CN108770292B - An electronic device and heat dissipation component - Google Patents

Abstract

The application relates to an electronic device and a heat dissipation assembly. This heat dissipation assembly includes: a camera; the middle frame comprises a main body part and a side wall extending from the main body part to the direction vertical to the main body part, the main body part comprises a heating area and a heat dissipation area, the camera is arranged in the heating area and at least partially protrudes out of the main body part, and the temperature of the heat dissipation area is lower than that of the heating area; and one end of the heat pipe is in heat conduction connection with at least one side face, protruding relative to the main body part, of the camera in the heating area, and the other end of the heat pipe bends from the side face to the direction of the main body part and then extends into the heat dissipation area. Since the temperature of the heat dissipation area is generally low, the heat generated by the camera can be guided to the low-temperature area through the heat conduction characteristic of the heat pipe, and the heat can be diffused to the periphery through the low temperature, so that the heat can be effectively dissipated. On the other hand, the heat pipe is in heat conduction connection with at least one side face, protruding relative to the main body part, of the camera in the heating area, so that the contact surface can be increased, and the heat pipe can obtain more heat.

Description

An electronic device and heat dissipation component

technical field

The present application relates to the technical field of electronic devices, and in particular, to an electronic device and a heat dissipation component.

Background technique

With the advancement of science and technology and people's pursuit of living standards, for electronic equipment, various functions are continuously developed and improved to meet people's needs. For example, in today's mobile phones, only the functions of calling and texting can no longer meet people's needs, so functions such as camera, QQ, WeChat, etc. have been added. As a result, problems such as power consumption and heat generation have been brought about. If the camera is hot, it will affect the function of the camera first, and secondly, it will reduce the user experience.

SUMMARY OF THE INVENTION

A technical solution adopted in the embodiments of the present application is to provide a heat dissipation component, including:

Camera;

The middle frame includes a main body portion and a side wall extending from the main body portion in a direction perpendicular to the main body portion, the main body portion includes a heat-generating area and a heat-dissipating area, the camera is arranged in the heat-generating area, and At least part of the side surface protrudes from the main body, and the temperature of the heat dissipation area is lower than the temperature of the heat generation area;

A heat pipe, one end of which is thermally connected to at least one side surface of the camera protruding from the main body portion in the heat-generating area, and the other end is bent from the side surface of the thermally conductive connection to the direction of the main body portion and then extends to the in the cooling zone.

Another technical solution adopted by the embodiments of the present application is to provide an electronic device, where the electronic device includes the aforementioned heat dissipation assembly.

The present application guides the heat generated by the camera to the heat dissipation area of the middle frame through the heat pipe. Since the temperature of the heat dissipation area is usually low, the heat generated by the camera can be guided to the low temperature area through the heat conduction characteristics of the heat pipe, and the heat can be diffused to the surrounding through the low temperature for effective dissipation.

On the other hand, the heat pipe is thermally connected to at least one side surface of the camera that protrudes from the main body in the heat-generating area, thereby increasing the contact surface, and the heat pipe can obtain more heat.

Description of drawings

FIG. 1 is a schematic structural diagram of a top view of an electronic device provided by an embodiment of the present application;

2 is a schematic cross-sectional structural diagram of the electronic device shown in FIG. 1 along the dotted line A1-A2;

Fig. 3 is the structural representation of the middle frame of the electronic device shown in Fig. 1;

FIG. 4 is a schematic top view of another electronic device provided by an embodiment of the present application;

Fig. 5 is the side view structure schematic diagram of the position of the camera shown in Fig. 1;

6 is a schematic top-view structure diagram of another electronic device provided by an embodiment of the present application;

FIG. 7 is a schematic top-view structure diagram of another electronic device provided by an embodiment of the present application;

FIG. 8 is a schematic structural diagram of another electronic device provided by an embodiment of the present application;

9 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 8;

10 is a schematic structural diagram of another electronic device provided by the present application;

FIG. 11 is a schematic structural diagram of another electronic device provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all the structures related to the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

Please refer to FIG. 1 and FIG. 3 together. FIG. 1 is a schematic top view of an electronic device according to an embodiment of the present application, and FIG. 2 is a schematic cross-sectional view of the electronic device shown in FIG. 3 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 1 . As shown in FIGS. 1-3 , the electronic device 10 of this embodiment includes a heat dissipation component 11 , a display screen 12 and a battery 13 .

The heat dissipation assembly 11 includes a camera 111 , a middle frame 112 and a heat pipe 113 .

The material of the middle frame 112 may include metal, glass, plastic, and the like. The metal material may include copper, aluminum, silver, etc., and alloys of at least two of them. Since the hardness and thermal conductivity of metal are good, the material of the middle frame 112 in this embodiment is preferably metal.

The middle frame 112 includes a side wall 1121 and a main body portion 1122 . The main body portion 1122 can be a quadrilateral structure, and includes a first side surface 1123 and a second side surface 1124 which are arranged opposite to each other. There are four side walls 1121 , and the four sides of the main body portion 1122 respectively extend in a direction perpendicular to the main body portion 1122 . Specifically, the four side walls 1121 extend in the same direction from the four sides of the first side surface 1123 of the main body portion 1122 and intersect end to end. The four side walls 1121 and the first side surface 1123 of the main body portion 1122 form an accommodating space. The first side surface 1123 includes a heat-generating area 1125 and a heat-dissipating area 1126 .

The four sides of the quadrilateral structure of the main body portion 1122 in this embodiment may be connected at right angles or may be connected by arc transitions.

It should be understood that, in other embodiments, the main body portion 1122 may also have other structures, such as a polygonal structure, a circular structure, and the like.

The camera 111 is disposed in the heat generating area 1125 of the first side surface 1123 of the main body portion 1122 . Specifically, the main body portion 1122 defines a through hole 1111 in the corresponding heating region 1125 , and the camera 111 is disposed in the through hole 1111 .

The camera 111 is a hexahedron structure, including six sides. The six side surfaces include a bottom surface 1112 and a top surface 1113 arranged opposite to each other and a side surface 1114 arranged between the bottom surface 1112 and the top surface 1113 . After the camera 111 is assembled to the through hole 1111 , its bottom surface 1112 is close to the second side 1124 of the middle frame 112 , and the bottom surface 1112 may be flush with the outer surface of the second side 1124 of the middle frame.

Parts of the top surface 1113 and the side surface 1114 are convex with respect to the surface of the first side of the main body part 1122 . And a mounting position 1115 of the lens is provided on the top surface 1113 .

As shown in FIGS. 1 and 3 , the heat generating area 1125 is adjacent to the two side walls 1126 and 1127 that intersect. That is, the camera 111 is disposed close to the side walls 1126 and 1127 of the middle frame 112 . The side walls 1126 and 1127 are the left side wall and the upper side wall shown in FIGS. 1 and 3 , respectively. That is to say, the camera 111 is arranged at the upper left position of the middle frame 112 .

In other embodiments, the camera 111 may also be arranged at other positions. For example, as shown in FIG. 4 , the camera 111 is only arranged close to the upper side wall 1126 , and is arranged in the middle position corresponding to the upper side wall 1126 . Alternatively, the upper side wall 1126 may be arranged at a position away from one end of the left side wall 1127 .

Further, a heat insulating member is further arranged between the camera 111 and the adjacent side wall.

In this embodiment, as shown in FIGS. 1 and 3 , the side walls 1126 and 1127 are hollowed out at positions corresponding to the camera 111 to form a groove 1128 . The heat dissipation assembly 11 further includes a heat insulating member 14 disposed in the groove 1128 . The material of the heat insulating member 14 can be plastic, which can be integrally formed with the side walls 1126 and 1127 by means of injection molding. Thereby, the strength of the side walls 1126 and 1127 can be ensured. Of course, the side walls 1126 and 1127 and the heat insulating member 14 may also be independent elements, and the heat insulating member 14 is arranged in the groove 1128 by means of nesting or sticking.

The thickness of insulator 14 may be equal to the depth of groove 1128 . The length of insulator 14 may be equal to the length of groove 1128 . The length of the camera head 111 may be equal to the length of the heat insulating member 14, thereby thermally isolating the camera head 111 from the side walls 1126 and 1127 corresponding to its position. The heat generated by the camera 111 is prevented from being concentrated in the middle frame near it, thereby preventing the electronic device 10 from being overheated locally at the position of the camera 111 , affecting the performance of the camera and the user's experience.

In other embodiments, the thickness of insulator 14 may also be greater than the depth of groove 1128 . The length of the heat shield 14 may also be greater than the length of the camera 111 . The strength of the side walls 1126 and 1127 and the thermal isolation effect on the camera 111 can be further improved.

It should be understood that when the camera 111 is disposed at other positions, the relationship between the camera 111 and the heat insulating member is similar to that described above, and details are not repeated here.

The battery 13 is disposed in the heat dissipation area 1126 of the first side surface 1123 of the main body portion 1122 . The heat dissipation area 1126 is generally disposed away from the heat generation area 1125 . For example, as shown in FIGS. 1 and 3 , the heat generating area 1125 is arranged at the upper left position of the middle frame 112 , and the heat dissipation area 1126 is arranged at the middle and lower positions of the middle frame 112 . The battery 13 usually generates a large amount of heat during charging, and relatively small heat during power supply use. Therefore, when the camera 111 is in use, the heat of the heat-generating region 1125 is generally higher than that of the heat-dissipating region 1126 .

The heat pipe 113 is disposed on the middle frame 112, and one end is thermally connected to the side 1114 of the camera 111 that is protruded from the main body 1122 in the heat generating area 1125, and the other end is bent and extended from the side 1114 of the thermally connected to the main body 1122. into the heat sink 1126.

The heat pipe 113 utilizes the principle of phase change and capillary action, so that its own heat transfer efficiency is hundreds to thousands of times higher than that of metals of the same material. The heat pipe 113 is a vacuum copper pipe, and the working liquid injected therein is the medium of heat transfer. The working liquid can be pure water. There is a liquid-absorbing core structure on the wall of the heat pipe. Relying on the capillary force generated by the wick, the condensed liquid is returned from the condensing end to the evaporating end.

After the inside of the heat pipe 113 is evacuated, the liquid is injected before the sealing, so the pressure inside the heat pipe 113 is determined by the vapor pressure of the working liquid after evaporation. As long as the surface of the heat pipe 113 is heated, the working liquid will evaporate. The temperature and pressure of the steam at the evaporating end are slightly higher than other parts of the heat pipe, therefore, a pressure difference is generated in the heat pipe 113, which promotes the steam to flow to the cooler end of the heat pipe. When the steam condenses on the wall of the heat pipe, the steam releases the latent heat of vaporization, thereby transferring the heat to the condensing end. After that, the wick structure of the heat pipe makes the condensed liquid return to the evaporation end. As long as there is a heat source heating, this process will cycle.

When the camera 111 is in use, the heat of the heat generating area 1125 is relatively high. The temperature of the heat pipe 113 in the heat generating area 1125 increases, the working liquid evaporates, and the temperature and pressure of the steam are higher than other parts of the heat pipe 113 . A pressure difference is generated in the heat pipe 113 , which causes the steam to flow to the end of the heat pipe that is away from the camera 111 . When the steam condenses on the wall of the heat pipe, the steam releases latent heat of vaporization, thereby transferring the heat to the heat dissipation area 1126 , so that the heat can be dissipated in the heat dissipation area 1126 away from the heat generating area 1125 .

In this embodiment, the main body 1122 of the middle frame 112 is provided with a groove 1129 . The groove 1129 extends from the outer edge of the heat-generating region 1125 to the heat-dissipating region 1126 .

The heat pipe 113 includes a first pipe section 1131 and a second pipe section 1132 . The first pipe section 1131 is thermally connected to the side 1114 of the camera 111 protruding from the main body 1122 , and the second pipe section 1132 is bent from the side 1114 to the main body 1122 and embedded in the groove 1129 of the main body 1122 .

Specifically, please refer to FIG. 5 . FIG. 5 is a schematic side view of the structure of the camera shown in FIG. 1 . The first pipe section 1131 is disposed on the first side surface, and specifically, the first pipe section 1131 is bonded to the side surface 1114 through the copper foil 16 . The second pipe section 1132 is disposed in the groove 1129 in a direction parallel to the main body 1122 after being bent by 90 degrees at the intersection of the first side surface 1114 and the main body 1122 .

The thickness of the heat pipe 113 may be equal to the thickness of the groove 1129 . Therefore, the outer surface of the second pipe section 1132 of the heat pipe 113 is flush with the surface of the main body portion 1122 .

In other embodiments, the thickness of the heat pipe 113 may be greater than the thickness of the groove 1129 . The outer surface of the second pipe section 1132 of the heat pipe 13 is convex with respect to the surface of the main body portion 1122 .

The heat dissipation assembly 11 further includes a heat insulating member 14 , and the heat insulating member 14 is disposed in the heat dissipation area 1126 . And the heat insulating member 14 is disposed between the battery 13 and the heat pipe 113 to cover the heat pipe 113 . And the size of the heat insulating member 14 may be equal to or larger than the size of the heat pipe 113 corresponding to the position of the battery 13 . It is used to prevent the heat of the heat pipe 113 from being transferred into the battery 13 to make the battery 13 generate heat. The material used for the heat insulating member 14 may be plastic, heat insulating foam, or the like.

The display screen 12 is disposed on one side of the second side surface 1124 of the middle frame 112 . The substrate of the display screen 12 may be glass. Other materials are also possible.

The heat dissipation assembly 11 further includes a heat dissipation member 115, and the heat dissipation member 115 is arranged between the display screen 12 and the second side surface 1124 of the middle frame 112, and the heat in the middle frame 112 can be further transferred to the display screen 12 through the heat dissipation member 115, The display screen 12 performs auxiliary heat dissipation. If the substrate of the display screen 12 is made of glass, it also has better heat dissipation capability, thereby improving the heat dissipation capability of the entire electronic device 10 .

In this embodiment, the bottom surface 1112 of the camera 111 can be in contact with the heat sink 115 . In other embodiments, the bottom surface 1112 of the camera 111 and the heat dissipation member 115 may also be spaced apart.

The heat sink 115 can be made of materials with good heat dissipation such as graphite or metal.

Please refer to FIG. 6 , which is a schematic top-view structural diagram of another electronic device provided by an embodiment of the present application. The difference between the electronic device 20 shown in FIG. 6 and the electronic device 10 described above is that the first pipe section 2131 of the heat pipe 213 of the electronic device 20 shown in FIG. 6 is further bent from the side surface 2114 to the top surface 2113 and then The top surface 2113 is thermally connected.

The camera head 211 is further provided with a lens placement area 2115 at the position of the top surface 2113 . Therefore, the first pipe section 2131 arranged in the top surface 2113 does not cover the placement area 2115 .

Further, the copper foil 26 may be further disposed on the top surface 2113 to bond the first pipe section 2131 on the top surface 2113 to the top surface 2113 .

In this embodiment, the contact area between the heat pipe 213 and the camera 211 is increased, so as to facilitate conduction and heat dissipation of the heat generated by the camera 211 .

Please refer to FIG. 7 , which is a schematic top-view structural diagram of another electronic device provided by an embodiment of the present application. The difference between the electronic device 30 shown in FIG. 7 and the aforementioned electronic device 10 is that the heat pipe 313 of the electronic device 30 shown in FIG. 7 transfers the heat generated by the camera 311 to the position where the SIM card 33 is set.

That is to say, the heat dissipation area 3126 in this embodiment is used to set the SIM card 33 .

It should be understood that in other embodiments, the heat pipe may also transmit the heat generated by the camera to other areas. As long as it is cooler than the area where the camera is set up.

Please refer to FIG. 8 and FIG. 9 . FIG. 8 is a schematic structural diagram of another electronic device provided by an embodiment of the present application. FIG. 9 is a schematic structural diagram of a middle frame of the electronic device shown in FIG. 8 . As shown in FIG. 8 and FIG. 9 , the electronic device 40 of this embodiment includes a heat dissipation component 41 , a display screen 42 and a battery (not shown).

The heat dissipation assembly 41 includes a camera 411 , a middle frame 412 and a heat pipe 413 .

The middle frame 412 includes a side wall 4121 and a main body portion 4122 . The main body portion 4122 can be a quadrilateral structure, and there are four side walls 4121 , and the four sides of the main body portion 4122 respectively extend in a direction perpendicular to the main body portion 4122 . The extending directions of the four side walls 4121 are the same and intersect end to end. The four side walls 4121 and the main body 4122 form an accommodating space. The main body 4122 includes a heat generating area 4125 for setting the camera 411 and a heat dissipation area 4126 for setting the battery.

The four sides of the quadrilateral structure of the main body portion 4122 in this embodiment may be connected at right angles, or may be connected by arc transitions.

It should be understood that, in other embodiments, the main body portion 4122 may also have other structures, such as a polygonal structure or a circular structure.

As shown in FIG. 9 , the heat generating area 4125 is adjacent to the two side walls 4126 and 4127 that intersect. That is, the camera 411 is disposed close to the side walls 4126 and 4127 of the middle frame 412 . The side walls 4126 and 4127 are the left side wall and the upper side wall shown in FIG. 9 , respectively. That is to say, the camera 411 in this embodiment is arranged at the upper left position of the middle frame 412 . A heat shield (not shown in the figure) is further provided between the camera 411 and the two adjacent side walls 4126 and 4127 .

Specifically, the side walls 4126 and 4127 are hollowed out at positions corresponding to the camera 411 to form a groove 4128 . The heat insulating element is arranged in the groove 4128 . The material of the heat insulating element can be plastic, which can be integrally formed with the side walls 4126 and 4127 by means of injection molding. Thereby, the strength of the side walls 4126 and 4127 can be ensured. It can also be arranged in the groove 4128 by means of nesting or sticking.

The relationship between the heat insulating member, the groove 4128 and the camera 411 is as described above, and will not be repeated here.

The difference from the middle frame described above is that the camera 411 in this embodiment is disposed on the main body portion 4122 . In this embodiment, a groove 4124 is also provided at the position of the heat generating region 4125 of the main body portion 4122 . Grooves 4124 communicate with grooves 4128 on side walls 4126 and 4127. A heat insulating member 45 is further provided on the groove 4124, and the heat insulating member 45 can be integrally formed with the heat insulating member on the groove 4128.

The camera 411 is disposed on the heat insulating member 45 of the groove 4124 , thereby further preventing the heat generated by the camera 411 from being conducted to the main body 4122 of the heating area 4215 .

Please refer to FIG. 10 , which is a schematic structural diagram of another electronic device provided by the present application. As shown in FIG. 10 , the electronic device 50 of this embodiment includes a heat dissipation component 51 , a display screen (not shown) and a battery 53 .

The heat dissipation assembly 51 includes a camera 511 , a middle frame 512 and a heat pipe 513 .

The middle frame 512 includes a side wall 5121 and a main body portion 5122 . The main body portion 5122 can be a quadrilateral structure, and there are four side walls 5121 , and the four sides of the main body portion 5122 respectively extend in a direction perpendicular to the main body portion 5122 . The extending directions of the four side walls 5121 are the same and intersect end to end. The four side walls 5121 and the main body 5122 form an accommodating space. The main body portion 5122 includes a heat-generating area 5125 for arranging the camera 511 and a heat-dissipating area 5123 for arranging the battery 53 .

The heat pipe 513 guides the heat generated by the camera 511 to the heat dissipation area 5123 where the battery 53 is provided. The specific settings are as described above, and are not repeated here.

The four sides of the quadrilateral structure of the main body portion 5122 in this embodiment may be connected at right angles, or may be connected by arc transitions.

It should be understood that, in other embodiments, the main body portion 5122 may also have other structures, such as a polygonal structure, a circular structure, and the like.

As shown in FIG. 10 , the heat generating area 5125 is adjacent to the two side walls 5126 and 5127 that intersect. That is, the camera 511 is disposed close to the side walls 5126 and 5127 of the middle frame 512 . The side walls 5126 and 5127 are the left side wall and the upper side wall shown in FIG. 10 , respectively. That is to say, the camera 511 in this embodiment is arranged at the upper left position of the middle frame 512 . A heat shield is provided between the camera 511 and the adjacent side wall.

Specifically, the side walls 5126 and 5127 are hollowed out at positions corresponding to the camera 511 to form a groove 5128 . The heat dissipation assembly 51 further includes a heat insulating member 54 disposed in the groove 5128 . The material of the heat insulating member 54 can be plastic, which can be integrally formed with the side walls 5126 and 5127 by means of injection molding. Thereby, the strength of the side walls 5126 and 5127 can be ensured. It can also be arranged in the groove 5128 by means of nesting or sticking.

The difference from the previous embodiment is that in this embodiment, the heat insulating member 54 further includes two sections of sub-insulation members 541 and 542 , and the two sections of sub-insulation members 541 and 542 are disposed between the side wall and the camera 511 at intervals. As shown in FIG. 10 , the sub-insulation member 541 is disposed between the side wall 5126 and the camera 511 . The sub-insulation piece 542 is disposed between the side wall 5127 and the camera 511 .

The arrangement of the sub-insulation pieces 541 and 542 can be the same as that of the heat insulation piece 14 described above, which is not repeated here.

In this embodiment, the sub-insulation members 541 and 542 are arranged at intervals, so that the material of the insulation member can be reduced under the condition of ensuring the insulation, so as to achieve the purpose of reducing the cost.

It should be understood that in other embodiments, other numbers of sub-insulation elements may also be provided, which are arranged in the grooves 5128 at intervals.

Please refer to FIG. 11 , which is a schematic structural diagram of another electronic device provided by the present application. As shown in FIG. 11 , the electronic device 60 of this embodiment includes a heat dissipation component 61 , a display screen (not shown) and a battery 63 .

The heat dissipation assembly 61 includes a camera 611 , a middle frame 612 and a heat pipe 613 .

The middle frame 612 includes a side wall 6121 and a main body portion 6122 . The main body portion 6122 can be a quadrilateral structure, and there are four side walls 6121 , and the four sides of the main body portion 6122 respectively extend in a direction perpendicular to the main body portion 6122 . The extending directions of the four side walls 6121 are the same and intersect end to end. The four side walls 6121 and the main body 6122 form an accommodating space. The main body 6122 includes a heat generating area 6124 for arranging the camera 611 and a heat dissipation area 6123 for arranging the battery 63 . The heat pipe 613 extends from the heat-generating area 6124 to the heat-dissipating area 6123 to transfer the heat of the camera 611 in the heat-generating area 6124 to the heat-dissipating area 613 . The details can be as described above, and details are not repeated here.

The four sides of the quadrilateral structure of the main body portion 6122 in this embodiment may be connected at right angles or may be connected by arc transitions.

It should be understood that, in other embodiments, the main body portion 6122 may also have other structures, such as a polygonal structure, a circular structure, and the like.

As shown in FIG. 11 , the heat generating region 6124 is adjacent to the intersecting two side walls 6126 and 6127 . That is, the camera 611 is disposed close to the side walls 6126 and 6127 of the middle frame 612 . The side walls 6126 and 6127 are the left side wall and the upper side wall shown in FIG. 9 , respectively. That is to say, the camera 611 in this embodiment is disposed at the upper left position of the middle frame 612 . A heat shield 64 is further disposed between the camera 611 and the two adjacent side walls 6126 and 6127 .

Specifically, the side walls 6126 and 6127 are hollowed out at positions corresponding to the camera 611 to form a groove 6128 . The heat dissipation assembly 61 further includes a heat insulating member 64 disposed in the groove 6128 . The material of the heat insulating member 64 can be plastic, which can be integrally formed with the side walls 6126 and 6127 by means of injection molding. Thereby, the strength of the side walls 6126 and 6127 can be ensured. It can also be arranged in the groove 6128 by means of nesting or sticking.

The difference from the previous embodiment is that in this embodiment, the heat insulating member 64 is only provided at the junction of the side walls 6126 and 6127 . That is, it is set at the upper left corner of the middle frame 612 .

The arrangement of the heat insulating element 64 can be the same as that of the heat insulating element 14 described above, and details are not repeated here.

In this embodiment, a heat insulating member 64 is provided at the junction of the side walls 6126 and 6127, which can reduce the material of the heat insulating member while ensuring heat insulation, thereby achieving the purpose of reducing costs.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (8)

1. A heat dissipation assembly for an electronic device, the heat dissipation assembly comprising:

a camera;

the middle frame comprises a main body part and a side wall extending from the main body part to the direction vertical to the main body part, the main body part comprises a heating area and a heat dissipation area, the camera is arranged in the heating area, at least part of the side surface of the camera protrudes out of the main body part, and the temperature of the heat dissipation area is lower than that of the heating area;

one end of the heat pipe is in heat conduction connection with at least one side face of the camera which protrudes relative to the main body part in the heating area, and the other end of the heat pipe bends from the side face in heat conduction connection to the direction of the main body part and then extends into the heat dissipation area; wherein:

the heat pipe comprises a first pipe section and a second pipe section, the first pipe section is in heat conduction connection with at least one side face of the camera which protrudes relative to the main body part, and the second pipe section is embedded in the main body part after being bent from the side face in heat conduction connection to the direction of the main body part;

the main body part is provided with a groove, and the second pipe section is arranged in the groove;

the side surface of the camera, which is convex relative to the main body part, comprises a first side surface which is vertical to the main body part and a second side surface which is parallel to the main body part;

the first pipe section is arranged on the first side surface, and the second pipe section is bent by 90 degrees at the intersection of the first side surface and the main body part and then arranged in the groove in a direction parallel to the main body part;

the first pipe section is further connected with the second side surface of the camera in a heat conduction mode after being bent from the first side surface of the camera to the second side surface of the camera.

2. The heat dissipation assembly of claim 1, wherein the heat dissipation area is configured to house a battery or a SIM card of the electronic device.

3. The heat dissipation assembly of claim 1, wherein the camera is disposed on the body portion.

4. The heat dissipating assembly of claim 1, wherein the main body has a through hole at the position of the heat generating region, and the camera is disposed in the through hole and partially protrudes from the main body.

5. The heat dissipation assembly of claim 1, wherein the first tube segment is bonded to at least one side surface projecting relative to the main body portion with a copper foil to form a thermally conductive connection.

6. The heat dissipation assembly of claim 3 or 4, wherein the middle frame comprises a first side surface and a second side surface which are oppositely arranged, the first side surface is provided with the heat dissipation area and the heat generation area, and the second side surface is provided with a heat dissipation member.

7. The heat dissipation assembly of claim 1, further comprising a second thermal insulator disposed on the heat dissipation region.

8. An electronic device, characterized in that the electronic device comprises a heat dissipation assembly according to any one of claims 1-7.

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