TWI824132B - A heat sink device - Google Patents

Abstract

A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.

Description

Cooling device

The present invention relates to a heat dissipation device, and in particular, to a heat dissipation device that can greatly improve heat transfer efficiency and heat dissipation efficiency.

According to reports, with the advancement of semiconductor technology, the size of integrated circuits has gradually shrunk. In order to enable integrated circuits to process more data, integrated circuits with the same volume can already accommodate several times more data than before. Computing elements. When the number of computing elements in an integrated circuit increases, the execution efficiency becomes higher and higher. Therefore, the heat energy generated by the computing elements when working is also increasing. Taking common central processing units as an example, in high-end When the workload is fully loaded, the heat emitted by the CPU is enough to burn the entire CPU. Therefore, the heat dissipation device of the integrated circuit has become an important issue.

The central processing unit and chips or other electronic components in electronic equipment are the heat sources in electronic equipment. When the electronic equipment operates, the heat source will generate heat. Therefore, thermally conductive components such as heat pipes, vapor chambers, Flat heat pipes, etc. have good heat dissipation and thermal conductivity for heat conduction or temperature equalization. The heat pipe is mainly used for remote heat conduction. It absorbs heat from one end (heat-absorbing end) to convert the internal working fluid from liquid to vapor to evaporate. The heat is transferred to the other end of the heat pipe (heat dissipation end) to achieve the purpose of heat conduction. For parts that require a larger heat transfer area, a vapor chamber will be selected as a heat dissipation element. The vapor chamber is mainly one of the components in contact with the heat source. The side surface absorbs heat and then conducts the heat to the other side of the corresponding surface for heat dissipation and condensation.

However, since conventional heat pipes, vapor chambers and other heat dissipation elements are single solution (only single temperature equalization or long-distance heat conduction) heat dissipation elements, in other words, the conventional heat dissipation elements installed in electronic equipment can only target heat pipes. Or conduct heat dissipation or heat dissipation at the position where the temperature equalization plate contacts the heat source, and cannot achieve both temperature equalization and remote heat dissipation. Of course, the heat exchange efficiency is also relatively poor.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve.

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation device that greatly improves the heat transfer efficiency.

A secondary purpose of the present invention is to provide a heat dissipation device that greatly improves heat dissipation efficiency.

To achieve the above object, the present invention provides a heat dissipation device, one side of which is attached to a heat source. The heat dissipation device includes a body, at least one heat pipe and a base. The body has a first side and a base. On the second side, a heat source is attached correspondingly to the second side. The heat pipe has a heat absorbing part and a heat dissipating part. The heat absorbing part is provided correspondingly on the first side. The heat dissipating part is far away from the heat absorbing part so as to generate heat. The heat generated by the source is absorbed by the heat-absorbing part and then conducted to the distal heat-dissipating part. The base is correspondingly arranged on the heat pipe and the body.

Through the design of this structure of the present invention, the heat source is attached to the second side of the body, and the heat-absorbing part of the heat pipe is disposed between the base and the body, utilizing the large-area heat conduction and heat dissipation of the body. The function of the heat pipe, combined with the remote heat dissipation effect of the heat pipe, can greatly improve the overall heat transfer efficiency and heat dissipation efficiency of the heat dissipation device.

2: Cooling device

20:Ontology

200: first side

201: Second side

202:Body chamber

203:First working fluid

204:Body capillary structure

205:Boss

206:Extension

206a: Upper side

206b: Lower side

21:Heat pipe

210: Heat absorption part

211:Heat dissipation department

212:Heat pipe chamber

213: Second working fluid

214: Heat pipe capillary structure

22: base

220: Upper surface

221: Lower surface

223: Hollow part

3: Heat source

4: First cooling fin group

5: Second cooling fin group

6:Third cooling fin group

7:Cover

Figure 1 is an exploded perspective view of the first embodiment of the heat dissipation device of the present invention; Figure 2 is an exploded perspective view of the first embodiment of the heat dissipation device of the present invention from another angle; Figure 3 is an assembled perspective view of the first embodiment of the heat dissipation device of the present invention; Figure 4 is an assembled perspective view of the first embodiment of the heat dissipation device of the present invention from another angle; Figure 5 is an assembled perspective view of the first embodiment of the heat dissipation device of the present invention. Cross-sectional view of the embodiment; Figure 6 is a perspective exploded view of the second embodiment of the heat sink of the present invention; Figure 7 is a perspective exploded view of the third embodiment of the heat sink of the present invention; Figure 8 is a perspective exploded view of the heat sink of the present invention An exploded perspective view of the fourth embodiment.

The above objects and structural and functional characteristics of the present invention will be explained based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 to 5, which are diagrams of the first embodiment of the heat dissipation device of the present invention. As shown in the figure, a heat dissipation device 2 has one side attached to a heat source 3. The heat dissipation device System 2 includes a body 20, at least one heat pipe 21 and a base 22. The body 20 (which can be made of gold, silver, copper, aluminum, stainless steel, titanium, ceramics, etc.) is represented in this embodiment as a uniform Warming plate, of course, the body 20 can also be selected as a hot plate, which will be described first.

The body 20 has a first side 200 and a second side 201. The first and second sides 200 and 201 jointly define a body cavity 202 (please refer to Figure 5). There is a first body cavity 202 in the body cavity 202. A working fluid 203 and a body capillary structure 204 are formed on part or all of the inner wall of the body chamber 202 , and the second side 201 is in contact with the heat source 3 .

The heat pipe 21 can be in the shape of "U, L or I". In this embodiment, the U shape is chosen for illustration. It has a heat absorption part 210 and a heat dissipation part 211. The heat pipe 21 also has a heat pipe chamber. 212 (please refer to Figure 5), a second working fluid 213 and a heat pipe capillary structure 214 are provided in the heat pipe chamber 212. The heat pipe capillary structure 214 is formed on the inner wall of the heat pipe chamber 212. The heat absorbing The portion 210 is correspondingly disposed on the first side 200 of the body 20 .

The base 22 has an upper surface 220 and a lower surface 221. A hollow portion 223 is formed on the base 22 and penetrates the upper and lower surfaces 220 and 221. The heat pipe 21 penetrates the hollow portion 223 and allows The heat absorbing part 210 is directly attached to the first side 200 of the body 20. In addition, a boss 205 is formed on the second side 201 of the body 20. The heat source 3 is attached to the base in corresponding contact. Boss 205.

In addition, the heat dissipation device 2 further has at least one first heat dissipation fin group 4. The first heat dissipation fin group 4 is correspondingly penetrated through the heat dissipation portion 211 of the heat pipe 21. Therefore, when the heat generated by the heat source 3 is The heat absorption part 210 of the heat pipe 21 is absorbed and then transferred to the heat dissipation part 211, and then the heat is discharged to the outside through the first heat dissipation fin group 4 penetrated on the heat dissipation part 211 for heat exchange.

In addition, the heat dissipation device 2 further has a cover 7, which is disposed corresponding to the gap between the first heat dissipation fin groups 4 and fixed on the base 22. The cover 7 can Reducing the air flow resistance also prevents the air flow inside the first heat dissipation fin group 4 from being lost, and can take away the heat of the heat source 3 more quickly, thus improving the overall heat dissipation effect of the heat dissipation device 2 .

Please continue to refer to Figure 1. The body 20 further extends outward to form an extension part 206. The extension part has an upper side 206a and a lower side 206b. At least one second heat dissipation fin group 5 is correspondingly disposed on the upper side of the body 3. 206a or the lower side 206b (not shown in the figure), or the second heat dissipation fin group 5 can be provided at least on one side of the extension portion 206 or simultaneously on the upper side 206a and the lower side 206b of the extension portion (such as As shown in Figure 6, which is the second embodiment of the present invention, through the arrangement of the second heat dissipation fin group 5, the heat generated by the heat source 3 can be discharged to the outside more quickly for heat exchange, and the heat dissipation can be further improved. The overall heat dissipation efficiency of device 2.

Therefore, through the design of this structure of the present invention, the heat source 3 is attached to the second side 201 of the body 20, and the heat pipe 21 is disposed between the base 22 and the body 20, and the heat absorbing part 210 is directly attached to Located on the first side 200 of the body 20 , utilizing the large-area heat conduction and heat dissipation function of the body 20 and the remote heat dissipation effect of the heat pipe 21 , the overall performance of the heat dissipation device 2 can be greatly improved. Heat transfer efficiency and heat dissipation efficiency.

Please refer to Figure 7, which is a third embodiment of the heat dissipation device of the present invention. The main difference between this third embodiment and the above is that the heat absorption part 210 of a part of the heat pipe 21 is arranged vertically to the heat dissipation part 211. , the heat absorbing part 210 of some heat pipes 21 is arranged non-perpendicularly to the heat dissipating part 211. That is to say, the heat dissipating part 211 extends obliquely outward from the heat absorbing part 210, and can dissipate heat extending obliquely outward. A third heat dissipation fin set 6 is correspondingly installed on the portion 211;

In addition, as shown in Figure 8, the shape of the heat pipe 21 can also be an "L" shape or an "I" shape. The heat absorbing part 210 is flat against the body 20, and the upper and lower parts of the heat dissipating part 211 are respectively covered by the third Three heat dissipation fin groups 6 are sandwiched. Therefore, after the heat of the heat source 3 reaches rapid lateral temperature uniformity through the body 20, the heat is then conducted to the heat dissipation part 211 of the heat pipe 21, and then through the third heat dissipation fin. Group 6 performs heat dissipation to achieve a more remote heat dissipation effect.

As mentioned above, the present invention has the following advantages compared with the conventional ones: 1. Significantly improve the heat transfer efficiency; 2. Significantly improve the heat dissipation efficiency.

The present invention has been described in detail above. However, the above is only a preferred embodiment of the present invention. It cannot limit the scope of the present invention, that is, all equivalent changes and modifications can be made according to the scope of the present invention. etc., should still fall within the scope of the patent of the present invention.

2: Cooling device

20:Ontology

200: first side

201: Second side

206:Extension

206a: Upper side

206b: Lower side

21:Heat pipe

210: Heat absorption part

211:Heat dissipation department

22: base

220: Upper surface

221: Lower surface

223: Hollow part

3: Heat source

4: First cooling fin group

5: Second cooling fin group

7:Cover

Claims (7)

A heat dissipation device includes: a body, which is a uniform temperature plate and has a first side and a second side; a heat source is correspondingly attached to the second side; at least one heat pipe, which has a heat absorption part and a heat dissipation part part, the heat-absorbing part has a first surface and a second surface, the first surface is attached to the first side of the body, and the heat-dissipating part is far away from the heat-absorbing part, so that the heat generated by the heat source is emitted from the The heat-absorbing part absorbs heat and conducts it to the distal heat-dissipating part; and a base has a lower surface, the lower surface is in contact with the second surface of the heat-absorbing part, and the base sequentially presses the The heat-absorbing part and the body of the heat pipe. The heat dissipation device of claim 1, wherein the base has an upper surface, a hollow portion is formed on the base and penetrates the upper and lower surfaces, and the heat pipe penetrates the hollow portion and makes the The heat absorbing part is attached to the first side. The heat dissipation device according to claim 1 further has at least one first heat dissipation fin group, and the first heat dissipation fin group is correspondingly penetrated through the heat dissipation portion of the heat pipe. The heat dissipation device of claim 1, wherein the body further extends outward to form an extension portion, the extension portion has an upper side and a lower side, and at least one second heat dissipation fin group is correspondingly disposed on the upper side or lower side or The upper and lower sides are set simultaneously. The heat dissipation device according to claim 1, wherein the second side of the body is further protruded to form a boss, and the heat source is correspondingly attached to the boss. The heat dissipation device according to claim 3 further includes a cover, which is disposed corresponding to the notch of the first heat dissipation fin group and fixed on the base. The heat dissipation device according to claim 1, wherein the heat pipe is in a "U" shape, an "L" shape, or an "I" shape.