TWM486933U - Electric substrate heat dissipation structure - Google Patents
Electric substrate heat dissipation structure Download PDFInfo
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- TWM486933U TWM486933U TW103210592U TW103210592U TWM486933U TW M486933 U TWM486933 U TW M486933U TW 103210592 U TW103210592 U TW 103210592U TW 103210592 U TW103210592 U TW 103210592U TW M486933 U TWM486933 U TW M486933U
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Description
本創作係有關於一種電子基板，尤指一種具有達到提升散熱效率及節省空間的電子基板散熱結構。
The present invention relates to an electronic substrate, and more particularly to an electronic substrate heat dissipation structure that achieves improved heat dissipation efficiency and space saving.
由於現行手持式行動裝置(如手機、平板電腦、PDA)隨著科技進步，在使用者其傾愛輕薄與運算及效能越來越高之要求下，導致手持式行動裝置的內部元件，例如中央處理器、積體電路等元件，運作時因裝置或機構內空間極為有限(因輕薄的要求)與執行或運算速度太快下皆會產生極高熱量，因此必須首要先將元件的熱量散去，方才能維持元件的運作效率及使用壽命。
而目前具有散熱結構的手持式行動裝置，係包含一殼體、一發熱元件及金屬材質所構成的一導熱板，該殼體內部設有一容腔，該發熱元件(如中央處理器或積體電路或其他電子構件)係容設在該容腔內，該導熱板是直接貼在相對該發熱元件一側上，所以透過該導熱板貼設在等發熱元件上，使發熱元件產生的熱量傳導至所述導熱板上，被用以達到散熱的功效。雖習知手持式行動裝置藉由導熱板貼設發熱元件來達到散熱效果，但其散熱效果明顯不彰，因習知之導熱板貼設在發熱元件上，會使熱量容易累積在導熱板鄰近發熱元件的局部位置（即高溫區），亦即令熱量容易囤積在發熱元件的周圍處，進而無法有效透過整個導熱板來散熱，以致於造成散熱效果不佳的問題。
是以，要如何解決上述習用之問題與缺失，又能在不增加厚度下符合輕薄的要求，即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。
As current handheld mobile devices (such as mobile phones, tablets, and PDAs) advance with technology, internal components of handheld mobile devices, such as the central government, are required to be thinner and more computationally intensive and more efficient. Processors, integrated circuits and other components, because of the extremely limited space in the device or mechanism (due to thin and light requirements) and the speed of execution or operation are too high, so the heat of the components must be dissipated first. In order to maintain the operational efficiency and service life of the components.
The hand-held mobile device having a heat dissipating structure comprises a heat conducting plate formed by a casing, a heating element and a metal material, and the casing is internally provided with a cavity, such as a central processing unit or an integrated body. a circuit or other electronic component is disposed in the cavity, and the heat conducting plate is directly attached to one side of the heat generating component, so that the heat conducting plate is attached to the heat generating component to heat the heat generated by the heat generating component. To the heat conducting plate, it is used to achieve heat dissipation. Although the conventional hand-held mobile device has a heat-dissipating component attached to the heat-dissipating plate to achieve the heat-dissipating effect, the heat-dissipating effect is obviously not good, because the conventional heat-conducting plate is attached to the heat-generating component, so that heat is easily accumulated in the heat-emitting plate adjacent to the heat-generating component. The local position (ie, the high temperature region), that is, the heat is easily accumulated in the periphery of the heating element, and thus cannot be effectively radiated through the entire heat conducting plate, so that the heat dissipation effect is not good.
Therefore, how to solve the problems and shortcomings of the above-mentioned practices, and to meet the requirements of light and thin without increasing the thickness, that is, the creators of the case and the relevant manufacturers engaged in the industry are eager to study the direction of improvement.
爰此，為有效解決上述之問題，本創作之主要目的在提供一種透過熱管嵌埋（或嵌設）在基板中結合為一體，藉由基板其上熱管將吸收到發熱元件的熱量傳導至基板之低溫區上散熱，令其得在不增加結構厚度（高度）之前提下以有效達到提升散熱效率的電子基板散熱結構。
本創作之另一目的係提供一種具有達到節省空間的電子基板散熱結構。
本創作之另一目的係提供一種具有效避免熱量累積(或囤積)在發熱元件周邊處，以有效提升發熱元件的運作效率及使用壽命的電子基板散熱結構。
為達上述目的，本創作係提供一種電子基板散熱結構，係包括一基板及至少一熱管，該基板係包括一佈線層、一接地層及一絕緣層，該佈線層具有一第一端面、一相反該第一端面之第二端面及一容設孔，該第一端面上設置有至少一發熱元件，該容設孔係從相鄰對應所述發熱元件的佈線層上朝遠離該發熱元件的方向延伸凹設構成，且其貫穿該第一、二端面，並前述接地層的一側係貼設相對該第二端面上，其另一側則與相對該絕緣層的一側相貼設，而該熱管係嵌埋在該容設孔內，且其一側貼設在對應該接地層的一側上，並該熱管具有一吸熱段及一從該吸熱段向外延伸的傳熱段，該吸熱段係嵌設於相鄰對應該發熱元件的容設孔內，該傳熱段則嵌設於遠離該發熱元件的容設孔內；透過本創作此電子基板散熱結構的設計，得有效避免熱量累積(或囤積)在發熱元件周邊處，以達到均溫、提升散熱效率及節省空間的效果。
本創作另提供一種電子基板散熱結構，係包括一基板及至少一熱管，該基板係包括一佈線層、一接地層及一絕緣層，該佈線層具有一第一端面及一相反該第一端面之第二端面，該第一端面上設置有至少一發熱元件，該接地層的一側係貼設相對該第二端面上，其另一側則與相對該絕緣層的一側相貼設，並該絕緣層具有一容設孔，該容設孔係從對應該發熱元件的絕緣層上朝遠離該發熱元件的方向延伸凹設構成，且其貫穿該絕緣層，而所述熱管係嵌埋（設）在該容設孔內，且其一側貼設在對應該接地層的另一側上，並該熱管具有一吸熱段及一從該吸熱段向外延伸的傳熱段，該吸熱段係嵌埋(或嵌設)於對應該發熱元件的容設孔內，該傳熱段係嵌埋(或嵌設)於遠離該發熱元件的容設孔內；透過本創作此電子基板散熱結構的設計，得有效避免熱量累積(或囤積)在發熱元件周邊處，以達到均溫、提升散熱效率及節省空間的效果。
Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a method in which a heat pipe is embedded (or embedded) in a substrate, and heat is absorbed to the substrate by a heat pipe on the substrate. The heat dissipation in the low temperature region is such that it can be removed before the structural thickness (height) is increased to effectively achieve the heat dissipation structure of the electronic substrate.
Another object of the present invention is to provide a heat dissipation structure for an electronic substrate that achieves space saving.
Another object of the present invention is to provide an electronic substrate heat dissipation structure that effectively prevents heat accumulation (or accumulation) at the periphery of the heat generating component to effectively improve the operational efficiency and service life of the heat generating component.
In order to achieve the above object, the present invention provides an electronic substrate heat dissipation structure, comprising a substrate and at least one heat pipe, the substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and a a second end surface of the first end surface and a receiving hole, wherein the first end surface is provided with at least one heat generating component, and the receiving hole is away from the wiring layer adjacent to the heat generating component and away from the heat generating component a direction extending recessed portion, and extending through the first and second end faces, and a side of the ground layer is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer, The heat pipe is embedded in the receiving hole, and one side of the heat pipe is attached to a side corresponding to the grounding layer, and the heat pipe has a heat absorption section and a heat transfer section extending outward from the heat absorption section. The heat absorbing section is embedded in a receiving hole corresponding to the heating element, and the heat transfer section is embedded in the receiving hole away from the heating element; the heat dissipation structure of the electronic substrate is designed to be effective Avoid heat accumulation (or hoarding) in fever At the perimeter, to achieve the average temperature, the heat dissipation efficiency and improve the space saving effect.
The present invention further provides an electronic substrate heat dissipation structure, comprising a substrate and at least one heat pipe, the substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and an opposite first end surface a second end surface, the first end surface is provided with at least one heat generating component, one side of the ground layer is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer, And the insulating layer has a receiving hole, and the receiving hole is formed by extending from the insulating layer corresponding to the heating element toward the heating element, and penetrates the insulating layer, and the heat pipe is embedded (provided) in the receiving hole, and one side of which is attached on the other side corresponding to the grounding layer, and the heat pipe has a heat absorbing section and a heat transfer section extending outward from the heat absorbing section, the heat absorbing portion The segment is embedded (or embedded) in a receiving hole corresponding to the heat generating component, and the heat transfer segment is embedded (or embedded) in the receiving hole away from the heat generating component; The structure is designed to effectively prevent heat accumulation (or accumulation) At the periphery of the heat generating element to reach the average temperature to improve heat dissipation efficiency and space-saving effect.
1‧‧‧電子基板散熱結構
10‧‧‧基板
101‧‧‧佈線層
1011‧‧‧第一端面
1012‧‧‧第二端面
1014、1031‧‧‧容設孔
102‧‧‧接地層
103‧‧‧絕緣層
105‧‧‧高溫區
106‧‧‧低溫區
107‧‧‧開口
12‧‧‧熱管
121‧‧‧吸熱段
122‧‧‧傳熱段
123‧‧‧毛細結構
124‧‧‧工作流體
125‧‧‧腔室
13‧‧‧發熱元件
131‧‧‧接腳
2‧‧‧手持電子裝置
21‧‧‧殼體
211‧‧‧前蓋
212‧‧‧視窗
213‧‧‧背蓋
214‧‧‧空間
23‧‧‧電池件
24‧‧‧顯示觸控螢幕
1‧‧‧Electronic substrate heat dissipation structure
10‧‧‧Substrate
101‧‧‧ wiring layer
1011‧‧‧ first end face
1012‧‧‧second end face
1014, 1031‧‧ ‧ hole
102‧‧‧ Grounding layer
103‧‧‧Insulation
105‧‧‧High temperature zone
106‧‧‧low temperature zone
107‧‧‧ openings
12‧‧‧ Heat pipe
121‧‧‧heat absorption section
122‧‧‧heat transfer section
123‧‧‧Capillary structure
124‧‧‧Working fluid
125‧‧‧ chamber
13‧‧‧heating components
131‧‧‧ pins
2‧‧‧Handheld electronic devices
21‧‧‧ housing
211‧‧‧ front cover
212‧‧‧Window
213‧‧‧ Back cover
214‧‧‧ Space
23‧‧‧ battery parts
24‧‧‧ display touch screen
第1圖係本創作之第一較佳實施例之分解立體示意圖。
第2圖係本創作之第一較佳實施例之組合立體示意圖。
第3圖係本創作之第一較佳實施例之組合剖視示意圖。
第4圖係本創作之第二較佳實施例之分解立體示意圖。
第5圖係本創作之第二較佳實施例之組合立體示意圖。
第6圖係本創作之第二較佳實施例之組合剖視示意圖。
第7圖係本創作之第三較佳實施例之分解立體示意圖。
第8圖係本創作之第三較佳實施例之分解立體示意圖。
第9圖係本創作之第三較佳實施例之組合立體示意圖。
Figure 1 is an exploded perspective view of a first preferred embodiment of the present invention.
Figure 2 is a perspective view showing the combination of the first preferred embodiment of the present invention.
Figure 3 is a schematic cross-sectional view showing the first preferred embodiment of the present invention.
Figure 4 is an exploded perspective view of a second preferred embodiment of the present invention.
Figure 5 is a perspective view showing the combination of the second preferred embodiment of the present invention.
Figure 6 is a schematic cross-sectional view showing a second preferred embodiment of the present invention.
Figure 7 is an exploded perspective view of a third preferred embodiment of the present invention.
Figure 8 is an exploded perspective view of a third preferred embodiment of the present invention.
Figure 9 is a perspective view showing the combination of the third preferred embodiment of the present invention.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
本創作係提供一種電子基板散熱結構，請參閱第1、2、3圖，係顯示本創作之第一較佳實施例之分解、組合及剖視示意圖；所述電子基板散熱結構1係包括一基板10及至少一熱管12，該基板10於該較佳實施例係以印刷電路板（Printed Circuit Board，PCB）做說明，但並不侷限於此；並該基板10包含一佈線層101、一接地層102及一絕緣層103，該佈線層101具有一第一端面1011及一相反該第一端面1011之第二端面1012及一容設孔1014，該第二端面1012係貼設(或貼合)在相對該接地層102的一側上，該第一端面1011上則設置有至少一發熱元件13，該發熱元件13於該較佳實施例係以處理器做說明，但並不侷限於此；於具體實施時，亦可選擇為積體電路，如金屬氧化物半導體場效應電晶體(MOSFET)。
而該發熱元件13其半導體本體具有複數接腳131，該等接腳131係設在該發熱元件13的周側，亦即該等接腳131係從該發熱元件13的周側上延伸而出，並貫穿（或不貫穿）過相對該佈線層101之第一、二端面1011、1012，以連接相對前述接地層102的一側上。前述佈線層101上於該發熱元件13之周邊區域形成至少一高溫區105，該佈線層101上遠離該發熱元件13之周邊區域則形成有一低溫區106，就是遠離該至少一高溫區105外的其他區域即為低溫區106。
前述容設孔1014係從相鄰對應該發熱元件13的佈線層101上朝遠離該發熱元件13的方向延伸凹設構成，亦即第1圖示，該容設孔1014係從相鄰對應該發熱元件13的佈線層101一側邊處，沿著鄰近該佈線層101遠離該發熱元件13的側邊延伸凹設構成，且所述容設孔1014係貫穿(或貫通)該佈線層101的第一、二端面1011、1012，其用以供容設相對的熱管12。
續參閱第1、3圖示，前述接地層102係以金屬材質所構成，如銅材質，且該接地層102的另一側係與相對該絕緣層103的一側相貼設(或貼合)，並該熱管12係嵌埋在對應的容設孔1014內，且其一側係貼設在對應該接地層102的一側上，亦即容設於該容設孔1014內的熱管12之一側係平齊該佈線層101的第二端面1012並共同與相對的接地層102一側相貼合。
而前述熱管12於本創作中係為薄型平板式為最佳選擇，該熱管12係設有一腔室125，並具有一吸熱段121、一從該吸熱段121向外延伸之傳熱段122及一設於腔室125內壁之毛細結構123，於較佳實施例中該毛細結構123係以燒結粉末體做說明，但並不侷限於此；亦可為編織結構、多孔隙結構、溝槽或其他具毛細力結構者，並該熱管12之腔室125內填充有一工作流體124。前述熱管之吸熱段121係嵌埋於相鄰（或鄰近）對應該發熱元件13之容設孔1014內，亦即該吸熱段121係嵌埋(或嵌設)於相鄰對應該發熱元件13之一側邊處的容設孔1014內，該傳熱段122係嵌埋(或嵌設)於遠離該發熱元件13的容設孔1014內；並該吸熱段121係位於高溫區105的容設孔1014內，該傳熱段122則位於低溫區106的容設孔1014內，令該熱管12嵌埋於該基板10之佈線層101的容設孔1014內，以與該基板10結合成為一體。其中前述熱管12於該較佳實施例係以1隻熱管12做說明，但並不侷限於此，於具體實施時，所述容設孔1014與熱管12的數量係匹配對應的發熱元件13的數量。
所以透過前述基板10之佈線層101上嵌埋的所述熱管12係由對應於發熱元件13的高溫區105朝向相對低溫區106方向延伸的結構設計，使得能在不增加空間或結構厚度之條件下達到整體散熱結構薄型化的效果。
並前述吸熱段121與傳熱段122的一側係共同貼設相對該接地層102的一側上，該吸熱段121與傳熱段122的另一側則得平齊或約低於該佈線層101的第一端面1011，所以當發熱元件13產生熱量時，其中大部分熱量會經由該發熱元件13的複數接腳131傳導到接地層102上，令位於高溫區105的熱管12之吸熱段121將接收到所述接地層102其上的熱量，迅速傳導至位於低溫區106的傳熱段122上，同時該吸熱段121也會一倂將前述佈線層101其上發熱元件13之周圍的些許熱量傳遞至傳熱段122上，並透過所述傳熱段122將接收到的熱量迅速傳遞到基板10的低溫區106上散熱，藉以讓發熱元件13的熱量可均勻傳導至整個基板10上，相對的便獲得較大的散熱面積來散熱，以避免熱量累積於發熱元件13上，故可達到提升發熱元件13的運作效率及使用壽命的效果。
因此，藉由本創作之熱管12嵌埋在基板10上結合為一體的設計，得有效達到提升散熱效率以及節省空間薄化的效果者。
請參閱第4、5、6圖示，係顯示本創作之第二較佳實施例之分解、組合及剖視示意圖；該較佳實施例之結構及連結關係及其功效大致與前述第一較佳實施例之相同，故在此不重新贅述，該本較佳實施例主要是將前述第一較佳實施例之位於該佈線層101上的容設孔1014改設計在所述絕緣層103上，並該熱管12隔著該接地層102對應該發熱元件13做說明，亦即前述絕緣層103具有一容設孔1031，該容設孔1031係從對應該發熱元件13的絕緣層103上朝遠離該發熱元件13的方向延伸凹設構成，且其貫穿該絕緣層103，換言之，就是第4圖示，該容設孔1031係從對應該發熱元件13之正下方處的絕緣層103上，沿著鄰近該絕緣層103遠離對應發熱元件13的側邊延伸凹設構成，並所述容設孔1031係從絕緣層103相對該接地層102的一側垂直貫通過該絕緣層103的另一側，其用以供容設相對的熱管12。
而前述熱管12的一側係貼設(或貼合)在對應該接地層102的另一側上，該熱管12之吸熱段121係嵌埋(或嵌設)於對應該發熱元件13的容設孔1031內，該傳熱段122係嵌埋(或嵌設)於遠離該發熱元件13的容設孔1031內，亦即該吸熱段121係隔著該接地層102嵌埋於相對該發熱元件13之正下方處或鄰近處的容設孔1031內，該傳熱段122係隔著該接地層102嵌埋於遠離該發熱元件13的絕緣層103其上容設孔1031內；並該熱管12之吸熱段121係位於該高溫區105，其傳熱段122則位於低溫區106，亦即所述吸熱段121位於對應高溫區105的容設孔1031內，該傳熱段122則位於對應低溫區106的容設孔1031內，令該吸熱段121與傳熱段122的一側共同貼設在相對該接地層102的另一側上，該吸熱段121與傳熱段122的另一側則平齊或約低於該絕緣層103的另一側，所以透過該熱管12嵌埋於該基板10之絕緣層103的容設孔1031內，以與該基板10結合成為一體。
故藉由前述基板10之絕緣層103上嵌埋的前述熱管12係由對應於發熱元件13的高溫區105朝向相對低溫區106方向延伸的結構設計，使得能達到節省空間，以及達到整體散熱結構薄型化的效果。
該本較佳實施例之發熱元件13的結構及連結關係及其功效大致與前述第一較佳實施例之發熱元件13相同，都是該發熱元件13具有的複數接腳131設在該發熱元件13的周側上，且貫穿或可不貫穿過該佈線層101之第一、二端面1011、1012，以連接在相對該接地層102的一側上。而所述接地層102的一側係貼設(或貼合)相對該佈線層101之第二端面1012上，其另一側則與相對該絕緣層103的一側相貼設。
所以當發熱元件13產生熱量時，該發熱元件13及其周邊區域的熱量(即高溫區的熱量)會傳導到相對的接地層102上，並透過位於對應高溫區105的熱管12之吸熱段121將接收到相對該接地層102的另一側上的熱量，傳導至遠端位於對應低溫區106的傳熱段122上，然後於該絕緣層103其上的傳熱段122將接收到的熱量迅速傳遞到基板10的低溫區106上散熱，藉以讓發熱元件13的熱量可均勻傳導至整個基板10上，相對的便獲得較大的散熱面積來散熱，以避免熱量累積於發熱元件13上，故可達到提升發熱元件13的運作效率及使用壽命的效果。
因此，透過本創作之熱管12的吸熱段121嵌埋在基板10之絕緣層103上，且間隔著該接地層102位於該發熱元件13的正下方或鄰近處，以藉由該熱管12之傳熱段122將熱量均勻傳導至整個基板10上散熱的結構設計，得有效達到提升散熱效率以及節省空間的效果，進而還有效達到提升發熱元件13的運作效率及使用壽命的效果者。
請參閱第7、8、9圖示，係顯示本創作之第三較佳實施例之分解與組合示意圖；該本較佳實施例主要是將前述第一、二較佳實施例之電子基板散熱結構1應用於手持電子裝置2(如手機、平板電腦、PDA、IPAD)上，且於該較佳實施例係以手持電子裝置2為一手機做說明，但並不侷限於此，於本創作實際實施時，本創作的電子基板散熱結構1也可應用於一電子裝置上(如桌上型電腦、筆記型電腦)或，合先陳明。
前述手持電子裝置2包含一殼體21、一電池件23、一顯示觸控螢幕24及前述電子基板散熱結構1，該殼體21係由一前蓋211與一背蓋213組成，該前蓋211與背蓋213之間界定一容設該基板10之空間214，該前蓋211開設有一視窗212裝設有前述顯示觸控螢幕24。並該基板10具有一容設該電池件23之開口107，該開口107係開設於該基板10上，且位於該熱管12與相對基板10邊緣之間。
所以透過本創作此電子基板散熱結構1應用於手持電子裝置2上，除了能將手持電子裝置2內的發熱元件13的熱量迅速均勻傳導至整個基板10上，以藉由基板10具有較大散熱面積以輻射方式散發至殼體21上對外快速散熱，進而有效避免熱量累積於發熱元件13上，因此使得達到提升散熱效率及節省空間的效果，及提升發熱元件13的運作效率及使用壽命的效果。
以上所述，本創作相較於習知具有下列之優點：
1.可避免熱量累積於發熱元件上，以有效提升散熱效率。
2.節省空間具有薄化功效。
3.具有提升發熱元件的運作效率及使用壽命的效果。
惟以上所述者，僅係本創作之較佳可行之實施例而已，舉凡利用本創作上述之方法、形狀、構造、裝置所為之變化，皆應包含於本案之權利範圍內。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
The present invention provides an electronic substrate heat dissipation structure. Please refer to FIGS. 1, 2, and 3 for a schematic, exploded, and cross-sectional view of the first preferred embodiment of the present invention. The electronic substrate heat dissipation structure 1 includes a The substrate 10 and the at least one heat pipe 12 are described in the preferred embodiment by a printed circuit board (PCB), but are not limited thereto; and the substrate 10 includes a wiring layer 101 and a The grounding layer 102 and an insulating layer 103 have a first end surface 1011 and a second end surface 1012 opposite to the first end surface 1011 and a receiving hole 1014. The second end surface 1012 is attached (or attached) The first end surface 1011 is provided with at least one heat generating component 13 on the side opposite to the ground layer 102. The heat generating component 13 is described by the processor in the preferred embodiment, but is not limited thereto. In the specific implementation, it may also be selected as an integrated circuit, such as a metal oxide semiconductor field effect transistor (MOSFET).
The heating element 13 has a semiconductor body having a plurality of pins 131, and the pins 131 are disposed on the circumferential side of the heat generating component 13, that is, the pins 131 extend from the peripheral side of the heat generating component 13. And passing through (or not penetrating) the first and second end faces 1011, 1012 of the wiring layer 101 to connect to the side opposite to the ground layer 102. At least one high temperature region 105 is formed on the wiring layer 101 in a peripheral region of the heat generating component 13. The peripheral region of the wiring layer 101 away from the heat generating component 13 is formed with a low temperature region 106, which is away from the at least one high temperature region 105. The other area is the low temperature zone 106.
The receiving hole 1014 is formed by extending from the adjacent wiring layer 101 corresponding to the heat generating component 13 in a direction away from the heat generating component 13, that is, the first figure, the receiving hole 1014 is corresponding to the adjacent hole. The side of the wiring layer 101 of the heat generating component 13 is formed to extend along a side adjacent to the side of the wiring layer 101 away from the heat generating component 13 , and the receiving hole 1014 penetrates (or penetrates) the wiring layer 101 . The first and second end faces 1011, 1012 are for receiving the opposite heat pipes 12.
Referring to FIGS. 1 and 3, the ground layer 102 is made of a metal material, such as a copper material, and the other side of the ground layer 102 is attached to or affixed to a side of the insulating layer 103. And the heat pipe 12 is embedded in the corresponding receiving hole 1014, and one side of the heat pipe 12 is attached to the side corresponding to the grounding layer 102, that is, the heat pipe 12 accommodated in the receiving hole 1014. One of the sides is flush with the second end face 1012 of the wiring layer 101 and is commonly attached to the opposite ground layer 102 side.
The heat pipe 12 is preferably a thin plate type in the present invention. The heat pipe 12 is provided with a chamber 125, and has a heat absorption section 121, a heat transfer section 122 extending outward from the heat absorption section 121, and a capillary structure 123 disposed on the inner wall of the chamber 125. In the preferred embodiment, the capillary structure 123 is illustrated by a sintered powder body, but is not limited thereto; it may also be a woven structure, a porous structure, or a groove. Or other capillary structure, and the chamber 125 of the heat pipe 12 is filled with a working fluid 124. The heat absorption section 121 of the heat pipe is embedded in the adjacent hole (or adjacent) of the receiving hole 1014 corresponding to the heat generating component 13, that is, the heat absorbing section 121 is embedded (or embedded) in the adjacent corresponding heat generating component 13 The heat transfer section 122 is embedded (or embedded) in the receiving hole 1014 away from the heating element 13 in one of the receiving holes 1014 at the side; and the heat absorbing section 121 is located in the high temperature area 105. In the hole 1014, the heat transfer portion 122 is located in the receiving hole 1014 of the low temperature region 106, and the heat pipe 12 is embedded in the receiving hole 1014 of the wiring layer 101 of the substrate 10 to be combined with the substrate 10. One. The heat pipe 12 is described in the preferred embodiment by a heat pipe 12, but is not limited thereto. In the specific implementation, the number of the receiving holes 1014 and the heat pipe 12 matches the corresponding heat generating component 13 Quantity.
Therefore, the heat pipe 12 embedded in the wiring layer 101 of the substrate 10 is designed to extend from the high temperature region 105 corresponding to the heat generating component 13 toward the relatively low temperature region 106, so that the space or the thickness of the structure can be increased. The effect of thinning the overall heat dissipation structure is achieved.
The side of the heat absorption section 121 and the heat transfer section 122 are disposed on the side opposite to the ground layer 102, and the other side of the heat absorption section 121 and the heat transfer section 122 are flush or lower than the wiring. The first end face 1011 of the layer 101, so when the heat generating component 13 generates heat, most of the heat is conducted to the ground layer 102 via the plurality of pins 131 of the heat generating component 13, so that the heat pipe of the heat pipe 12 located in the high temperature region 105 is heated. The heat received on the ground layer 102 is rapidly conducted to the heat transfer section 122 located in the low temperature region 106, and the heat absorption section 121 also circumscribes the wiring layer 101 around the heat generating component 13 A small amount of heat is transferred to the heat transfer section 122, and the heat received is quickly transmitted to the low temperature region 106 of the substrate 10 through the heat transfer portion 122 to dissipate heat, so that the heat of the heat generating component 13 can be uniformly conducted to the entire substrate 10. In contrast, a large heat dissipation area is obtained to dissipate heat to prevent heat from accumulating on the heating element 13, so that the operation efficiency and the service life of the heating element 13 can be improved.
Therefore, the heat pipe 12 of the present invention is embedded in the substrate 10 and integrated into the design, thereby effectively achieving the effect of improving heat dissipation efficiency and saving space thinning.
4, 5, and 6 are schematic views showing the decomposition, combination and cross-sectional view of the second preferred embodiment of the present invention; the structure and the connection relationship of the preferred embodiment and its efficacy are substantially the same as the first one described above. The preferred embodiment is the same, so the preferred embodiment is mainly to design the receiving hole 1014 on the wiring layer 101 of the first preferred embodiment on the insulating layer 103. And the heat pipe 12 is disposed corresponding to the heat generating component 13 via the ground layer 102, that is, the insulating layer 103 has a receiving hole 1031 which is directed from the insulating layer 103 corresponding to the heat generating component 13 A direction away from the heating element 13 is extended and recessed, and penetrates through the insulating layer 103, in other words, a fourth figure, the receiving hole 1031 is from the insulating layer 103 directly under the heating element 13. And extending along a side adjacent to the insulating layer 103 away from the side of the corresponding heating element 13 , and the receiving hole 1031 is perpendicularly passed through the insulating layer 103 from the side of the ground layer 102 through the insulating layer 103 The side is for receiving the opposite heat pipe 12.
One side of the heat pipe 12 is attached (or fitted) to the other side corresponding to the ground layer 102, and the heat absorption section 121 of the heat pipe 12 is embedded (or embedded) in the capacity corresponding to the heating element 13. In the hole 1031, the heat transfer portion 122 is embedded (or embedded) in the receiving hole 1031 away from the heating element 13, that is, the heat absorption portion 121 is embedded in the heat relative to the heat through the ground layer 102. The heat transfer section 122 is embedded in the receiving hole 1031 of the insulating layer 103 away from the heat generating component 13 via the grounding layer 102, and is disposed in the receiving hole 1031 directly below or adjacent to the component 13; The heat absorption section 121 of the heat pipe 12 is located in the high temperature zone 105, and the heat transfer section 122 is located in the low temperature zone 106, that is, the heat absorption section 121 is located in the receiving hole 1031 corresponding to the high temperature zone 105, and the heat transfer section 122 is located. Corresponding to the inside of the receiving hole 1031 of the low temperature region 106, the heat absorbing section 121 and one side of the heat transfer section 122 are commonly attached to the other side of the ground layer 102, and the heat absorbing section 121 and the heat transfer section 122 are further One side is flush or lower than the other side of the insulating layer 103, so that the heat pipe 12 is embedded in the receiving hole 1031 of the insulating layer 103 of the substrate 10, It is integrated with the substrate 10 to be integrated.
Therefore, the heat pipe 12 embedded in the insulating layer 103 of the substrate 10 is designed to extend from the high temperature region 105 corresponding to the heat generating component 13 toward the relatively low temperature region 106, so that space saving and overall heat dissipation structure can be achieved. The effect of thinning.
The structure and connection relationship of the heat generating component 13 of the preferred embodiment and its function are substantially the same as those of the heat generating component 13 of the first preferred embodiment, and the plurality of pins 131 of the heat generating component 13 are disposed on the heat generating component. The first and second end faces 1011, 1012 of the wiring layer 101 are penetrated or not penetrated on the circumferential side of the 13 to be connected to the side opposite to the ground layer 102. One side of the ground layer 102 is attached (or bonded) to the second end surface 1012 of the wiring layer 101, and the other side of the ground layer 102 is attached to the side opposite to the insulating layer 103.
Therefore, when the heat generating component 13 generates heat, the heat of the heat generating component 13 and its peripheral region (i.e., the heat in the high temperature region) is conducted to the opposite ground layer 102 and passes through the heat absorbing section 121 of the heat pipe 12 located in the corresponding high temperature region 105. The heat received on the other side of the ground plane 102 will be conducted to the heat transfer section 122 at the distal end of the corresponding low temperature zone 106, and then the heat transfer section 122 on the insulating layer 103 will receive the heat. The heat is quickly transferred to the low temperature region 106 of the substrate 10, so that the heat of the heat generating component 13 can be uniformly conducted to the entire substrate 10, and a relatively large heat dissipation area is obtained to dissipate heat to prevent heat from accumulating on the heat generating component 13. Therefore, the effect of improving the operating efficiency and the service life of the heating element 13 can be achieved.
Therefore, the heat absorbing section 121 of the heat pipe 12 of the present invention is embedded in the insulating layer 103 of the substrate 10, and the grounding layer 102 is located directly under or adjacent to the heat generating component 13 to pass through the heat pipe 12. The heat segment 122 uniformly conducts heat to the heat dissipation structure of the entire substrate 10, so as to effectively achieve the effect of improving heat dissipation efficiency and space saving, and thereby effectively achieving the effect of improving the operating efficiency and service life of the heat generating component 13.
Please refer to the seventh, eighth, and ninth drawings for the decomposition and combination of the third preferred embodiment of the present invention. The preferred embodiment is mainly for dissipating the electronic substrate of the first and second preferred embodiments. The structure 1 is applied to the handheld electronic device 2 (such as a mobile phone, a tablet computer, a PDA, an IPAD), and the preferred embodiment uses the handheld electronic device 2 as a mobile phone, but is not limited thereto. In actual implementation, the electronic substrate heat dissipation structure 1 of the present invention can also be applied to an electronic device (such as a desktop computer or a notebook computer) or a combination of Chen Ming.
The handheld electronic device 2 includes a housing 21, a battery member 23, a display touch screen 24, and the electronic substrate heat dissipation structure 1. The housing 21 is composed of a front cover 211 and a back cover 213. The front cover A space 214 for receiving the substrate 10 is defined between the 211 and the back cover 213. The front cover 211 defines a window 212 for mounting the display touch screen 24. The substrate 10 has an opening 107 for receiving the battery member 23. The opening 107 is formed on the substrate 10 and is located between the heat pipe 12 and the edge of the opposite substrate 10.
Therefore, the heat dissipation structure 1 of the electronic substrate is applied to the handheld electronic device 2, and the heat of the heat generating component 13 in the handheld electronic device 2 can be quickly and uniformly transmitted to the entire substrate 10 to have a large heat dissipation by the substrate 10. The area is radiated to the housing 21 for rapid heat dissipation, thereby effectively preventing heat from accumulating on the heating element 13, thereby achieving the effect of improving heat dissipation efficiency and space saving, and improving the operating efficiency and service life of the heating element 13. .
As mentioned above, this creation has the following advantages over the prior art:
1. It can avoid the accumulation of heat on the heating element to effectively improve the heat dissipation efficiency.
2. Space saving has thinning effect.
3. It has the effect of improving the operating efficiency and service life of the heating element.
However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.
1‧‧‧電子基板散熱結構 1‧‧‧Electronic substrate heat dissipation structure
10‧‧‧基板 10‧‧‧Substrate
101‧‧‧佈線層 101‧‧‧ wiring layer
102‧‧‧接地層 102‧‧‧ Grounding layer
103‧‧‧絕緣層 103‧‧‧Insulation
105‧‧‧高溫區 105‧‧‧High temperature zone
106‧‧‧低溫區 106‧‧‧low temperature zone
12‧‧‧熱管 12‧‧‧ Heat pipe
121‧‧‧吸熱段 121‧‧‧heat absorption section
122‧‧‧傳熱段 122‧‧‧heat transfer section
13‧‧‧發熱元件 13‧‧‧heating components
131‧‧‧接腳 131‧‧‧ pins
Claims (7)
一基板，係包含一佈線層、一接地層及一絕緣層，該佈線層具有一第一端面、一相反該第一端面之第二端面及一容設孔，該第一端面上設置有至少一發熱元件，該容設孔係從相鄰對應該發熱元件的佈線層上朝遠離該發熱元件的方向延伸凹設構成，且其貫穿該第一端面與該第二端面，並該接地層的一側係貼設相對該第二端面上，其另一側則與相對該絕緣層的一側相貼設；及
至少一熱管，係嵌埋在該容設孔內，且其一側貼設在對應該接地層的一側上，並該熱管具有一吸熱段及一從該吸熱段向外延伸的傳熱段，該吸熱段係嵌埋於相鄰對應該發熱元件的容設孔內，該傳熱段係嵌埋於遠離該發熱元件的容設孔內。An electronic substrate heat dissipation structure includes:
a substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface, a second end surface opposite to the first end surface, and a receiving hole, wherein the first end surface is provided with at least a heat generating component, the receiving hole is formed by extending from a adjacent wiring layer corresponding to the heat generating component toward a direction away from the heat generating component, and penetrates the first end surface and the second end surface, and the ground layer One side is attached to the second end surface, and the other side is attached to a side opposite to the insulating layer; and at least one heat pipe is embedded in the receiving hole, and one side is attached On the side corresponding to the grounding layer, the heat pipe has a heat absorbing section and a heat transfer section extending outward from the heat absorbing section, and the heat absorbing section is embedded in the receiving hole of the adjacent heat generating component. The heat transfer section is embedded in a receiving hole away from the heat generating component.
一基板，係包含一佈線層、一接地層及一絕緣層，該佈線層具有一第一端面及一相反該第一端面之第二端面，該第一端面上設置有至少一發熱元件，該接地層的一側係貼設相對該第二端面上，其另一側則與相對該絕緣層的一側相貼設，並該絕緣層具有一容設孔，該容設孔係從對應該發熱元件的絕緣層上朝遠離該發熱元件的方向延伸凹設構成，且其貫穿該絕緣層；及
至少一熱管，係嵌埋在該容設孔內，且其一側貼設在對應該接地層的另一側上，並該熱管具有一吸熱段及一從該吸熱段向外延伸的傳熱段，該吸熱段係嵌埋於對應該發熱元件的容設孔內，該傳熱段係嵌埋於遠離該發熱元件的容設孔內。An electronic substrate heat dissipation structure includes:
a substrate comprising a wiring layer, a ground layer and an insulating layer, the wiring layer having a first end surface and a second end surface opposite to the first end surface, wherein the first end surface is provided with at least one heat generating component, One side of the ground layer is attached to the second end surface, and the other side of the ground layer is attached to a side opposite to the insulating layer, and the insulating layer has a receiving hole, and the receiving hole is correspondingly The insulating layer of the heating element is configured to extend away from the heating element and extend through the insulating layer; and at least one heat pipe is embedded in the receiving hole, and one side of the heating element is attached to the corresponding one. On the other side of the formation, the heat pipe has a heat absorption section and a heat transfer section extending outward from the heat absorption section, and the heat absorption section is embedded in a receiving hole corresponding to the heat generating component, and the heat transfer section is Embedded in a receiving hole away from the heating element.
The electronic substrate heat dissipation structure according to claim 6, wherein the heating element has a plurality of pins, the pins are disposed on a circumferential side of the heating element, and penetrate the first and second layers of the wiring layer The end faces are connected to one side opposite to the ground layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103210592U TWM486933U (en) | 2014-06-17 | 2014-06-17 | Electric substrate heat dissipation structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103210592U TWM486933U (en) | 2014-06-17 | 2014-06-17 | Electric substrate heat dissipation structure |
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| Publication Number | Publication Date |
|---|---|
| TWM486933U true TWM486933U (en) | 2014-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103210592U TWM486933U (en) | 2014-06-17 | 2014-06-17 | Electric substrate heat dissipation structure |
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| TW (1) | TWM486933U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636406A (en) * | 2014-11-07 | 2016-06-01 | 泰硕电子股份有限公司 | Radiating module of mobile device |
| US9535470B2 (en) | 2014-07-02 | 2017-01-03 | Asia Vital Components Co., Ltd. | Electronic substrate with heat dissipation structure |
| TWI701991B (en) * | 2019-07-08 | 2020-08-11 | 欣興電子股份有限公司 | Circuit board structure |
| CN113631022A (en) * | 2015-10-29 | 2021-11-09 | 奇鋐科技股份有限公司 | Heat dissipation unit and manufacturing method thereof |
-
2014
- 2014-06-17 TW TW103210592U patent/TWM486933U/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9535470B2 (en) | 2014-07-02 | 2017-01-03 | Asia Vital Components Co., Ltd. | Electronic substrate with heat dissipation structure |
| CN105636406A (en) * | 2014-11-07 | 2016-06-01 | 泰硕电子股份有限公司 | Radiating module of mobile device |
| CN113631022A (en) * | 2015-10-29 | 2021-11-09 | 奇鋐科技股份有限公司 | Heat dissipation unit and manufacturing method thereof |
| TWI701991B (en) * | 2019-07-08 | 2020-08-11 | 欣興電子股份有限公司 | Circuit board structure |
| US11337303B2 (en) | 2019-07-08 | 2022-05-17 | Unimicron Technology Corp. | Circuit board structure |
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