TWI738462B - Computer host - Google Patents

Abstract

A computer host includes a chassis, an electronic module, a first heat dissipation module and a second heat dissipation module. The cabinet has a top wall and a side wall connecting the top wall. The electronic module includes a circuit board close to the top wall, and a first electronic component and a second electronic component that are arranged on the circuit board and generate heat during operation. The first heat dissipation module includes a first heat sink arranged on the chassis and covering the top wall, and a first heat conduction unit connecting the first heat sink and the first electronic element. The second heat dissipation module includes a second heat sink arranged on the chassis and covering the side wall, and a second heat conduction unit connecting the second heat sink and the second electronic element. By using the first heat dissipation module and the second heat dissipation module to dissipate heat together, not only the overall heat capacity can be increased, but also the mutual influence or interference of the temperature of the first electronic component and the second electronic component can be avoided.

Description

Computer host

The present invention relates to a computer host, in particular to a computer host with dual processors.

Generally, computer hosts with a central processing unit (hereinafter referred to as CPU) and graphics processing unit (hereinafter referred to as GPU) use heat sinks located on the top side (that is, above the CPU and GPU) to dissipate heat.

However, because the thermal design power (Thermal Design Power, abbreviated TDP) of the CPU and GPU set in the same computer host are mostly different, for example, the TDP of the CPU is 35W and the TDP of the GPU is 65W. When the TDP of the two differ greatly , The smaller TDP is easier to receive the heat energy of the larger TDP, and the temperature of the smaller TDP increases, which in turn affects the operating efficiency of the smaller TDP. In other words, the temperature of the CPU and GPU will affect each other and cause interference.

In addition, only the heat sink on the top side helps the CPU and GPU to dissipate heat. When the TDP of the GPU and GPU are both large, the problem of insufficient heat volume will occur, and the heat dissipation efficiency will be poor.

Therefore, one of the objectives of the present invention is to provide a computer host that can solve the aforementioned problems.

Therefore, another objective of the present invention is to provide an electrical connector assembly

Therefore, in some embodiments, the computer host of the present invention includes a chassis, an electronic module, a first heat dissipation module, and a second heat dissipation module. The chassis defines an accommodating space, and has a top wall and a side wall connected to the top wall. The electronic module is arranged in the chassis, and includes a circuit board located in the accommodating space and close to the top wall, a first electronic component arranged on the circuit board, and a circuit board arranged on the circuit board and connected to the first electronic circuit board. A second electronic component with components separated by a certain distance, the first electronic component and the second electronic component will generate heat during operation. The first heat dissipation module includes a first heat sink disposed in the chassis and covering the top wall, and a first heat conduction unit connecting the first heat sink and the first electronic component, and the first heat sink has a plurality of The first heat dissipation fin, and the first heat conduction unit is used for conducting the heat energy of the first electronic component to the first heat sink. The second heat dissipation module includes a second heat sink disposed in the chassis and covering the side wall, and a second heat conduction unit connecting the second heat sink and the second electronic component. The second heat sink has a plurality of first heat sinks. Two heat dissipation fins, and the second heat conduction unit is used for conducting the heat energy of the second electronic component to the second heat sink.

In some embodiments, the second heat conduction unit includes a plate-shaped heat-conducting part located above the second electronic component, and an extended heat-conducting part connected to the plate-shaped heat-conducting part and in contact with the second heat sink. The plate The heat-conducting part is separated from the first heat sink by a gap.

In some embodiments, the second heat dissipation module further includes an adjustment member located in the gap and connecting the plate-shaped heat conduction portion and the first heat sink, and the adjustment member has a function of heat insulation or heat conduction.

In some embodiments, the first electronic component is a graphics processor, and the second electronic component is a central processing unit.

The present invention has the following effects: through the joint heat dissipation of the first heat dissipation module and the second heat dissipation module, not only the overall heat capacity can be increased, but also the mutual influence of the temperature of the first electronic component and the second electronic component can be avoided Or interference. Further, the first heat dissipation module and the second heat dissipation module can be connected by the adjusting member to adjust the thermal energy distribution of the first heat dissipation module and the second heat dissipation module to achieve better heat dissipation performance.

Referring to FIGS. 1 to 4, an embodiment of the computer host 100 of the present invention includes a chassis 1, an electronic module 2, a first heat dissipation module 3 and a second heat dissipation module 4.

The case 1 defines an accommodating space 11 and has a top wall 12 and a side wall 13 vertically connected to the top wall 12. In this embodiment, the chassis 1 further has a bottom wall 14 opposite to the top wall 12, two supporting walls 15 opposite to each other and connecting the top wall 12 and the bottom wall 14, and a side wall 14 13 Opposite second side wall 16.

The electronic module 2 is disposed in the chassis 1, and includes a circuit board 21 located in the accommodating space 11 and close to the top wall 12, a first electronic component 22 disposed on the circuit board 21, and a circuit board disposed on the circuit board 21. The board 21 and the second electronic component 23 spaced apart from the first electronic component 22 will generate heat when the first electronic component 22 and the second electronic component 23 are in operation. In this embodiment, the first electronic component 22 is a graphics processing unit (GPU), and the second electronic component 23 is a central processing unit (CPU). In this embodiment, the top wall 12 is provided with two openings 121 corresponding to the first electronic component 22 and the second electronic component 23 respectively. The first electronic component 22 is arranged close to the second side wall 16, and the second The two electronic components 23 are arranged close to the side wall 13.

The first heat dissipation module 3 includes a first heat sink 31 disposed on the chassis 1 and covering the top wall 12 and a first heat conducting unit 32 connecting the first heat sink 31 and the first electronic component 22. The first heat sink 31 has a first base 311 and a plurality of first heat dissipation fins 312 connected to the first base 311. The first heat-conducting unit 32 is used to conduct the thermal energy of the first electronic component 22 to the first heat sink 31. In this embodiment, the first heat-conducting unit 32 includes a copper-made heat-conducting plate 321 and two copper-made heat-conducting pipes 322 connected to the heat-conducting plate 321 and extending to both sides. The heat-conducting plate 321 is located above the first electronic element 22 to contact and conduct heat with the first electronic element 22, which may be in direct contact or indirect contact through a heat-conducting medium. The outer side of the first base portion 311 is connected with the first heat dissipation fins 312, and the inner side of the first base portion 311 is formed with a plurality of accommodating grooves 311 a corresponding to the heat conducting plate 321 and the heat conducting tubes 322. In this embodiment, the heat conducting plate 321 and the heat conducting tubes 322 are embedded in the inner side of the first base 311.

The second heat dissipation module 4 includes a second heat sink 41 disposed on the chassis 1 and covering the side wall 13 and a second heat conduction unit 42 connecting the second heat sink 41 and the second electronic component 23. The second heat sink 41 has a second base portion 411 and a plurality of second heat dissipation fins 412 connected to the second base portion 411, and the second heat conducting unit 42 is used to conduct the thermal energy of the second electronic component 23 to the second base portion 411.二 radiator 41. In this embodiment, the second heat conducting unit 42 includes a plate-shaped heat-conducting portion 421 located above the second electronic component 23, and an extended heat-conducting portion connected to the plate-shaped heat-conducting portion 421 and in contact with the second heat sink 41部422. In this embodiment, the plate-shaped heat-conducting portion 421 is made of copper and used for contacting and conducting heat with the second electronic component 23, which can be in direct contact or indirect contact through a heat-conducting medium. The extended heat conduction portion 422 is composed of two copper pipes for conducting heat to the second heat sink 41. The outer side of the second base portion 411 is connected with the second heat dissipation fins 412, and the inner side of the second base portion 411 is formed with two grooves 411 a for embedding the two copper pipes of the extending heat conduction portion 422 respectively. In addition, the inner side of the first base portion 311 is also formed with an escape groove 311 b having a shape corresponding to the second heat conducting unit 42.

The plate-shaped heat conducting portion 421 and the first heat sink 31 are separated by a gap G. In this embodiment, the gap G is about 5 mm. Further, in this embodiment, the second heat dissipation module 4 may further include an adjusting member 43 located in the gap G and connecting the plate-shaped heat conducting portion 421 and the first heat sink 31, and the adjusting member 43 has a spacer. The function of heat or heat conduction can be adjusted according to the needs of use. For example, the adjusting member 43 may be a thermally insulating sheet (thermal conductivity k=0), a thermally conductive patch (thermal conductivity k=1-20), a copper sheet (thermal conductivity k=401), etc., which may be based on the first electronic The thermal design power (TDP) of the element 22 and the second electronic element 23 are adjusted. In this embodiment, the preset heat volume of the first radiator 31 is 65W, and the preset heat volume of the second radiator 41 is 35W. When the first electronic component 22 (GPU) and the second electronic component 22 are used When the TDP of the component 23 (CPU) is different, the adjustment member 43 of different materials can be used correspondingly as shown in Table 1 below.

Table 1 TDP of the first electronic component TDP of the second electronic component Adjustment piece example 1 50W 35W Thermal insulation sheet Example 2 78W 35W Thermal insulation sheet Example 3 50W 65W Copper sheet Example 4 78W 65W Thermal patch

Examples 1 and 2 in Table 1 are when the TDP of the second electronic component 23 is equivalent to the preset heat volume of the second radiator 41, the second electronic component 23 can dissipate heat through the second radiator 41, and the adjustment piece 43 may use a thermal insulation sheet to prevent the heat energy of the first heat sink 31 from being conducted to the second electronic element 23, that is, to prevent the heat energy generated by the first electronic element 22 from affecting the second electronic element 23. In this case, the adjustment member 43 may not be provided, and it may be implemented only by air resistance. Since the heat generated by the first electronic element 22 is dissipated through the first heat dissipation module 3, and the heat generated by the second electronic element 23 is dissipated through the second heat dissipation module 4, it can be dissipated between the first electronic element 22 and the second electronic element. When the TDP of 23 has a large difference, the electronic components with a small TDP are prevented from being affected or interfered.

Examples 3 and 4 in Table 1 show that when the TDP of the second electronic component 23 is greater than the preset heat volume of the second radiator 41, heat can be dissipated by the first radiator 31, so the adjusting member 43 is used. The thermal conductivity function, and the thermal conductivity of the adjusting member 43 can be different depending on the TDP of the first electronic component 22. For example 3, the TDP of the first electronic component 22 is relatively small, and the adjusting member 43 with a relatively large thermal conductivity can be used to conduct more heat generated by the second electronic component 23 to the first heat sink 31 for heat dissipation, that is, Let the first radiator 31 share more heat energy. For example 4, the TDP of the first electronic component 22 is larger, so the first heat sink 31 needs to bear more heat energy of the first electronic component 22, so the adjusting member 43 with a smaller thermal conductivity is used to make the first heat sink The device 31 shares less heat energy generated by the second electronic component 23.

To sum up, through the joint heat dissipation of the first heat dissipation module 3 and the second heat dissipation module 4, not only the overall heat capacity can be increased, but also the damage of the first electronic component 22 and the second electronic component 23 can be avoided. Temperature affects or interferes with each other. Further, the first heat dissipation module 3 and the second heat dissipation module 4 can be connected by the adjusting member 43 to adjust the thermal energy distribution of the first heat dissipation module 3 and the second heat dissipation module 4 to achieve better Cooling efficiency.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

100: computer host 1: Chassis 11: accommodating space 12: top wall 121: open 13: side wall 14: bottom wall 15: support wall 16: second side wall 2: Electronic module 21: circuit board 22: The first electronic component 23: The second electronic component 3: The first heat dissipation module 31: The first radiator 311: first base 311a: containment groove 311b: Avoid groove 312: The first cooling fin 32: The first heat conduction unit 321: Thermal Conductive Plate 322: heat pipe 4: The second heat dissipation module 41: second radiator 411: second base 411a: Groove 412: Second cooling fin 42: The second heat conduction unit 421: Plate-shaped heat conduction part 422: Extend the heat conduction part 43: adjustment parts G: gap

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a perspective view of an embodiment of the computer host of the present invention; Figure 2 is a three-dimensional exploded view of the embodiment; Figure 3 is another perspective exploded view of the embodiment; and Figure 4 is a schematic cross-sectional view of this embodiment.

100: computer host

1: Chassis

12: top wall

121: open

13: side wall

15: support wall

3: The first heat dissipation module

31: The first radiator

311: first base

312: The first cooling fin

32: The first heat conduction unit

321: Thermal Conductive Plate

322: heat pipe

4: The second heat dissipation module

41: second radiator

411: second base

412: Second cooling fin

42: The second heat conduction unit

421: Plate-shaped heat conduction part

422: Extend the heat conduction part

43: adjustment parts

Claims (4)

A computer host that contains: A case, defining an accommodating space, and having a top wall and a side wall connected to the top wall; An electronic module is arranged in the chassis and includes a circuit board located in the accommodating space and close to the top wall, a first electronic component arranged on the circuit board, and a circuit board arranged on the circuit board and connected to the first A second electronic component whose electronic components are separated by a certain distance, the first electronic component and the second electronic component will generate heat during operation; A first heat dissipation module, including a first heat sink disposed on the chassis and covering the top wall, and a first heat conduction unit connecting the first heat sink and the first electronic component, the first heat sink having a plurality of A first heat dissipation fin, the first heat conduction unit is used to conduct the thermal energy of the first electronic component to the first heat sink; and A second heat dissipation module, including a second heat sink disposed in the chassis and covering the side wall, and a second heat conduction unit connecting the second heat sink and the second electronic component, the second heat sink having a plurality of The second heat dissipation fin, and the second heat conduction unit is used for conducting the heat energy of the second electronic component to the second heat sink. The computer host according to claim 1, wherein the second heat conduction unit includes a plate-shaped heat-conducting portion located above the second electronic component, and an extended heat-conducting portion connected to the plate-shaped heat-conducting portion and in contact with the second heat sink Part, the plate-shaped heat-conducting part is separated from the first heat sink by a gap. The computer host according to claim 2, wherein the second heat dissipation module further includes an adjustment member located in the gap and connecting the plate-shaped heat conduction portion and the first heat sink, and the adjustment member has a function of heat insulation or heat conduction. The computer host according to claim 1, wherein the first electronic component is a graphics processor, and the second electronic component is a central processing unit.

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