CN106455404B - Heat-insulated middle frame structure and electronic equipment - Google Patents
Heat-insulated middle frame structure and electronic equipment Download PDFInfo
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- CN106455404B CN106455404B CN201510488942.3A CN201510488942A CN106455404B CN 106455404 B CN106455404 B CN 106455404B CN 201510488942 A CN201510488942 A CN 201510488942A CN 106455404 B CN106455404 B CN 106455404B
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Abstract
The invention provides a heat-insulated middle frame structure and an electronic device. The middle frame is applied to electronic equipment and comprises a body and a frame unit, wherein the frame unit comprises an inner layer, an outer layer and a heat insulation layer, the heat insulation layer is positioned between the inner layer and the outer layer, the inner layer is adjacent to the body, the outer layer is positioned on the outermost side of the frame unit, and the heat of the body is prevented from being transferred to the outer layer of the frame unit by the heat insulation layer.
Description
[ technical field ] A
The present invention relates to the field of portable electronic devices, and more particularly, to a heat-insulated middle frame structure and an electronic device.
[ background of the invention ]
At present, the larger the size and the thinner the thickness of smart personal electronic devices such as mobile phones, tablet computers or portable readers are, the worse the heat dissipation performance of the electronic devices becomes, however, most of the heat generated in the electronic devices is generated by the operation of each functional unit, for example, the operation of various units such as a central processing unit (especially a multi-core arithmetic unit configured to address the increase of the execution speed, and even frost on the heat dissipation problem of the terminal device), a battery, a power converter, a display screen, etc. will increase or intensify the heat generated by the electronic devices. At present, the heat sources of most electronic devices are fixed on the middle frame structure of the electronic device, so the middle frame firstly absorbs the heat generated when each functional unit is executed, therefore, after the electronic device is started up to operate, the temperature of the middle frame is very easy to rise, which causes the body and the outer edge of the middle frame to have extremely high temperature, when a user holds the electronic device, because the size of the electronic device is larger (for example, the mainstream of a touch mobile phone is more than 5 inches), the user can hardly grasp the electronic device completely, most of the electronic devices are grasped by fingers, and the contact points or positions for grasping the electronic device are mostly positioned at the outer edge or two longer sides of the middle frame, so that the high temperature is transmitted to the outer edge of the middle frame, which affects or causes the user to use troubles and inconvenience.
[ summary of the invention ]
To effectively solve the above problems, an object of the present invention is to provide an inner frame structure having a heat blocking layer to block heat transfer to an outer layer of a frame unit of an inner frame.
Another object of the present invention is to provide a heat-shielding structure for an electronic device, which is used in the electronic device to prevent heat generated by internal electronic components of the electronic device from being transferred to the side of the electronic device.
To achieve the above object, the present invention provides a heat-insulated middle frame structure, which comprises a main body and a frame unit, wherein the frame unit comprises an inner layer, an outer layer and a heat-insulated layer, the heat-insulated layer is located between the inner layer and the outer layer, the inner layer is adjacent to the main body, and the outer layer is located at the outermost side of the frame unit.
The body and the inner layer and the outer layer of the frame unit are made of metal or nonmetal materials, and the heat insulating layer of the frame unit is made of heat insulating materials.
The body is a flat heat pipe or a hot plate or a temperature-equalizing plate, and a closed chamber is arranged in the body, and a capillary structure and working fluid are arranged in the closed chamber.
To achieve the above object, the present invention further provides an electronic device, comprising: a display module having a front surface; a front shell connected with the display module, wherein the front shell is provided with a window hole, and the front surface of the display module is exposed at the window hole; the middle frame is connected with the front shell and comprises a body and a frame unit, the frame unit comprises an inner side layer, an outer side layer and a heat insulation layer, the heat insulation layer is located between the inner side layer and the outer side layer, the inner side layer is adjacent to the body, the outer side layer is located on the outermost side of the frame unit, and a plurality of internal electronic parts are arranged on the body.
The middle frame is connected with or formed with a back shell.
The body and the inner layer and the outer layer of the frame unit are made of metal or nonmetal materials, and the heat insulating layer of the frame unit is made of heat insulating materials.
The body is a flat heat pipe or a hot plate, and is internally provided with a closed chamber, and a capillary structure and working fluid are arranged in the closed chamber.
The display module is a touch display module, and the front side is a touch display surface.
[ description of the drawings ]
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. Through the embodiments herein and with reference to the corresponding drawings, the embodiments of the present invention will be explained in detail and the operation principle of the invention will be explained.
FIG. 1 is a schematic diagram of a middle frame of the present invention;
FIG. 2A is a cross-sectional partial view of the middle frame of the present invention;
FIG. 2B is a cross-sectional partial schematic view of another alternative implementation of the body of the middle frame of the present invention;
FIG. 3 is a schematic exploded view of an electronic device according to the present invention:
FIG. 4 is a cross-sectional partial schematic view of an electronic device according to the present invention.
The components represented by the respective numbers in the drawings are:
10 middle frame
11 main body
111 first side surface
112 second side surface
1111. 1121 groove
116 sealing the chamber
117 capillary structure
118 working fluid
12a frame unit
121a inner layer
123a outer layer
122a thermal break layer
131 first side
132 second side
20 front shell
21 window hole
30 display module
31 front side
32 back side
40 back shell
41 mainboard
42 cell
43. 44 front and rear lens module
[ detailed description ] A
The above objects of the present invention, together with the structural and functional features thereof, will be best understood from the following description taken in conjunction with the accompanying drawings.
The invention provides a heat-insulating middle frame structure, which comprises a body and a frame unit arranged on at least two opposite sides of the body or arranged on four sides of the body, wherein the frame unit comprises an inner side layer, an outer side layer and a heat-insulating layer, the heat-insulating layer is positioned between the inner side layer and the outer side layer, the inner side layer is adjacent to the body, and the outer side layer is positioned on the outermost side of the frame unit.
Reference will now be made in detail to the various embodiments of the present invention, examples of which are illustrated in the accompanying drawings and described in the following.
FIG. 1 is a schematic diagram of a middle frame of the present invention; FIG. 2A is a schematic cross-sectional view of a middle frame of the present invention; FIG. 2B is a schematic cross-sectional view of another middle frame of the present invention. As shown, the middle frame 10 is applied to an electronic device, and not only serves to support and protect various components in the electronic device, but also relates to the structural strength of the electronic device, so as to directly protect the electronic device when the electronic device is subjected to compression or force. At least a part of the middle frame 10 is made of metal, however, the middle frame 10 may be entirely made of a metal material. Since the strength of the metal material is high, the strength of the whole middle frame 10 is high. The foregoing metal materials are, for example: stainless steel, aluminum-magnesium alloy, aluminum-titanium alloy, and the like.
The middle frame 10 includes a main body 11 and a frame unit 12a, the frame unit 12a is located on at least two opposite sides of the main body 11, which are shown on four sides of the main body 11 in the figure, the frame unit 12a includes an inner layer 121a, an outer layer 123a and a heat insulating layer 122a, the heat insulating layer 122a is sandwiched between the inner layer 121a and the outer layer 123a to prevent the inner layer 121a from contacting the outer layer 123a, wherein the inner layer 121a is adjacent to the periphery of the main body 11, and the outer layer 123a is located on the outermost side of the frame unit 12 a.
The main body 11 has a first side surface 111 and a second side surface 112, which are respectively provided with a plurality of coupling structures such as grooves or through holes or tabs or posts or combinations thereof, in this embodiment, the grooves 1111 and 1121 are shown, by which a plurality of internal electronic components of the electronic device are mounted on the first side surface 111 and/or the second side surface 112.
Furthermore, the inner layer and the outer layer of the body 11 and the frame unit 12 are made of metal and/or non-metal material respectively in one implementation.
In another alternative embodiment, as shown in fig. 2B, the body 11 is a flat heat pipe or a hot plate or a vapor chamber, and has a closed chamber 116 therein, and the closed chamber 116 has a capillary structure 117 and a working fluid 118 therein. The working fluid 118 generates vapor-liquid circulation in the closed chamber 111, so that the heat on the body 11 is uniformly distributed.
In practice, the heat insulation layer 122a is formed of a heat insulation material (also called thermal insulation material). The adiabatic material is, for example, polyurethane foam, glass fiber, asbestos, ethylene propylene rubber (EPDM), or aramid fiber. Preferably, the heat insulating layer 122a is composed of ethylene propylene rubber (EPDM) and aramid fiber, or composed of ethylene propylene rubber (EPDM) and asbestos. Since the heat insulating layer 122a is formed of a heat insulating material, the heat absorbed by the body 11 from the internal electronic parts is not transferred to the frame unit 12 a.
The application implementation of the foregoing middle box will be exemplified below.
Fig. 3 is a schematic exploded view of an electronic device according to the present invention: FIG. 4 is a cross-sectional partial schematic view of an electronic device according to the present invention. The electronic device shown in the figure comprises a middle frame 10, a front shell 20 and a display module 30.
The middle frame 10 is as shown in fig. 1, fig. 2A, fig. 2B and fig. 3, the middle frame 10 includes a main body 11 and a frame unit 12A disposed at the periphery of the main body 11, the frame unit 12A includes an inner layer 121a, an outer layer 123a and a heat blocking layer 122A, the heat blocking layer 122A is disposed between the inner layer 121a and the outer layer 123a, the inner layer 121a is adjacent to the periphery of the main body 11, and the outer layer 123a is disposed at the outermost side of the frame unit 12A. The middle frame 10 is connected to the front shell 20, and the front shell 20 is shown to be located on the first side 111 of the middle frame 10, a receiving space (not shown) is formed between the front shell 20 and the middle frame 10, and a window 21 is formed on the front shell 20.
The display module 30 is fixedly disposed in the accommodating space. The display module 30 includes a front surface 31 and a back surface 32 opposite to the front surface 31, the front surface 31 is a display portion of the display module 30, and when the display module 30 is installed in the accommodating space, the front surface 31 of the display module 30 is exposed through the window hole 21. The display module 30 may be a Liquid Crystal Display (LCD) or a touch display or other alternative devices. When the display module 30 is a touch display panel, the front surface 31 serves as a touch surface for providing touch operation in addition to displaying images.
The middle frame 10 is further connected to a back shell 40, and the back shell 40 is shown to be located on the second side 112 of the middle frame 10, and the front shell 20 and the back shell 40 form the overall shape of the electronic device. The outer layer 123a of the frame unit 12a of the middle frame 10 forms at least two opposite sides or four sides of the electronic device exposed to the outside as a contact area for holding a hand.
A plurality of internal electronic components of the electronic device are disposed on the body 11 of the center frame 10, and the internal electronic components include a main board 41, a battery 42, and front and rear lens modules 43 and 44. The motherboard 41 is provided with various components such as a processor, a power supply chip, and an audio/video chip. In this figure, the main board 41 and the battery 42 are shown as being disposed in the grooves 1111 and 1121 on the first side surface 111 and the second side surface 112 of the main body 11 of the middle frame 10, respectively. The display module 30, the battery 42, and the front and rear lens modules 43 and 44 are electrically connected to the main board 41. In another alternative implementation, the back shell 40 is integrally formed with the middle frame 10, and the plurality of electronic components are disposed on the first side 111 of the body 11 of the middle frame 10.
When the electronic device is operated, heat generated by internal electronic components, such as the main board 41, the battery 42, and the front and rear lens modules 43 and 44, is transferred to the body 11 of the middle frame 10, and the heat-blocking layer 122a of the frame unit 12a is located between the inner layer 121a and the outer layer 123a to block the heat of the body 11 from being transferred to the outer layer 123a of the frame unit 12a, so that the heat generated by the internal electronic components is distributed on the body 11 of the middle frame 10. Furthermore, since the heat of the main body 11 cannot be transferred to the outer layer 123a of the frame unit 12a, the outer layer 123a serving as at least two opposite sides or four sides of the electronic device can be comfortably held by the hand without causing inconvenience and trouble in use.
In a specific implementation, the electronic device may be a mobile phone or a tablet computer, and it should be understood by those skilled in the art that the mobile phone or the tablet computer is only an example, and is not used to limit the technical solution of the embodiment, and other types of electronic devices are also applicable.
According to the above embodiments, the present invention has at least the following advantages:
the heat insulation layer 123a is disposed between the inner layer 121a and the outer layer 123a of the frame unit 12a of the middle frame 10a to insulate the heat of the main body 11 from the outer layer 123a of the frame unit 12a, and at least two opposite sides or four sides of the electronic device are exposed to the outside due to the outer layer 123a of the frame unit 12a, and the two opposite sides (for example, but not limited to, the long sides) are used as contact areas for holding the hand, thereby providing comfortable holding of the electronic device.
However, the above-described preferred embodiments of the present invention are only examples of the present invention, and all changes in the method, shape, structure and apparatus using the above-described method, shape, structure and apparatus of the present invention are all included in the scope of the claims of the present invention.
Claims (8)
1. A heat-insulated frame structure for supporting other components in an electronic device, comprising:
a body having a first side surface and a second side surface, each of which is provided with a plurality of coupling structures for mounting a plurality of internal electronic components in the electronic device; and
the frame unit is arranged at the outer edge of the body and comprises an inner side layer, an outer side layer and a heat insulation layer, the heat insulation layer is positioned between the inner side layer and the outer side layer, the heat insulation layer prevents the inner side layer from contacting the outer side layer, the inner side layer is adjacent to the body, the outer side layer is positioned at the outermost side of the frame unit to form a contact area for holding at least two opposite sides or four sides of the electronic device exposed outside as hands, and the heat insulation layer prevents the heat of the body from being transferred to the outer side layer of the frame unit.
2. The heat-insulating frame structure of claim 1, wherein the inner layer and the outer layer of the frame unit and the body are made of metal or nonmetal, and the heat-insulating layer of the frame unit is made of heat-insulating material.
3. The heat dissipating frame structure of claim 1, wherein the body is a flat heat pipe, a hot plate or a vapor chamber, and the closed chamber contains the capillary structure and the working fluid.
4. An electronic device, comprising:
a display module having a front surface;
a front shell connected with the display module, wherein the front shell is provided with a window hole, and the front surface of the display module is exposed at the window hole;
the middle frame is connected with the front shell and comprises a body and a frame unit, the body is provided with a first side surface and a second side surface which are respectively provided with a plurality of combination structures for a plurality of internal electronic part cases in the electronic device, the frame unit is arranged at the outer edge of the body and comprises an inner side layer, an outer side layer and a heat insulation layer, the heat insulation layer is positioned between the inner side layer and the outer side layer and used for preventing the inner side layer from contacting the outer side layer, the inner side layer is adjacent to the body, the outer side layer is positioned at the outermost side of the frame unit, at least two opposite side edges or four side edges of the electronic device are formed to be exposed to the outside and used as a contact area for holding by hands, and the heat insulation layer is used for preventing the heat of the body from being transferred to the outer side layer of the frame unit.
5. The electronic device of claim 4, wherein the middle frame is connected to or formed with a back shell.
6. The electronic device of claim 4, wherein the inner and outer layers of the body and the frame unit are made of metal or nonmetal, and the heat insulation layer of the frame unit is made of heat insulation material.
7. The electronic device of claim 4, wherein the body is a flat heat pipe or a hot plate, and the body has a sealed chamber therein, and the capillary structure and the working fluid are disposed in the sealed chamber.
8. The electronic device according to claim 4, wherein the display module is a touch display module, and the front surface is a touch display surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510488942.3A CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510488942.3A CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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| Publication Number | Publication Date |
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| CN106455404A CN106455404A (en) | 2017-02-22 |
| CN106455404B true CN106455404B (en) | 2022-07-01 |
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| CN201510488942.3A Active CN106455404B (en) | 2015-08-11 | 2015-08-11 | Heat-insulated middle frame structure and electronic equipment |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770292B (en) * | 2018-06-11 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic equipment and heat dissipation assembly |
| CN108990334B (en) * | 2018-06-29 | 2020-05-19 | Oppo广东移动通信有限公司 | Middle frame assembly and electronic device |
| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
| US11516940B2 (en) | 2018-12-25 | 2022-11-29 | Asia Vital Components Co., Ltd. | Middle bezel frame with heat dissipation structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098904A (en) * | 2011-02-28 | 2011-06-15 | 株洲南车时代电气股份有限公司 | Anti-burning heat radiating device and method of electronic components |
| CN202009411U (en) * | 2011-03-07 | 2011-10-12 | 海能达通信股份有限公司 | Hand-held communication terminal |
| CN202310428U (en) * | 2011-10-25 | 2012-07-04 | 吴哲元 | Thermal-resistant cooling structure of casing |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN104797120A (en) * | 2014-01-21 | 2015-07-22 | 宏达国际电子股份有限公司 | Electronic device |
| CN205196194U (en) * | 2015-08-11 | 2016-04-27 | 奇鋐科技股份有限公司 | Frame structure and electronic equipment among disconnected heat of utensil |
-
2015
- 2015-08-11 CN CN201510488942.3A patent/CN106455404B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098904A (en) * | 2011-02-28 | 2011-06-15 | 株洲南车时代电气股份有限公司 | Anti-burning heat radiating device and method of electronic components |
| CN202009411U (en) * | 2011-03-07 | 2011-10-12 | 海能达通信股份有限公司 | Hand-held communication terminal |
| CN202310428U (en) * | 2011-10-25 | 2012-07-04 | 吴哲元 | Thermal-resistant cooling structure of casing |
| CN104737634A (en) * | 2013-06-19 | 2015-06-24 | 阿莫绿色技术有限公司 | Hybrid insulation sheet and electronic equipment comprising same |
| CN104797120A (en) * | 2014-01-21 | 2015-07-22 | 宏达国际电子股份有限公司 | Electronic device |
| CN205196194U (en) * | 2015-08-11 | 2016-04-27 | 奇鋐科技股份有限公司 | Frame structure and electronic equipment among disconnected heat of utensil |
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| CN106455404A (en) | 2017-02-22 |
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