TWI598726B - Portable electronic product and heat-dissipating casing structure applied thereto - Google Patents

Description

Portable electronic products and heat-dissipating housing structures for portable electronic products

The present invention relates to an electronic product and an outer casing structure for the electronic product, and more particularly to a portable electronic product and a heat dissipation outer casing structure for the portable electronic product.

The prior art heat dissipation methods generally have the following three major directions: (1) Conduction, which allows the heat source to pass through the conductive medium to conduct to a low temperature, and this method is currently a copper block or a heat block. The Heat Pipe is a commonly used heat sink component that works well but is costly. (2) Radiation, which is performed by heat exchange between heat source and space, and is currently more common with lower cost heat sinks, finned copper or aluminum heat sinks. Thermal solution, but the structure is more space. (3) Convection, which is performed by air or liquid flow, such as natural air cooling, cooling fan (Fan), and even water cooling equipment are often used, and can be used as Auxiliary devices with type components, but they are more bulky and are not suitable for portable electronic products such as smart phones, tablets or notebook computers that require thin and light.

The technical problem to be solved by the present invention is to provide a portable electronic product and a heat-dissipating outer casing structure for a portable electronic product in view of the deficiencies of the prior art.

In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a heat dissipation type housing structure for a portable electronic product, comprising: an insulating housing and a heat conducting unit. The insulating housing is disposed on the portable electronic product, wherein the insulating housing has an inner surface, an outer surface opposite to the inner surface, and a connecting to the inner surface and the outer surface a conductive via structure, wherein the heat conducting unit corresponds to a heat generating unit of the portable electronic product, wherein the heat conducting unit comprises a first heat conducting layer disposed on the inner surface of the insulating housing, a second heat conducting layer disposed on the outer surface of the insulating case and a via structure extending through the insulating case and connected to the first heat conducting layer and the second heat conducting layer The third heat conducting layer.

Further, the via structure includes at least one via hole, and the third heat conduction layer includes a first heat conduction portion that penetrates at least one of the via holes and contacts the heat generating unit of the portable electronic product, and a second heat conducting portion extending through at least one of the through holes and circumferentially connected between the first heat conducting portion and an inner surface of at least one of the through holes, and the second heat conducting portion is coupled to the first portion a thermally conductive layer and a second thermally conductive layer.

Further, the via structure includes at least one via, the third heat conducting layer includes a first heat conducting portion penetrating through the at least one via hole, and one of the first heat conducting portions is disposed on one end of the first heat conducting portion And a second heat conducting portion connected to the first heat conducting layer and a third heat conducting portion disposed on the other end of the first heat conducting portion and connected to the second heat conducting layer, and the second heat conducting portion Partially contacting the heat generating unit of the portable electronic product.

Further, the heat generating unit includes a plurality of heat generating sources, and the through hole structure includes a plurality of conductive holes respectively corresponding to the plurality of heat generating sources, and the first heat conductive layer is divided into a plurality of separate and separate Contacting a plurality of first heat conduction contacts of the heat source, the second heat conduction layer being divided into a plurality of second heat conduction contacts separated from each other and respectively corresponding to the plurality of first heat conduction contacts, and at least one The electronic component is disposed between two adjacent ones of the heat sources and two adjacent ones of the first leads Between the thermal contacts, wherein the insulating housing is a plastic housing or a glass housing, the inner surface and the outer surface of the insulating housing are both roughened surfaces, and the first heat conducting layer has a first predetermined patterning structure, the second heat conducting layer has a second predetermined patterning structure, and the first heat conducting layer, the second heat conducting layer and the third heat conducting layer are all metal layers.

Further, the heat dissipation housing structure for the portable electronic product further includes: a protective layer disposed on the second heat conduction layer to cover the second heat conduction layer, wherein the The interior of the protective layer is mixed with a plurality of thermally conductive particles.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic product, wherein the portable electronic product uses a heat dissipation outer casing structure, and the heat dissipation outer casing structure The utility model comprises: an insulating shell and a heat conducting unit. The insulating housing is disposed on the portable electronic product, wherein the insulating housing has an inner surface, an outer surface opposite to the inner surface, and a connecting to the inner surface and the outer surface a conductive via structure, wherein the heat conducting unit corresponds to a heat generating unit of the portable electronic product, wherein the heat conducting unit comprises a first heat conducting layer disposed on the inner surface of the insulating housing, a second heat conducting layer disposed on the outer surface of the insulating case and a via structure extending through the insulating case and connected to the first heat conducting layer and the second heat conducting layer The third heat conducting layer.

Further, the via structure includes at least one via hole, and the third heat conduction layer includes a first heat conduction portion that penetrates at least one of the via holes and contacts the heat generating unit of the portable electronic product, and a second heat conducting portion extending through at least one of the through holes and circumferentially connected between the first heat conducting portion and an inner surface of at least one of the through holes, and the second heat conducting portion is coupled to the first portion a thermally conductive layer and a second thermally conductive layer.

Further, the via structure includes at least one via, the third heat conducting layer includes a first heat conducting portion penetrating through the at least one via hole, and one of the first heat conducting portions is disposed on one end of the first heat conducting portion And connected to the first heat conducting layer a heat conducting portion and a third heat conducting portion disposed on the other end of the first heat conducting portion and connected to the second heat conducting layer, and the second heat conducting portion contacting the portable electronic product The heating unit is described.

Further, the heat generating unit includes a plurality of heat generating sources, and the through hole structure includes a plurality of conductive holes respectively corresponding to the plurality of heat generating sources, and the first heat conductive layer is divided into a plurality of separate and separate Contacting a plurality of first heat conduction contacts of the heat source, the second heat conduction layer being divided into a plurality of second heat conduction contacts separated from each other and respectively corresponding to the plurality of first heat conduction contacts, and at least one The electronic component is disposed between two adjacent ones of the heat generating sources and between the two adjacent ones of the first heat conducting contacts, wherein the insulating case is a plastic case or a glass case, The inner surface of the insulative housing and the outer surface are both roughened surfaces, the first thermally conductive layer has a first predetermined patterning structure, and the second thermally conductive layer has a second predetermined patterning structure, and The first heat conductive layer, the second heat conductive layer, and the third heat conductive layer are all metal layers.

Further, the heat dissipation outer casing structure further includes: a protective layer disposed on the second heat conductive layer to cover the second heat conductive layer, wherein the inner layer of the protective layer is mixed A plurality of thermally conductive particles.

The present invention has the beneficial effects of the portable electronic product provided by the technical solution of the present invention and the heat dissipation type outer casing structure for the portable electronic product, wherein the insulating housing has an inner surface and a relative surface An outer surface of the inner surface and a via structure connected between the inner surface and the outer surface" and "the heat conducting unit corresponds to a heat generating unit of the portable electronic product, wherein the heat conduction The unit includes a first heat conducting layer disposed on the inner surface of the insulating case, a second heat conducting layer disposed on the outer surface of the insulating case, and a through the insulating case The via structure is connected to the first heat conducting layer and the third heat conducting layer of the second heat conducting layer to improve the heat dissipation performance of the portable electronic product.

In order to further understand the features and technical contents of the present invention, please refer to the following The detailed description of the present invention and the accompanying drawings are in no way

P‧‧‧Portable Electronics

S‧‧‧ Heat-dissipating shell structure

1‧‧‧Insulated housing

100‧‧‧via structure

1000‧‧‧via

101‧‧‧ inner surface

102‧‧‧ outer surface

2‧‧‧thermal unit

21‧‧‧First thermal conduction layer

210‧‧‧First thermal contact

22‧‧‧Second thermal layer

220‧‧‧Second thermal contact

23‧‧‧ Third heat conducting layer

231, 231'‧‧‧ first heat conduction part

232, 232'‧‧‧second heat conduction part

233‧‧‧The third heat conduction part

3‧‧‧Protective layer

30‧‧‧thermal particles

H‧‧‧Fever unit

H‧‧‧heat source

E‧‧‧Electronic components

1 is a side elevational view of a portable electronic product of the present invention.

2 is a side cross-sectional view showing a heat dissipating outer casing structure for a portable electronic product according to a first embodiment of the present invention.

3 is a side cross-sectional view showing the use of another protective layer having a plurality of thermally conductive particles in accordance with a first embodiment of the present invention.

4 is a side cross-sectional view showing a heat dissipating outer casing structure for a portable electronic product according to a second embodiment of the present invention.

FIG. 5 is a side cross-sectional view showing a heat dissipating outer casing structure for a portable electronic product according to a third embodiment of the present invention.

6 is a side cross-sectional view showing a heat dissipating outer casing structure for a portable electronic product according to a fourth embodiment of the present invention.

The following is a specific embodiment to illustrate the implementation of the present invention regarding "portable electronic products and heat-dissipating outer casing structures for portable electronic products", and those skilled in the art can understand the contents disclosed in the present specification. Advantages and effects of the present invention. The present invention may be carried out or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not intended to be construed in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2, a first embodiment of the present invention provides a portable electronic product P and a heat dissipation housing structure S for the portable electronic product P, and the heat dissipation housing structure S includes an insulation. The housing 1 and a heat transfer unit 2. For example, the portable electronic product P can be a mobile phone, a tablet computer or a notebook computer, and the heat-dissipating outer casing structure S can be used as an outer casing of a mobile phone, a tablet computer or a notebook computer.

First, as shown in FIG. 1 and FIG. 2, the insulating housing 1 is disposed on the portable electronic product P, wherein the insulating housing 1 has an inner surface 101, an outer surface 102 opposite to the inner surface 101, and a connection A via structure 100 between the inner surface 101 and the outer surface 102. For example, the insulative housing 1 can be a plastic housing or a glass housing, and both the inner surface 101 and the outer surface 102 of the insulative housing 1 can be roughened surfaces for adding the insulating housing 1 and the thermal conduction unit. 2 contact area. In addition, the via structure 100 may include at least one or more vias 1000, and the vias 1000 are fabricated and selectively formed by laser engraving or numerically controlled drilling or mold injection molding according to different processing requirements. However, the invention is not limited to the examples set forth above.

Moreover, as shown in FIG. 2, the heat transfer unit 2 corresponds to (for example, directly contacts or approaches without touching) a heat generating unit H of the portable electronic product P, and the heat transfer unit 2 includes a heat insulating unit 2 disposed therein. a first heat conducting layer 21 on the surface 101, a second heat conducting layer 22 disposed on the outer surface 102 of the insulating case 1, and a via structure 100 penetrating the insulating case 1 and connected to the first heat conducting layer 21 and The third heat conducting layer 23 of the two heat conducting layers 22. For example, the first heat conduction layer 21, the second heat conduction layer 22, and the third heat conduction layer 23 used by the heat conduction unit 2 may all be made of the same material, for example, may be a metal layer having a heat dissipation function, or have The heat insulating layer of the heat dissipation function may also be used, and of course, a heat dissipation layer having a conductive function may also be used. In addition, according to different design requirements, the first heat conduction layer 21 has a first predetermined patterning structure formed by laser engraving or exposure development, and the second heat conduction layer 22 has a manner of laser engraving or exposure development. A second predetermined patterned structure is formed. That is to say, the first heat conductive layer 21 and the second heat conductive layer 22 can be arranged in different pattern structures according to different design requirements.

For example, as shown in FIG. 2, the via structure 100 includes at least one via. The third heat conducting layer 23 includes a first heat conducting portion 231 that penetrates the at least one via hole 1000 and contacts the heat generating unit H of the portable electronic product P, and a through hole through the through hole 1000 and is circumferentially connected to the first heat conducting portion. 231 and at least one second heat conducting portion 232 between the inner surfaces of the vias 1000, and the second heat conducting portion 232 is connected to the first heat conducting layer 21 and the second heat conducting layer 22. Therefore, when the first heat conducting portion 231 of the third heat conducting layer 23 contacts a heat generating unit H of the portable electronic product P, the heat generated by the heat generating unit H passes through the heat conducting unit 2 to dissipate heat. That is, when the heat-dissipating outer casing structure S is coupled to the portable electronic product P as the outer casing of the portable electronic product P (as shown in FIG. 1), the first heat-transfer portion of the third heat-conducting layer 23 231 will directly contact the heat generating unit H of the portable electronic product P to guide the heat generated by the heat generating unit H from the portable electronic product P to the outside of the heat-dissipating outer casing structure S, so as to effectively improve the use for carrying The heat dissipation performance of the electronic product P.

Further, as shown in FIG. 2, the heat dissipation housing structure S of the portable electronic product further includes a protective layer 3 disposed on the second heat conductive layer 22 to cover and protect the second heat conduction layer. twenty two. Moreover, it is worth mentioning that, as shown in FIG. 3, the inside of the protective layer 3 of the first embodiment may be mixed with a plurality of heat conductive particles 30 to increase the heat dissipation performance of the protective layer 3. That is, by mixing the additives of the plurality of thermally conductive particles 30, the heat generated by the heat generating unit H can also be transferred to the protective layer 3 for heat transfer by the heat transfer unit 2.

[Second embodiment]

Referring to FIG. 1 and FIG. 4, a second embodiment of the present invention provides a portable electronic product P and a heat-dissipating outer casing structure S for the portable electronic product P, and the heat-dissipating outer casing structure S includes an insulation. The housing 1 and a heat transfer unit 2. 4 and FIG. 2, the greatest difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the heat generating unit H includes a plurality of heat generating sources h (FIG. 4 uses two heat sources). h is an example), and the via structure 100 includes a plurality of vias 1000 respectively corresponding to the plurality of heat sources h (FIG. 4 is exemplified by two vias 1000), so the second embodiment Number of vias 1000 and heat generation The number of sources h will be the same. In addition, the first heat conduction layer 21 can be divided into a plurality of first heat conduction contacts 210 that are separated from each other and respectively contact the plurality of heat sources h (FIG. 4 is described by taking two first heat conduction contacts 210 as an example), The two heat conducting layers 22 can be divided into a plurality of second heat conducting contacts 220 that are separated from each other and respectively correspond to the plurality of first heat conducting contacts 210 (FIG. 4 is exemplified by two second heat conducting contacts 220).

It is worth mentioning that, in the example cited in the second embodiment, since the first heat conduction layer 21 can be divided into two first heat conduction contacts 210 which are separated from each other and respectively contact the plurality of heat sources h, As shown in FIG. 4, an accommodating space (not labeled) is formed between two adjacent heat generating sources h and between two adjacent first heat conducting contacts 210. Therefore, the present invention can additionally provide at least one electronic component E between two adjacent heat generating sources h and between two adjacent first heat conducting contacts 210 to effectively increase the portable electronic product P. Available space.

[Third embodiment]

Referring to FIG. 1 and FIG. 5, a third embodiment of the present invention provides a portable electronic product P and a heat dissipation housing structure S for the portable electronic product P, and the heat dissipation housing structure S includes an insulation. The housing 1 and a heat transfer unit 2. The difference between the third embodiment of the present invention and the first embodiment is that, in the third embodiment, the third heat conduction layer 23 includes a first heat conduction through the at least one via hole 1000. a portion 231 ′, a second heat conducting portion 232 ′ disposed on one end of the first heat conducting portion 231 ′ and connected to the first heat conducting layer 21 , and a second end disposed on the other end of the first heat conducting portion 231 ′ and connected The third heat conducting portion 233 of the second heat conducting layer 22, and the second heat conducting portion 232' contacts the heat generating unit H of the portable electronic product P. Therefore, when the second heat conducting portion 232' of the third heat conducting layer 23 contacts a heat generating unit H of the portable electronic product P, the heat generated by the heat generating unit H passes through the heat conducting unit 2 to dissipate heat. That is, when the heat-dissipating outer casing structure S is coupled to the portable electronic product P as the outer casing of the portable electronic product P (as shown in FIG. 1), the second thermally conductive portion of the third thermally conductive layer 23 232' will be direct Contacting the heat generating unit H of the portable electronic product P to guide the heat generated by the heat generating unit H from the portable electronic product P to the outside of the heat-dissipating outer casing structure S, thereby effectively improving the portable electronic product P Cooling performance.

[Fourth embodiment]

Referring to FIG. 1 and FIG. 6 , a fourth embodiment of the present invention provides a portable electronic product P and a heat dissipation housing structure S for the portable electronic product P, and the heat dissipation housing structure S includes an insulation. The housing 1 and a heat transfer unit 2. It can be seen from the comparison between FIG. 6 and FIG. 5 that the greatest difference between the fourth embodiment of the present invention and the third embodiment is that in the fourth embodiment, the heat generating unit H includes a plurality of heat generating sources h (FIG. 6 with two heat generating sources) h is an example), and the via structure 100 includes a plurality of vias 1000 respectively corresponding to the plurality of heat sources h (FIG. 6 is described by taking two vias 1000 as an example), so the fourth embodiment The number of via holes 1000 and the number of heat sources h will be the same. In addition, the first heat conduction layer 21 can be divided into a plurality of first heat conduction contacts 210 that are separated from each other and respectively contact the plurality of heat sources h (FIG. 6 is described by taking two first heat conduction contacts 210 as an example), The two heat conducting layers 22 can be divided into a plurality of second heat conducting contacts 220 that are separated from each other and respectively correspond to the plurality of first heat conducting contacts 210 (FIG. 6 is exemplified by two second heat conducting contacts 220).

It is worth mentioning that, in the example cited in the fourth embodiment, since the first heat conduction layer 21 can be divided into two first heat conduction contacts 210 which are separated from each other and respectively contact the plurality of heat sources h, As shown in FIG. 6, an accommodating space (not labeled) is formed between two adjacent heat generating sources h and between two adjacent first heat conducting contacts 210. Therefore, the present invention can additionally provide at least one electronic component E between two adjacent heat generating sources h and between two adjacent first heat conducting contacts 210 to effectively increase the portable electronic product P. Available space.

[Advantageous Effects of Embodiments]

In summary, the present invention has the beneficial effects of the portable electronic product P provided by the technical solution of the present invention and the heat dissipation type casing for the portable electronic product P. S can be passed through "the insulating housing 1 has an inner surface 101, an outer surface 102 relative to the inner surface 101, and a via structure 100 connected between the inner surface 101 and the outer surface 102" and a "thermal conduction unit" 2 corresponds to a heat generating unit H of the portable electronic product P, wherein the heat conducting unit 2 comprises a first heat conducting layer 21 disposed on the inner surface 101 of the insulating housing 1, and a heat conducting unit 21 disposed on the outer surface 102 of the insulating housing 1. a second heat conducting layer 22 and a third heat conducting layer 23 extending through the via structure 100 of the insulating housing 1 and connected to the first heat conducting layer 21 and the second heat conducting layer 22 (that is, the heat conducting unit 2 is bonded to the insulating layer The housing 1 is designed to improve the heat dissipation performance of the portable electronic product P.

The above disclosure is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the application of the present invention. Within the scope of the patent.

S‧‧‧ Heat-dissipating shell structure

1‧‧‧Insulated housing

100‧‧‧via structure

1000‧‧‧via

101‧‧‧ inner surface

102‧‧‧ outer surface

2‧‧‧thermal unit

21‧‧‧First thermal conduction layer

22‧‧‧Second thermal layer

23‧‧‧ Third heat conducting layer

231‧‧‧First heat conducting part

232‧‧‧Second heat conduction part

3‧‧‧Protective layer

H‧‧‧Fever unit

Claims (10)

A heat dissipating outer casing structure for a portable electronic product, comprising: an insulative housing, wherein the insulative housing is disposed on the portable electronic product, wherein the insulative housing has an inner surface, An outer surface of the inner surface and a via structure connected between the inner surface and the outer surface; and a heat conducting unit corresponding to a heat generating unit of the portable electronic product The heat conducting unit includes a first heat conducting layer disposed on the inner surface of the insulating case, a second heat conducting layer disposed on the outer surface of the insulating case, and a through hole The via structure of the insulative housing is coupled to the first thermally conductive layer and the third thermally conductive layer of the second thermally conductive layer. The heat dissipation type housing structure for a portable electronic product according to claim 1, wherein the via hole structure comprises at least one via hole, and the third heat conduction layer comprises a through hole and contacts through at least one of the via holes. a first heat conducting portion of the heat generating unit of the portable electronic product and a through hole passing through at least one of the through holes and circumferentially connected between the first heat conducting portion and an inner surface of at least one of the through holes a second heat conducting portion, and the second heat conducting portion is coupled to the first heat conducting layer and the second heat conducting layer. The heat dissipation type housing structure for a portable electronic product according to claim 1, wherein the via hole structure comprises at least one via hole, and the third heat conduction layer comprises a first through hole of the at least one of the through holes a heat conducting portion, a second heat conducting portion disposed on one of the ends of the first heat conducting portion and connected to the first heat conducting layer, and a second heat conducting portion disposed on the other end of the first heat conducting portion and connected to a third heat conducting portion of the second heat conducting layer, and the second heat conducting portion contacts the heat generating unit of the portable electronic product. A heat-dissipating outer casing structure for a portable electronic product according to claim 1, The heat generating unit includes a plurality of heat generating sources, and the through hole structure includes a plurality of conductive holes respectively corresponding to the plurality of heat generating sources, and the first heat conductive layer is divided into a plurality of separated from each other and respectively contacted a first thermally conductive contact portion of the heat generating source, the second thermally conductive layer being divided into a plurality of second thermally conductive contacts separated from each other and respectively corresponding to the plurality of the first thermally conductive contacts, and at least one electronic component And disposed between two adjacent ones of the heat sources and between two adjacent ones of the first heat conducting contacts, wherein the insulating shell is a plastic shell or a glass shell, the insulating shell The inner surface of the body and the outer surface are both roughened surfaces, the first heat conductive layer has a first predetermined patterning structure, the second heat conductive layer has a second predetermined patterning structure, and The first heat conductive layer, the second heat conductive layer, and the third heat conductive layer are all metal layers. The heat-dissipating outer casing structure for a portable electronic product according to claim 1, further comprising: a protective layer disposed on the second heat conductive layer to cover the second heat conductive layer Wherein the interior of the protective layer is mixed with a plurality of thermally conductive particles. A portable electronic product is characterized in that the portable electronic product uses a heat-dissipating outer casing structure, and the heat-dissipating outer casing structure comprises: an insulating casing, and the insulating casing is disposed on the portable In the electronic product, the insulative housing has an inner surface, an outer surface opposite to the inner surface, and a via structure connected between the inner surface and the outer surface; and a heat conducting unit, The heat conducting unit corresponds to a heat generating unit of the portable electronic product, wherein the heat conducting unit comprises a first heat conducting layer disposed on the inner surface of the insulating case, and a heat conducting layer disposed on the inner surface of the insulating case a second heat conducting layer on the outer surface of the body and a via structure extending through the insulating case and connected to the first heat conducting layer and the third heat conducting layer of the second heat conducting layer. The portable electronic product of claim 6, wherein the via structure package Including at least one via hole, the third heat conduction layer includes a first heat conduction portion penetrating through the at least one of the via holes and contacting the heat generating unit of the portable electronic product, and a through hole through the at least one of the through holes A second thermally conductive portion is circumferentially coupled between the first thermally conductive portion and an inner surface of at least one of the vias, and the second thermally conductive portion is coupled to the first thermally conductive layer and the second thermally conductive layer. The portable electronic product of claim 6, wherein the via structure comprises at least one via, the third heat conducting layer comprises a first heat conducting portion extending through at least one of the via holes, and a a second heat conducting portion on one end of the first heat conducting portion and connected to the first heat conducting layer and a second heat conducting portion disposed on the other end of the first heat conducting portion and connected to the second heat conducting layer a third heat conducting portion, and the second heat conducting portion contacts the heat generating unit of the portable electronic product. The portable electronic product of claim 6, wherein the heat generating unit comprises a plurality of heat generating sources, and the via hole structure comprises a plurality of via holes respectively corresponding to the plurality of heat generating sources, the first The heat conductive layer is divided into a plurality of first heat conduction contacts separated from each other and respectively contacting the plurality of heat sources, the second heat conduction layer being divided into a plurality of separated from each other and respectively corresponding to the plurality of the first heat conduction contacts a second thermally conductive contact portion, and at least one electronic component is disposed between two adjacent ones of the heat generating sources and between the two adjacent ones of the first thermally conductive contacts, wherein the insulating housing is a plastic housing or a glass housing, wherein the inner surface and the outer surface of the insulating housing are roughened surfaces, and the first heat conductive layer has a first predetermined patterning structure, and the second heat conduction The layer has a second predetermined patterning structure, and the first heat conducting layer, the second heat conducting layer, and the third heat conducting layer are all metal layers. The portable electronic product of claim 6, wherein the heat dissipation housing structure further comprises: a protective layer disposed on the second heat conductive layer to cover the second heat conduction a layer in which the interior of the protective layer is mixed A plurality of thermally conductive particles.