CN105636406A - Cooling Module for Mobile Devices - Google Patents

Abstract

A heat dissipation module of a mobile device, the mobile device having a front panel and a rear cover, the heat dissipation module of the mobile device comprising: a frame located between the front panel and the back cover, the frame having a containing part; a first plate disposed in the frame and located in the accommodating portion; the second plate is combined with the first plate, and a cavity with closed periphery is formed between the second plate and the first plate; the first capillary layer is arranged on one plate surface of the first plate and is positioned in the cavity; the second capillary layer is arranged on one plate surface of the second plate and positioned in the chamber, and the second capillary layer and the first capillary layer are separated by a preset distance to form a gas flow channel between the second capillary layer and the first capillary layer; and a working fluid located in the chamber.

Description

Cooling Module for Mobile Devices

technical field

The present invention relates to heat dissipation technology, in particular to a heat dissipation module of a mobile device.

Background technique

With the advancement of technology, mobile devices (such as mobile phones, tablet computers or personal assistants) have become an essential tool for modern people, and mobile devices can perform calls, network connections, web browsing, sending and receiving emails, and executing applications ( APP) and other functions, therefore, the functions and execution speed of mobile devices are increasing day by day. The use of high-speed central processing unit (CPU) and integrated circuit chips will cause heat generation. When the temperature is too high, users will feel uncomfortable. Therefore, the heat dissipation problem of mobile devices has gradually been paid attention to recently.

China Taiwan Announcement No. M460507 patent discloses a shell structure of a mobile phone device, which mainly makes a vapor chamber into the shape of the back shell of the mobile phone device, or is made into a part of the back shell of the mobile phone device, and utilizes The rapid heat conduction characteristics of the uniform temperature plate can achieve the effect of heat dissipation. However, using the vapor chamber as part or all of the back shell of the mobile phone can only dissipate heat from the heating element inside the mobile phone that is closer to the back, which poses a relatively large limitation on the location of the heating element. In addition, since most of the current vapor chambers are flat, if you want to make the vapor chamber into the back case of a mobile phone or a part of it, it is necessary to make a curved part in accordance with the shape, or discard the curved part to make a uniform warm plate. In addition, if the vapor chamber is made into the back shell of the mobile phone, there will be a problem of durability. When the mobile phone encounters a collision or falls to the ground, it may cause damage to the vapor chamber and lose the heat dissipation effect.

Contents of the invention

The main purpose of the present invention is to provide a heat dissipation module for a mobile device, which can integrate a vapor chamber into the mobile device, provide a more convenient location for the heating element inside the mobile phone, and have better convenience in position design.

Another object of the present invention is to provide a heat dissipation module for a mobile device, which can integrate a vapor chamber into the mobile device, and does not need to match the shape of the casing to manufacture or avoid curved surfaces.

Another object of the present invention is to provide a heat dissipation module of a mobile device, which can integrate a vapor chamber into the mobile device, thereby avoiding the problems of collision and damage.

In order to achieve the above object, the present invention provides a heat dissipation module of a mobile device, the mobile device has a front panel and a rear cover, the heat dissipation module of the mobile device includes: a frame, located between the front panel and the rear cover Between, the frame has an accommodating portion; a first plate is arranged on the frame and is located in the accommodating portion; a second plate is combined with the first plate, between the second plate and the first plate A cavity is formed with a closed perimeter; a first capillary layer is arranged on a surface of the first plate and is located in the cavity; a second capillary layer is arranged on a surface of the second plate and is located in the cavity In the chamber, the second capillary layer is separated from the first capillary layer by a predetermined distance to form a gas channel therebetween; and a working fluid is located in the chamber. In this way, the first plate and the second plate form a structure of a uniform temperature plate, which can provide a more convenient location for the heating element inside the mobile phone, and has better convenience in position design, and does not need to match the shape of the shell To make or avoid curved surfaces, thereby avoiding the problem of collision and breaking.

Description of drawings

Fig. 1 is a perspective view of the first preferred embodiment of the present invention.

Fig. 2 is an exploded view of the first preferred embodiment of the present invention.

Fig. 3 is a cross-sectional view along line 3-3 in Fig. 1 .

FIG. 4 is a partially enlarged view of FIG. 3 .

Fig. 5 is an assembly diagram of the first preferred embodiment of the present invention.

Fig. 6 is an exploded view of assembly of the first preferred embodiment of the present invention.

Fig. 7 is a schematic diagram of the combination of some components of the first preferred embodiment of the present invention.

Fig. 8 is an exploded view of the second preferred embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of a second preferred embodiment of the present invention.

Fig. 10 is an exploded view of the third preferred embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view of a third preferred embodiment of the present invention.

detailed description

In order to describe in detail the technical features of the present invention, the following preferred embodiments are given and illustrated as follows in conjunction with the drawings, wherein:

As shown in Figures 1 to 4, a heat dissipation module 10 of a mobile device provided by the first preferred embodiment of the present invention, the mobile device 90 has a front panel 91 and a rear cover 92, the heat dissipation module of the mobile device 10 is mainly composed of a frame 11, a first plate 21, a second plate 31, a first capillary layer 41, a second capillary layer 51 and a working fluid (not shown), wherein:

The frame 11 is located between the front panel 91 and the rear cover 92 , and the frame 11 has a receiving portion 12 . In practical implementation, the frame 11 can be disposed inside the front panel 91 and the rear cover 92 , or partially exposed outside. In this first embodiment, the part of the frame 11 is exposed outside, which mainly forms a gap around the mobile device 90 between the front panel 91 and the rear cover 92, and the frame 11 protrudes outward around its periphery. Extending to form a ring wall 14, the ring wall 14 is located in the gap and clamped by the front panel 91 and the rear cover 92, and the outer surface of the ring wall 14 is exposed outside. The frame 11 is made of plastic material in the first embodiment, and can be manufactured by an insert molding process.

The first board 21 is disposed on the frame 11 and located in the accommodating portion 12 . In the first embodiment, the first plate 21 is set on the frame 11 and fills the accommodating portion 12 by insert molding. This structure is more convenient in manufacture, however, it can also be manufactured in practice. As not to fill up the accommodating portion 12, this can be determined according to the manufacturer's requirements.

The second plate 31 is combined with the first plate 21 , and a cavity 34 is formed between the second plate 31 and the first plate 21 . In this first embodiment, the peripheral edge of the second plate 31 extends a vertical wall 32 toward the first plate 21, and the vertical wall 32 is combined with the first plate 21 by welding or hot pressing, and the cavity 34 Located in the area enclosed by the vertical wall 32 . The second plate 31 is located in the accommodating portion 12 without contacting the frame 11 , and the outer surface of the second plate 31 is horizontal.

The first capillary layer 41 is disposed on a surface of the first plate 21 and located in the cavity 34 .

The second capillary layer 51 is arranged on a surface of the second plate 31 and is located in the chamber 34. The second capillary layer 51 is separated from the first capillary layer 41 by a predetermined distance to form a gap between them. Gas channel C.

The first capillary layer 41 and the second capillary layer 51 are sintered from copper powder or mesh.

A working fluid (not shown in the figure) is located in the chamber 34 . Wherein, since the liquid is adsorbed in the first capillary layer 41 or the second capillary layer 51, it is difficult to represent, and the working fluid is a well-known element in the technical field, so it is not shown in the figure express.

Thereby, the first plate 21 , the second plate 31 , the first capillary layer 41 , the second capillary layer 51 and the working fluid jointly form a uniform temperature plate 88 .

In this first embodiment, the frame 11 has several perforations 18 passing through from front to back, and the first board 21 also has several perforations 28 aligned with the perforations 18 of the frame 11 respectively, and these perforations 18, 28 can be Bolts (not shown in the figure) are passed through and fixed, and then the frame 11 and the first plate 21 are fixed in the moving device 90 .

From the above structure, it can be understood that the present invention provides a heat dissipation module 10 that is combined with the temperature chamber 88 and the frame 11 inside the mobile device 90 .

Please refer to FIG. 5 to FIG. 7 again, and the direction of the above and below 10 of the present invention is opposite to that of FIG. 1 . When the present invention is implemented in the mobile device 90 , since the temperature chamber 88 is located inside the mobile device 90 , it is convenient for a plurality of electronic components 94 to contact the temperature chamber 88 , thereby producing a good heat conduction effect. The designer has extremely high flexibility and convenience when designing the installation positions of the relevant circuit boards and electronic components 94 . In addition, by combining the temperature chamber 88 in the mobile device 90 , the temperature chamber 88 does not need to match the shape of the shell surface of the mobile device 90 , and the problem of the temperature chamber 88 being bumped and broken can also be avoided.

Please refer to FIG. 8 to FIG. 9 again. The heat dissipation module 10' of a mobile device provided by the second preferred embodiment of the present invention is basically the same as the first embodiment disclosed above, except that:

The second plate 31' is not provided with the vertical wall, but is extended from the first plate 21' to a direction opposite to the position of the second plate 31' to form a recessed portion 22', and the recessed portion 22' is formed around the recessed portion 22'. Standing wall 23'. The second plate 31' is welded to the first plate 21', and the cavity 34' is formed in the recessed portion 22'.

In this structure, the first plate 21', the second plate 31', the first capillary layer 41', the second capillary layer 51' and the working fluid can be combined to form a uniform temperature plate 88'.

The rest of the structures and functions of the second embodiment are the same as those of the first embodiment disclosed above, and will not be repeated here.

Please refer to Fig. 10 and Fig. 11 again, the heat dissipation module 10" of a mobile device provided by the third preferred embodiment of the present invention is basically the same as the first embodiment disclosed above, the difference lies in:

The first plate 21" is not combined with the frame 11" by insert molding, but by assembly. In the third embodiment, an insert 26 ″ is formed at both ends of the first plate 21 ″, and two embedded grooves 16 ″ are formed on the frame 11 ″ correspondingly for the two inserts 26 ″ to be inserted respectively, The first plate 21" is combined on the frame 11" through the engagement relationship between the inserts 26" and the slots 16". In addition, the first plate 21" can also be matched with bolts 96 Combining with the frame 11" can increase the fixing effect. Furthermore, it can be understood that it can also be combined by a size tightening fit between the first plate 21" and the frame 11", The method is not shown in the diagram because it is understandable without the use of interlocking relationships or bolts. The above description is mainly to illustrate that the present invention is not limited to the combination method of assembly or insert forming.

Thereby, a more convenient and lower-cost combination can be provided.

The rest of the structure and functions of the third embodiment are the same as those of the first embodiment disclosed above, and will not be repeated here.

Claims (12)

1. A cooling module for a mobile device, characterized in that the mobile device has a front panel and a rear cover, and the cooling module for the mobile device includes: a frame, located between the front panel and the rear cover, the frame has an accommodating part; a first plate, arranged on the frame and located in the receiving part; a second plate, coupled to the first plate, forming a peripherally closed cavity between the second plate and the first plate; a first capillary layer disposed on a surface of the first plate and located in the chamber; a second capillary layer, arranged on a plate surface of the second plate and located in the chamber, the second capillary layer is separated from the first capillary layer by a predetermined distance to form a gas flow channel therebetween; and A working fluid is located in the chamber. 2. The heat dissipation module of the mobile device according to claim 1, wherein the edge of the frame is exposed outside. 3. The heat dissipation module of a mobile device according to claim 2, wherein a gap surrounding the mobile device is formed between the front panel and the rear cover, and the frame protrudes outward from its periphery to form a ring wall , the ring wall is located in the gap and clamped by the front panel and the rear cover, and the outer surface of the ring wall is exposed outside. 4 . The heat dissipation module of a mobile device according to claim 1 , wherein the first plate fills up the receiving portion. 5 . The heat dissipation module of a mobile device according to claim 1 , wherein a peripheral edge of the second board extends toward the first board to form a vertical wall, and the vertical wall is combined with the first board, and the chamber is located at the In the area enclosed by the vertical wall. 6 . The heat dissipation module of a mobile device according to claim 1 , wherein the first plate extends in a direction opposite to that of the second plate to form a concave portion, and a vertical wall is formed around the concave portion. 7 . 7 . The heat dissipation module of a mobile device according to claim 1 , wherein the second board is located in the accommodating portion and does not contact the frame. 8 . 8 . The heat dissipation module of the mobile device according to claim 1 , wherein the outer surface of the second board is horizontal. 9 . The heat dissipation module of a mobile device according to claim 1 , wherein the frame has a plurality of through holes penetrating from front to back, and the first board also has a plurality of through holes respectively aligned with the through holes of the frame. 10 . The heat dissipation module of a mobile device according to claim 1 , wherein the first board and the second board are combined by welding or heat pressing. 11 . 11 . The heat dissipation module of a mobile device according to claim 1 , wherein the first plate is disposed on the frame in an insert-molding manner. 11 . 12 . The heat dissipation module of a mobile device according to claim 1 , wherein the first board is combined with the frame by assembling. 13 .