CN108770292B

CN108770292B - Electronic equipment and heat dissipation assembly

Info

Publication number: CN108770292B
Application number: CN201810597203.1A
Authority: CN
Inventors: 田汉卿
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-06-11
Filing date: 2018-06-11
Publication date: 2020-09-04
Anticipated expiration: 2038-06-11
Also published as: CN108770292A

Abstract

The application relates to an electronic device and a heat dissipation assembly. This heat dissipation assembly includes: a camera; the middle frame comprises a main body part and a side wall extending from the main body part to the direction vertical to the main body part, the main body part comprises a heating area and a heat dissipation area, the camera is arranged in the heating area and at least partially protrudes out of the main body part, and the temperature of the heat dissipation area is lower than that of the heating area; and one end of the heat pipe is in heat conduction connection with at least one side face, protruding relative to the main body part, of the camera in the heating area, and the other end of the heat pipe bends from the side face to the direction of the main body part and then extends into the heat dissipation area. Since the temperature of the heat dissipation area is generally low, the heat generated by the camera can be guided to the low-temperature area through the heat conduction characteristic of the heat pipe, and the heat can be diffused to the periphery through the low temperature, so that the heat can be effectively dissipated. On the other hand, the heat pipe is in heat conduction connection with at least one side face, protruding relative to the main body part, of the camera in the heating area, so that the contact surface can be increased, and the heat pipe can obtain more heat.

Description

Electronic equipment and heat dissipation assembly

Technical Field

The present application relates to the field of electronic devices, and in particular, to an electronic device and a heat dissipation assembly.

Background

With the progress of science and technology and the pursuit of people on the living standard, various functions are continuously developed and perfected aiming at electronic equipment to meet the needs of people. For example, in the existing mobile phone, only the functions of telephone and short message can not meet the requirements of people any more, so that the functions of camera shooting, qq, WeChat and the like are added. This causes problems such as power consumption and heat generation. If the camera generates heat, the function of the camera is affected, and the use experience of a user is reduced.

Disclosure of Invention

The embodiment of the application adopts a technical scheme that: there is provided a heat dissipating assembly comprising:

a camera;

the middle frame comprises a main body part and a side wall extending from the main body part to the direction vertical to the main body part, the main body part comprises a heating area and a heat dissipation area, the camera is arranged in the heating area, at least part of the side surface of the camera protrudes out of the main body part, and the temperature of the heat dissipation area is lower than that of the heating area;

and one end of the heat pipe is in heat conduction connection with at least one side face, opposite to the main body part, of the camera in the heating area, and the other end of the heat pipe extends into the heat dissipation area after being bent from the side face in heat conduction connection towards the main body part.

Another technical scheme adopted by the embodiment of the application is as follows: there is provided an electronic device comprising the heat dissipation assembly as described above.

This application leads the heat that the camera produced to the heat dissipation district of center through the heat pipe. Since the temperature of the heat dissipation area is generally low, the heat generated by the camera can be guided to the low-temperature area through the heat conduction characteristic of the heat pipe, and the heat can be diffused to the periphery through the low temperature, so that the heat can be effectively dissipated.

On the other hand, the heat pipe is in heat conduction connection with at least one side face, protruding relative to the main body part, of the camera in the heating area, so that the contact surface can be increased, and the heat pipe can obtain more heat.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device in a top view according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of the electronic device shown in FIG. 1 along the dashed line A1-A2;

FIG. 3 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 1;

fig. 4 is a schematic structural diagram of another electronic device in a top view according to an embodiment of the present disclosure;

FIG. 5 is a schematic side view of the camera head of FIG. 1 in position;

fig. 6 is a schematic top view of another electronic device provided in the embodiments of the present application;

fig. 7 is a schematic top view of another electronic device provided in the embodiments of the present application;

fig. 8 is a schematic structural diagram of another electronic device provided in the embodiment of the present application;

FIG. 9 is a block diagram of the electronic device shown in FIG. 8;

FIG. 10 is a schematic structural diagram of yet another electronic device provided herein;

fig. 11 is a schematic structural diagram of another electronic device provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 and fig. 3 together, fig. 1 is a schematic top view structure diagram of an electronic device according to an embodiment of the present disclosure, fig. 2 is a schematic cross-sectional structure diagram of the electronic device shown in fig. 1 along a dashed line a1-a2, and fig. 3 is a schematic structure diagram of a middle frame of the electronic device shown in fig. 1. As shown in fig. 1 to 3, the electronic device 10 of the present embodiment includes a heat dissipation assembly 11, a display 12, and a battery 13.

The heat sink assembly 11 includes a camera 111, a middle frame 112, and a heat pipe 113.

The material of the middle frame 112 may include metal, glass, plastic, and the like. The metal material may include copper, aluminum, silver, and alloys of at least two thereof. The material of the middle frame 112 in the present embodiment is preferably metal because metal has good hardness, thermal conductivity, and the like.

The middle frame 112 includes a side wall 1121 and a body portion 1122. The body portion 1122 may have a quadrilateral configuration including a first side 1123 and a second side 1124 disposed opposite to each other. The four side walls 1121 extend from the four sides of the main body 1122 in a direction perpendicular to the main body 1122. Specifically, the four side walls 1121 extend in the same direction from four sides of the first side surface 1123 of the main body 1122, and intersect end to end. The four sidewalls 1121 and the first side surface 1123 of the body portion 1122 form an accommodating space. Wherein the first side 1123 includes a heat generating area 1125 and a heat dissipating area 1126.

In the present embodiment, four sides of the quadrilateral structure of the main body 1122 may be connected at right angles or in an arc transition.

It should be understood that in other embodiments, body portion 1122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.

The camera 111 is disposed in the heat generating region 1125 of the first side surface 1123 of the body portion 1122. Specifically, the main body 1122 has a through hole 1111 opened in the corresponding heat generating region 1125, and the camera 111 is disposed in the through hole 1111.

The camera 111 has a hexahedral structure including six side surfaces. The six side surfaces include oppositely disposed bottom surface 1112 and top surface 1113 and side surface 1114 disposed between bottom surface 1112 and top surface 1113. After the camera 111 is assembled to the through hole 1111, the bottom surface 1112 is adjacent to the second side 1124 of the middle frame 112, and the bottom surface 1112 may be flush with the outer surface of the second side 1124 of the middle frame.

Portions of the top surface 1113 and the side surfaces 1114 are raised relative to a surface of the first side of the body portion 1122. And a lens mount position 1115 is provided on the top surface 1113.

As shown in fig. 1 and 3, the heat generating region 1125 is proximate to the intersecting two

sidewalls

1126 and 1127. I.e., the camera 111 is positioned adjacent to the

sidewalls

1126 and 1127 of the center frame 112. The

sidewalls

1126 and 1127 are the left and upper sidewalls shown in fig. 1 and 3, respectively. That is, the camera 111 is disposed at the upper left position of the middle frame 112.

In other embodiments, the camera 111 may be disposed at other positions, for example, as shown in fig. 4, the camera 111 is disposed only near the upper sidewall 1126 and is disposed at a corresponding middle position of the upper sidewall 1126. Or at an end of the upper sidewall 1126 remote from the left sidewall 1127.

Further, a heat insulation member is further disposed between the camera 111 and the adjacent side wall.

In this embodiment, as shown in fig. 1 and 3, the

sidewalls

1126 and 1127 are hollowed out at locations corresponding to the cameras 111 to form recesses 1128. The heat dissipation assembly 11 further includes a heat insulation member 14 disposed in the groove 1128. The thermal shield 14 may be formed of plastic and may be injection molded with the

sidewalls

1126 and 1127. Whereby the strength of the

side walls

1126 and 1127 can be ensured. Of course, the

sidewalls

1126 and 1127 and the thermal insulation 14 may also be separate elements, with the thermal insulation 14 being disposed in the recess 1128 by nesting or gluing, etc.

The thickness of the thermal shield 14 may be equal to the depth of the groove 1128. The length of the thermal shield 14 may be equal to the length of the groove 1128. The length of the camera head 111 may be equal to the length of the thermal shield 14, thereby thermally isolating the camera head 111 from its

corresponding side walls

1126 and 1127. The heat generated by the camera 111 is prevented from being concentrated in the middle frame nearby the camera 111, so that the electronic device 10 is prevented from being locally heated excessively at the position of the camera 111, and the performance of the camera and the experience of a user are prevented from being influenced.

In other embodiments, the thickness of the thermal shield 14 may also be greater than the depth of the groove 1128. The length of the thermal shield 14 may also be greater than the length of the camera head 111. The strength of the

sidewalls

1126 and 1127 and the thermal isolation effect on the camera head 111 can be further improved.

It should be understood that when the camera 111 is disposed at other positions, the relationship between the camera and the thermal insulation member is similar to that described above, and will not be described herein.

The battery 13 is disposed in the heat dissipation region 1126 of the first side surface 1123 of the body portion 1122. Wherein the heat dissipating area 1126 is generally located away from the heat generating area 1125. For example, as shown in fig. 1 and 3, the heat generating region 1125 is disposed at the upper left of the middle frame 112, and the heat dissipating region 1126 is disposed at the middle and lower portions of the middle frame 112. The battery 13 typically generates a relatively large amount of heat during charging and a relatively small amount of heat during power use. Therefore, in a state where the camera 111 is used, the heat generation region 1125 generally has a higher heat amount than the heat dissipation region 1126.

The heat pipe 113 is disposed on the middle frame 112, and one end of the heat pipe is connected to the side 1114 of the camera 111 protruding relative to the main body 1122 in the heat generating region 1125 in a heat conducting manner, and the other end of the heat pipe is bent from the side 1114 of the heat conducting connection to the direction of the main body 1122 and then extends into the heat dissipating region 1126.

The heat pipe 113 uses the phase change principle and capillary action, so that its heat transfer efficiency is hundreds to thousands times higher than that of metal of the same material. The heat pipe 113 is a vacuum copper pipe, and the working fluid injected therein is a medium for heat transfer. The working liquid can be purified water. The wall of the heat pipe is provided with a liquid absorption core structure. The condensed liquid is returned from the condensing end to the evaporating end by virtue of capillary forces generated by the wick.

Since the liquid is injected before the sealing after the inside of the heat pipe 113 is evacuated, the pressure inside the heat pipe 113 is determined by the vapor pressure after the working liquid is evaporated. The working liquid evaporates as long as the surface of the heat pipe 113 is heated. The vapor at the evaporator end is at a slightly higher temperature and pressure than the rest of the heat pipe, and therefore, a pressure differential is created within the heat pipe 113, causing vapor to flow to the cooler end of the heat pipe. When the steam condenses on the hot tube walls, the steam gives off latent heat of vaporization, thereby transferring heat to the condensing end. The wick structure of the heat pipe then returns the condensed liquid to the evaporator end. The process is cycled as long as the heat source is available for heating.

In a state where the camera 111 is used, the heat generation region 1125 has a high heat amount. The heat pipe 113 of the heat generating region 1125 has a temperature rise, the working liquid is evaporated, and the temperature and pressure of the vapor are higher than those of the other portions of the heat pipe 113. A pressure differential is created within the heat pipe 113 that causes steam to flow into the end of the heat pipe away from the camera 111. As the steam condenses on the heat pipe walls, the steam gives off latent heat of vaporization, transferring heat to the heat dissipation region 1126, allowing heat to be dissipated in the heat dissipation region 1126 away from the heat generating region 1125.

In this embodiment, the main body 1122 of the middle frame 112 is provided with a groove 1129. The grooves 1129 extend from the outer edge of the heat emitting region 1125 to the heat dissipation region 1126.

The heat pipe 113 includes a first pipe segment 1131 and a second pipe segment 1132. The first pipe section 1131 is in heat conduction connection with the side face 1114 of the camera 111, which protrudes relative to the main body 1122, and the second pipe section 1132 is bent from the side face 1114 to the main body 1122 and then embedded in the groove 1129 of the main body 1122.

Specifically, referring to fig. 5, fig. 5 is a schematic side view of the camera shown in fig. 1. The first tube section 1131 is disposed on the first side, and the first tube section 1131 is bonded to the side 1114, in particular by a copper foil 16. The second tube segment 1132 is disposed in the groove 1129 in a direction parallel to the body portion 1122 after being bent 90 degrees at the intersection of the first side surface 1114 and the body portion 1122.

The thickness of the heat pipe 113 may be equal to the thickness of the groove 1129. Thus, the outer surface of the second segment 1132 of the heat pipe 113 is flush with the surface of the body portion 1122.

In other embodiments, the thickness of the heat pipe 113 may be greater than the thickness of the groove 1129. The outer surface of the second tube segment 1132 of the heat pipe 13 is convex with respect to the surface of the body portion 1122.

The heat dissipation assembly 11 further includes an insulation 14, the insulation 14 being disposed in the heat dissipation region 1126. And the heat insulator 14 is disposed between the battery 13 and the heat pipe 113, covering the heat pipe 113. And the size of the heat insulator 14 may be equal to or larger than the size of the heat pipe 113 corresponding to the position of the battery 13. For preventing the heat of the heat pipe 113 from being transferred to the battery 13 to heat the battery 13. The heat insulation member 14 may be made of plastic, heat insulation foam, etc.

The display screen 12 is disposed on a side of a second side 1124 disposed on the center frame 112. The substrate of the display 12 may be glass. Other materials are also possible.

The heat dissipation assembly 11 further includes a heat dissipation member 115, the heat dissipation member 115 is disposed between the display 12 and the second side 1124 of the middle frame 112, and the heat in the middle frame 112 can be further transmitted to the display 12 through the heat dissipation member 115, and the heat dissipation is assisted by the display 12. If the substrate of the display 12 is made of glass, it also has a better heat dissipation capability, so as to improve the heat dissipation capability of the whole electronic device 10.

In this embodiment, the bottom surface 1112 of the camera 111 may contact the heat sink 115. In other embodiments, the bottom surface 1112 of the camera 111 may be spaced apart from the heat dissipation member 115.

The heat dissipation member 115 may be made of graphite or metal.

Referring to fig. 6, fig. 6 is a schematic top view of another electronic device according to an embodiment of the present disclosure. The electronic device 20 shown in fig. 6 differs from the electronic device 10 described above in that: the first tube segment 2131 of the heat pipe 213 of the electronic device 20 shown in fig. 6 is further bent from the side surface 2114 to the top surface 2113, and then is thermally connected to the top surface 2113.

The camera 211 is further provided with a lens placement area 2115 at the position of the top surface 2113. The first tube segment 2131 disposed in the top surface 2113 does not cover the placement area 2115.

Further, copper foil 26 may be further disposed on top surface 2113 to adhere first tube segment 2131 on top surface 2113 to top surface 2113.

The contact area between the heat pipe 213 and the camera 211 is increased in this embodiment, so that heat generated by the camera 211 can be conducted and dissipated conveniently.

Referring to fig. 7, fig. 7 is a schematic top view of another electronic device according to an embodiment of the present disclosure. The electronic device 30 shown in fig. 7 differs from the electronic device 10 described above in that: the heat pipe 313 of the electronic apparatus 30 shown in fig. 7 transfers the heat generated by the camera 311 to the position where the SIM card 33 is disposed.

That is, the heat dissipation area 3126 of the present embodiment is used to dispose the SIM card 33.

It should be understood that in other embodiments, the heat pipe may also transport heat generated by the camera to other areas. As long as it is cooler than the region where the camera is located.

Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of another electronic device according to an embodiment of the present disclosure. Fig. 9 is a schematic structural diagram of a middle frame of the electronic device shown in fig. 8. As shown in fig. 8 and 9, the electronic device 40 of the present embodiment includes a heat dissipation assembly 41, a display screen 42, and a battery (not shown).

The heat dissipation assembly 41 includes a camera 411, a middle frame 412, and a heat pipe 413.

The bezel 412 includes a side wall 4121 and a body portion 4122. The main body 4122 may have a quadrangular structure, and the four side walls 4121 may extend from four sides of the main body 4122 in a direction perpendicular to the main body 4122. The four side walls 4121 extend in the same direction and intersect end to end. The four side walls 4121 and the main body 4122 form an accommodating space. Among them, the main body portion 4122 includes a heat generation region 4125 for disposing the camera 411 and a heat dissipation region 4126 for disposing the battery.

In the present embodiment, four sides of the quadrangular structure of the main body portion 4122 may be connected at right angles or may be connected in an arc transition manner.

It should be understood that in other embodiments, the body portion 4122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.

As shown in fig. 9, the heat generating region 4125 is adjacent to the intersecting two

side walls

4126 and 4127. I.e., the camera 411 is disposed adjacent to the

side walls

4126 and 4127 of the middle frame 412. The

side walls

4126 and 4127 are the left and upper side walls, respectively, shown in fig. 9. That is, the camera 411 of the present embodiment is disposed at the upper left position of the middle frame 412. Further insulation (not shown) is provided between the camera 411 and the two

adjacent side walls

4126 and 4127.

Specifically, the

side walls

4126 and 4127 are hollowed out at positions corresponding to the cameras 411 to form grooves 4128. The heat insulation member is disposed in the groove 4128. The thermal insulation members may be made of plastic, and may be integrally formed with the

side walls

4126 and 4127 by injection molding. Whereby the strength of the

side walls

4126 and 4127 can be secured. May be disposed in the groove 4128 by nesting or gluing, etc.

The relationship between the thermal shield and the groove 4128 and the camera head 411 are as described above and will not be described herein.

The difference from the foregoing middle boxes is: the camera 411 of the present embodiment is provided on the main body portion 4122. The present embodiment also provides a groove 4124 at the position of the heat generating region 4125 of the main body portion 4122. The groove 4124 communicates with the grooves 4128 on the

side walls

4126 and 4127. Further, a heat insulating member 45 is provided on the groove 4124, and the heat insulating member 45 may be integrally formed with the heat insulating member on the groove 4128.

The camera 411 is disposed on the heat insulator 45 of the groove 4124, whereby heat generated by the camera 411 can be further prevented from being conducted to the main body portion 4122 of the heat generation region 4215.

Referring to fig. 10, fig. 10 is a schematic structural diagram of another electronic device provided in the present application. As shown in fig. 10, the electronic device 50 of the present embodiment includes a heat sink 51, a display (not shown), and a battery 53.

The heat sink assembly 51 includes a camera 511, a middle frame 512, and a heat pipe 513.

The middle frame 512 includes a sidewall 5121 and a body 5122. The main body 5122 may have a quadrilateral structure, and four side walls 5121 extend from four sides of the main body 5122 in a direction perpendicular to the main body 5122. The four side walls 5121 extend in the same direction and intersect end to end. The four side walls 5121 and the main body 5122 form an accommodating space. Among them, the main body portion 5122 includes a heat generation region 5125 for disposing the camera 511 and a heat dissipation region 5123 for disposing the battery 53.

The heat pipe 513 guides heat generated by the camera 511 to a heat dissipation area 5123 where the battery 53 is disposed. The specific configuration is as described above, and is not described herein again.

The four sides of the quadrilateral structure of the main body 5122 of this embodiment may be connected at right angles, or may be connected in an arc transition manner.

It is understood that in other embodiments, the body portion 5122 may have other configurations, such as a polygonal configuration, a circular configuration, or the like.

As shown in fig. 10, the heat generation region 5125 is adjacent to the intersecting two

side walls

5126 and 5127. I.e., the camera 511 is disposed adjacent to the

side walls

5126 and 5127 of the middle frame 512. The

side walls

5126 and 5127 are the left and upper side walls, respectively, as shown in fig. 10. That is, the camera 511 of the present embodiment is disposed at the upper left position of the middle frame 512. A thermal shield is provided between the camera 511 and the adjacent side wall.

Specifically, the

side walls

5126 and 5127 are hollowed out at positions corresponding to the positions of the cameras 511 to form grooves 5128. The heat sink assembly 51 further includes a heat insulator 54 disposed in the groove 5128. The thermal insulation members 54 can be made of plastic, and can be integrally formed with the

sidewalls

5126 and 5127 by injection molding. Whereby the strength of the

side walls

5126 and 5127 can be secured. And may be disposed in the groove 5128 by nesting or adhering, etc.

The difference from the previous embodiment is: in this embodiment, the thermal insulation member 54 further includes two

sub-thermal insulation members

541 and 542, and the two

sub-thermal insulation members

541 and 542 are disposed between the side wall and the camera 511 at intervals. As shown in fig. 10, the sub insulator 541 is disposed between the side wall 5126 and the camera 511. The sub insulator 542 is disposed between the side wall 5127 and the camera 511.

The arrangement of the

sub insulation members

541 and 542 may be the same as that of the insulation member 14 described above, and thus, a detailed description thereof will be omitted.

The

sub-insulators

541 and 542 are disposed at intervals in this embodiment, so that the material of the insulator can be reduced while ensuring heat insulation, thereby achieving the purpose of reducing the cost.

It should be appreciated that in other embodiments, other numbers of sub-insulators may be provided, spaced within groove 5128.

Referring to fig. 11, fig. 11 is a schematic structural diagram of another electronic device provided in the present application. As shown in fig. 11, the electronic device 60 of the present embodiment includes a heat sink 61, a display (not shown), and a battery 63.

The heat sink assembly 61 includes a camera 611, a middle frame 612, and a heat pipe 613.

The middle frame 612 includes a sidewall 6121 and a body portion 6122. The main body 6122 may have a quadrilateral structure, and the number of the side walls 6121 is four, and the four side walls extend from four sides of the main body 6122 to a direction perpendicular to the main body 6122. The four sidewalls 6121 extend in the same direction and intersect end to end. The four side walls 6121 and the main body 6122 form an accommodating space. The main body 6122 includes a heat generation area 6124 for disposing the camera 611 and a heat dissipation area 6123 for disposing the battery 63. The heat pipe 613 extends from the heat generation region 6124 to the heat dissipation region 6123 to transfer heat of the camera 611 of the heat generation region 6124 into the heat dissipation region 613. The details can be as described above, and are not described herein.

Four sides of the quadrilateral structure of the main body portion 6122 of this embodiment may be connected at right angles, or may be connected in an arc transition manner.

It should be understood that in other embodiments, the body portion 6122 may also have other structures, such as a polygonal structure, a circular structure, or the like.

As shown in fig. 11, the heat generation region 6124 is adjacent to the two intersecting sidewalls 6126 and 6127. I.e., the camera 611 is disposed adjacent to the

sidewalls

6126 and 6127 of the center frame 612. The

sidewalls

6126 and 6127 are the left and upper sidewalls, respectively, as shown in fig. 9. That is, the camera 611 of the present embodiment is disposed at the upper left position of the middle frame 612. A thermal shield 64 is further disposed between the camera 611 and the two

adjacent sidewalls

6126 and 6127.

Specifically, the

side walls

6126 and 6127 are hollowed out at positions corresponding to the camera 611 to form grooves 6128. The heat dissipation assembly 61 further includes a thermal insulation member 64 disposed in the groove 6128. The heat insulation member 64 can be made of plastic, which can be integrally formed with the

sidewalls

6126 and 6127 by injection molding. Whereby the strength of the

side walls

6126 and 6127 can be secured. And may be disposed in the groove 6128 by nesting or gluing, etc.

The difference from the previous embodiment is: in this embodiment, the thermal insulation 64 is only disposed at the intersection of the

sidewalls

6126 and 6127. I.e., at the top left corner of the middle frame 612.

The arrangement of the insulation 64 can be the same as that of the insulation 14 described above and will not be described in detail.

In this embodiment, the heat insulating member 64 is disposed at the joint of the

side walls

6126 and 6127, so that the material of the heat insulating member can be reduced while heat insulation is ensured, thereby reducing the cost.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A heat dissipation assembly for an electronic device, the heat dissipation assembly comprising:

a camera;

one end of the heat pipe is in heat conduction connection with at least one side face of the camera which protrudes relative to the main body part in the heating area, and the other end of the heat pipe bends from the side face in heat conduction connection to the direction of the main body part and then extends into the heat dissipation area; wherein:

the heat pipe comprises a first pipe section and a second pipe section, the first pipe section is in heat conduction connection with at least one side face of the camera which protrudes relative to the main body part, and the second pipe section is embedded in the main body part after being bent from the side face in heat conduction connection to the direction of the main body part;

the main body part is provided with a groove, and the second pipe section is arranged in the groove;

the side surface of the camera, which is convex relative to the main body part, comprises a first side surface which is vertical to the main body part and a second side surface which is parallel to the main body part;

the first pipe section is arranged on the first side surface, and the second pipe section is bent by 90 degrees at the intersection of the first side surface and the main body part and then arranged in the groove in a direction parallel to the main body part;

the first pipe section is further connected with the second side surface of the camera in a heat conduction mode after being bent from the first side surface of the camera to the second side surface of the camera.

2. The heat dissipation assembly of claim 1, wherein the heat dissipation area is configured to house a battery or a SIM card of the electronic device.

3. The heat dissipation assembly of claim 1, wherein the camera is disposed on the body portion.

4. The heat dissipating assembly of claim 1, wherein the main body has a through hole at the position of the heat generating region, and the camera is disposed in the through hole and partially protrudes from the main body.

5. The heat dissipation assembly of claim 1, wherein the first tube segment is bonded to at least one side surface projecting relative to the main body portion with a copper foil to form a thermally conductive connection.

6. The heat dissipation assembly of claim 3 or 4, wherein the middle frame comprises a first side surface and a second side surface which are oppositely arranged, the first side surface is provided with the heat dissipation area and the heat generation area, and the second side surface is provided with a heat dissipation member.

7. The heat dissipation assembly of claim 1, further comprising a second thermal insulator disposed on the heat dissipation region.

8. An electronic device, characterized in that the electronic device comprises a heat dissipation assembly according to any one of claims 1-7.