JP3152577U - Heat dissipation structure for communication equipment case - Google Patents

Abstract

Provided is a heat dissipation structure for a communication equipment case in which heat absorbed by at least one first copper heat absorption device is conducted to a non-contact portion with the first copper heat absorption device to radiate heat. A chamber 2 includes at least one first copper heat-absorbing device 211 and a first heat-conducting tube unit 213 therein. The first heat conducting tube unit 213 is connected to the first copper heat absorbing device 211 and the non-contact portion 212 of the first copper heat absorbing device, and the amount of heat absorbed by the first copper heat absorbing device 211 is the first copper heat absorbing device. The heat is conducted to the non-contact portion 212 with the device to be dissipated. [Selection] Figure 2

Description

  The present invention relates to a heat dissipation structure for a communication device case, and in particular, the heat absorbed by at least one first copper heat-absorbing device is conducted to a non-contact portion with the first copper heat-absorbing device by the first heat conducting tube unit. The present invention relates to a heat dissipation structure for a communication device case in which heat dissipation is performed quickly and effectively.

Conventional electronic communication devices are arranged and operated in a communication device case to generate a heat source. The communication device case is a closed body made of metal and is processed by an integral molding technique. At present, due to the limitations of the pressing technique, the heat transfer coefficient of the material is relatively low. In the communication equipment case, the amount of heat absorbed from the electronic device is accumulated in the local part of the case chamber, and the local temperature becomes high, but it is difficult to dissipate heat.
Therefore, the accumulated heat source exceeds the load of the electronic device and adversely affects the reliability and lifetime of the electronic device. However, in the case chamber, most of the range away from the electronic device is low, unlike the local area that contacts the electronic device.

  Since the temperature distribution in the case chamber is not uniform, the heat dissipation effect of the entire case is directly affected. Currently, the only solution to this problem is to increase the size of the chamber or improve the material of the chamber. However, these measures cannot avoid technical problems such as the chamber becoming too heavy.

  Therefore, it is important to improve the heat dissipation effect without changing the size and weight of the case chamber.

  The prior art will be described below with reference to the drawings. Please refer to FIG. FIG. 1 is an exploded perspective view showing a communication device case according to the prior art. As shown in FIG. 1, the communication device case according to the prior art includes a cover 10. A lid 11, two struts 12 and a substrate 13 are included. The cover 10 includes a storage space 101 and a plurality of radiating fins 103. The heat radiating fins 103 are provided on the surface of the cover 10 opposite to the storage space 101. The two struts 12 are provided at the end of the storage space 101 and join the corresponding substrates 13. The lid 11 is placed so as to correspond to one end of the cover 10, closes the storage space 101, and forms a closed space with the cover 10.

When the substrate 13 in the case chamber is operated, a plurality of heat generating devices 131 (chip, CPU or other IC) on the substrate 13 perform arithmetic processing, and a high-temperature heat source is generated. The heat source is accumulated in the closed storage space 101 and is not quickly released. However, heat is conducted to the cover 10 by the radiation method, and the heat radiation fins 103 outside the cover 10 only radiate heat to the outside. Since the heat generating device 131 on the substrate 13 does not have a conductive medium such as a heat conductive tube or a heat conductive device, the heat source generated by the heat generating device 131 cannot be quickly conducted to the heat radiating fins 103 of the cover 10 to radiate heat. The heat in the case chamber is not released to the outside.
For this reason, the heat generating device 131 may frequently freeze during arithmetic processing, the quality of the communication signal may be poor, the heat generating device 131 may be damaged, or the life may be shortened. From the above description, it can be seen that the communication device case according to the prior art has the following five drawbacks. 1. The heat dissipation effect is poor. 2. Freeze frequently. 3. The quality of the communication signal is poor. 4. Life is short. 5. High burnout rate.

JP 2003-209385 A

A first object of the present invention is to provide a heat dissipation structure for a communication equipment case in which heat absorbed by at least one first copper heat-absorbing device is conducted to a non-contact portion with the first copper heat-absorbing device to dissipate heat. There is to do.
A second object of the present invention is to provide a heat dissipation structure for a communication device case having a suitable heat dissipation effect.
A third object of the present invention is to provide a heat dissipation structure for a communication device case that extends the life.
A fourth object of the present invention is to provide a heat dissipation structure for a communication device case that stabilizes the quality of transmission and reception.
A fifth object of the present invention is to provide a heat dissipation structure for a communication device case having a uniform heat conduction area.

  In order to achieve the above object, the present invention provides a heat dissipation structure for a communication device case. The heat dissipation structure for a communication device case according to the present invention includes a chamber. The chamber has at least one first copper heat-absorbing device and a first heat-conducting tube unit inside. The first heat conducting tube unit is connected to a non-contact portion between the first copper heat absorption device and the first copper heat absorption device, and the amount of heat absorbed by the first copper heat absorption device is not equal to that of the first copper heat absorption device. Heat is dissipated through conduction to the contact portion.

  That is, the invention of claim 1 is a heat dissipation structure for a communication device housing, and has at least one first copper heat-absorbing device and a first heat-conducting tube unit inside, wherein the first heat-conducting tube unit is the first heat-conducting tube unit. 1 is connected to the non-contact portion between the copper heat-absorbing device and the first copper heat-absorbing device, and the heat absorbed by the first copper-heat-absorbing device is conducted to the non-contact portion with the first copper-heat-absorbing device. It is characterized by comprising a chamber in which is performed.

According to a second aspect of the present invention, in the heat dissipating structure for the communication device casing according to the first aspect, the chamber has a storage space.
The invention of claim 3 is the heat dissipating structure of the communication device case according to claim 1, wherein the first copper heat-absorbing device is disposed in a first end face that extends flatly on the bottom face of the chamber, and in the bottom face of the chamber. The second end face is formed integrally with the chamber.
The invention according to claim 4 is the heat dissipation structure for the communication device case according to claim 1, wherein the first copper heat-absorbing device is in contact with at least one heat-generating device to form a high-heat part. It is characterized by that.
The invention of claim 5 is the communication device case heat dissipation structure according to claim 4, wherein the first heat conducting tube unit has a plurality of at least one first heat absorption end and at least one first heat dissipation end. The first heat-absorbing end is adjacent to the first copper heat-absorbing device, and the first heat-dissipating end is far from the first copper heat-absorbing device. Features.

The invention according to claim 6 is the heat dissipation structure for the communication device case according to claim 2, wherein the chamber includes a first heat dissipating part, a second heat dissipating part, a third heat dissipating part, a fourth heat dissipating part, and a fourth heat dissipating part. 5, and a low heat part is formed in communication with each other. The first heat radiating part is provided on a bottom surface of the storage space far from the first copper heat absorbing device, The heat dissipating part, the third heat dissipating part, the fourth heat dissipating part, and the fifth heat dissipating part are provided so as to go around the storage space.
The invention according to claim 7 is the heat dissipation structure for the communication device case according to claim 2, wherein the housing space is mounted with at least one substrate on which at least one heat generating device is arranged.
The invention of claim 8 is the heat dissipating structure of the communication device case according to claim 4, wherein the chamber has at least one recessed groove in which the first heat conducting tube is disposed, and the recessed groove is A part is adjacent to the periphery of the first copper heat-absorbing device, and the remaining portion is adjacent to a non-contact portion with the first copper heat-absorbing device and the periphery of the chamber.
The invention of claim 9 is the heat dissipation structure for the communication device case according to claim 2, wherein the chamber has a plurality of heat dissipating fins on the outside, and the plurality of heat dissipating fins are opposite to the storage space of the chamber. It is provided in the surface of this.

The invention according to claim 10 is the heat dissipation structure for the communication device case according to claim 7, wherein the storage space is adjacent to a support device provided in the storage space of the chamber in order to support the substrate. Arranged between the two substrates, and at least one second copper heat absorbing device is disposed on each side, and is in contact with the heat generating device on the substrate to form a high heat part. And a heat conducting device.
The invention of claim 11 is the heat dissipating structure of the communication device case according to claim 10, wherein the second copper heat absorbing device has an end face that is flat with the heat conducting device and is integrally molded. .
The invention of claim 12 is the heat dissipation structure for a communication device case according to claim 10, wherein the heat-conducting device includes a second heat-conducting tube unit having a plurality of second heat-conducting tubes, and each of the second heat-conducting units. The tube has a second endothermic end adjacent to the second copper endothermic device, and a second end end distant from the second copper endothermic device, and the amount of heat absorbed by the second endothermic end is the first end. Heat radiation is conducted by being conducted to a non-contact portion with the first copper heat-absorbing device by the heat radiation end of 2.

The invention of claim 13 is the heat dissipating structure of the communication device case according to claim 2, wherein the chamber further covers a lid, and one side of the lid is opposed to the storage space, and at least one third A heat sink device made of copper, and a plurality of heat dissipating fins disposed on the opposite side of the storage space, which is the other side surface; the third heat sink device made of copper is in contact with the heat generating device to form a high heat portion; Yes. The third copper heat-absorbing device is in contact with at least one heat-generating device to form a high-heat part.
The invention of claim 14 is the heat dissipating structure of the communication device casing of claim 13, wherein the lid is integrally molded so that one side surface of the lid continues flatly to the third copper heat absorbing device. .
The invention of claim 15 is the heat dissipating structure of the communication device casing of claim 13, wherein the lid includes a third heat transfer tube unit having a plurality of third heat transfer tubes, and each of the third heat transfer tubes is the A third endothermic end adjacent to the third copper endothermic device; and a third endothermic end away from the third copper endothermic device; and the amount of heat absorbed by the third endothermic end is the third endothermic end. The heat radiation end conducts heat to a non-contact portion of the lid with the heat radiation fin and the first copper heat absorption device, respectively, and performs heat radiation.
The invention of claim 16 is the heat dissipation structure for a communication device casing according to claim 4, wherein the chamber has a storage space on which at least one substrate on which the heat generating device is arranged is mounted. .

In the heat dissipation structure of the communication device case of the present invention, the heat absorbed by the at least one first copper heat-absorbing device is conducted to the non-contact portion with the first copper heat-absorbing device by the first heat conducting tube unit, and the heat is dissipated. There are six advantages as follows.
1. The heat conduction effect can be improved.
2. The heat dissipation effect can be improved.
3. The heat conduction efficiency can be improved uniformly.
4. The heat radiation area can be improved.
5. The stability of communication signal quality can be improved.
6. The life can be extended.

It is a disassembled perspective view which shows the communication apparatus case by a prior art. It is a disassembled perspective view which shows the thermal radiation structure of the communication apparatus case by one Embodiment of this invention. It is a disassembled perspective view which shows a chamber, a thermal radiation pipe, and a board | substrate. 1 is an exploded perspective view showing a heat dissipation structure of a communication device case according to a preferred embodiment of the present invention. 1 is a perspective view showing a heat dissipation structure of a communication device case according to a preferred embodiment of the present invention. It is sectional drawing which shows the AA cross section of FIG.

Embodiments of the present invention will be described below with reference to the drawings.
Please refer to FIG. FIG. 2 is an exploded perspective view illustrating a heat dissipation structure of a communication device case according to an embodiment of the present invention. As shown in FIG. 2, the heat dissipation structure for the communication device case of the present invention includes a chamber 2. The chamber 2 has a storage space 21 and heat radiating fins 23. The heat radiating fins 23 are provided on the surface of the chamber 2 opposite to the storage space 21. The chamber 2 includes at least one first copper heat absorption device 211 and a first heat conducting tube unit 213. The first heat conducting tube unit 213 is provided in the storage space 21 of the chamber 2 and is connected to a non-contact portion 212 between the first copper heat absorbing device 211 and the first copper heat absorbing device.
By this. The amount of heat absorbed by the first copper heat-absorbing device 211 is conducted to the non-contact portion 212 with the first copper heat-absorbing device, and heat is radiated. The non-contact portion 212 with the first copper heat-absorbing device is located away from the first copper heat-absorbing device 211 and is not in contact with the first copper heat-absorbing device 211.

Since the first copper heat-absorbing device 211 has heat conductivity (heat absorption), it can quickly absorb the amount of heat. The first heat transfer tube unit 213 includes a plurality of first heat transfer tubes 2130 having at least one first heat absorption end 2131 and at least one first heat dissipation end 2132. The amount of heat absorbed by the first heat radiating end 2132 is conducted to the first copper heat-absorbing device 211 to radiate heat.
That is, when the first heat absorbing end 2131 quickly conducts the heat absorbed by the first copper heat absorbing device 211 to the first heat radiating end 2132, the heat received by the first heat radiating end 2132 is transferred to the first copper heat absorbing device 2132. The heat is quickly conducted to the non-contact part 212, the chamber 2 and other parts.
Therefore, heat is uniformly distributed and conducted through the first heat conducting tube unit 213 to the non-contact portion 212, the chamber 2 and other portions with the first copper heat absorbing device, and heat is dissipated. In addition, since the entire heat radiation area is increased uniformly and the thermal conductivity is improved, a suitable heat radiation effect can be obtained.

Reference is made to FIGS. FIG. 3 is an exploded perspective view showing the chamber, the heat radiating tube, and the substrate. FIG. 4 is an exploded perspective view showing a heat dissipation structure of a communication device case according to a preferred embodiment of the present invention. FIG. 5 is a perspective view illustrating a heat dissipation structure of a communication device case according to a preferred embodiment of the present invention.
FIG. 6 is a cross-sectional view showing the AA cross section of FIG. As shown in FIGS. 2 to 6, the first copper heat-absorbing device 211 has a first end surface 211 a that continues flat on the bottom surface of the chamber 2, and a second end surface 211 b that is disposed in the bottom surface of the chamber 2. 2 is integrally molded. The first copper heat-absorbing device 211 is in contact with at least one heat-generating device 41 and forms a high-heat part H.
The high heat part H is a relatively high-temperature heat source part in the storage space 21 because the first copper heat-absorbing device 211 has absorbed the amount of heat generated by the heat-generating device 41. The first endothermic end 2131 is adjacent to the first copper endothermic device 211, and the first endothermic end 2132 is far from the first copper endothermic device 211.

  The chamber 2 includes a first heat radiating part 2121, a second heat radiating part 2122, a third heat radiating part 2123, a fourth heat radiating part 2124, and a fifth heat radiating part 2125, and communicates with each other to form the low heat part L. Forming. The low heat part L is far from the high heat part H and is not in contact with the heat generating device 41, and thus is a relatively low temperature heat radiation part in the storage space 21. The first heat radiating portion 2121, the second heat radiating portion 2122, the third heat radiating portion 2123, the fourth heat radiating portion 2124, and the fifth heat radiating portion 2125 are non-contact portions 212 with the first copper heat absorbing device. .

The first heat radiating portion 2121 is located on the bottom surface of the storage space 21 away from the first copper heat absorbing device 211, and the second heat radiating portion 2122, the third heat radiating portion 2123, the fourth heat radiating portion 2124, The five heat dissipating parts 2125 communicate with each other and are arranged around the storage space 21.
That is, the second heat radiating portion 2122 is connected to the third heat radiating portion 2123 and the fifth heat radiating portion 2125 corresponding to both side surfaces. Another side surface of the third heat radiating portion 2123 and the fifth heat radiating portion 2125 is connected to both side surfaces of the fourth heat radiating portion 2124. Accordingly, the second heat radiating part 2122, the third heat radiating part 2123, the fourth heat radiating part 2124, and the fifth heat radiating part 2125 are arranged so as to go around the storage space 21.

The chamber 2 has at least one concave groove 214 in which the first heat conducting tube 2130 is disposed on the inner surface. The concave groove 214 is partially adjacent to the periphery of the first copper heat-absorbing device 211 and the remaining portion is adjacent to the non-contact portion 212 and the chamber 2 with the first copper heat-absorbing device.
That is, the concave groove 214 partially surrounds the first copper heat absorption device 211 along the first heat absorption end 2131 of the first heat conducting tube 2130, and the remaining portion is formed from the first copper heat absorption device 211. Separated, it extends along the first heat radiating end 2132 of the first heat-conducting tube 2130 and comes into contact with the non-contact portion 212 and the chamber 2 with the first copper heat-absorbing device. In the storage space 21, at least one substrate 4 on which a heat generating device 41 is arranged is mounted.

  Please refer to FIG. As shown in FIG. 4, the storage space 21 further includes at least one support device 215 and at least one heat conducting device 216. The plurality of support devices 215 are provided in the storage space 21 of the chamber 2 in order to support the substrate 4. Thereby, not only the substrate 4 is firmly fixed in the storage space 21, but also the heat source generated by the substrate 4 is conducted to the chamber 2 through the plurality of support devices 215. Further, the heat source conducted to the chamber 2 is radiated to the outside by the radiation fins 23 outside the chamber 2.

  The heat conducting device 216 is disposed between two adjacent substrates 4, and one end thereof is mutually fixed to the inside of the storage space 21. The heat conducting device 216 is provided with at least one second copper heat absorbing device 2162 on each side. Each second copper heat-absorbing device 2162 is in contact with the heat-generating device 41 on the substrate 4 to form a high heat part H. The second copper heat absorption device 2162 has a suitable heat conductivity (absorption), and can quickly absorb the amount of heat generated by the heat generating device 41 on the substrate 4. The heat conducting device 216 may be a heat conducting plate. The second copper heat-absorbing device 2162 has an end surface that is flat with the heat-conducting device 216 and is integrally molded.

The heat conducting device 216 further includes a second heat conducting tube unit 2163. The second heat transfer tube unit 2163 has a plurality of second heat transfer tubes 2164. Each second heat conducting tube 2164 has a second heat absorbing end 2165 adjacent to the second copper heat absorbing device 2162 and a second heat radiating end 2166 apart from the second copper heat absorbing device 2162. The amount of heat absorbed by the second heat absorbing end 2165 is not contacted with the first copper heat absorbing device by the second heat radiating end 2166 (the first heat radiating portion 2121, the second heat radiating portion 2122, the third heat radiating portion). 2123, the fourth heat radiating portion 2124 and the fifth heat radiating portion 2125) to dissipate heat.
Thus, when the amount of heat absorbed from the heat generating device 41 of the second copper heat absorbing device 2162 is conducted to the second heat radiating end 2166 by the second heat absorbing end 2165, the amount of heat received by the second heat radiating end 2166 is reduced. Conduction is made to the non-contact portion 212 with the first copper heat-absorbing device. The non-contact portion 212 with the first copper heat-absorbing device performs auxiliary heat dissipation by the heat-dissipating fins 23 on the chamber 2 in addition to performing heat dissipation to the outside by a radiation method.
The main heat radiation is that the first heat radiation part 2121, the second heat radiation part 2122, the third heat radiation part 2123, the fourth heat radiation part 2124 and the fifth heat radiation part 2125 radiate heat to the outside by a radiation method, It is to perform heat exchange and heat dissipation with external air. The heat radiation performed by the heat radiation fins 23 on the chamber 2 is auxiliary.

  The chamber 2 is further covered with a lid 5. The lid 5 has at least one third copper heat absorption device 51 and at least one third heat conducting tube unit 52 on one side surface facing the storage space 21, and the other side surface of the storage space 21. A plurality of heat radiation fins 53 are arranged on the opposite side. The third copper heat-absorbing device 51 is in contact with the heat-generating device 41 and forms a high-heat part H. The third copper endothermic device 51 absorbs the amount of heat generated by the heating device 41 on the substrate 4. The lid 5 is integrally molded so that one side surface of the lid 5 continues flatly to the third copper heat-absorbing device 51.

  The third heat transfer tube unit 52 includes a plurality of third heat transfer tubes 520. Each third heat conducting tube 520 has a third heat absorbing end 521 adjacent to the third copper heat absorbing device 51 and a third heat radiating end 522 away from the third copper heat absorbing device 51. The amount of heat absorbed by the third heat absorbing end 521 is conducted by the third heat radiating end 522 to the heat dissipating fins 53 on the opposite side of the lid 5 and / or the non-contact portion 212 with the first copper heat absorbing device, and heat is radiated. Is called. When the third copper heat-absorbing device 51 quickly absorbs the amount of heat of the heat-generating device 41 due to good thermal conductivity, and the amount of heat is conducted to the third heat-dissipating end 522 by the third heat-absorbing end 521, the third heat-dissipating device The amount of heat received by the end 522 is conducted to the non-contact portion 212 with the first copper heat-absorbing device and to the heat-dissipating fins 53 on the lid 5 to radiate heat.

Reference is again made to FIGS. The embodiment of the present invention described above is organized as follows.
When the substrate 4 in the communication device case is operated, the heat generating device 41 of the substrate 4 generates heat. The first copper heat-absorbing device 211 quickly absorbs the heat quantity of the heat-generating device 41 of the substrate 4 due to its good thermal conductivity.
When the amount of heat is conducted to the first heat radiating end 2132 by the first heat absorbing end 2131 of the first heat conducting tube 2130, the amount of heat received by the first heat radiating end 2132 is not in contact with the first copper heat absorbing device. 212 (first heat radiating part 2121, second heat radiating part 2122, third heat radiating part 2123, fourth heat radiating part 2124 and fifth heat radiating part 2125). The non-contact portion 212 with the first copper heat-absorbing device performs auxiliary heat radiation by the heat radiation fins 23 on the chamber 2 in addition to heat radiation to the outside by a radiation method with a large heat radiation area.

At the same time, when the second copper heat absorbing devices 2162 on both sides of the heat conducting device 216 also quickly absorb the heat sources of the corresponding heat generating devices 41, the second heat absorbing ends 2165 of the second heat conducting tubes 2164 become the second heat radiating ends. 2166 conducts a heat source.
When the amount of heat received by the second heat radiating end 2166 is conducted to the non-contact portion 212 with the first copper heat-absorbing device, the non-contact portion 212 with the first copper heat-absorbing device becomes the first heat radiating portion 2121, The heat sources are evenly diffused in the second heat radiating portion 2122, the third heat radiating portion 2123, the fourth heat radiating portion 2124, and the fifth heat radiating portion 2125, and heat is radiated to the outside by a radiation method. Further, auxiliary heat dissipation is performed by the heat dissipation fins 23 on the chamber 2.

At the same time, when the third copper heat absorbing device 51 of the lid 5 quickly absorbs the amount of heat generated by the heat generating device 41 on the other substrate 4, the third heat absorbing end 521 of the third heat conducting tube 520 is The absorbed amount of heat is conducted to the third heat radiating end 522. When the amount of heat received by the third heat radiating end 522 is conducted to the non-contact portion 212 with the first copper heat-absorbing device, the non-contact portion 212 with the first copper heat-absorbing device is the first heat radiating portion 2121, The heat source is evenly diffused in the second heat radiating portion 2122, the third heat radiating portion 2123, the fourth heat radiating portion 2124, and the fifth heat radiating portion 2125, and heat is radiated to the outside by a radiation method.
Further, auxiliary heat dissipation is performed by the heat dissipation fins 23 on the chamber 2. As described above, the substrate 4 in the communication device case operates stably and the quality of the communication signal is good. In addition, the life is extended, and a suitable heat dissipation effect is obtained.

  Although the present invention discloses preferred embodiments as described above, these are not intended to limit the present invention in any way, and anyone skilled in the art is within the spirit and scope of the present invention. Various changes and modifications can be made. Therefore, the scope of protection of the present invention is based on the contents specified in the claims of the utility model.

2 Chamber 4 Substrate 5 Lid 21 Storage space 23 Radiation fin 41 Heat generation device 51 Third copper heat absorption device 52 Third heat transfer tube unit 53 Heat radiation fin 211 First copper heat absorption device 211a First end surface 211b Second end surface 212 Non-contact portion 213 with first copper heat absorption device 213 First heat transfer tube unit 214 Concave groove 215 Support device 216 Heat transfer device 520 Third heat transfer tube 521 Third heat absorption end 522 Third heat dissipation end 2121 First heat dissipation Part 2122 second heat radiating part 2123 third heat radiating part 2124 fourth heat radiating part 2125 fifth heat radiating part 2130 first heat conducting tube 2131 first heat absorbing end 2132 first heat radiating end 2162 second copper heat absorbing device 2163 2nd heat transfer tube unit 2164 2nd heat transfer tube 2165 2nd heat absorption end 2166 2nd heat radiation end H high heat part L low Hot section

Claims (16)

  It has at least one first copper heat-absorbing device and a first heat-conducting tube unit inside, and the first heat-conducting tube unit is in a non-contact portion with the first copper heat-absorbing device and the first copper heat-absorbing device. A heat dissipation structure for a communication device case, comprising: a chamber that is connected and the heat quantity absorbed by the first copper heat-absorbing device is conducted to a non-contact portion with the first copper heat-absorbing device to dissipate heat.   The heat radiating structure for a communication device case according to claim 1, wherein the chamber has a storage space.   The first copper heat-absorbing device has a first end surface that continues flat on the bottom surface of the chamber, and a second end surface that is disposed in the bottom surface of the chamber, and is integrally formed with the chamber. The heat dissipation structure for a communication device case according to claim 1.   2. The heat dissipation structure for a communication device case according to claim 1, wherein the first copper heat-absorbing device is in contact with at least one heat-generating device to form a high-heat part.   The first heat transfer tube unit includes a plurality of first heat transfer tubes having at least one first heat absorption end and at least one first heat dissipation end, and the first heat absorption end is the first heat absorption end. 5. The heat dissipation structure for a communication device case according to claim 4, wherein the heat dissipation structure is adjacent to a copper heat absorption device, and the first heat dissipation end is far from the first copper heat absorption device.   The chamber includes a first heat radiating portion, a second heat radiating portion, a third heat radiating portion, a fourth heat radiating portion, and a fifth heat radiating portion, and communicates with each other to form a low heat portion. Are provided on the bottom surface of the storage space far from the first copper heat-absorbing device, the second heat-dissipating part, the third heat-dissipating part, the fourth heat-dissipating part, and the fifth heat-dissipating part. The heat dissipating structure of the communication device case according to claim 2, wherein the heat dissipating part is provided so as to go around the storage space.   The heat dissipation structure for a communication device case according to claim 2, wherein at least one substrate on which at least one heat generating device is disposed is mounted in the storage space.   The chamber includes at least one concave groove in which the first heat conducting tube is disposed, and the concave groove is partially adjacent to the periphery of the first copper heat absorbing device, and the remaining portion is the The heat dissipating structure of the communication device case according to claim 4, wherein the heat dissipating structure is adjacent to a non-contact portion with the first copper heat absorbing device and around the chamber.   The communication device case according to claim 2, wherein the chamber has a plurality of heat radiating fins on the outside, and the plurality of heat radiating fins are provided on a surface of the chamber opposite to the storage space. Heat dissipation structure.   In order to support the substrate, the storage space is disposed between a support device provided in the storage space of the chamber and two adjacent substrates, and at least one second copper product is provided on both sides. The communication device case according to claim 7, further comprising: a heat conducting device in which each of the heat absorbing devices is disposed and is in contact with the heat generating device on the substrate so as to form a high heat part. Heat dissipation structure.   11. The heat dissipation structure for a communication equipment case according to claim 10, wherein the second copper heat-absorbing device has an end surface that is flat with the heat-conducting device and is integrally molded.   The heat-conducting device includes a second heat-conducting tube unit having a plurality of second heat-conducting tubes, wherein each second heat-conducting tube has a second heat-absorbing end adjacent to the second copper heat-absorbing device, and a second A second heat dissipating end away from the copper heat-absorbing device, and the amount of heat absorbed by the second heat-absorbing end is conducted to a non-contact portion with the first copper heat-absorbing device by the second heat dissipating end. The heat dissipation structure for a communication device case according to claim 10, wherein heat dissipation is performed.   The chamber further covers a lid, the lid has at least one third copper heat-absorbing device on one side opposite to the storage space, and a plurality of caps on the other side opposite to the storage space. The third copper heat-absorbing device is in contact with the heat-generating device and forms a high-heat part. The heat dissipation structure for a communication device case according to claim 2, wherein the third copper heat-absorbing device is in contact with at least one heat-generating device to form a high-heat part.   The heat dissipating structure of the communication device case according to claim 13, wherein the lid is integrally molded so that one side surface thereof is flatly connected to the third copper heat absorbing device.   The lid includes a third heat transfer tube unit having a plurality of third heat transfer tubes, each of the third heat transfer tubes being adjacent to the third copper heat absorption device, and the third heat absorption end. A third heat dissipating end away from the copper heat absorbing device, and the amount of heat absorbed by the third heat absorbing end is not in contact with the heat dissipating fin of the lid and the first copper heat absorbing device by the third heat dissipating end; The heat dissipation structure for a communication device case according to claim 13, wherein the heat dissipation is performed by being conducted to each part.   5. The heat dissipation structure for a communication device case according to claim 4, wherein the chamber has a storage space in which at least one substrate on which the heat generating device is disposed is mounted.

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