TWM513545U - Middle frame structure with heat separation and electronic apparatus - Google Patents

Description

Frame structure and electronic equipment with heat interruption

This creation is about the field of portable electronic devices, especially a frame structure and electronic equipment with heat insulation.

At present, smart personal electronic devices such as mobile phones, tablets or portable readers are getting bigger and thinner and thinner, resulting in worse and worse heat dissipation of electronic devices. However, most of the heat generated in electronic devices is The operation of the functional unit is generated, for example, the central processing unit (especially for configuring the multi-core computing unit for improving the execution speed, which is worse for the heat dissipation problem of the terminal device), the operation of the battery, the power converter, the display screen, and the like. Both will increase or increase the heat generated by electronic devices. At present, the heat source of most electronic devices is fixed on the middle frame structure of the electronic device, so the middle frame first absorbs the heat generated when each functional unit is executed. Therefore, after the electronic device is turned on, the temperature of the middle frame is extremely easy to rise, resulting in The temperature of the main body and the outer edge of the frame is extremely high. When the user holds the electronic device, since the size of the electronic device is large (for example, the mainstream of the touch mobile phone is more than 5 inches), the user can hardly grasp it completely, and most of them are only With the grip between the fingers, the contact points or positions of the grasping electronic device are mostly located on the outer edge or the longer sides of the middle frame, so that the high temperature conduction to the outer edge of the middle frame will affect or cause the user to use and inconvenient.

Accordingly, in order to effectively solve the above problems, it is an object of the present invention to provide an outer layer of a frame unit having a frame structure in a heat insulating layer to block heat transfer to the middle frame.

Another object of the present invention is to provide a heat insulating effect for a middle frame structure used in an electronic device for blocking heat generated by internal electronic components of the electronic device from being transmitted to the side of the electronic device.

In order to achieve the above object, the present invention provides a heat-insulating frame structure comprising a body and a frame unit, the frame unit including an inner layer and an outer layer and a thermal insulation layer, the thermal insulation layer is located on the inner side Between the layer and the outer layer, the inner layer abuts the body, the outer layer being located at the outermost side of the frame unit.

In one implementation, another heat-insulating frame structure provided by the present invention is applied to an electronic device, the electronic device comprising: a display module having a front surface; a front case connecting the display module, the front The cover is provided with a window, the front surface of the display module is exposed in the window; a middle frame is connected to the front case, the middle frame includes a body and a frame unit, and the frame unit includes an inner layer and an outer layer A thermal insulation layer is located between the inner layer and the outer layer, the inner layer abuts the body, the outer layer is located at an outermost side of the frame unit, and a plurality of inner parts are disposed on the body.

In one implementation, the middle frame is connected or directly formed integrally with a back shell.

In one implementation, the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat insulation layer of the frame unit is formed of a heat-insulating material.

In one implementation, the body is a flat-plate heat pipe or a hot plate having a closed chamber therein, and the closed chamber is provided with a capillary structure and a working fluid.

In one implementation, the display module is a touch display module, and the front surface is a touch display surface.

10‧‧‧ middle frame

11‧‧‧Ontology

111‧‧‧First side surface

112‧‧‧Second side surface

1111, 1121‧‧‧ grooves

116‧‧‧Closed chamber

117‧‧‧Capillary structure

118‧‧‧Working fluid

12a‧‧‧Box unit

121a‧‧‧ inside layer

123a‧‧‧Outer layer

122a‧‧‧ Thermal insulation layer

20‧‧‧ front shell

21‧‧‧ window hole

30‧‧‧Display module

31‧‧‧ positive

32‧‧‧Back

40‧‧‧ Back shell

41‧‧‧ motherboard

42‧‧‧Battery

43, 44‧‧‧ front and rear lens modules

The following drawings are intended to provide a more complete understanding of the invention, and are in the The specific embodiments of the present invention are described in detail by reference to the specific embodiments herein,

The first picture is a schematic diagram of the middle frame of the creation;

Figure 2A is a partial schematic view of the frame in the middle of the creation;

2B is a partial cross-sectional partial view showing another alternative implementation of the body of the middle frame of the creation;

Figure 3 is a schematic exploded view of the creation of the electronic device:

Figure 4 is a partial cross-sectional view showing the application to the electronic device.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

The present invention provides a heat-insulating frame structure, comprising a body and a frame unit disposed on at least opposite sides of the body or on four sides of the body, the frame unit including an inner layer and an outer layer and a frame a thermal insulation layer between the inner layer and the outer layer, the inner layer abutting the body, the outer layer being located at an outermost side of the frame unit.

The various implementations of this creation will be described in detail below. Please refer to the drawings and their component symbols and descriptions.

Please refer to FIG. 1 for a schematic diagram of the middle frame of the creation; FIG. 2A is a schematic cross-sectional view of the middle frame of the creation; FIG. 2B is a schematic cross-sectional view of another middle frame of the creation. As shown in the figure, the middle frame 10 is applied to an electronic device in addition to the use of supporting various parts in the electronic device, and relates to the structural strength of the electronic device, in the case where the electronic device is pressed or applied. A direct protection can be created for the electronic device. At least a portion of the middle frame 10 is made of metal, however, the middle frame 10 may also be entirely made of a metal material. Since the strength of the metal material is good, the strength of the entire middle frame 10 is better. The aforementioned metal materials are, for example, stainless steel, aluminum, aluminum-magnesium alloy, aluminum titanium alloy, and the like.

The middle frame 10 includes a body 11 and a frame unit 12a. The frame unit 12a is located on at least opposite side edges of the body 11, and is represented on the four sides of the body 11 in the present illustration. The frame unit 12a includes a frame unit 12a. The inner layer 121a and an outer layer 123a and a thermal insulation layer 122a are interposed between the inner layer 121a and the outer layer 123a to block the inner layer 121a from contacting the outer layer 123a. The layer 121a is adjacent to the periphery of the body 11, and the outer layer 123a is located at the outermost side of the frame unit 12a.

The body 11 has a first side surface 111 and a second side surface 112 respectively provided with a plurality of joint structures such as grooves or through holes or buckles or columns or a combination thereof. In the present embodiment, the grooves 1111, 1121 are displayed, and the electronic device The plurality of internal electronic components are mounted on the first side surface 111 and/or the second side surface 112 by the combined construction.

Furthermore, the inner layer and the outer layer of the main body 11 and the frame unit 12 are made of a metal material and/or a non-metal material, respectively.

As shown in FIG. 2B, in another alternative embodiment, the body 11 is a flat heat pipe or a hot plate or a temperature equalizing plate having a closed chamber 116 therein, and the closed chamber 116 is provided with a capillary structure 117 and working. Fluid 118. The vapor-liquid circulation is generated in the closed chamber 111 by the working fluid 118 to uniformly distribute the heat on the body 11.

In a specific implementation, the thermal insulation layer 122a described in the present invention is formed by a thermal insulation material, which is also referred to as a thermal insulation material. The heat-insulating material is, for example, a polyurethane foam, a glass fiber, an asbestos, an ethylene propylene rubber (EPDM) or an aromatic polyamide fiber. Preferably, the heat insulation layer 122a is composed of ethylene propylene rubber (EPDM) and aromatic polyamide fibers, or is composed of ethylene propylene rubber (EPDM) and asbestos. Since the heat insulating layer 122a is formed of a heat insulating material, heat absorbed by the body 11 from the internal electronic components is not transmitted to the frame unit 12a.

The application implementation of the aforementioned middle frame will be exemplified below.

Please refer to FIG. 3 for a three-dimensional exploded view of the application applied to the electronic device: FIG. 4 is a partial cross-sectional view of the creation applied to the electronic device. The electronic device includes a middle frame 10, a front case 20 and a display module 30 as shown.

The middle frame 10 has been shown in Figures 1, 2A, 2B, and 3, and the middle frame 10 includes a body 11 and a frame unit 12a disposed on the periphery of the body 11. The frame unit 12a includes an inner layer. 121a and an outer layer 123a and a thermal insulation layer 122a. The thermal insulation layer 122a is located between the inner layer 121a and the outer layer 123a. The inner layer 121a is adjacent to the periphery of the body 11. The outer layer 123a is located in the frame unit 12a. The outermost side. The middle frame 10 is connected to the front case 20, and the front case 20 is located on the first side 111 of the middle frame 10, and an accommodation space (not shown) is formed between the front case 20 and the middle frame 10. A window 21 is provided on the front case 20.

The display module 30 is fixedly disposed in the accommodating space. The display module 30 includes a front surface 31 and a rear surface 32 opposite to the front surface 31. The front surface 31 is a display portion of the display module 30. As shown in FIG. 3, when the display module 30 is installed in the accommodating space, The front side 31 of the display module 30 is exposed through the aperture 21. The display module 30 can be a liquid crystal display (LCD) or a touch display or other alternative components. When the display module 30 is a touch display panel, the front surface 31 provides a touch operation as a touch surface in addition to the display image.

The middle frame 10 is further connected to a back shell 40. The back shell 40 is located on the second side 112 of the middle frame 10. The front shell 20 and the back shell 40 form an overall shape of the electronic device. The outer layer 123a of the frame unit 12a of the middle frame 10 forms at least two opposite sides or four sides of the electronic device exposed to the outside as a contact area for providing hand grip.

The plurality of internal electronic components of the electronic device are disposed on the body 11 of the middle frame 10. The internal electronic components include a main board 41 and a battery 42 and front and rear lens modules 43 and 44. The main board 41 is provided with various components such as a processor, a power supply chip, and a sound image chip. In the figure, the main plate 41 and the battery 42 are respectively disposed on the first side 111 and the second side 112 of the main body 11 of the middle frame 10, and the grooves 1111 and 1121 are formed. The display module 30 and the battery 42 and the front and rear lens modules 43 and 44 are electrically connected to the main board 41. In another alternative implementation, the back shell 40 is integrally formed with the middle frame 10, and the plurality of electronic components are disposed on the first side 111 of the body 11 of the middle frame 10.

When the electronic device is in operation, internal electronic components, such as the main board 41 and the battery 42 and the front and rear lens modules 43, 44 (as shown in FIG. 3) generate heat transfer to the body 11 of the middle frame 10, and by the frame The heat-dissipating layer 122a of the unit 12a is located between the inner layer 121a and the outer layer 123a to block the heat transfer from the body 11 to the outer layer 123a of the frame unit 12a, so that the heat generated by the internal electronic components is distributed on the body 11 of the middle frame 10. . Moreover, since the heat of the body 11 cannot be transmitted to the outer layer 123a of the frame unit 12a, the outer layer 123a, which is at least the opposite side edges or the four sides of the electronic device, can provide a comfortable grip of the hand, and is not hot. Causes inconvenience and troubles in use.

In an embodiment, the electronic device in the present disclosure may be a mobile phone or a tablet computer, etc., and those skilled in the art should understand that the mobile phone or the tablet computer is only an example, and is not used to limit the technical solutions of the embodiment, and other types of electronic devices. The device is also suitable.

According to the above embodiment, the creation has at least the following advantages:

The present invention is disposed between the inner layer 121a and the outer layer 123a of the frame unit 12a of the middle frame 10a by the heat-dissipating layer 122a to block the heat transfer from the body 11 to the outer layer 123a of the frame unit 12a, and due to the frame The outer layer 123a of the unit 12a forms at least two opposite sides or four sides of the electronic device exposed to the outside, and wherein the opposite two sides (such as but not limited to the long side) serve as a contact area for providing hand grip In turn, the hand grip electronic device is provided.

However, the above descriptions are only preferred embodiments of the present invention, and variations of the methods, shapes, structures, and devices described above are intended to be included in the scope of the present invention.

10‧‧‧ middle frame

11‧‧‧Ontology

111‧‧‧First side surface

112‧‧‧Second side surface

1111, 1121‧‧‧ grooves

12a‧‧‧Box unit

121a‧‧‧ inside layer

123a‧‧‧Outer layer

122a‧‧‧ Thermal insulation layer

Claims (8)

A heat-insulating frame structure comprising a body and a frame unit, the frame unit comprising an inner layer and an outer layer and a thermal insulation layer, the thermal insulation layer being located between the inner layer and the outer layer, The inner layer abuts the body, the outer layer being located at the outermost side of the frame unit. The frame structure having a heat-breaking structure according to claim 1, wherein the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat-dissipating layer of the frame unit is formed of a heat-breaking material. . The heat-insulating middle frame structure according to claim 1, wherein the body is a flat heat pipe or a hot plate or a temperature equalizing plate, and has a closed chamber therein, and the closed chamber is provided with a capillary structure and a working fluid. An electronic device comprising:
a display module having a front side;
a front case connecting the display module, the front case is provided with a window hole, and a front surface of the display module is exposed in the window hole;
a middle frame connecting the front case, the middle frame comprising a body and a frame unit, the frame unit comprising an inner layer and an outer layer and a thermal insulation layer, the thermal insulation layer being located at the inner layer and the outer layer The inner layer abuts the body, the outer layer is located at the outermost side of the frame unit, and a plurality of internal electronic components are disposed on the body. The electronic device of claim 4, wherein the middle frame is connected or formed with a back shell. The electronic device of claim 4, wherein the inner layer and the outer layer of the body and the frame unit are made of a metal material or a non-metal material, and the heat insulation layer of the frame unit is formed of a heat-insulating material. The electronic device of claim 4, wherein the body is a flat heat pipe or a hot plate having a closed chamber therein, the capillary chamber being provided with a capillary structure and a working fluid. The electronic device of claim 4, wherein the display module is a touch display module, and the front surface is a touch display surface.