CN110278699A - A kind of smart phone liquid-cooling heat radiator - Google Patents

A kind of smart phone liquid-cooling heat radiator Download PDF

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Publication number
CN110278699A
CN110278699A CN201910685051.5A CN201910685051A CN110278699A CN 110278699 A CN110278699 A CN 110278699A CN 201910685051 A CN201910685051 A CN 201910685051A CN 110278699 A CN110278699 A CN 110278699A
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CN
China
Prior art keywords
liquid
cooling heat
heat radiator
smart phone
liquid cooling
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Application number
CN201910685051.5A
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Chinese (zh)
Inventor
陈建聪
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Individual
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Individual
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Priority to CN201910685051.5A priority Critical patent/CN110278699A/en
Publication of CN110278699A publication Critical patent/CN110278699A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a kind of smart phone liquid-cooling heat radiators, including liquid cooling heat radiator, small pump, water inlet pipe, outlet pipe, matched junction, water tank, auxiliary heat conduction material, the liquid cooling heat radiator includes clamp button of the spring, fin, radiator fan, porous shell, liquid cooling pipe and thermal conductive metal plate, and the auxiliary heat conduction material is mounted between the liquid cooling heat radiator and the cell-phone heating back side;One end of the water inlet pipe and the outlet pipe is connected on the liquid cooling heat radiator, and the other end is connected on the water tank, and the outlet pipe is connected by the small pump with the matched junction on the water tank.Present apparatus structure is simple, easy to use, adjustability is strong, wide adaptability, efficiently solves the heat dissipation problem of smart phone.

Description

A kind of smart phone liquid-cooling heat radiator
Technical field:
The present invention relates to liquid-cooling heat radiation field, specially a kind of smart phone liquid-cooling heat radiator.
Background technique:
With the fast development of high-performance smart phone, the heat dissipation problem of mobile phone is also more and more obvious.And lucky mobile phone Height fever is to restrict the release of handset capability, the big bottleneck of the one of development.And cell phone manufacturer design produce mobile phone when there is no mistakes Consider the problems of its height fever, most of cell-phone heating can only rely on internal graphite flake by thermally conductive heat transfer more To environment, small part flagship interior of mobile phone is just equipped with micro heat pipe and carrys out auxiliary heat dissipation.In order to solve the problems, such as that presently, there are need For mobile phone external radiator.
The external radiator of mobile phone mainly has air-cooled radiator and liquid cooling heat radiator.Air-cooled radiator makes by radiator fan The air of flowing takes away heat, but the smaller thermal load capacity of the specific heat capacity of air is poor, and the heat dissipation effect liquid cooling that compares dissipates Heat is in a disadvantageous position.Liquid-cooling heat radiation refers to that working medium (usually water) takes away heat at equipment heating end under the action of circulating pump, Working medium carries out cold and hot exchange more Biological process simultaneously in water tank, and Temperature of Working reduction is made to restart circulation cooling.Liquid-cooling heat radiation because It is far longer than the heat convection ability of air for the heat convection ability of liquid, therefore the liquid-cooling heat radiation wind-cooling heat dissipating that compares has Preferably cooling effect, and also have the advantages that noise is small.The heat that liquid cooling pipe is absorbed in not up to radiating end is mainly Heat is discharged by air and liquid cooling pipe heat convection.However the liquid cooling pipe for installing fin additional can increase the contact surface with air Product improves convection transfer rate, heat removal capacity greatly improved, so that high enhances the heat-transfer capability of liquid cooling pipe.In order to The heat-sinking capability for improving liquid cooling pipe needs the narrow space in radiator to increase heat exchange area as much as possible or improve working medium Circulation rate.The bigger working medium under the unit time of heat exchange area can absorb that the heat taken away is more, and working medium circulation speed is got over Drop faster at a temperature of high working medium, then the heat dissipation effect of liquid cooling heat radiator is better.
Smart phone size is different, and cell phone manufacturer is to reach more comfortable grip feeling mobile phone is usually designed to band There is the dorsal shield of cambered surface, it is therefore desirable to improve the versatility of liquid cooling heat radiator and using auxiliary heat conduction material filling gap to enhance Thermal conductivity.The heat condition of smart phone is affected with working state of mobile phone and environment, needs one kind that can adjust heat dissipation The radiator of power adapts to different heat conditions, to improve the versatility and economy of the smart phone liquid-cooling heat radiator Property.
Summary of the invention:
The purpose of the present invention is in view of the drawbacks of the prior art, providing a kind of smart phone liquid-cooling heat radiator, to solve The problem of above-mentioned background technique proposes.
To achieve the above object, the invention provides the following technical scheme: a kind of smart phone liquid-cooling heat radiator, including liquid Cold heat sink, small pump, water inlet pipe, outlet pipe, matched junction, water tank, auxiliary heat conduction material, the liquid cooling heat radiator include Clamp button of the spring, fin, radiator fan, porous shell, liquid cooling pipe and thermal conductive metal plate, the auxiliary heat conduction material are mounted on described Between liquid cooling heat radiator and the cell-phone heating back side;One end of the water inlet pipe and the outlet pipe is connected to the liquid cooling and dissipates On hot device, the other end is connected on the water tank, and the outlet pipe passes through described on the small pump and the water tank Connector is connected.
As a preferred technical solution of the present invention, the auxiliary heat conduction material is that soft heat-conducting silica gel sheet is soft Material.
As a preferred technical solution of the present invention, be equipped with coolant liquid in the water tank, coolant liquid be water, ethylene glycol or Any one of glycerine.
As a preferred technical solution of the present invention, the matched junction is equipped at least two, one of them is used for New coolant liquid is accessed, another is for being discharged extra excessive coolant liquid.
As a preferred technical solution of the present invention, the liquid cooling pipe is waveform.
As a preferred technical solution of the present invention, flexible bottom layer is equipped on the inside of the clamp button of the spring.
As a preferred technical solution of the present invention, the liquid cooling heat radiator, the water inlet pipe, the outlet pipe and institute Water tank is stated to use with grid, the encapsulation of porous shell.
The beneficial effects of the present invention are: the device is far longer than the heat convection of air using the heat convection ability of liquid Ability is radiated using liquid cooling mode, and liquid-cooling heat radiation compares wind-cooling heat dissipating with preferably cooling effect, and also has The small advantage of noise, the liquid cooling pipe for installing fin additional, which can increase, improves convection transfer rate with the contact area of air, substantially Heat removal capacity is improved, so that high enhances the heat-transfer capability of liquid cooling pipe, which increases in radiator narrow space The circulation rate for adding heat exchange area, improving working medium, heat exchange area is bigger, and working medium can absorb the heat taken away under the unit time It is more, drop faster at a temperature of the higher working medium of working medium circulation speed, then the heat dissipation effect of liquid cooling heat radiator is better, which can be with The heat for draining smart phone generation in time is allowed to play superior performance and prolong the service life.
Detailed description of the invention:
Fig. 1 is the structural diagram of the present invention;
Fig. 2, Fig. 3 are liquid cooling heat radiator internal heat dissipating fan of the present invention, the structural schematic diagram of liquid cooling pipe and fin;
In figure: 1- clamp button of the spring, 2- auxiliary heat conduction material, 3- fin, 4- radiator fan, 5- outlet pipe, 6- water inlet pipe, 7- Small pump, 8- matched junction, 9- water tank, 10- porous shell, 11- liquid cooling pipe, 12- thermal conductive metal plate.
Specific embodiment:
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawing, so that advantages and features of the invention energy It is easier to be understood by those skilled in the art, so as to make a clearer definition of the protection scope of the present invention.
Embodiment 1
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of smart phone liquid-cooling heat radiator, including liquid cooling Radiator, small pump 7, water inlet pipe 6, outlet pipe 5, matched junction 8, water tank 9, auxiliary heat conduction material 2, liquid cooling heat radiator include Clamp button of the spring 1, fin 3, radiator fan 4, porous shell 10, liquid cooling pipe 11 and thermal conductive metal plate 12, auxiliary heat conduction material 2 are installed Between liquid cooling heat radiator and the cell-phone heating back side;One end of water inlet pipe 6 and outlet pipe 5 is connected on liquid cooling heat radiator, The other end is connected on water tank 9, and outlet pipe 5 is connected by small pump 7 with the matched junction 8 on water tank 9.Auxiliary heat conduction material 2 materials soft for soft heat-conducting silica gel sheet, water tank 9 is interior to be equipped with coolant liquid, and coolant liquid is water, ethylene glycol or glycerine Any one, matched junction 8 is equipped at least two, one of them is for accessing new coolant liquid, another is for being discharged Extra excessive coolant liquid, liquid cooling pipe 11 are waveform, are equipped with flexible bottom layer, liquid cooling heat radiator, water inlet pipe on the inside of clamp button of the spring 1 6, outlet pipe 5 and water tank 9 are encapsulated using with grid, porous shell.
Working principle: a kind of smart phone liquid-cooling heat radiator, liquid cooling heat radiator include clamp button of the spring 1, fin 3, heat dissipation Fan 4, porous shell 10, liquid cooling pipe 11, thermal conductive metal plate 12.Liquid cooling pipe 11 makes wavy shape.Liquid in liquid cooling heat radiator Fin 3 is connected between cold pipe 11 and thermal conductive metal plate 12, fin bottom portion is equipped with small-sized heat radiating fan 4, passes through fin 3 and radiation air Fan 4 carrys out a part of heat of dissipation liquid cooling pipe working medium.6 one end of inlet and outlet pipes is connect with liquid cooling heat radiator, and the other end and water tank 9 connect It connects.The liquid cooling pipe 11 of liquid cooling heat radiator is connect by small pump 7 with outlet pipe 5, is mentioned by small pump 7 for working medium circulation For power, and it can also adjust the power of small pump to adapt to different heat conditions.
The cell-phone heating back side and liquid cooling heat radiator are in close contact by the present apparatus by auxiliary heat conduction material 2, and pass through spring Buckle 1 makes liquid cooling heat radiator be fastened on mobile phone back.The heat that mobile phone back generates is conducted to liquid by auxiliary heat conduction material 2 The working medium of cold heat sink is discharged working medium heat by fin 3 and radiator fan 4 first and reduces the temperature of working medium, in miniature water Working medium carries out cold and hot exchange in water tank 9 under the action of pump 7, is distributed in even heat in water tank and reduces rapidly cycle fluid Temperature.Water tank 9 is additionally provided with matched junction 8, it is necessary to when can external other cooling device to update or add coolant liquid, The heat dissipation effect that the circulation rate of coolant liquid strengthens liquid-cooling heat radiator with this can also be accelerated, water tank matched junction 8 is in use, answer Connector cover is taken in the ban, then the screw thread of the water injection pipe of external cooling device and connection port is screwed, and additionally separately needs external water outlet It is effective be discharged in time update circulation working medium, the power of small pump 7 should also be adjusted, to adapt to different cell-phone heatings State avoids unnecessary energy waste.
The device is far longer than the heat convection ability of air using the heat convection ability of liquid, using liquid cooling mode into Row heat dissipation, liquid-cooling heat radiation compares wind-cooling heat dissipating with preferably cooling effect, and also has the advantages that noise is small, installs wing additional The liquid cooling pipe of piece, which can increase, improves convection transfer rate with the contact area of air, and heat removal capacity greatly improved, thus High enhances the heat-transfer capability of liquid cooling pipe, which increases heat exchange area in radiator narrow space, improves working medium Circulation rate, heat exchange area is bigger, and working medium can absorb that the heat taken away is more, and working medium circulation speed is got under the unit time Drop faster at a temperature of high working medium, then the heat dissipation effect of liquid cooling heat radiator is better, which can drain smart phone production in time Raw heat is allowed to play superior performance and prolong the service life.
Only several embodiments of the present invention are expressed for above embodiments, and the description thereof is more specific and detailed, but can not Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art, Under the premise of not departing from present inventive concept, various modifications and improvements can be made, and these are all within the scope of protection of the present invention.

Claims (7)

1. a kind of smart phone liquid-cooling heat radiator, including liquid cooling heat radiator, small pump (7), water inlet pipe (6), outlet pipe (5), matched junction (8), water tank (9), auxiliary heat conduction material (2), which is characterized in that the liquid cooling heat radiator includes clamp button of the spring (1), fin (3), radiator fan (4), porous shell (10), liquid cooling pipe (11) and thermal conductive metal plate (12), the auxiliary heat conduction Material (2) is mounted between the liquid cooling heat radiator and the cell-phone heating back side;The water inlet pipe (6) and the outlet pipe (5) One end is connected on the liquid cooling heat radiator, and the other end is connected on the water tank (9), and the outlet pipe (5) passes through institute Small pump (7) is stated to be connected with the matched junction (8) on the water tank (9).
2. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: the auxiliary heat conduction material (2) material soft for soft heat-conducting silica gel sheet.
3. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: set in the water tank (9) There is coolant liquid, coolant liquid is any one of water, ethylene glycol or glycerine.
4. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: the matched junction (8) Equipped at least two, one of them is for accessing new coolant liquid, another is for being discharged extra excessive coolant liquid.
5. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: the liquid cooling pipe (11) is Waveform.
6. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: the clamp button of the spring (1) Inside is equipped with flexible bottom layer.
7. a kind of smart phone liquid-cooling heat radiator according to claim 1, it is characterised in that: the liquid cooling heat radiator, The water inlet pipe (6), the outlet pipe (5) and the water tank (9) are encapsulated using with grid, porous shell.
CN201910685051.5A 2019-07-27 2019-07-27 A kind of smart phone liquid-cooling heat radiator Withdrawn CN110278699A (en)

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Application Number Priority Date Filing Date Title
CN201910685051.5A CN110278699A (en) 2019-07-27 2019-07-27 A kind of smart phone liquid-cooling heat radiator

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Application Number Priority Date Filing Date Title
CN201910685051.5A CN110278699A (en) 2019-07-27 2019-07-27 A kind of smart phone liquid-cooling heat radiator

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111386013A (en) * 2020-03-09 2020-07-07 泰烯新材料科技(浙江)有限公司 Graphene heat dissipation assembly and water-cooled radiator with same
CN113597196A (en) * 2021-06-11 2021-11-02 合肥锐联传热技术有限公司 Multi-angle moving unit for liquid cooling system
CN116119200A (en) * 2023-04-18 2023-05-16 临沭科诺包装材料销售有限公司 Temperature detection device for ink storage

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
CN202168321U (en) * 2011-08-11 2012-03-14 北京奇宏科技研发中心有限公司 Integrated liquid cooling radiator
CN204065993U (en) * 2014-07-25 2014-12-31 深圳市酷威散热设备科技有限公司 A kind of automatic liquid cooling and radiation device
CN105097734A (en) * 2015-08-25 2015-11-25 上海理工大学 Semiconductor liquid-cooling heat radiation device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6760221B2 (en) * 2002-10-23 2004-07-06 International Business Machines Corporation Evaporator with air cooling backup
CN202168321U (en) * 2011-08-11 2012-03-14 北京奇宏科技研发中心有限公司 Integrated liquid cooling radiator
CN204065993U (en) * 2014-07-25 2014-12-31 深圳市酷威散热设备科技有限公司 A kind of automatic liquid cooling and radiation device
CN105097734A (en) * 2015-08-25 2015-11-25 上海理工大学 Semiconductor liquid-cooling heat radiation device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111386013A (en) * 2020-03-09 2020-07-07 泰烯新材料科技(浙江)有限公司 Graphene heat dissipation assembly and water-cooled radiator with same
CN111386013B (en) * 2020-03-09 2022-01-21 泰烯新材料科技(浙江)有限公司 Graphene heat dissipation assembly and water-cooled radiator with same
CN113597196A (en) * 2021-06-11 2021-11-02 合肥锐联传热技术有限公司 Multi-angle moving unit for liquid cooling system
CN116119200A (en) * 2023-04-18 2023-05-16 临沭科诺包装材料销售有限公司 Temperature detection device for ink storage

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Application publication date: 20190924