828U (en) | 2023-12-19 |
Family
ID=89141914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320718485.2U Active CN220210828U (en) | 2023-03-29 | 2023-03-29 | Main control board heat dissipation shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220210828U (en) |
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2023
- 2023-03-29 CN CN202320718485.2U patent/CN220210828U/en active Active
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