CN202310428U

CN202310428U - Thermal-resistant cooling structure of casing

Info

Publication number: CN202310428U
Application number: CN2011204113496U
Authority: CN
Inventors: 吴哲元
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-10-25
Filing date: 2011-10-25
Publication date: 2012-07-04
Anticipated expiration: 2021-10-25

Abstract

The utility model discloses a thermal-resistant cooling structure of a casing. The thermal-resistant cooling structure at least comprises a casing and a thermal-resisting part with a thermal resistance effect, wherein a heat source capable of generating heat can be arranged inside the casing; and the thermal-resistant part is arranged at the part on the surface on the inner side of the casing, which corresponds to the heat radiating part of the heat source. According to the thermal-resistant cooling structure disclosed by the utility model, the thermal-resistant part with thermal resistance is formed between a part near the hear source or a high-temperature part with concentrated heat and the like and the casing, so that the radiation of high temperature is properly separated, the phenomenon that abnormal temperature rise occurs in local areas is avoided and temperature equalizing state of the whole casing surface is ensured.

Description

Resistance hot type housing cooling structure

Technical field

The utility model relates to a kind of cooling structure, particularly relates to a kind of resistance hot type housing cooling structure, refers near the heat diffusion at the position of a kind of suitably blocking heat source especially, so that all side shells position is able to keep the cooling structure of samming distribution.

Background technology

Like Fig. 1, shown in Figure 2; One of which is applied to the common traditional heat-dissipating mechanism in the small space; Mainly in the shell 3 that is made up of clamshell 31, base plate 32, a circuit board 10 is set; Be provided with at least one thermal source 1 (can be CPU, power crystal or other can produce the electronic building brick of heat) in this circuit board 10, in being incorporated into via a heat-conducting piece 11 on the heat abstractor 5 (can be assemblies such as fin, heat pipe) on each thermal source 1; During practical application, by the splendid heat conduction efficiency of this heat-conducting piece 11, the heat delivered that can each thermal source 1 be produced and is externally dispersed via this heat abstractor 5 (fin) to this heat abstractor 5 (fin).

Yet; Because the thermal conduction characteristic of common metal material is mostly for having splendid vertical thermal conduction effect; But the true non-excellence of its horizontal thermal conduction effect; Though therefore the heat-conducting piece 11 of this metal material can conduct to the heat that this thermal source 1 is produced on the heat abstractor 5 (fin) apace, disperses in the process of heat at heat abstractor 5 (fin), this heat energy can be directly conducted on shell 5 inner surfaces via the mode of radiation or convection current; Make near the position of this shell 5 corresponding thermal source 1 can produce higher temperature, cause the situation of temperature distributing disproportionation on the whole.

Therefore, for common cooling mechanism, also need study improvement with above-mentioned application shortcoming.

The utility model content

The technical problem that the utility model will solve provides a kind of resistance hot type housing cooling structure, can stop the heat of thermal source directly to diffuse to the corresponding position of shell inner surface through this structure, and can avoid the temperature distributing disproportionation situation on the shell.

For solving the problems of the technologies described above, the resistance hot type housing cooling structure of the utility model, it comprises at least: a shell, its inside are allowed and are inserted the thermal source that can produce heat; One has the hot portion of resistance of thermal resistance effect, is arranged at this shell inner surface is dispersed heat corresponding to this thermal source position.

According to said structure, wherein the hot portion of this resistance is a deformation place of being located at this inner surface of outer cover, by this deformation place to increase the distance between this thermal source and the shell inner surface.

According to said structure, wherein the hot portion of this resistance is a sinking space of being located at this inner surface of outer cover.

According to said structure, wherein the hot portion of this resistance comprises that one is incorporated into the insulating assembly of inner surface of outer cover.

According to said structure, wherein this insulating assembly is plates.

According to said structure, wherein this insulating assembly is attached to this inner surface of outer cover via an adhesion layer.

According to said structure, wherein being provided with one between this thermal source and the hot portion of resistance can be with the conduction diffusion sheet of the even diffusion of heat.

According to said structure, wherein be provided with the heat-conducting piece of a tool high-heat conductive efficency between this thermal source and the conduction diffusion sheet, and this heat-conducting piece contacts with this thermal source, conduction diffusion sheet respectively.

Adopt said structure; The utility model can near the thermal source or heat concentrate to wait the hot portion of resistance of formation one tool thermal resistance between high temperature position and the shell; Use dispersing of suitable this high temperature of obstruct; Avoid causing regional area to produce unusual temperature and raise, and guarantee that whole case surface keeps equal temperature state.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is done further detailed explanation:

Fig. 1 is the STRUCTURE DECOMPOSITION figure of common cooling mechanism;

Fig. 2 is the combination section of common cooling mechanism

Fig. 3 is the STRUCTURE DECOMPOSITION figure of the utility model first embodiment;

Fig. 4 is the entire combination profile of the utility model first embodiment;

Fig. 5 is the STRUCTURE DECOMPOSITION figure of the utility model second embodiment;

Fig. 6 is the entire combination profile of the utility model second embodiment;

Fig. 7 is the heat diffusion situation sketch map of the utility model second embodiment.

Description of reference numerals is following among the figure:

1 is thermal source, and 11 is heat-conducting piece, and 10 is circuit board

2 are the conduction diffusion sheet, and 3 is shell, and 31 is clamshell

32 is base plate, and 4,40 are the hot portion of resistance, and 41 is adhesion layer

5 is heat abstractor

Embodiment

For having more specifically, purpose, effect and characteristic to the utility model understand, existing conjunction with figs. and Reference numeral, and details are as follows:

Like Fig. 3, shown in Figure 4, but the resistance hot type housing cooling structure of knowledge capital utility model first embodiment mainly comprises: thermal source 1, conduction diffusion sheet 2 and hinder hot portion 4 etc. partly; Wherein this thermal source 1 is one can produce the assembly (can be a CPU, power crystal or other similar electronic building brick) of heat; It is arranged on the circuit board 10, and this circuit board 10 then can interior (in the diagram, this clamshell 31 has downward opening according to being arranged at the shell is made up of clamshell 31 and base plate 32 3; 32 of this base plates are covered on the opening of this clamshell 31); And this circuit board 10 has a table side of thermal source 1 towards this base plate 32, in addition is provided with at least one sheet heat-conducting piece 11 with splendid heat conduction efficiency in this thermal source 1, and conduction diffusion sheet 2 is one to have the radiator of splendid heat-conducting effect; It is incorporated on this heat-conducting piece 11; Use the heat of dispersing this thermal source 1, this hinder hot portion 4 can be one have a thermal resistance effect mechanism, it is arranged at the position of this shell 3 (base plate 32) inner surface corresponding to this thermal source 1; In present embodiment; This hinders hot portion 4 is that (for example: sinking space), this deformation place hinders heat conducting effect for increasing the spacing between this thermal source 1 and shell 3 inner surfaces, use to reach to a deformation place of being located at shell 3 (base plate 32) inner surface.

When heat that this thermal source 1 is produced is passed to by heat-conducting piece 11 on the conduction diffusion sheet 2; Wherein there is heat partly and outwards to disperse by the 2 horizontal proliferation conduction of conduction diffusion sheet; Other has the heat that does not partly reach diffusion then can be piled up in the position of this conduction diffusion sheet 2 near thermal source 1 (heat-conducting piece 11); This heat of partly piling up can be dispersed via the mode of radiation or convection current, at this moment, hinders hot portion 4 (being located at the deformation place or the sinking space of shell 3 inner surfaces) by this and hinders control transfer of heat; The position that this shell 3 (base plate 32) is gone up corresponding to this thermal source 1 can't produce higher temperature, makes the situation of these shell 3 surperficial each position temperature distributing disproportionations of unlikely generation.

Extremely shown in Figure 7 like Fig. 5; But the resistance hot type housing cooling structure of knowledge capital utility model second embodiment; Mainly comprise: identical thermal source 1, conduction diffusion sheet 2, shell 3, and the hot portion 40 of a resistance etc. is partly, wherein the hot portion 40 of this resistance one has the sheet insulating assembly of thermal resistance effect; And this insulating assembly is incorporated into the position of this shell 3 (base plate 32) inner surface corresponding to this thermal source 1 via an adhesion layer 41; Hinder the mode of hot portion 40 (insulating assembly) by this, also have and the heat conducting effect of the identical obstruction of aforementioned first embodiment, and then can reach the effect that makes these shell 3 each position sammings of surface with direct obstruct.

Comprehensive the above; The resistance hot type housing cooling structure of the utility model really can be reached the effect of improving heat temperature distributing disproportionation that concentration of local causes; But the content of above-mentioned explanation; Be merely the preferred embodiment explanation of the utility model, the variation, modification, change or the equivalent replacement person that are extended according to the technological means and the category of the utility model such as also all should fall in the scope of the utility model.

Claims

1. one kind is hindered hot type housing cooling structure, it is characterized in that: comprise at least:

One shell, its inside are allowed and are inserted the thermal source that can produce heat;

One has the hot portion of resistance of thermal resistance effect, is arranged at this shell inner surface is dispersed heat corresponding to this thermal source position.

2. resistance hot type housing cooling structure as claimed in claim 1 is characterized in that: the hot portion of said resistance is a deformation place of being located at this inner surface of outer cover, by this deformation place to increase the distance between this thermal source and the shell inner surface.

3. resistance hot type housing cooling structure as claimed in claim 2 is characterized in that: the hot portion of said resistance is a sinking space of being located at this inner surface of outer cover.

4. resistance hot type housing cooling structure as claimed in claim 1 is characterized in that: the hot portion of said resistance comprises that one is incorporated into the insulating assembly of inner surface of outer cover.

5. resistance hot type housing cooling structure as claimed in claim 4, it is characterized in that: said insulating assembly is plates.

6. like claim 4 or 5 described resistance hot type housing cooling structures, it is characterized in that: said insulating assembly is attached to this inner surface of outer cover via an adhesion layer.

7. like each described resistance hot type housing cooling structure of claim 1-5, it is characterized in that: being provided with one between said thermal source and the hot portion of resistance can be with the conduction diffusion sheet of the even diffusion of heat.

8. resistance hot type housing cooling structure as claimed in claim 6 is characterized in that: being provided with one between said thermal source and the hot portion of resistance can be with the conduction diffusion sheet of the even diffusion of heat.

9. resistance hot type housing cooling structure as claimed in claim 7 is characterized in that: be provided with the heat-conducting piece of a tool high-heat conductive efficency between said thermal source and the conduction diffusion sheet, and this heat-conducting piece contacts with this thermal source, conduction diffusion sheet respectively.

10. resistance hot type housing cooling structure as claimed in claim 8 is characterized in that: be provided with the heat-conducting piece of a tool high-heat conductive efficency between said thermal source and the conduction diffusion sheet, and this heat-conducting piece contacts with this thermal source, conduction diffusion sheet respectively.