CN204616265U - heat sink - Google Patents

Abstract

The utility model discloses a heat dissipation device, including a bottom plate and a heat pipe. The bottom plate is provided with a groove. The heat pipe is arranged in the groove, wherein the heat pipe is flattened and completely accommodated in the groove. When the heat dissipation device of the utility model is used in combination with a multi-heat pipe heat dissipation module, the heat of the heat source is transferred to the multi-heat pipe heat dissipation module, and compared with using the bottom plate alone, the heat conduction speed is faster, and compared with a temperature equalizing plate, the heat dissipation device has a better cost performance.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device which can be used in combination with other heat dissipation modules.

Background technique

With the development of the technology industry, the performance of the electronic components in the electronic device is increasingly powerful, and the heat generated by the electronic components also increases accordingly. Therefore, in order to maintain the normal operation of the electronic components, a heat sink is used to help the electronic components dissipate heat.

In order to meet the heat dissipation effect, multiple heat pipes are often designed in the heat sink. When the heat sink is installed on the heat source, in order to allow these heat pipes to be heated evenly and to withstand a higher power heat source, these heat pipes are usually not allowed to directly contact the heat source. Instead, they come into indirect contact with the heat source through a welded base plate or vapor chamber. The base plate or vapor chamber directly contacts the heat source, which then conducts the heat into these heat pipes.

However, the heat conduction effect of the bottom plate is poor, and the cost of the vapor chamber is high.

Utility model content

The utility model discloses a heat dissipation device, which comprises a bottom plate and a heat pipe. The bottom plate is provided with grooves. The heat pipe is arranged in the groove, wherein the heat pipe is flattened and completely accommodated in the groove.

In an embodiment of the present invention, the upper surface of the heat pipe is on the same plane as the upper surface of the bottom plate.

In an embodiment of the present invention, the thickness of the heat pipe is smaller than that of the bottom plate.

In one embodiment of the present invention, the heat pipe is connected to the bottom plate by welding.

In one embodiment of the present invention, the groove is C-shaped.

In an embodiment of the present invention, the heat dissipation device is used in combination with a multi-heat pipe heat dissipation module.

The heat dissipation device of the present utility model, when used in combination with the multi-heat pipe heat dissipation module, conducts the heat of the heat source to the multi-heat pipe heat dissipation module. It has better cost performance.

These and other objects, features, aspects and advantages of the present invention will be clearly understood by those skilled in the art from the following detailed description, which discloses preferred embodiments of the present invention in conjunction with the accompanying drawings.

Description of drawings

1 and 2 are schematic diagrams of the heat dissipation device of the present invention.

Fig. 3 is a cross-sectional view of the heat dissipation device of the present invention.

Fig. 4 is a schematic diagram of the combination of the heat dissipation device of the present invention and other heat dissipation modules.

Detailed ways

Referring to FIG. 1 and FIG. 2 , FIG. 1 and FIG. 2 are schematic diagrams of a heat dissipation device 100 of the present invention.

The heat dissipation device 100 includes a bottom plate 101 , and a groove 102 is formed on the bottom plate 101 , and the groove 102 is used for accommodating a heat pipe 103 .

In this embodiment, the number of grooves 102 is two, which can be used to accommodate two heat pipes 103, but those skilled in the art should know that according to design requirements, the number of grooves 102 can be appropriately increased or decreased to set the corresponding The number of heat pipes 103 .

In this embodiment, the shape of the groove 102 is C-shaped, but those skilled in the art should know that according to design requirements, the groove 102 can also be in other shapes to satisfy heat pipes of different shapes.

Referring to FIG. 3 , FIG. 3 is a cross-sectional view of the heat dissipation device of the present invention. As shown in FIG. 3 , the heat pipe 103 is flattened to be completely embedded in the groove 102 .

3, when the heat pipe 103 has been fully embedded in the groove 102, the upper surface 104 of the heat pipe 103 and the upper surface 105 of the bottom plate 101 are on the same plane, and the thickness of the heat pipe 103 is smaller than the thickness of the bottom plate 101.

In order to achieve a stable connection between the heat pipe 103 and the bottom plate 101 , the heat pipe 103 and the bottom plate 101 can be connected by welding.

Referring to FIG. 4 , FIG. 4 is a schematic diagram of the combined use of the heat dissipation device 100 of the present invention and other heat dissipation modules 200 .

In this embodiment, the cooling module 200 has multiple heat pipes, and is a multi-heat pipe cooling module. Moreover, the heat dissipation module 200 is a dual-fan heat dissipation module, but this case is not limited thereto. The heat dissipation module 200 in this case can also be a single-fan heat dissipation module, or a water-cooled heat dissipation module.

Continue to refer to FIG. 4 , as shown in FIG. 4 , the heat dissipation device 100 is used in combination with the heat dissipation module 200 to dissipate heat from the heat source. One side of the heat sink 100 where the heat pipe is exposed is directly attached to the heat source, and the opposite side is combined with the heat dissipation module 200 . The heat dissipation device 100 and the heat dissipation module 200 can be connected by welding.

The utility model discloses a heat dissipation device. The heat pipe is flattened and directly embedded in the bottom plate. Therefore, when the heat dissipation module combined with multiple heat pipes is used to dissipate heat from the heat source, the heat of the heat source can be conducted faster than that of the bottom plate alone. Compared with the vapor chamber, the heat dissipation module with multiple heat pipes has better cost performance.

Although the utility model has been disclosed as above with the embodiment, it is not intended to limit the utility model. Anyone with ordinary knowledge in the technical field can make some changes without departing from the spirit and scope of the utility model. and retouching, so the scope of protection of the present utility model should be as defined by the claims.

Claims (6)

1. a heat abstractor, is characterized in that comprising:

Base plate, is provided with groove;

Heat pipe, is arranged in above-mentioned groove, wherein above-mentioned heat pipe through flaky process to be placed in completely in above-mentioned groove.

2. heat abstractor according to claim 1, is characterized in that:

The upper surface of above-mentioned heat pipe and the upper surface of above-mentioned base plate are at grade.

3. heat abstractor according to claim 1, its feature with:

The thickness of above-mentioned heat pipe is less than the thickness of above-mentioned base plate.

4. heat abstractor according to claim 1, is characterized in that:

Above-mentioned heat pipe is connected by welding manner with above-mentioned base plate.

5. heat abstractor according to claim 1, is characterized in that:

Above-mentioned groove is C font.

6. heat abstractor according to claim 1, is characterized in that:

Above-mentioned heat abstractor is combined with many heat pipe heat radiations module.