TWI601932B - Heat dissipation unit - Google Patents

Description

Cooling unit

The invention relates to a heat dissipating unit, in particular to a heat dissipating unit which can greatly reduce the production cost and has the advantages of large-area heat dissipation and remote heat conduction.

According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit can process more data, the integrated circuit under the same volume can accommodate more than several times more than before. Computational components, when the number of computing components in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the thermal energy generated by the computing components is getting larger and larger, taking the common central processor as an example, at a high level. At full load, the heat generated by the central processing unit is enough to cause the central processor to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue.

The central processing unit and the chip or other electronic components in the electronic device are heat sources in the electronic device. When the electronic device operates, the heat source generates heat. Therefore, heat conducting components such as heat pipes and temperature equalizing plates are often used. The flat heat pipe has good heat dissipation and heat conduction performance for heat conduction or temperature uniformity, wherein the heat pipe is mainly used as the remote heat conduction; the heat is absorbed from one end (the heat absorption end) to convert the internal working fluid from the liquid state to the vapor state evaporation. The heat is transferred to the other end of the heat pipe (heat sinking end) to achieve the purpose of heat conduction, and for the part requiring a large heat transfer area, the temperature equalizing plate is selected as the heat radiating element, and the temperature equalizing plate is mainly contacted with the heat source. The side plane absorbs heat, and then conducts heat to the other side of the corresponding surface for heat dissipation condensation.

However, since conventional heat pipes such as heat pipes and temperature equalizing plates are heat-dissipating components of a single solution (only a single temperature or long-distance heat conduction), in other words, the conventional heat-dissipating components are disposed in the electronic device only for the heat pipes. Or heat conduction or temperature equalization at the position where the temperature equalization plate contacts the heat source When the heat is dissipated, it is impossible to have both the uniform temperature and the heat dissipation at the same time. Of course, the heat exchange efficiency is relatively poor.

Accordingly, in order to effectively solve the above problems, the main object of the present invention is to provide a heat dissipating unit which can greatly reduce the production cost.

A secondary object of the present invention is to provide a heat dissipation unit having both large-area heat dissipation and remote heat conduction performance.

To achieve the above object, the present invention provides a heat dissipating unit comprising an integrally formed body having a first chamber and at least a second chamber, the first and second chambers being adjacent to each other Disconnected, the first chamber is filled with a first working fluid and defined as a first heat dissipating portion, and the second chamber is filled with a second working fluid and defined as a second heat dissipating portion. Correspondingly connecting the second heat dissipation portion, wherein an inner wall of the first chamber has a first capillary structure, and an inner wall of the second chamber has a second capillary structure, the first and second capillary structures The system is not connected.

Through the design of the structure of the present invention, the effect of large-area heat dissipation and remote heat conduction and heat dissipation can be simultaneously achieved, thereby improving the problem that the conventional temperature equalization plate and the heat pipe have only a single solution.

1‧‧‧ Ontology

11‧‧‧ first board

12‧‧‧Second plate

13‧‧‧First heat sink

131‧‧‧First connection

132‧‧‧second connection

133‧‧‧ first chamber

134‧‧‧First working fluid

135‧‧‧First capillary structure

14‧‧‧second heat sink

141‧‧‧heat end

142‧‧‧heating end

143‧‧‧ second chamber

144‧‧‧Second working fluid

145‧‧‧Second capillary structure

15‧‧‧Support structure

1 is a perspective exploded view of a first embodiment of a heat dissipating unit of the present invention; FIG. 2 is a perspective assembled view of a first embodiment of the heat dissipating unit of the present invention; and FIG. 3 is the first heat dissipating unit of the present invention. Figure 4 is a cross-sectional view of a second embodiment of the heat dissipating unit of the present invention; Fig. 5 is a perspective exploded view of a third embodiment of the heat dissipating unit of the present invention; Fig. 7 is a plan sectional view showing a fourth embodiment of the heat dissipating unit of the present invention; Fig. 8 is a cross-sectional view showing a sixth embodiment of the heat dissipating unit of the present invention.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to the first, second, and third figures, which are perspective exploded view, perspective assembled view and sectional view of the first embodiment of the heat dissipating unit of the present invention. As shown in the figure, a heat dissipating unit includes an integrally formed body. The first body 11 has a first plate body 12 corresponding to a second plate body 12. The body 1 has a first heat dissipation portion 13 connected to at least one second heat dissipation portion 14. In this embodiment, the first plate The heat dissipating portion 13 is equivalent to a temperature equalizing plate structure, but is not limited thereto. In the specific implementation, it may be the same equivalent as the temperature equalizing plate, and the second heat dissipating portion 14 is equivalent to a heat pipe. The structure, but not limited thereto, may be other equivalents as the heat pipe in the specific implementation; the first heat dissipation portion 13 has a first connection end 131 and a second connection end 132, and The first heat dissipation portion 13 is formed with a first chamber 133 filled with a first working fluid 134, the inner wall of the first chamber 133 has a first capillary structure 135, and the second heat dissipation portion 14 has a heat absorption end 141. And a heat dissipation end 142, and the second heat dissipation portion 14 is formed with a second chamber 143 filled with a second workflow 144, the inner wall of the second chamber 143 has a second capillary structure 145, and the first and second chambers 133, 143 are disposed between the first plate 11 and the second plate 12 (ie, The first and second working fluids 134, 144 may be pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal or organic compounds; The first and second capillary structures 135 and 145 are selected from the group consisting of a mesh, a fibrous body, a sintered powder body, a mesh and a sintered powder combination or a micro-groove, or a plurality of combinations thereof, and the first and second capillary structures 135 145 is also not connected to each other; through the design of the structure of the present invention, since the body 1 is an integrally formed structure, the heat absorbing end 141 of the second heat dissipating portion 14 is connected to the first connecting end of the first heat dissipating portion 13 131, the second heat dissipation The heat dissipating end 142 of the portion 14 is formed to extend in the opposite direction of the heat absorbing end 141, but is not limited thereto. In an embodiment, the heat absorbing end 141 of the second heat dissipating portion 14 is selectable and the first The other two sides of the first and second connecting ends 131, 132 of the heat dissipating portion 13 are correspondingly connected (not shown); when the second board 12 of the body 1 is in contact with a heat source (for example, CPU, MCU, graphics processing) The heat of the heat source can be dissipated through the first heat dissipating portion 13 for large-area uniform heat dissipation, and the second heat dissipating through the second heat dissipating device or other heat generating electronic components or coils (not shown) The structural design of the portion 14 transmits heat to the distal end to have the effect of heat conduction and heat dissipation at the distal end, and improves the time and cost required for the conventional temperature equalizing plate and the heat pipe to be separately manufactured, thereby greatly reducing the cost of production. It also has the effect of large-area heat dissipation and remote heat conduction and heat dissipation.

Referring to FIG. 4, it is a top cross-sectional view of a second embodiment of the heat dissipating unit of the present invention. The corresponding relationship between the components and the components of the heat dissipating unit is the same as that of the heat dissipating unit, and therefore will not be further described herein. The first and second connecting ends 131 and 132 of the first heat dissipating portion 13 are connected to the heat absorbing ends 141 of the two second heat dissipating portions 14, respectively. The 142 is formed to extend in the opposite direction of the heat absorbing end 141. In other words, in the embodiment, the body 1 has two second heat dissipating portions 14 respectively connected to the first connecting end 131 of the first heat dissipating portion 13 and The second connection end 132 can also achieve the aforementioned effects.

Referring to FIG. 5, it is a perspective exploded view of a third embodiment of the heat dissipating unit of the present invention. The corresponding relationship between the components and the components of the heat dissipating unit is the same as that of the heat dissipating unit, and therefore will not be further described herein. However, the main difference between the heat dissipating unit and the foregoing is that the heat dissipating ends 142 of the second heat dissipating portion 14 are respectively formed by extending outwardly from opposite ends of the heat absorbing end 141, as shown in the figure, the second heat dissipating The portion 14 is connected in a U-shape to the first connection end 131 of the first heat dissipation portion 13, and the same effect can be achieved.

Please refer to FIG. 6 , which is a top cross-sectional view of a fourth embodiment of the heat dissipating unit of the present invention. The corresponding relationship between the components and components of the heat dissipating unit is the same as that of the heat dissipating unit, so Further, the main difference between the heat dissipating unit and the foregoing is that the heat absorbing end 141 is formed by the first connecting end 131 toward the first chamber 133, and the heat dissipating end 142 is directed toward the heat absorbing end. The end 141 is formed to extend in the opposite direction. In other words, a portion of the second chamber 143 is disposed in the first chamber 133. In an embodiment, as shown in FIG. 7, the body 1 has two The second heat dissipating portion 14 is formed by the first and second connecting ends 131 and 132 respectively facing the first chamber 133, and the two heat dissipating ends 142 are respectively facing the two heat absorbing ends. 141 is formed by extending in the opposite direction, and the aforementioned effects can also be achieved.

FIG. 8 is a cross-sectional view showing a sixth embodiment of the heat dissipating unit of the present invention. The corresponding relationship between the components and components of the heat dissipating unit is the same as that of the heat dissipating unit. The main difference between the heat dissipating unit and the foregoing is that the first chamber 133 of the first heat dissipating portion 13 further has at least one supporting structure 15 which is a copper pillar and is sintered. Any one of the powder cylinder and the annular cylinder, the two ends of the support structure 15 are respectively connected to the first and second plates 11, 12, and the second structure 12 is heated, when the second plate 12 is heated, After the working fluid 134 is evaporated into the vaporized first working fluid 134, the vapor working fluid will be condensed and converted into the liquid first working fluid 134 after being in contact with the first plate 11 and contacting the inner wall of the first plate 11. The liquid working fluid is then pulled back to the second plate body 12 by the support structure 15.

As described above, the present invention has the following advantages as compared with the prior art: 1. greatly reducing the production cost; 2. simultaneously having the effect of large-area uniform temperature heat dissipation and remote heat conduction.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. And so on, should still be covered by the patent of the present invention.

1‧‧‧ Ontology

11‧‧‧ first board

12‧‧‧Second plate

13‧‧‧First heat sink

131‧‧‧First connection

132‧‧‧second connection

133‧‧‧ first chamber

14‧‧‧second heat sink

141‧‧‧heat end

142‧‧‧heating end

143‧‧‧ second chamber

Claims (12)

A heat dissipating unit includes: an integrally formed body having a first chamber and at least a second chamber, wherein the first and second chambers are not in communication, and the first chamber is filled with a first The working fluid is defined as a first heat dissipating portion, and the second chamber is filled with a second working fluid and defined as a second heat dissipating portion. The first heat dissipating portion is correspondingly connected to the second heat dissipating portion and is located on a common plane. . The heat dissipating unit according to claim 1, wherein the inner wall of the first chamber has a first capillary structure, and the inner wall of the second chamber has a second capillary structure, the first and second capillary The structural systems are not connected. The heat dissipating unit according to claim 2, wherein the first and second capillary structures are selected from the group consisting of a mesh, a fibrous body, a sintered powder body, a mesh and a sintered powder combination or a micro groove. The heat dissipation unit of claim 1, wherein the body further has a first plate body and a second plate body, wherein the first and second plate bodies are correspondingly closed, and the first and second chambers are arranged. Defined between the first plate body and the second plate body. The heat dissipation unit of claim 4, wherein the first heat dissipation portion is a temperature equalization plate, and the second heat dissipation portion is a heat pipe. The heat dissipation unit of claim 5, wherein the first heat dissipation portion further has a first connection end and a second connection end, and the second heat dissipation portion further has a heat absorption end and at least one heat dissipation end. The heat dissipating unit according to claim 6, wherein the heat absorbing end is connected to the first connecting end, and the heat dissipating end is formed to extend in a direction opposite to the heat absorbing end. The heat dissipating unit of claim 6, wherein the first and second connecting ends of the first heat dissipating portion are respectively connected to the heat absorbing ends of the two second heat dissipating portions, and the two heat dissipating ends are respectively opposite to the heat absorbing end The direction extends to form. The heat dissipating unit according to claim 6, wherein the heat absorbing end is formed by the first connecting end toward the first chamber, and the heat dissipating end is formed to extend in a direction opposite to the heat absorbing end. The heat dissipating unit of claim 6, wherein the heat absorbing end portions of the two second heat dissipating portions are respectively formed by the first and second connecting ends toward the first chamber, and the two heat dissipating ends are respectively directed toward The two heat absorbing ends are formed to extend in opposite directions. The heat dissipating unit of claim 6, wherein the first chamber further has at least one supporting structure, wherein the supporting structure is a copper pillar, a sintered powder cylinder and an annular cylinder, and both ends of the supporting structure The first and second plates are respectively connected. The heat dissipating unit according to claim 6, wherein the heat dissipating end portions are respectively formed to extend outwardly from opposite ends of the heat absorbing end.