TWM539220U - Heat-dissipation module - Google Patents

Description

Thermal module

The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module which can improve the problem that the solder paste is easily scraped when the combination of the conventional heat dissipation fin structure and the heat dissipation unit is improved.

According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit can process more data, the integrated circuit under the same volume can accommodate more than several times more than before. Computational components, when the number of computing components in the integrated circuit is increasing, the execution efficiency is getting higher and higher, so the thermal energy generated by the computing components is getting larger and larger, taking the common central processor as an example, at a high level. At full load, the heat generated by the central processing unit is enough to cause the central processor to burn out. Therefore, the heat sink of the integrated circuit becomes an important issue. The central processing unit and the chip or other electronic components in the electronic device are heat sources in the electronic device. When the electronic device operates, the heat source generates heat. Therefore, heat conducting components such as heat pipes and temperature equalizing plates are often used. The flat heat pipe has good heat dissipation and heat conduction performance for heat conduction or even temperature. The heat pipe is mainly used as the remote heat conduction; the heat is transferred from the liquid to the vaporization by the internal working fluid from the liquid to the heat pipe. At the other end, the purpose of heat conduction is achieved, and for the part with a large heat transfer area, the temperature equalizing plate is selected as the heat dissipating component, and the temperature equalizing plate mainly absorbs heat from one side plane in contact with the heat source, and then conducts heat to the other. One side is used for heat dissipation condensation. At present, there is a heat dissipating component 1 on the market, as shown in FIGS. 1A and 1B, which is a two-level warming plate 11 passing through a cylinder (covered by the heat dissipating fin group 12 and not shown) 11 is connected to form the heat dissipating component 1 , and a heat dissipating fin set 12 is built in the heat dissipating component 1 . When used, the conventional heat dissipating fin set 12 is directly placed between the two temperature equalizing plates 11 for combination. Since the upper and lower sides of the heat dissipation fin group 12 are first coated with solder paste (or the solder paste may also be coated on the temperature equalization plate 11), the heat dissipation fin group 12 coated with the solder paste is placed. between 11, in the process of placement due to a height H 11 between two isothermal plates ₁ and ₂ are equal _exactly the height H of the fin assembly of the two vapor chamber 12, and because of the fin assembly 12 must be so strong The relationship between the ground and the two uniform temperature plates 11 is tightly combined. Therefore, when the heat dissipation fin group 12 is placed, it is at least in contact with one side of the two temperature equalization plates 12, and then slides in, so that during the combination process, the coating is performed. A part of the solder paste of the heat dissipation fin group 12 on the side of the solder paste is scraped off by the temperature equalization plate, so that the heat dissipation fin group 12 cannot be soldered due to the loss of solder paste. It is welded to reduce its stability and thermal resistance.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation module which can greatly improve the problem that the solder paste is easily scraped when the combination of the conventional heat dissipation fin structure and the heat dissipation unit is improved. In order to achieve the above objective, the present invention provides a heat dissipation module including a heat dissipation unit and a first heat dissipation fin set and a second heat dissipation fin set, the heat dissipation unit having a first body and a second body. The first body has a first surface and a second surface. The second body has a third surface and a fourth surface. The two ends of the tube are respectively connected to the first and third surfaces. The first and second heat dissipating fin sets are disposed in the receiving space, and the first heat dissipating fin set has a first side and a second The second side protrudes from the at least one convex portion, the convex portion forms a first inclined surface and a second inclined surface, and the second heat dissipation fin set has a third side and a fourth side, and the third side is And the third side is disposed, and the third side defines at least one groove corresponding to the convex portion, the groove forms a third inclined surface and a fourth inclined surface, and the third inclined surface contacts the first inclined surface . The first heat dissipation fin set further has a first end and a second end, and the second heat sink fin set has a third end and a fourth end. In the first embodiment, the first and fourth sides are coated with a solder paste, and then the first and second heat dissipating fin groups are stacked and placed in the receiving space of the heat dissipating unit, The length of the first end to the protrusion is not equal to the length of the third end to the groove, so the first and third ends of the first and second heat dissipation fin sets are not tangent Parallel, the second and fourth ends are also not tangentially parallel, and then the first end of the first fin group is slidably moved toward the second end to make the third bevel contact A gap is formed between the second and fourth inclined surfaces, and an open space is formed between the first and second heat radiating fin groups to communicate the gap. And the first and fourth sides of the first and second heat dissipation fin sets are respectively closely attached to the heat dissipation sheet The first and third surfaces of the first and second heat dissipating fin groups can be more stably combined with the heat dissipating unit, and the solder paste is easily scraped when the combination of the conventional heat dissipating fin structure and the heat dissipating unit is improved. problem.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. Please refer to FIG. 2, FIG. 3, FIG. 4 and FIG. 5 for an exploded perspective view, a three-dimensional combination diagram, an enlarged view and a side view of the first embodiment of the heat dissipation module. As shown in the figure, the heat dissipation module is as shown in the figure. The heat dissipation unit 3 includes a first heat dissipation fin group 21 and a second heat dissipation fin group 22, and the first heat dissipation fin group 21 is composed of a plurality of first heat dissipation fins 211, and the first heat dissipation fin The fin group 21 has a first side 212 and a second side 213. The second side 213 protrudes from the at least one protrusion 214, and the protrusion 214 is formed with a first slope 2141 and a second slope 2142. The second heat dissipation fin group 22 is composed of a plurality of second heat dissipation fins 221, and the second heat dissipation fin group 22 has a third side 222 and a fourth side 223. The third side 222 corresponds to the convex portion. The portion 214 defines at least one recess 224, and the recess 224 defines a third inclined surface 2241 and a fourth inclined surface 2242. The second side 213 of the first heat dissipation fin set 21 is coupled to the second heat dissipation fin set. The third side 222 of the 22 is correspondingly disposed such that the third inclined surface 2241 contacts and abuts the first inclined surface 2141. The following is a schematic side view of the first embodiment of the present invention, wherein the first heat dissipation fin group 21 further has a first end 211a and a second end 211b. The second heat dissipation fin group 22 further has a third end 221a and a fourth end 221b. In the embodiment of the present embodiment, two sets of first and second heat dissipation fin sets 21 and 22 are disclosed. The first and second heat-dissipating fin sets 21 and 22 of the two groups are identical in operation and assembly. The present invention is described by the first and second heat-dissipating fin sets 21 and 22 of one set; The first body 31 has a first surface 311 and a second surface 312, and the second body 32 has a third portion. The first body 31 has a first surface 31 and a second surface 312. The second body 32 has a third surface. A surface 321 and a fourth surface 322 are connected to the first and third surfaces 311 and 321 respectively, and the first and second bodies 31 and 32 and the tube 33 collectively define a housing. Space 34; firstly coating the first and fourth sides 212, 223 with tin After the first and second heat dissipation fin sets 21 and 22 are superimposed (ie, the convex portion 214 of the second side 213 is correspondingly received in the recess 224 of the third side 222 The first and second slopes 2141, 2142 are unequal in length and the third and fourth slopes 2241, 2242 are unequal in length. And the first and third inclined fins 21141 and 2241 are equal in length and the second and fourth inclined surfaces 2142 and 2242 are equal in length, so that the first and second heat radiating fin groups 21 and 22 are stacked. In time, the first and third ends 211a and 221a are not aligned, and the second and fourth ends 211b and 221b are not aligned. Then, the first heat dissipation fin group 21 is first. The end 211a slides in the direction of the second end 211b, so that the third inclined surface 2241 contacts and abuts the first inclined surface 2141, and a gap 226 is generated between the second and fourth inclined surfaces 2142, 2242, and An open space 227 is formed between the first and second heat dissipation fin groups 21 and 22 to communicate with the gap 226 through the sliding motion. The first and third ends 211a and 221a are aligned in parallel, and the second and fourth ends 211b and 221b are aligned in parallel to form the first and second heat dissipation fin sets 21 and 22. The first and fourth sides 212 and 223 are respectively in close contact with the first and third surfaces 311 and 321 of the heat dissipating unit 3, so as to achieve the first and second heat dissipating fin groups 21 and 22 to be more stably connected to the heat dissipating unit. The combination of the three phases improves the problem that the solder paste is easily scraped when the conventional heat sink fin structure and the heat sink unit are combined. Please refer to FIGS. 8 and 9 for a perspective view and a cross-sectional enlarged view of a second embodiment of the heat dissipation module. The corresponding relationship between the components and components of the heat dissipation module and the heat dissipation module are The second embodiment of the first heat dissipation fin group 21 further has at least one engagement slot 215, and the second heat dissipation. The third side 222 of the fin set 22 further has at least one joint portion 225. The joint portion 225 is correspondingly engaged with the engaging groove 215, and the joint portion 225 is coupled with the engaging groove 215 to make the first portion. The first and second heat dissipating fin groups 21 and 22 prevent slippage during assembly, and are better and firmly assembled with each other to achieve the aforementioned effects. As described above, the present invention has the following advantages over the conventional ones: 1. Improving the problem that the conventional solder paste is easily scraped; 2. It is more firm. The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.

21‧‧‧First heat sink fin set
211‧‧‧First heat sink fin
211a‧‧‧ first end
211b‧‧‧ second end
212‧‧‧ first side
213‧‧‧ second side
214‧‧‧ convex
2141‧‧‧ first slope
2142‧‧‧second bevel
215‧‧‧ snap groove
22‧‧‧Second heat sink fin set
221‧‧‧Second heat sink fins
221a‧‧‧ third end
221b‧‧‧ fourth end
222‧‧‧ third side
223‧‧‧ fourth side
224‧‧‧ Groove
2241‧‧‧3rd bevel
2242‧‧‧4th bevel
225‧‧‧Combination Department
226‧‧‧ gap
227‧‧‧Open space
3‧‧‧heating unit
31‧‧‧First Ontology
311‧‧‧ first surface
312‧‧‧ second surface
32‧‧‧Second ontology
321‧‧‧ third surface
322‧‧‧ fourth surface
33‧‧‧ tube body
34‧‧‧ Included space

1A is a perspective exploded view of a conventional heat dissipation module; FIG. 1B is a three-dimensional combination diagram of a conventional heat dissipation module; FIG. 2 is an exploded perspective view of the first embodiment of the creation heat dissipation module; Figure 3 is a perspective view of the first embodiment of the heat dissipation module of the present invention; Figure 4 is an enlarged view of the first embodiment of the heat dissipation module of the present invention; A schematic side view of a first embodiment of the present invention; FIG. 7 is a side view of a first embodiment of the present heat dissipation module; FIG. 8 is a perspective assembled view of a second embodiment of the present heat dissipation module; FIG. 9 is an enlarged cross-sectional view of the second embodiment of the heat dissipation module.

21‧‧‧First heat sink fin set

211‧‧‧First heat sink fin

214‧‧‧ convex

22‧‧‧Second heat sink fin set

221‧‧‧Second heat sink fins

31‧‧‧First Ontology

32‧‧‧Second ontology

33‧‧‧ tube body

Claims (6)

A heat dissipation module includes: a heat dissipation unit having a first body and a second body, the first body having a first surface and a second surface, the second body having a third surface and a first surface a fourth surface, the two ends of the tube are respectively connected to the first and third surfaces, the first and second bodies and the tube body jointly define a receiving space; a first heat dissipating fin group is disposed on the The first heat-dissipating fin group protrudes from at least one convex portion, the convex portion forms a first inclined surface and a second inclined surface, and a second heat-dissipating fin set is disposed in the receiving space. And the first heat-dissipating fin set is disposed in the space, and the second heat-dissipating fin set has at least one groove corresponding to the convex portion, the groove forming a third inclined surface and a fourth inclined surface, and The third inclined surface contacts the first inclined surface, and a gap is formed between the fourth inclined surface and the second inclined surface. An open space is formed between the first and second heat dissipation fin groups, and the open space and the gap communicate with each other. The heat dissipation module of claim 1, wherein the first heat dissipation fin group is composed of a plurality of first heat dissipation fins, and the second heat dissipation fin group is composed of a plurality of second heat dissipation fins. The heat dissipation module of claim 1, wherein the first heat dissipation fin set has a first side and a second side, and the second heat dissipation fin set has a third side and a fourth side. The second side protrudes from the convex portion, and the third side defines the concave portion corresponding to the convex portion. The heat dissipation module of claim 3, wherein the second side further has at least one engaging groove, and the third side further has at least one joint portion, and the joint portion correspondingly engages the engaging groove. The heat dissipation module of claim 3, wherein the first heat dissipation fin set further has a first end and a second end, and the second heat dissipation fin set further has a third end and a fourth end The first and third ends are relatively flush, and the second and fourth ends are relatively flush. The heat dissipation module of claim 1, wherein the lengths of the first and second slopes are not equal, and the lengths of the third and fourth slopes are not equal.