CN111405823B

CN111405823B - Heat sink device

Info

Publication number: CN111405823B
Application number: CN202010231835.3A
Authority: CN
Inventors: 林胜煌
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2020-03-27
Filing date: 2020-03-27
Publication date: 2023-04-18
Anticipated expiration: 2040-03-27
Also published as: CN111405823A

Abstract

The invention provides a heat dissipation device, which comprises a body, at least one heat pipe and a base, wherein the body is provided with a first side and a second side, a heat source is correspondingly attached to the second side, the heat pipe is provided with a heat absorption part and a heat dissipation part, the heat absorption part is correspondingly arranged on the first side, the heat dissipation part is far away from the heat absorption part, so that heat generated by the heat source is conducted to the heat dissipation part at the far end after being absorbed by the heat absorption part, and the base is correspondingly arranged on the heat pipe and the body.

Description

Heat sink device

Technical Field

The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device capable of greatly improving heat transfer efficiency and heat dissipation efficiency.

Background

With the progress of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to make the integrated circuit process more data, the integrated circuit with the same volume can already contain more than several times of the conventional computing devices, and the execution efficiency is higher and higher as the number of the computing devices in the integrated circuit is higher and higher, so the heat generated by the computing devices during operation is also higher and higher.

The CPU and chip or other electronic components in the electronic device are all heating sources in the electronic device, when the electronic device is running, the heating source will generate heat, so the heat conduction components such as heat pipe, temperature equalizing plate, flat heat pipe, etc. with good heat dissipation and heat conduction efficiency are used to conduct heat conduction or temperature equalization, wherein the heat pipe is mainly used as far-end heat conduction, one end (heat absorption end) absorbs heat to convert the internal working fluid from liquid state to vapor state for evaporation and transfers the heat to the other end (heat dissipation end) of the heat pipe, thereby achieving the purpose of heat conduction, and the temperature equalizing plate is selected as heat dissipation component for the part requiring large heat transfer area, the temperature equalizing plate mainly absorbs heat from the plane of one side contacting with the heat source, and then transfers the heat to the other side of the corresponding surface for heat dissipation and condensation.

However, the existing heat dissipation elements such as the heat pipe and the temperature equalization plate are all heat dissipation elements with a single solution (only single temperature equalization or long-distance heat conduction), in other words, the existing heat dissipation elements are disposed in the electronic device only for the position where the heat pipe or the temperature equalization plate contacts the heat source to conduct heat dissipation such as heat conduction or temperature equalization, and thus the heat dissipation elements cannot have the effects of temperature equalization and long-distance heat dissipation at the same time, and certainly, the heat exchange efficiency is relatively poor.

Therefore, how to solve the above-mentioned problems and disadvantages is a direction in which the inventors of the present invention and related manufacturers engaged in the industry need to research and improve.

Disclosure of Invention

Accordingly, the present invention is directed to a heat dissipation device with improved heat dissipation efficiency.

A secondary objective of the present invention is to provide a heat dissipation device with greatly improved heat dissipation efficiency.

To achieve the above object, the present invention provides a heat dissipation device, comprising:

a body having a first side and a second side, a heat source correspondingly attached to the second side;

the heat pipe is provided with a heat absorption part and a heat dissipation part, the heat absorption part is correspondingly arranged on the first side, and the heat dissipation part is far away from the heat absorption part so that heat generated by the heating source is absorbed by the heat absorption part and then is conducted to the heat dissipation part at the far end; and

a base correspondingly arranged on the heat pipe and the body.

The heat sink comprises a base, a heat pipe and a heat absorption part, wherein the base is provided with an upper surface and a lower surface, a hollow part is formed on the base and penetrates through the upper surface and the lower surface, and the heat pipe penetrates through the hollow part and enables the heat absorption part to be attached to the first side.

The heat dissipation device is further provided with at least one first heat dissipation fin group, and the first heat dissipation fin group correspondingly penetrates through the heat dissipation part of the heat pipe.

In the heat dissipation device, the body is a temperature equalization plate or a hot plate.

In the heat dissipation device, the body extends outward to form an extension portion, the extension portion has an upper side and a lower side, and at least one second heat dissipation fin group is correspondingly disposed on the upper side or the lower side or both the upper side and the lower side.

The heat sink, wherein, the second side of body still sets up protrudingly and forms a boss, the source of generating heat is located this boss department of corresponding subsides.

The heat dissipation device further comprises a cover cap which is correspondingly arranged at the notch of the first heat dissipation fin group and fixed on the base.

In the heat dissipation device, the heat pipe is U-shaped, L-shaped or I-shaped.

Through the design of the structure, the heating source is attached to the second side of the body, the heat absorption part of the heat pipe is arranged between the base and the body, and the heat conduction efficiency and the heat dissipation efficiency of the whole heat dissipation device are greatly improved by utilizing the large-area heat conduction and heat dissipation functions of the body and the far-end heat dissipation effect of the heat pipe.

Drawings

FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation device of the present invention;

FIG. 2 is another perspective exploded view of the first embodiment of the heat dissipation device of the present invention;

FIG. 3 is a perspective assembly view of a first embodiment of the heat dissipation device of the present invention;

FIG. 4 is another perspective assembly view of the first embodiment of the heat dissipation device of the present invention;

FIG. 5 is a cross-sectional view of a first embodiment of the heat sink of the present invention;

FIG. 6 is an exploded perspective view of a second embodiment of the heat sink of the present invention;

FIG. 7 is an exploded perspective view of a third embodiment of a heat sink in accordance with the present invention;

fig. 8 is an exploded perspective view of a fourth embodiment of the heat sink of the present invention.

Description of reference numerals: a heat sink 2; a body 20; a first side 200; a second side 201; a body cavity 202; a first working fluid 203; a body capillary structure 204; a boss 205; an extension 206; an upper side 206a; a lower side 206b; a heat pipe 21; a heat absorbing part 210; a heat dissipation portion 211; a heat pipe chamber 212; a second working fluid 213; a heat pipe capillary structure 214; a base 22; an upper surface 220; a lower surface 221; a hollowed-out portion 223; a heat generating source 3; a first heat radiation fin group 4; a second heat radiation fin group 5; a third set of cooling fins 6; a cover 7.

Detailed Description

The above objects of the invention, together with the structure and functional features thereof, are best understood by reference to the following detailed description of the preferred embodiment when read in conjunction with the accompanying drawings.

Referring to fig. 1 to 5, which are drawings showing a first embodiment of the heat dissipation device of the present invention, as shown in the drawings, a heat dissipation device 2 is attached to a heat source 3 at one side thereof, the heat dissipation device 2 includes a main body 20, at least one heat pipe 21 and a base 22, the main body 20 (which may be made of a material such as gold, silver, copper, aluminum, stainless steel, titanium, ceramic, etc.) is shown as a temperature equalization plate in the present embodiment, and of course, the main body 20 may be a heat plate, which will be described in the foregoing.

The body 20 has a first side 200 and a second side 201, the first and

second sides

200, 201 together define a body cavity 202 (see fig. 5), the body cavity 202 has a first working fluid 203 and a body capillary structure 204 therein, the body capillary structure 204 is formed on a part or all of the inner wall of the body cavity 202, and the second side 201 is in contact with the heat source 3.

The heat pipe 21 may be U-shaped, L-shaped, or I-shaped, and in the embodiment, the heat pipe 21 is described as U-shaped, and includes a heat absorbing portion 210 and a heat dissipating portion 211, the heat pipe 21 further includes a heat pipe chamber 212 (see fig. 5), a second working fluid 213 and a heat pipe capillary structure 214 are disposed in the heat pipe chamber 212, the heat pipe capillary structure 214 is formed on an inner wall of the heat pipe chamber 212, and the heat absorbing portion 210 is disposed on the first side 200 of the main body 20.

The base 22 has an upper surface 220 and a lower surface 221, a hollow portion 223 is formed on the base 22 and penetrates through the upper and

lower surfaces

220, 221, the heat pipe 21 penetrates through the hollow portion 223 and enables the heat absorbing portion 210 to be directly attached to the first side 200 of the body 20, in addition, a boss 205 is further convexly formed on the second side 201 of the body 20, and the heat source 3 is correspondingly attached to the boss 205 in a contact manner.

In addition, the heat dissipation device 2 further has at least one first heat dissipation fin set 4, and the first heat dissipation fin set 4 is correspondingly disposed through the heat dissipation portion 211 of the heat pipe 21, so that heat generated by the heat source 3 is absorbed by the heat absorption portion 210 of the heat pipe 21 and then transferred to the heat dissipation portion 211, and then the heat is dissipated to the outside through the first heat dissipation fin set 4 disposed through the heat dissipation portion 211 for heat exchange.

In addition, the heat dissipation device 2 further has a cover 7, the cover 7 is correspondingly covered on the gap between the first heat dissipation fin sets 4 and fixed on the base 22, the cover 7 can reduce airflow impedance, prevent airflow inside the first heat dissipation fin sets 4 from dissipating, and take away heat of the heat source 3 more quickly, so as to improve the overall heat dissipation effect of the heat dissipation device 2.

Referring to fig. 1, the main body 20 further extends outward to form an extending portion 206 having an upper side 206a and a lower side 206b, and at least one second heat dissipating fin set 5 is disposed at the upper side 206a or the lower side 206b (not shown) of the main body 3, or the second heat dissipating fin set 5 may be disposed at least at one side of the extending portion 206 or at both the upper side 206a and the lower side 206b of the extending portion (as shown in fig. 6, which is a second embodiment of the present invention), by means of the arrangement of the second heat dissipating fin set 5, the heat generated by the heat source 3 can be discharged to the outside to perform heat exchange more quickly, and the overall heat dissipating efficiency of the heat dissipating device 2 is further improved.

Therefore, through the design of the structure of the present invention, the second side 201 of the body 20 is attached to the heat source 3, the heat pipe 21 is disposed between the base 22 and the body 20, and the heat absorbing portion 210 is directly attached to the first side 200 of the body 20, so that the heat transfer efficiency and the heat dissipation efficiency of the entire heat dissipation device 2 can be greatly improved by utilizing the large-area heat conduction and heat dissipation effects of the body 20 and the far-end heat dissipation effect of the heat pipe 21.

Referring to fig. 7, a third embodiment of the heat dissipation device of the present invention is mainly different from the above-mentioned first embodiment in that a part of the heat absorbing portion 210 of the heat pipe 21 is disposed perpendicular to the heat dissipation portion 211, and a part of the heat absorbing portion 210 of the heat pipe 21 is disposed non-perpendicular to the heat dissipation portion 211, that is, the heat dissipation portion 211 extends obliquely outward from the heat absorbing portion 210, and a third heat dissipation fin group 6 is correspondingly disposed on the heat dissipation portion 211 extending obliquely outward;

as shown in fig. 8, the heat pipe 21 may be in an "L" or "I" shape, the heat absorbing portion 210 is attached to the main body 20, and the heat dissipating portion 211 is sandwiched between the third heat dissipating fin set 6, so that the heat of the heat source 3 is quickly and laterally equalized by the main body 20, and then transferred to the heat dissipating portion 211 of the heat pipe 21, and then dissipated by the third heat dissipating fin set 6, thereby achieving a further heat dissipating effect.

As described above, the present invention has the following advantages over the prior art:

1. the heat transfer efficiency is greatly improved;

2. the heat dissipation efficiency is greatly improved.

The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A heat dissipating device, comprising:

the heat pipe is provided with a heat absorption part and a heat dissipation part, the heat absorption part is correspondingly arranged on the first side, the heat dissipation part extends away from the heat absorption part and is provided with at least one first heat dissipation fin group in a penetrating way, and the first heat dissipation fin group is provided with at least one notch so that heat generated by the heating source is absorbed by the heat absorption part and then is conducted to one end of the heat dissipation part; and

the base is correspondingly arranged on the heat pipe and the body;

wherein the body is a temperature equalizing plate or a hot plate; the body extends outwards to form an extension part, the extension part is provided with an upper side connected with the first side of the body and a lower side to jointly define a body cavity, and a first working fluid and a body capillary structure are formed on the inner wall of the body cavity in the body cavity; at least one second heat radiation fin group is correspondingly arranged on the upper side;

the cover is correspondingly arranged at the gap of the first radiating fin group and fixed on the base, so that the uncovered fins and the heat pipe of the first radiating fin group are exposed.

2. The heat dissipating device of claim 1, wherein the base further has an upper surface and a lower surface, a hollow portion is formed on the base and penetrates the upper and lower surfaces, and the heat pipe penetrates the hollow portion and attaches the heat absorbing portion to the first side.

3. The heat sink as claimed in claim 1, wherein the second side of the body further forms a protruding platform, and the heat source is correspondingly attached to the protruding platform.

4. The heat dissipating device of claim 1, wherein said heat pipe is "U" shaped or "L" shaped or "I" shaped.