CN106455404A - Middle frame structure with heat insulation function and electronic device - Google Patents
Middle frame structure with heat insulation function and electronic device Download PDFInfo
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- CN106455404A CN106455404A CN201510488942.3A CN201510488942A CN106455404A CN 106455404 A CN106455404 A CN 106455404A CN 201510488942 A CN201510488942 A CN 201510488942A CN 106455404 A CN106455404 A CN 106455404A
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- frame unit
- outer layer
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- electronic installation
- insulation layer
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Abstract
The invention provides a middle frame structure with a heat insulation function and an electronic device. The middle frame, which is applied to an electronic device, comprises a body and a frame unit. The frame unit comprises an inner side, an outer side, and a heat insulation layer. The heat insulation layer is located between the inner layer and the outer layer. The inner layer is adjacent to the body. The outer layer is at the outermost side of the frame unit. Heat of the body is stopped by the heat insulation layer from being transferred to the outer layer of the frame unit.
Description
【Technical field】
The present invention is related to portable electronic device field, espespecially the middle frame structure of the disconnected heat of one kind tool and electronic equipment.
【Background technology】
Its size of intelligent personal electronic equipments such as mobile phone, panel computer or portable reader is done bigger and bigger and thickness becomes thinner and thinner at present, cause the heat dispersion of electronic equipment worse and worse, but the caloric value great majority in electronic equipment be each functional unit work running produced, such as central processing unit（It is especially the lifting configuration multi-core arithmetic element stressing execution speed, even more the heat dissipation problem of terminal unit is made the matter worse）, battery, power converter, the running of all units such as display screens the caloric value of electronic equipment all can be led to increase or aggravate.The thermal source of most electronic equipments is all integrally fixed on the middle frame structure of electronic equipment at present, therefore center absorbs the heat producing during the execution of each functional unit first, therefore after electronic equipment start running, center temperature is easy to raise, lead to body and the outer rim extreme temperatures of center, when user hand-hold electronic equipments, because the size of current electronic equipment is larger（Main flow as touch-control mobile phone is all more than 5 cun）User almost cannot be grasped completely, be only mostly using finger between grasping, being located at the both sides of the outer rim or longer of center its grasping contact point of electronic installation or position, causing high temperature to conduct to center outer rim will affect or cause user in the puzzlement using and inconvenience more.
【Content of the invention】
For the above-mentioned problem of effectively solving, one of present invention purpose has the middle frame structure of insulation layer in offer one kind, to intercept heat transfer to the outer layer of the frame unit of center.
Another object of the present invention has disconnected hot merit effect, the side of the heat transfer that the internal electron part in order to intercept electronic equipment produces to electronic installation in a kind of middle frame structure using in the electronic device of offer.
For reaching above-mentioned purpose, the present invention provides a kind of middle frame structure of the disconnected heat of tool, including a body and a frame unit, this frame unit includes a la m and an outer layer and an insulation layer, this insulation layer is located between this la m and this outer layer, this la m adjoins this body, and this outer layer is located at the outermost of frame unit.
The la m of this body and this frame unit and outer layer are made up of metal material or non-metallic material, and the insulation layer of this frame unit is formed by heat insulation material material.
This body is flat plate heat tube or hot plate or temperature-uniforming plate, has an airtight chamber, be provided with capillary structure and working fluid in this airtight chamber in it.
For reaching above-mentioned purpose, the present invention separately provides a kind of electronic installation, including：One display module, has a front；One fore shell, connects this display module, and this fore shell is provided with a fenestra, and the front of this display module appears in this fenestra；One center, connect this fore shell, this center includes a body and a frame unit, this frame unit includes a la m and an outer layer and an insulation layer, this insulation layer is located between this la m and this outer layer, this la m adjoins this body, and this outer layer is located at the outermost of frame unit, and plural internal electron part is arranged on this body.
This center connects or is formed with a shell on the back.
The la m of this body and this frame unit and outer layer are made up of metal material or non-metallic material, and the insulation layer of this frame unit is formed by heat insulation material material.
This body is flat plate heat tube or hot plate, has an airtight chamber, be provided with capillary structure and working fluid in this airtight chamber in it.
This display module is touch-control display module, and this front is touch-control display surface.
【Accompanying drawingExplanation】
FollowingFigureThe purpose of formula is to enable the invention to be more easily understood, and can encyclopaedize those in this articleFigureFormula, and make it constitute some of specific embodiment.Through specific embodiment herein and with reference to correspondingFigureFormula, in order to the detailed specific embodiment explaining the present invention, and in order to illustrate the action principle of invention.
Figure 1Center for the present invention is illustratedFigure；
Figure 2APartially schematic for the center section view of the present inventionFigure；
Figure 2BThe section view implemented for another replacement of body of the center of the present invention is partially schematicFigure；
Figure 3The stereo decomposing being applied to electronic installation for the present invention is illustratedFigure：
Figure 4The section view being applied to electronic installation for the present invention is partially schematicFigure.
Attached In figureAssembly representated by each sequence number is：
10 centers
11 bodies
111 first side surfaces
112 second side surfaces
1111st, 1121 groove
116 airtight chamber
117 capillary structures
118 working fluids
12a frame unit
121a la m
123a outer layer
122a insulation layer
131 first sides
132 second sides
20 fore shells
21 fenestras
30 display modules
31 fronts
32 back sides
40 shell on the backs
41 mainboards
42 batteries
43rd, 44 forward and backward camera lens module
【Specific embodiment】
The above-mentioned purpose of the present invention and its structure and characteristic functionally, will be according to instituteAccompanying drawingThe embodiment of formula is explained.
The present invention provides a kind of middle frame structure of the disconnected heat of tool, including the frame unit located at body at least opposite sides side or the four side located at body for the body and, this frame unit includes a la m and an outer layer and an insulation layer, this insulation layer is located between this la m and this outer layer, this la m adjoins this body, and this outer layer is located at the outermost of frame unit.
Will be detailed below the various enforcement of the present invention, refer to eachFigureFormula and its component symbol and explanation.
Please joinFigure 1Center for the present invention is illustratedFigure；Figure 2ACenter section view for the present invention is illustratedFigure；Figure 2BAnother center section view for the present invention is illustratedFigure.As schemedShow; center 10 is applied to one in electronic installation in addition to the purposes as the various part supporting in protection electronic installation; and it is related to the structural strength of electronic installation, one kind can be produced to electronic installation in the case of electronic installation faces extrusion or force and directly protect.At least some of center 10 is made of metal, however, this center 10 can also be all made up of metal material.Due to metal material intensity preferably, and then make center 10 entirety intensity preferable.Aforesaid metal material is for example：Rustless steel, aluminum, almag, aluminum titanium alloy etc..
This center 10 includes a body 11 and a frame unit 12a, and this frame unit 12a is located at least opposite sides side of this body 11, at thisDiagramMiddle four sides representing in body 11, this frame unit 12a includes a la m 121a and an outer layer 123a and an insulation layer 122a, this insulation layer 122a sandwiched is located between this la m 121a and this outer layer 123a, contact this outer layer 123a to intercept this la m 121a, wherein this la m 121a adjoins the periphery of this body 11, and this outer layer 123a is located at the outermost of frame unit 12a.
This body 11 has the first side surface 111 and one second side surface 112 is respectively equipped with plural combined structure such as groove or open-work or cramp or post or a combination thereof, represent groove 1111,1121 in this enforcement, the plural internal electron part of electronic installation, by this grade combined structure, is arranged on this first side surface 111 and/or the second side surface 112.
Furthermore, the la m of body 11 and frame unit 12 and outer layer are implemented respectively metal material and/or non-metallic material one and are made.
As Figure 2BShown, implement in another replacement, this body 11 is flat plate heat tube or hot plate or temperature-uniforming plate, has an airtight chamber 116, be provided with capillary structure 117 and working fluid 118 in this airtight chamber 116 in it.Produce steam-condensate circulating by working fluid 118 in airtight chamber 111, so that the heat on body 11 is uniformly distributed.
When being embodied as, the insulation layer 122a described in this case is by heat insulation material material（thermal insulation material）Formed, heat insulation material material is also called heat insulator.This heat insulation material material is, for example, polyurethane foam, glass fibre, asbestos, ethylene propylene rubber（EPDM）Or aromatic series aramid.Preferably, this insulation layer 122a is by ethylene propylene rubber（EPDM）And the composition of aromatic series aramid, or by ethylene propylene rubber（EPDM）And asbestos composition.Because insulation layer 122a is formed by heat insulation material material, so the heat that body 11 absorbs from internal electron part is not transferred to frame unit 12a.
The application implementation of aforementioned center will be illustrated below.
Please joinFigure 3The stereo decomposing being applied to electronic installation for the present invention is illustratedFigure：Figure 4The section view being applied to electronic installation for the present invention is partially schematicFigure.As schemedShow that electronic installation includes a center 10, a fore shell 20 and a display module 30.
This center 10 is as elucidated beforeFigure 1、Figure 2A、Figure 2B、Figure 3Shown, center 10 includes a body 11 and the frame unit 12a being located at this body 11 periphery, this frame unit 12a includes a la m 121a and an outer layer 123a and an insulation layer 122a, this insulation layer 122a is located between this la m 121a and this outer layer 123a, this la m 121a adjoins the periphery of this body 11, and this outer layer 123a is located at the outermost of frame unit 12a.This center 10 connects this fore shell 20,DiagramThe middle first side 111 showing that this fore shell 20 is located at this center 10, forms an accommodation space between fore shell 20 and center 10（In figureDo not indicate）, fore shell 20 is provided with fenestra（window）21.
Display module 30 is fixedly installed on accommodation space.Display module 30 includes a front 31 and a back side 32 contrary with this front 31, and this front 31 is the display portion of display module 30, and after display module 30 is installed on accommodation space, the front 31 of display module 30 is appeared by this fenestra 21.This display module 30 can be liquid crystal display (LCD) or touch control display or other substituting elements.When this display module 30 is touch-control display panel, this front 31, in addition to as show image, more as the surface of touch-control, provides touch control type operation.
Aforesaid center 10 more connects a shell on the back 40,In figureShow that this shell on the back 40 is located at the second side 112 of this center 10, fore shell 20 and shell on the back 40 form the overall external form shape of electronic installation.The outer layer 123a of the frame unit 12a of center 10 then forms at least opposite sides side of electronic installation or four sides are revealed in the extraneous contact area gripping as offer hand.
The plural internal electron part of electronic installation is arranged on the body 11 of this center 10, and this grade internal electron part includes mainboard 41 and battery 42 and forward and backward camera lens module 43,44.This mainboard 41 is provided with processor, the various elements such as power wafers, audio and video chip.At thisIn figureRepresent this mainboard 41 and battery 42 is separately positioned on the groove 1111,1121 in the first side 111 of body 11 of center 10 and second side 112.Display module 30 and battery 42 and forward and backward camera lens module 43,44 are electrically connected with this mainboard 41.Implement in another replacement, this shell on the back 40 is integrally formed with this center 10, then this plural electronic component is arranged on the first side 111 of the body 11 of center 10.
When electronic installation operates, internal electron part, such as mainboard 41 and battery 42 and forward and backward camera lens module 43,44 produce heat transfer on the body 11 of center 10, and the insulation layer 122a by frame unit 12a is located between la m 121a and outer layer 123a, to intercept the heat transfer of body 11 to the outer layer 123a of frame unit 12a, make the heat distribution that internal electron part produces on the body 11 of center 10.Furthermore, because the heat of body 11 cannot be delivered to the outer layer 123a of frame unit 12a so that the outer layer 123a of at least opposite sides side as electronic installation or four sides can provide hand comfortable gripping, will not scald one's hand and cause using upper inconvenience and puzzlement.
When being embodied as, electronic installation described in this case can be mobile phone or panel computer etc., it will be understood by those of skill in the art that mobile phone or panel computer are merely illustrative, it is not used to the technical scheme of the present embodiment is limited, other kinds of electronic installation is also all suitable for.
According to above embodiment, the present invention at least possesses lower example advantage：
Between la m 121a and outer layer 123a by the frame unit 12a being arranged on center 10a by insulation layer 123a for the present invention, outer layer 123a with the heat transfer of obstruct body 11 to frame unit 12a, and because the outer layer 123a of this frame unit 12a forms at least opposite sides side of electronic equipment or four sides are revealed in the external world, and wherein relative to two sides（For example but be not limited to long side）As the contact area providing hand to grip, and then provide hand comfortable gripping electronic equipment.
Only as described above, the only preferably feasible embodiment of the present invention, such as changed for it using the above-mentioned method of the present invention, shape, construction, device, all should be contained in the interest field of this case.
Claims (8)
1. a kind of middle frame structure having disconnected heat is it is characterised in that include a body and a frame unit, this frame unit includes a la m and an outer layer and an insulation layer, this insulation layer is located between this la m and this outer layer, and this la m adjoins this body, and this outer layer is located at the outermost of frame unit.
2. it is characterised in that the la m of described body and this frame unit and outer layer are made up of metal material or non-metallic material, the insulation layer of this frame unit is formed the middle frame structure having disconnected heat according to claim 1 by heat insulation material material.
3. the middle frame structure having disconnected heat according to claim 1, it is characterised in that described body is flat plate heat tube or hot plate or temperature-uniforming plate, has an airtight chamber, is provided with capillary structure and working fluid in this airtight chamber in it.
4. a kind of electronic installation is it is characterised in that include：
One display module, has a front；
One fore shell, connects this display module, and this fore shell is provided with a fenestra, and the front of this display module appears in this fenestra；
One center, connect this fore shell, this center includes a body and a frame unit, this frame unit includes a la m and an outer layer and an insulation layer, this insulation layer is located between this la m and this outer layer, this la m adjoins this body, and this outer layer is located at the outermost of frame unit, and plural internal electron part is arranged on this body.
5. electronic installation according to claim 4 is it is characterised in that described center connects or is formed with a shell on the back.
6. it is characterised in that the la m of described body and this frame unit and outer layer are made up of metal material or non-metallic material, the insulation layer of this frame unit is formed electronic installation according to claim 4 by heat insulation material material.
7. electronic installation according to claim 4, it is characterised in that described body is flat plate heat tube or hot plate, has an airtight chamber, is provided with capillary structure and working fluid in this airtight chamber in it.
8. it is characterised in that described display module is touch-control display module, this front is touch-control display surface to electronic installation according to claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488942.3A CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510488942.3A CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN106455404A true CN106455404A (en) | 2017-02-22 |
| CN106455404B CN106455404B (en) | 2022-07-01 |
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| CN201510488942.3A Active CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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Cited By (4)
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| CN108770292A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
| CN108990334A (en) * | 2018-06-29 | 2018-12-11 | Oppo广东移动通信有限公司 | Center component and electronic device |
| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
| US11516940B2 (en) | 2018-12-25 | 2022-11-29 | Asia Vital Components Co., Ltd. | Middle bezel frame with heat dissipation structure |
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| CN108770292A (en) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | A kind of electronic equipment and radiating subassembly |
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|---|---|
| CN106455404B (en) | 2022-07-01 |
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