CN104797120A - Electronic device - Google Patents
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- CN104797120A CN104797120A CN201510024638.3A CN201510024638A CN104797120A CN 104797120 A CN104797120 A CN 104797120A CN 201510024638 A CN201510024638 A CN 201510024638A CN 104797120 A CN104797120 A CN 104797120A
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- Prior art keywords
- electronic installation
- soaking plate
- plate
- framework
- electronic
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Abstract
The invention discloses an electronic device. The electronic device comprises a housing with an accommodating space, a circuit board disposed in the accommodating space, a heating element disposed on the circuit board, and a soaking plate which is disposed on one side of the circuit board and is next to the heating element. The soaking plate comprises an upper plate, a lower plate assembled together with the upper plate, and a working fluid configured in a cavity. The electronic device can effectively dissipate accumulated heat in the electronic device and then prolong the service life of the electronic device.
Description
Technical field
The present invention relates to a kind of electronic installation, and particularly relate to a kind of soaking plate and be applied to electronic installation wherein.
Background technology
In recent years, along with scientific and technological industry is day by day flourishing, the electronic installations such as information products such as notebook computer (notebookcomputer), panel computer (tablet computer) and mobile phone (mobile phone) are used in daily life widely.Kenel and the function of electronic installation are more and more polynary, and convenience and practicality make these electronic installations more popular.
One framework can be set in electronic installation usually to provide the support force required for electronic installation.On the other hand, central processing unit (central processing unit, CPU), process chip or other electronic components can be configured with in electronic installation, and these electronic components operationally can produce heat energy.But along with the volume of electronic installation is more and more less, the setting of electronic component is more and more intensive, the accumulated heat problem therefore in electronic installation is more and more difficult to process, and the heat of electronic installation often can be caused to work as machine.Therefore, the improvement of heat radiation is more and more important.
Summary of the invention
The object of the present invention is to provide a kind of electronic installation with good radiating effect.
For reaching above-mentioned purpose, a kind of electronic installation of the present invention, comprise the housing with accommodation space, the circuit board be arranged in accommodation space, be arranged at the heater element on circuit board and be arranged at circuit board side and near the soaking plate of heater element.The lower plate that soaking plate comprises upper plate, fit together with upper plate is with the working fluid forming cavity and be configured in cavity.
Based on above-mentioned, electronic device applications of the present invention soaking plate with the accumulated heat in runaway electron device effectively, and then extends the useful life of electronic installation.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and the accompanying drawing appended by coordinating is described in detail below.
Accompanying drawing explanation
Fig. 1 is the decomposing schematic representation of electronic installation of the present invention;
Fig. 2 is the schematic diagram of soaking plate;
Fig. 3 is that heater element, soaking plate and circuit board group are fitted together and the schematic diagram of the working-fluid flow of soaking plate inside;
Fig. 4 has the schematic diagram arranging framework around soaking plate;
Fig. 5 is the schematic diagram be arranged at along the soaking plate of the A-A hatching of Fig. 4 in the perforation of framework;
Fig. 6 is the schematic diagram be arranged at along the soaking plate of the A-A hatching of Fig. 4 in the blind hole of framework.
Symbol description
100: electronic installation
110: protecgulum
120: housing
130: display module
140: circuit board
150: heater element
160: soaking plate
161: upper plate
163: lower plate
164: strutting piece
166: fixed part
167: working fluid
168: framework
168a: opening
170: touch-control module
C: cavity
H: hole
S: accommodation space
Embodiment
Fig. 1 is the decomposing schematic representation of electronic installation of the present invention, Fig. 2 is the schematic diagram of soaking plate.Please also refer to Fig. 1 and Fig. 2, the electronic installation 100 of the present embodiment is such as intelligent mobile phone or panel computer, it comprise the housing 120 with accommodation space S, the circuit board 140 be arranged in accommodation space S, be arranged at the heater element 150 on circuit board 140 and be arranged at circuit board 140 side and near the soaking plate 160 between heater element 150.
In the present embodiment, housing 120 is such as the bonnet of electronic installation 100, and electronic installation 100 also can comprise the protecgulum 110 fitted together with housing 120, and above-mentioned circuit board 140, heater element 150 and soaking plate 160 are covered by between protecgulum 110 and housing 120.
The lower plate 163 that soaking plate 160 at least comprises upper plate 161, fits together with upper plate 161, the working fluid 167 being formed at the cavity C between upper plate 161 and lower plate 163 and being configured in cavity C, and at least one of them the inner surface of upper plate 161 and lower plate 163 is provided with capillary structure, this capillary structure can be made up of sintered powder or etching process.In addition, soaking plate 160 can by stiffness coefficient between 200HB and 500HB, and heat passes the material of coefficient between 15W/ (mK) and 120W/ (mK) is made, such as stainless steel.And in order to reach corrosion protection effect, therefore the working fluid 167 in soaking plate 160 is except pure water, also added in order to corrosion protection additive, wherein the ratio of pure water and additive is 1:1 to 2:1, and additive is such as ethylene glycol (Ethylene Glycol), diethylene glycol (Diethylene Glycol), propylene glycol (Propylene Glycol), nitrate, sulfate, methylbenzotrazole (tolytriazole), polytriazoles (polytriazole) or sulfenyl benzene (mercaptenbenzenthiazole), can select according to actual demand.In another embodiment, soaking plate 160 also also can comprise surrounding around upper plate 161 and lower plate 163 to be configured to the side plate of cavity C altogether.
Fig. 3 is that heater element, soaking plate and circuit board group are fitted together and the schematic diagram of the working-fluid flow of soaking plate inside.Please also refer to Fig. 2 and Fig. 3, soaking plate 160 also can comprise multiple strutting piece 164, and these strutting pieces 164 to be configured in cavity C and to contact upper plate 161 and lower plate 163, to make to maintain gap between upper plate 161 and lower plate 163.Strutting piece 164 can have multiple hole H, and working fluid 167 can flow through strutting piece 164 via multiple hole H in cavity C.Soaking plate 160 also has fixed part 166, and circuit board 140 by fixed part 166 to lock, to inlay, to bind, etc. mode and soaking plate 160 fit together.
Please also refer to Fig. 2 and Fig. 3, the soaking plate 160 of the present embodiment is set to direct contact heating element 150, and the area of soaking plate 160 is greater than the area of heater element 150, and therefore heater element 150 is positioned at soaking plate 160 completely in the orthographic projection of soaking plate 160.But in other enforcement aspect, heater element 150 also can be only overlap with soaking plate 160, equally also can reach the object allowing heater element 150 be dispelled the heat by soaking plate 160, the present invention is not limited thereto.
Consider the height of heater element 150 not necessarily identical and cause soaking plate 160 to be difficult to touch each heater element 150 simultaneously, so in other possible execution mode, soaking plate 160 also can be set to direct contact circuit plate 140 to provide large-area sinking path, therefore can reach good radiating effect equally.
In aforesaid enforcement aspect, the length of soaking plate 160 and wide size close to the length of housing 120 and wide size, and have enough intensity and rigidity, therefore can not need around it to arrange framework in addition with the intensity of assistant reinforcement soaking plate 160 or rigidity.
Please also refer to Fig. 1, Fig. 2 and Fig. 3, the lower plate 163 contact heating element 150 of soaking plate 160 and the upper plate 161 of soaking plate 160 are relatively away from heater element 150.When using this electronic installation 100, the heat trnasfer of heater element 150 is to soaking plate 160, and be comparatively heated close to the working fluid 167 of heater element 150 and flash to gas and upwards flow and be full of whole cavity C, and when the working fluid 167 evaporated flows to relatively away from heater element 150 place, because the temperature at this place is relatively low, therefore hot-air and other media are (as capillary structure, upper plate 161 or cold air etc.) carry out heat exchange and after being condensed into liquid, the capillarity backflow caused by capillary structure, the backflow of liquid can be via having the strutting piece 164 of multiple hole H or being back to lower in cavity C (namely relatively near heater element 150) place along the sidewall (sign) of upper plate 161.The running of this evaporation and condensation can be carried out again and again in cavity C, therefore the heat dissipation that heater element 150 sends can be fallen by soaking plate 160 effectively, avoid the heat localization in electronic installation 100, and then electronic installation 100 can be run for a long time and heat can not work as machine, extend the useful life of electronic installation 100 simultaneously.
Compared to the soaking plate wherein not using strutting piece, because there is the strutting piece 164 using and there is multiple hole H in soaking plate 160 in the present embodiment, and the hole H of this strutting piece 164 can be considered capillary structure, also capillarity can be provided, so the speed of liquid backflow promotes, make wherein to use the soaking plate 160 of the strutting piece 164 with multiple hole H to have better radiating efficiency.
Fig. 4 has the schematic diagram arranging framework around soaking plate.Fig. 5 is the schematic diagram be arranged at along the soaking plate of the A-A hatching of Fig. 4 in the perforation of framework.Please also refer to Fig. 1, Fig. 4 and Fig. 5, implement in aspect at another kind, when the length of soaking plate 160 and wide size are less than the length of casing 120 and wide size, electronic installation 100 can comprise framework 168, and framework 168 has opening 168a, and soaking plate 160 is arranged in opening 168a.This opening 168a is the perforation running through the upper and lower surface of framework 168.Or opening 168a also can be blind hole, as shown in Figure 6, wherein Fig. 6 is the schematic diagram be arranged at along the soaking plate of the A-A hatching of Fig. 4 in the blind hole of framework.Framework 168 can in order to increase the bulk strength of electronic installation 100.The material of above-mentioned framework 168 can be selected according to demand, such as, select metal to make framework 168, can in order to the radiating effect of auxiliary enhancing soaking plate 160; And select plastic cement to make framework 168, the mode of extra quality injection can be utilized framework 168 to be formed at the periphery of soaking plate 160.
Subsidiary one carries, and electronic installation 100 also can comprise a display module 130, and this display module 130 is in the present embodiment between protecgulum 110 and soaking plate 160.But may implement in aspect at other, electronic installation 100 can not comprise protecgulum 110, but is put by display module 130 as having the function of protecgulum to fit together with casing 120 and to cover accommodation space S.Again, mostly current intelligent mobile phone and panel computer are to control in the mode of touch-control, therefore the electronic installation 100 of the present embodiment still can comprise the touch-control module 170 be arranged between protecgulum 110 and display module 130, touches touch-control module 170 to control electronic installation 100 with person easy to use by finger.
In sum, apply soaking plate in electronic installation of the present invention to provide the sinking path of heater element larger area, therefore can improve the problem that heater element forms accumulated heat in electronic installation.In addition, being provided with multiple even if the heater element in electronic installation is intensive, also can reaching good radiating effect by increasing the area of soaking plate.
In addition, soaking plate and circuit board group are fitted together, because soaking plate has the support force that enough rigidity provide electronic installation enough to replace the framework that rarely has, therefore do not need in electronic installation to arrange framework in addition, and the integral thickness of electronic installation can maintain and can not increase.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (17)
1. an electronic installation, is characterized in that comprising:
Housing, has accommodation space;
Circuit board, is arranged in described accommodation space;
At least one heater element, is arranged on described circuit board;
Soaking plate, is arranged at the side of described circuit board, and near described at least one heater element, described soaking plate comprises:
Upper plate;
Lower plate, is assembled in described upper plate to form cavity; And
Working fluid, is arranged in described cavity.
2. electronic installation as claimed in claim 1, is characterized in that described heater element is positioned at described soaking plate completely in the orthographic projection of described soaking plate.
3. electronic installation as claimed in claim 1, is characterized in that described soaking plate contacts described heater element.
4. electronic installation as claimed in claim 1, it is characterized in that described soaking plate also has fixed part, and described circuit board is fixed on described fixed part.
5. electronic installation as claimed in claim 1, characterized by further comprising framework, and described soaking plate is assembled in described framework.
6. electronic installation as claimed in claim 5, is characterized in that the material of described framework is plastic cement, and utilizes the mode of extra quality injection to be formed at the periphery of described soaking plate.
7. electronic installation as claimed in claim 5, is characterized in that the material of described framework is metal.
8. electronic installation as claimed in claim 7, it is characterized in that described framework has opening, and described soaking plate is arranged in described opening.
9. electronic installation as claimed in claim 1, is characterized in that the stiffness coefficient of described soaking plate is between 200HB and 500HB, and heat passes coefficient between 15W/ (mK) and 120W/ (mK).
10. electronic installation as claimed in claim 1, is characterized in that described soaking plate also comprises multiple strutting piece, to be configured in described cavity and to contact described upper plate and described lower plate, to make to maintain gap between described upper plate and described lower plate.
11. electronic installations as claimed in claim 10, is characterized in that more described strutting piece has multiple hole.
12. electronic installations as claimed in claim 1, it is characterized in that described upper plate and described lower plate at least one of them inner surface be provided with capillary structure.
13. electronic installations as claimed in claim 12, is characterized in that described capillary structure is made up of sintered powder or etching process.
14. electronic installations as claimed in claim 1, is characterized in that described working fluid comprises pure water and additive.
15. electronic installations as claimed in claim 14, is characterized in that the ratio of pure water and additive is 1:1 to 2:1.
16. electronic installations as claimed in claim 14, is characterized in that additive is ethylene glycol, diethylene glycol, propylene glycol, nitrate, sulfate, methylbenzotrazole, polytriazoles or sulfenyl benzene.
17. electronic installations as claimed in claim 1, characterized by further comprising display module, are assembled to described housing and cover described accommodation space.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461929512P | 2014-01-21 | 2014-01-21 | |
| US61/929,512 | 2014-01-21 | ||
| US14/596,224 US9939858B2 (en) | 2014-01-21 | 2015-01-14 | Electronic device |
| US14/596,224 | 2015-01-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104797120A true CN104797120A (en) | 2015-07-22 |
Family
ID=53561507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510024638.3A Pending CN104797120A (en) | 2014-01-21 | 2015-01-19 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104797120A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN106455404A (en) * | 2015-08-11 | 2017-02-22 | 奇鋐科技股份有限公司 | Middle frame structure with heat insulation function and electronic device |
| CN108601293A (en) * | 2018-04-17 | 2018-09-28 | 南昌黑鲨科技有限公司 | A kind of manufacturing method of radiating component and radiating component |
| CN111050523A (en) * | 2018-10-12 | 2020-04-21 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN111800526A (en) * | 2019-04-08 | 2020-10-20 | 极地及有限公司 | Integrated vapor chamber for smart phone |
| CN112601430A (en) * | 2020-12-29 | 2021-04-02 | 瑞声科技（南京）有限公司 | Heat dissipation element |
| CN112714598A (en) * | 2020-12-29 | 2021-04-27 | 瑞声科技（南京）有限公司 | Heat dissipation element |
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| JP2003322483A (en) * | 2002-04-26 | 2003-11-14 | Furukawa Electric Co Ltd:The | Plate type heat pipe and method for manufacturing the same |
| CN1878454A (en) * | 2005-06-10 | 2006-12-13 | 郑文春 | Nearly isothermal heat pipe heat sink and process for making the same |
| CN1982826A (en) * | 2005-12-12 | 2007-06-20 | 财团法人工业技术研究院 | Penetrating support structure and its production |
| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| CN102778157A (en) * | 2011-05-12 | 2012-11-14 | 北京芯铠电子散热技术有限责任公司 | Flat plate vapor chamber and manufacturing method thereof |
| TW201339814A (en) * | 2012-02-24 | 2013-10-01 | Furukawa Electric Co Ltd | Sheet-like heat pipe, and electronic device provided with same |
| TWM469525U (en) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | Heat dissipation structure for handheld mobile device |
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- 2015-01-19 CN CN201510024638.3A patent/CN104797120A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003322483A (en) * | 2002-04-26 | 2003-11-14 | Furukawa Electric Co Ltd:The | Plate type heat pipe and method for manufacturing the same |
| CN1878454A (en) * | 2005-06-10 | 2006-12-13 | 郑文春 | Nearly isothermal heat pipe heat sink and process for making the same |
| CN1982826A (en) * | 2005-12-12 | 2007-06-20 | 财团法人工业技术研究院 | Penetrating support structure and its production |
| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| CN102778157A (en) * | 2011-05-12 | 2012-11-14 | 北京芯铠电子散热技术有限责任公司 | Flat plate vapor chamber and manufacturing method thereof |
| TW201339814A (en) * | 2012-02-24 | 2013-10-01 | Furukawa Electric Co Ltd | Sheet-like heat pipe, and electronic device provided with same |
| TWM469525U (en) * | 2013-07-23 | 2014-01-01 | Asia Vital Components Co Ltd | Heat dissipation structure for handheld mobile device |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017020419A1 (en) * | 2015-07-31 | 2017-02-09 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN105578840B (en) * | 2015-07-31 | 2018-06-15 | 宇龙计算机通信科技(深圳)有限公司 | A kind of mobile terminal |
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN106455404B (en) * | 2015-08-11 | 2022-07-01 | 奇鋐科技股份有限公司 | Heat-insulated middle frame structure and electronic equipment |
| CN106455404A (en) * | 2015-08-11 | 2017-02-22 | 奇鋐科技股份有限公司 | Middle frame structure with heat insulation function and electronic device |
| CN108601293A (en) * | 2018-04-17 | 2018-09-28 | 南昌黑鲨科技有限公司 | A kind of manufacturing method of radiating component and radiating component |
| WO2019200877A1 (en) * | 2018-04-17 | 2019-10-24 | 南昌黑鲨科技有限公司 | Heat dissipation member and method for manufacturing heat dissipation member |
| CN111050523A (en) * | 2018-10-12 | 2020-04-21 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN111800526A (en) * | 2019-04-08 | 2020-10-20 | 极地及有限公司 | Integrated vapor chamber for smart phone |
| CN112601430A (en) * | 2020-12-29 | 2021-04-02 | 瑞声科技（南京）有限公司 | Heat dissipation element |
| CN112714598A (en) * | 2020-12-29 | 2021-04-27 | 瑞声科技（南京）有限公司 | Heat dissipation element |
| CN112601430B (en) * | 2020-12-29 | 2022-03-29 | 瑞声科技（南京）有限公司 | Heat dissipation element |
| CN112714598B (en) * | 2020-12-29 | 2022-04-29 | 瑞声科技（南京）有限公司 | Heat dissipation element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150722 |