CN107072105B

CN107072105B - Heat radiation unit

Info

Publication number: CN107072105B
Application number: CN201611154852.1A
Authority: CN
Inventors: 陈志明
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2016-12-14
Filing date: 2016-12-14
Publication date: 2020-01-03
Anticipated expiration: 2036-12-14
Also published as: CN107072105A

Abstract

A heat dissipation unit comprises a body formed integrally, the body is divided into a first cavity and at least one second cavity, the first cavity and the second cavity are adjacent and not communicated, wherein the first cavity is filled with a first working fluid and defined as a first heat dissipation part, the second cavity is filled with a second working fluid and defined as a second heat dissipation part, and the first heat dissipation part is correspondingly connected with the second heat dissipation part.

Description

Heat radiation unit

[ technical field ] A method for producing a semiconductor device

The present invention relates to a heat dissipation unit, and more particularly, to a heat dissipation unit with a large area heat dissipation and a remote heat conduction capability, which can greatly reduce the production cost.

[ background of the invention ]

With the progress of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit process more data, the integrated circuit with the same volume can already contain more than several times of the conventional computing devices, and the execution efficiency is higher and higher as the number of the computing devices in the integrated circuit is higher and higher, so the heat generated by the computing devices during operation is also higher and higher.

The CPU and the chip or other electronic components in the electronic device are all heating sources in the electronic device, and when the electronic device is operated, the heating sources will generate heat, so that the heat conducting components such as heat pipes, temperature equalizing plates, flat heat pipes, etc. are commonly used to conduct heat conduction or temperature equalization with good heat dissipation and heat conduction efficiency, wherein the heat pipes are mainly used for remote heat conduction; one end (heat absorption end) absorbs heat to convert the internal working fluid from liquid state to vapor state for evaporation and transfers the heat to the other end (heat dissipation end) of the heat pipe, so as to achieve the purpose of heat conduction, and the part requiring larger heat transfer area can select the temperature equalizing plate as the heat dissipation element, the temperature equalizing plate mainly absorbs heat from one side plane contacting with the heat source and then transfers the heat to the other side of the corresponding plane for heat dissipation and condensation.

However, the conventional heat dissipation elements such as the heat pipe and the temperature equalization plate are all heat dissipation elements with a single solution (only single temperature equalization or long-distance heat conduction), in other words, the conventional heat dissipation elements are disposed in the electronic device only for the position where the heat pipe or the temperature equalization plate contacts the heat source to conduct heat dissipation such as heat conduction or temperature equalization, and thus, the heat dissipation elements cannot have the effects of temperature equalization and long-distance heat dissipation at the same time, and certainly, the heat exchange efficiency is relatively poor.

[ summary of the invention ]

Therefore, in order to effectively solve the above problems, the present invention is directed to a heat dissipation unit capable of greatly reducing the production cost.

The secondary objective of the present invention is to provide a heat dissipation unit having both large-area heat dissipation and remote heat conduction.

To achieve the above object, the present invention provides a heat dissipation unit, which includes a body formed integrally, the body has a first cavity and at least a second cavity, the first and second cavities are adjacent and not connected, the first cavity is filled with a first working fluid and defined as a first heat dissipation portion, the second cavity is filled with a second working fluid and defined as a second heat dissipation portion, the first heat dissipation portion is correspondingly connected to the second heat dissipation portion, wherein the inner wall of the first cavity has a first capillary structure, the inner wall of the second cavity has a second capillary structure, and the first and second capillary structures are not connected.

Through the design of the structure of the present invention, the effects of large-area heat dissipation and remote heat conduction heat dissipation can be achieved at the same time, so as to improve the problem that the conventional temperature equalization plate and heat pipe have only a single solution.

[ description of the drawings ]

FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation unit of the present invention;

FIG. 2 is a perspective assembly view of a heat dissipation unit according to a first embodiment of the present invention;

FIG. 3 is a cross-sectional view of a first embodiment of the heat dissipation unit of the present invention;

FIG. 4 is a top view of a second embodiment of the heat dissipation unit of the present invention;

FIG. 5 is an exploded perspective view of a heat sink unit according to a third embodiment of the present invention;

FIG. 6 is a top view of a fourth embodiment of a heat dissipation unit of the present invention;

FIG. 7 is a top view of a fifth embodiment of the heat dissipation unit of the present invention;

FIG. 8 is a cross-sectional view of a sixth embodiment of the heat dissipating unit of the present invention.

Description of the main symbols:

body 1

First plate body 11

Second plate body 12

First heat sink member 13

First connection end 131

Second connecting end 132

First chamber 133

First working fluid 134

First capillary structure 135

Second heat sink member 14

Heat sink end 141

Heat dissipating end 142

Second chamber 143

Second working fluid 144

Second capillary structure 145

A support structure 15.

[ detailed description ] embodiments

The above objects of the present invention, together with the structural and functional features thereof, are best understood from the following description of the preferred embodiments when read in connection with the accompanying drawings.

Referring to fig. 1, 2 and 3, which are an exploded view, an assembled view and a sectional view of a heat dissipating unit according to a first embodiment of the present invention, as shown in the drawings, a heat dissipating unit includes a body 1 formed integrally, the body 1 has a first plate 11 covering a second plate 12 correspondingly, the body 1 has a first heat dissipating portion 13 connected to at least one second heat dissipating portion 14, in this embodiment, the first heat dissipating portion 13 is equivalent to a temperature equalizing plate structure, but not limited thereto, and in the specific implementation, the first heat dissipating portion may be other equivalent same as the temperature equalizing plate, and the second heat dissipating portion 14 is equivalent to a heat pipe structure, but not limited thereto, and in the specific implementation, the second heat dissipating portion may be other equivalent same as the heat pipe;

the first heat sink 13 has a first connection end 131 and a second connection end 132, and the first heat sink 13 is formed with a first chamber 133 filled with a first working fluid 134, the inner wall of the first chamber 133 has a first capillary structure 135;

the second heat sink 14 has a heat absorbing end 141 and a heat dissipating end 142, and the second heat sink 14 forms a second chamber 143 filled with a second working fluid 144, the inner wall of the second chamber 143 has a second capillary structure 145, the first and

second chambers

133, 143 are defined between the first plate 11 and the second plate 12 (i.e. on the same plane) and are not communicated with each other, and the first and

second working fluids

134, 144 may be any one of pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coals or organic compounds;

the first and second

capillary structures

135, 145 can be selected from one or more of meshes, fiber bodies, sintered powder bodies, combinations of meshes and sintered powder, or micro-grooves, and the first and second

capillary structures

135, 145 are not connected to each other;

through the design of the structure of the present invention, since the main body 1 is an integrally formed structure, the heat absorbing end 141 of the second heat dissipating part 14 is connected to the first connecting end 131 of the first heat dissipating part 13, and the heat dissipating end 142 of the second heat dissipating part 14 extends toward the opposite direction of the heat absorbing end 141, but not limited thereto, in an embodiment, the heat absorbing end 141 of the second heat dissipating part 14 can be selectively connected to the other two sides of the first and second connecting

ends

131, 132 of the first heat dissipating part 13 (not shown);

when the second board 12 of the main body 1 contacts a heat source (such as a CPU, MCU, graphic processor, or other electronic components or coils that generate heat, not shown), the heat of the heat source can be conducted to a far end through the structural design of the second heat sink 14 in addition to the first heat sink 13 to perform large-area uniform-temperature heat dissipation, so that the heat source has far-end heat conduction and heat dissipation effects, thereby improving the time and cost required for manufacturing the conventional uniform-temperature plate and heat pipe separately, and further greatly reducing the cost of production, and also having large-area heat dissipation and far-end heat conduction and heat dissipation effects.

Please refer to fig. 4, which is a top view of a second embodiment of the heat dissipation unit of the present invention, wherein the corresponding relationship between some components of the heat dissipation unit and the components is the same as the heat dissipation unit, and therefore, the description is omitted herein, but the main difference between the heat dissipation unit and the above-mentioned heat dissipation unit is that the first and second connection ends 131 and 132 of the first heat dissipation part 13 are respectively connected to the heat absorption ends 141 of the two second heat dissipation parts 14, and the two heat dissipation ends 142 are respectively formed by extending towards the opposite direction of the heat absorption ends 141, in other words, in this embodiment, the main body 1 has two second heat dissipation parts 14, which are respectively connected to the first connection end 131 and the second connection end 132 of the first heat dissipation part 13, and the above-mentioned effects can also be achieved.

Please refer to fig. 5, which is an exploded perspective view of a third embodiment of the heat dissipation unit of the present invention, wherein the corresponding relationship between some components of the heat dissipation unit and the components is the same as the heat dissipation unit, and therefore, the description is omitted herein, but the difference between the heat dissipation unit and the above-mentioned first embodiment is that the heat dissipation end 142 of the second heat dissipation portion 14 is formed by extending from two ends of the heat absorption end 141, respectively, and as shown in the figure, the second heat dissipation portion 14 is connected to the first connection end 131 of the first heat dissipation portion 13 in a U-shape, and the above-mentioned effects can also be achieved.

Please refer to fig. 6, which is a top view of a fourth embodiment of the heat dissipation unit of the present invention, wherein the relationship between some components of the heat dissipation unit and the correspondence between the components are the same as the heat dissipation unit, and therefore the description is omitted herein, but the difference between the heat dissipation unit and the above-mentioned main components is, the heat absorbing end 141 is formed from the first connection end 131 toward the first chamber 133, the heat dissipating end 142 is formed to extend in the opposite direction of the heat absorbing end 141, in other words, the second chamber 143 is partially disposed in the first chamber 133. in one embodiment, as shown in fig. 7, the body 1 has two second heat dissipating parts 14, two heat absorbing ends 141 are respectively formed by the first and second connecting

ends

131, 132 toward the first chamber 133, the two heat dissipation ends 142 are formed to extend toward the opposite directions of the two heat absorption ends 141, respectively, so as to achieve the aforementioned effects.

Referring to fig. 8 and fig. 1, which are cross-sectional views of a sixth embodiment of a heat dissipation unit according to the present invention, the corresponding relationship between some components of the heat dissipation unit and the components is the same as the heat dissipation unit, so it is not repeated herein, but the main difference between the heat dissipation unit and the above-mentioned components is, the first heat sink 13 further has at least one supporting structure 15 in the first cavity 133, the supporting structure 15 is any one of a copper column, a sintered powder column and an annular column, two ends of the supporting structure 15 are respectively connected to the first plate 11 and the second plate 12, and after the liquid first working fluid 134 is evaporated into the vapor first working fluid 134 when the second plate 12 is heated through the supporting structure 15, the vaporous working fluid is directed toward the first plate 11 and contacts the inner wall of the first plate 11, and then is condensed and converted into a liquid first working fluid 134, and the liquid working fluid is then drawn back to the second plate 12 by the supporting structure 15.

As mentioned above, the present invention has the following advantages over the prior art:

1. the production cost is greatly reduced;

2. meanwhile, it has the effects of large-area uniform temperature heat dissipation and remote heat conduction.

The present invention has been described in detail, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited by the above description, and all equivalent variations and modifications should be included within the scope of the present invention.

Claims

1. A heat dissipating unit, comprising:

the integrated body is provided with a first cavity and at least one second cavity, the first cavity is a temperature-equalizing heat dissipation cavity, the second cavity is a far-end heat dissipation cavity which is integrated with and different from the first cavity, the first cavity and the second cavity are not communicated, the first cavity is filled with a first working fluid and defined as a first heat dissipation part, the second cavity is filled with a second working fluid and defined as a second heat dissipation part, and the first heat dissipation part is correspondingly connected with the second heat dissipation part.

2. The heat dissipating unit of claim 1, wherein the inner wall of the first chamber has a first capillary structure, the inner wall of the second chamber has a second capillary structure, and the first and second capillary structures are not connected.

3. The heat dissipating unit of claim 2, wherein the first and second wicking structures are selected from one of a mesh, a fiber, a sintered powder, a combination of a mesh and a sintered powder, or a micro-channel.

4. The heat dissipating unit of claim 1, wherein the body further comprises a first plate and a second plate, the first and second plates are correspondingly covered, and the first and second chambers are defined between the first plate and the second plate.

5. The heat dissipating unit of claim 4, wherein the first heat dissipating portion is a vapor chamber and the second heat dissipating portion is a heat pipe.

6. The heat dissipation unit of claim 5, wherein the first heat dissipation portion further has a first connection end and a second connection end, and the second heat dissipation portion further has a heat absorption end and at least one heat dissipation end.

7. The heat dissipating unit of claim 6, wherein the heat absorbing end is connected to the first connecting end, and the heat dissipating end extends in a direction opposite to the heat absorbing end.

8. The heat dissipating unit of claim 6, wherein the body has two second heat dissipating parts, the first and second connecting ends of the first heat dissipating part are respectively connected to the heat absorbing ends of the two second heat dissipating parts, and the heat dissipating ends of the two second heat dissipating parts are respectively formed by extending in a direction opposite to the heat absorbing ends.

9. The heat dissipation unit of claim 6, wherein the heat sink end is formed from the first connection end disposed within the first chamber and the heat sink end extends in a direction opposite the heat sink end.

10. The heat dissipating unit of claim 6, wherein the body has two second heat dissipating parts, the heat absorbing ends of the two second heat dissipating parts are formed from the first connecting end and the second connecting end toward the first cavity, and the heat dissipating ends of the two second heat dissipating parts are formed by extending toward opposite directions of the two heat absorbing ends.

11. The heat dissipating unit of claim 6, wherein the first chamber further comprises at least one supporting structure, the supporting structure is a copper pillar, a sintered powder pillar or an annular pillar, and two ends of the supporting structure are connected to the first and second plates respectively.

12. The heat dissipating unit of claim 6, wherein the heat dissipating end is formed by extending the two ends of the heat absorbing end outward.