TWM522552U - Handheld communication apparatus and thin heat sink thereof - Google Patents

Abstract

A handheld communication apparatus and a thin heat sink thereof are disclosed. The thin heat sink includes a first heat-conducting plate, a heat pipe, and a second heat-conducting plate. The first heat-conducting plate has a through slot and the heat pipe is installed in the through slot. The second heat-conducting plate is correspondingly adhered to the first heat-conducting plate and the heat pipe so that heat generated from a heating element is uniformly conducted to the heat pipe and the heat-conducting plates, thus avoiding heat accumulation around the heating element and increasing efficiency of dissipating heat.

Description

Handheld communication device and thinned heat sink thereof

The present invention relates to a heat sink, and more particularly to a handheld communication device and a thinned heat sink.

Handheld communication devices, such as mobile phones, tablets, PDAs, GPS, etc., with the advancement of technology, their computing functions and efficiency are gradually stronger, resulting in internal components of handheld communication devices, such as central processing units and integrated circuits, etc. Both will generate high heat, so the heat of the component must be dissipated before the operating efficiency and service life of the component can be maintained.

At present, a heat sink for a handheld communication device mainly comprises a heat conducting plate made of a metal material, and directly heat-bonds a heat generating component such as a central processing unit and an integrated circuit by using a heat conducting plate, so that heat of the heat generating component is transmitted to the heat conducting plate. On, to achieve the effect of heat dissipation.

However, the heat sink directly heat-contacts the heat-generating component by using the heat-conducting plate, so that the heat-dissipating efficiency of the heat-generating component is slow, so that heat is easily accumulated in a portion of the heat-conducting plate adjacent to the heat-generating component, that is, heat is easily accumulated around the heat-generating component, thereby causing heat dissipation efficiency. Not at all.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The purpose of this creation is to provide a handheld communication device and a thinned heat sink thereof, which uniformly conduct heat generated by a heating element to a heat pipe and a heat conducting plate to prevent heat from accumulating around the heating element to improve heat dissipation efficiency. The effect.

In order to achieve the above object, the present invention provides a thinned heat sink comprising: a first heat conducting plate provided with a through slot; a heat pipe disposed in the through slot; and a second heat conducting plate corresponding to the first The heat conducting plate and the heat pipe are attached.

In order to achieve the above object, the present invention provides a handheld communication device comprising: a housing having a cavity therein; a heat generating component housed in the cavity; and a thinned heat sink as described above The cavity is disposed in the cavity, and the second heat conducting plate is thermally attached to the heat generating component.

The present invention also has the following effects: First, a second heat conducting plate is interposed between the heat generating component and the heat pipe to closely adhere to the surface of the heat generating component by using the surface of the second heat conducting plate to more efficiently heat the component The generated heat is led to the peripheral edge of the second heat conducting plate to enhance the heat dissipation capability of the thinned heat sink, and the characteristics of achieving uniform temperature heat dissipation in a short time are pursued.

Secondly, the heat pipe is formed by stamping and embedded in the through groove, so that the thickness of the heat pipe is substantially equal to the thickness of the first heat conducting plate, so that the thinned heat sink has the advantage of being thinned, and the thin heat sink has a thin size. It does not occupy space and is convenient for assembly.

Third, the heat pipe is formed by stamping, and the heat pipe and the first heat conducting plate together form a coplanar structure, so that the surface of the second heat conducting plate is more easily adhered to the coplanar structure, thereby improving the heat dissipation efficiency of the thinned heat sink. .

The fourth and second heat conducting plates can cover the first heat conducting plate and the heat pipe in a large area, so that the heat generated by the heat generating component is quickly transmitted to the first heat conducting plate, thereby achieving the advantages of uniform temperature heat dissipation in a short time.

Fifth, the heat pipe is an L-shaped pipe body or a U-shaped pipe body, so that the heat pipe can be used in a limited space, and the first heat conduction plate and the second heat conduction plate are attached to the large area to enhance the heat pipe and the first heat conduction plate. The heat bonding area between the second heat conducting plates further increases the heat dissipation effect of the thinned heat sink.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

Please refer to the first to sixth figures. The present invention provides a handheld communication device and a thinned heat sink thereof. The thinned heat sink 10 mainly includes a first heat conducting plate 1, a heat pipe 2 and a first Two heat conducting plates 3; the handheld communication device 100 includes a housing 20, a heat generating component 30, and a thinned heat sink 10.

The first heat conducting plate 1 is a flat metal plate, and the preferred embodiment thereof is a copper plate or an aluminum plate. The first heat conducting plate 1 is provided with a through slot 11 and the first heat conducting plate 1 has a thickness h1. The shape of the through slot 11 may be a geometric shape such as a letter shape, an L shape or a U shape, which is not limited by this embodiment.

A heat pipe 2 is disposed in the through slot 11; as described in detail below, the heat pipe 2 is formed by stamping and embedded in the through slot 11, and the thickness h2 of the heat pipe 2 is substantially equal to The thickness h1 of a heat conducting plate 1, that is, the thickness h2 of the heat pipe 2 is equal to, slightly larger or slightly smaller than the thickness h1 of the first heat conducting plate 1, and the surface 21 of the heat pipe 2 and the first heat conducting plate 1 The surfaces 12 together form a coplanar structure S, i.e., the surface 21 of the heat pipe 2 and the surface 12 of the first heat conducting plate 1 are on the same plane.

Further, the heat pipe 2 may be a one-shaped pipe body, an L-shaped pipe body or a U-shaped pipe body, and the shape of the through groove 11 may match the shape of the heat pipe 2 .

The second heat conducting plate 3 is a flat metal plate. The preferred embodiment is a copper plate. The second heat conducting plate 3 is attached to the first heat conducting plate 1 and the heat pipe 2, and the second heat conducting plate 3 is completely covered. Heat Pipe 2. The second heat conducting plate 3 is connected to the heat pipe 2 by welding; the second heat conducting plate 3 can be connected to the first heat conducting plate 1 by welding or gluing.

The thinned heat sink 10 further includes a thermal grease 4 filled between the first heat conducting plate 1 and the heat pipe 2.

A cavity 201 is disposed inside the casing 20; as described in detail below, the casing 20 is assembled from an upper casing and a lower casing, and the cavity 201 is formed inside the upper casing and the lower casing.

The heating element 30 can be an element such as a central processing unit and an integrated circuit, but is not limited thereto, and the heating element 30 is housed in the cavity 201.

The thin heat sink 10 is also accommodated in the cavity 201, and the second heat conducting plate 3 is thermally attached to the heat generating component 30,

The combination of the thinned heat sink 10 of the present invention, as shown in the first to third figures, is provided with a through slot 11 by the first heat conducting plate 1; the heat pipe 2 is disposed in the through slot 11; the second heat conducting plate 3 corresponds to the first The heat conducting plate 1 and the heat pipe 2 are attached.

The handheld communication device 100 further includes a circuit board 40. The heat generating component 30 is mounted on the circuit board 40, so that the heat generating component 30 and the circuit board 40 are accommodated together in the cavity 201, and the circuit board 40 and the first heat conducting board 1 are disposed. Arranged in a stack.

The combination of the present handheld communication device 100, as shown in the fourth to sixth figures, is provided with a cavity 201 inside the housing 20; the heat generating component 30 is housed in the cavity 201; the thinned heat sink 10 as described above It is accommodated in the cavity 201, and the second heat conducting plate 3 is thermally attached to the heat generating component 30. Thereby, the second heat conducting plate 3 uniformly conducts the heat generated by the heat generating component 30 to the heat pipe 2 and the first heat conducting plate 1 to prevent heat from accumulating around the heat generating component 30, so as to improve the heat dissipation of the heat sink 10. effectiveness.

Compared with the heat sink of the conventional handheld communication device, the heat-generating component is directly heat-bonded only by the heat-conducting plate, so that heat is easily accumulated in the portion of the heat-conducting plate adjacent to the heat-generating component, that is, heat is easily accumulated around the heat-generating component.

The use state of the thinned heatsink 10 and the handheld communication device 100 is as shown in the sixth figure, wherein the heat pipe and the heat dissipation effect of the heat pipe 2 are better than that of the first heat conducting plate 1, so the second heat conducting plate 3 When the heat is applied to the heat generating component 30, the heat generated by the heat generating component 30 can be uniformly conducted to the first heat conducting plate 1 by the heat pipe 2, thereby preventing heat from accumulating around the heat generating component 30 and playing the first. The function of the heat conducting plate 1 distributes the heat evenly to the handheld communication device 100 through the first heat conducting plate 1, so that the thinned heat sink 10 has good heat dissipation efficiency.

In addition, the surface of the heat pipe 2 is not easy to form a true plane, but the surface of the second heat conducting plate 3 is easy to form a true plane. Therefore, the second heat conducting plate 3 is interposed between the heat generating component 30 and the heat pipe 2 . In order to utilize the surface of the second heat conducting plate 3 to closely adhere to the surface of the heat generating component 30, the heat generated by the heat generating component 30 is more efficiently guided to the peripheral edge of the second heat conducting plate 3, so that heat is transferred to the heat element more quickly. The first heat conducting plate 1 enhances the heat dissipation capability of the thinned heat sink 10, and pursues the characteristics of uniformizing heat dissipation in a short time.

Furthermore, the heat pipe 2 is formed by stamping and embedded in the through groove 11 such that the thickness h2 of the heat pipe 2 is substantially equal to the thickness h1 of the first heat conducting plate 1 to make the thinned heat sink 10 The advantage of thinning is achieved, so that the thinned heat sink 10 has the advantages of light volume, no space occupation and convenient assembly.

Moreover, the heat pipe 2 is formed by stamping, and the heat pipe 2 and the first heat conducting plate 1 together form a coplanar structure S, so that the surface of the second heat conducting plate 3 is more easily adhered to the common The surface structure S further increases the heat dissipation efficiency of the thinned heat sink 10.

In addition, the second heat conducting plate 3 can cover the first heat conducting plate 1 and the heat pipe 2 in a large area, so that the heat generated by the heat generating component 30 is quickly transmitted to the first heat conducting plate 1 to achieve a uniform temperature in a short time. The advantages of heat dissipation.

Referring to the seventh to eighth embodiments, the second embodiment, the third embodiment, the second embodiment, the third embodiment and the first embodiment of the present invention are different in that the heat pipe (Heat Pipe) 2 is divided into an L-shaped tube body, which may also be an L-shaped tube body or a U-shaped tube body, and the shape of the through-groove 11 matches the shape of the heat pipe 2, which is further described below.

The heat pipe 2 can be an L-shaped pipe body or a U-shaped pipe body, so that the heat pipe 2 can be attached to the first heat conduction plate 1 and the second heat conduction plate 3 in a large area by utilizing a shape in a limited space. In order to increase the heat bonding area between the heat pipe 2 and the first heat conducting plate 1 and the second heat conducting plate 3, the heat dissipation effect of the thinned heat sink 10 is further increased.

Referring to FIG. 9 , the fourth embodiment of the present invention is different from the first embodiment in that the second heat conducting plate 3 is completely covered by the heat pipe 2 . The second heat conducting plate 3 may also partially cover the heat pipe 2 and is not limited by the first embodiment.

In summary, the handheld communication device and the thinned heat sink of the present invention can achieve the intended purpose of use, and solve the lack of conventional knowledge, and have industrial utilization, novelty and progress, and fully meet the requirements for creating patent applications. If you apply for an application under the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

100‧‧‧Handheld communication equipment

10‧‧‧Thin heat sink

1‧‧‧First heat conducting plate

11‧‧‧through slot

12‧‧‧ surface

2‧‧‧heat pipe

21‧‧‧ surface

3‧‧‧Second heat conducting plate

4‧‧‧ Thermal paste

20‧‧‧shell

201‧‧‧容容

30‧‧‧heating components

40‧‧‧ boards

H1, h2‧‧‧ thickness

S‧‧‧coplanar structure

The first figure is an exploded view of the present handheld communication device.

The second figure is a perspective exploded view of the first embodiment of the present invention.

The third drawing is a combined sectional view of the first embodiment of the present thinned heat sink.

The fourth figure is a three-dimensional combination diagram of the present handheld communication device.

Figure 5 is a cross-sectional view of the combination of the present handheld communication device.

The sixth figure is a schematic diagram of the state of use of the present handheld communication device.

Figure 7 is a schematic view showing the combination of the second embodiment of the present invention.

The eighth figure is a combination diagram of the third embodiment of the present invention.

Fig. 9 is a schematic view showing the combination of the fourth embodiment of the present invention.

100‧‧‧Handheld communication equipment

10‧‧‧Thin heat sink

1‧‧‧First heat conducting plate

11‧‧‧through slot

2‧‧‧heat pipe

3‧‧‧Second heat conducting plate

20‧‧‧shell

201‧‧‧容容

30‧‧‧heating components

40‧‧‧ boards

Claims (10)

A thin heat sink includes: a first heat conducting plate provided with a through slot; a heat pipe disposed in the through slot; and a second heat conducting plate corresponding to the first heat conducting plate and the heat pipe. The thinned heat sink of claim 1, wherein the heat pipe has a thickness substantially equal to a thickness of the first heat conducting plate. The thinned heat sink of claim 1, wherein the heat pipe is formed by stamping, and the heat pipe and the first heat conducting plate have a coplanar structure. The thinned heat sink of claim 1, wherein the second heat conducting plate partially covers the heat pipe. The thinned heat sink of claim 1, wherein the second heat conducting plate completely covers the heat pipe. The thinned heat sink of claim 1, wherein the second heat conducting plate is soldered to the heat pipe. The thinned heat sink of claim 1, wherein the second heat conducting plate is soldered or glued to the first heat conducting plate. The thinned heat sink of claim 1, further comprising a heat dissipating paste filled between the first heat conducting plate and the heat pipe. The thinned heat sink of claim 1, wherein the heat pipe is a one-shaped pipe body, an L-shaped pipe body or a U-shaped pipe body, and the shape of the groove is matched with the shape of the heat pipe. A handheld communication device comprising: a housing having a cavity therein; a heat generating component housed in the cavity; and a thinned heat sink according to any one of claims 1 to 9 The second heat conducting plate is thermally attached to the heat generating component in the cavity.