CN110996629B - Heat dissipation device and electronic product with same - Google Patents

Heat dissipation device and electronic product with same Download PDF

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Publication number
CN110996629B
CN110996629B CN201911374197.4A CN201911374197A CN110996629B CN 110996629 B CN110996629 B CN 110996629B CN 201911374197 A CN201911374197 A CN 201911374197A CN 110996629 B CN110996629 B CN 110996629B
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China
Prior art keywords
heat
heat dissipation
heat pipe
soaking plate
fins
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CN201911374197.4A
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Chinese (zh)
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CN110996629A (en
Inventor
余斌俊
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Wuxi Ruiqin Technology Co Ltd
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Wuxi Ruiqin Technology Co Ltd
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Priority to CN201911374197.4A priority Critical patent/CN110996629B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

The invention discloses a heat dissipation device, comprising: one end of the heat pipe is used for being connected with a heat source; the first soaking plate is connected with the other end of the heat pipe; the heat dissipation fins are connected with the first vapor chamber; and the fan is used for blowing air to the radiating fins. The heat dissipation device realizes the connection of the heat pipe and the heat dissipation fins through the first vapor chamber, and utilizes the ultrahigh heat conduction performance of the first vapor chamber to quickly transfer the heat of the heat pipe to the whole first vapor chamber and simultaneously transfer the heat to the heat dissipation fins through the whole first vapor chamber. Compared with the prior art that heat conduction is carried out through the contact area between the heat pipe and the radiating fins, the radiating device provided by the invention has the advantages that the radiating area is increased, the radiating area is not limited to the width or the pipe diameter of the heat pipe, and the conducting path between the heat pipe and the radiating fins is reduced, so that the integral radiating capacity is improved, and the radiating effect is better. The invention also discloses an electronic product comprising the heat dissipation device, which has a good heat dissipation effect.

Description

Heat dissipation device and electronic product with same
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device. In addition, the invention also relates to an electronic product comprising the heat dissipation device.
Background
For electronic products, the working performance of electronic components is directly affected by the heat dissipation function of the electronic products. At present, a heat dissipation device is generally adopted to cool down electronic components.
A heat dissipation device in the prior art generally includes a heat pipe, heat dissipation fins, and a fan, where one end of the heat pipe is connected to a heat source, the other end of the heat pipe is a heat dissipation end and connected to the heat dissipation fins, and the fan is used to blow air to the heat dissipation fins.
When the heat pipe type heat dissipation device works, heat of a heat source is brought to the heat dissipation end through the heat pipe, and the heat dissipation end of the heat pipe is welded with the heat dissipation fins, so that the heat of the heat pipe is transferred to the heat dissipation fins through the contact surfaces of the heat pipe and the heat dissipation fins by utilizing the heat conduction effect, and then the heat on the heat dissipation fins is dissipated by blowing air through the fan.
Therefore, the heat dissipation device in the prior art conducts heat mainly through the contact area between the heat pipe and the heat dissipation fins, and the contact area between the heat pipe and the heat dissipation fins is limited by the width or the pipe diameter of the heat pipe, so that the heat dissipation device is small in heat dissipation area, long in conduction path and not beneficial to heat dissipation.
Therefore, how to provide a heat dissipation device with better heat dissipation capability is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a heat dissipation device with better heat dissipation capability.
Another objective of the present invention is to provide an electronic product including the heat dissipation device, which has a better heat dissipation effect.
In order to achieve the above purpose, the invention provides the following technical scheme:
a heat dissipation device, comprising:
one end of the heat pipe is used for being connected with a heat source;
the first soaking plate is connected with the other end of the heat pipe;
the heat dissipation fins are connected with the first vapor chamber;
and the fan is used for blowing air to the radiating fins.
Preferably, the heat pipe includes:
the first heat pipe is connected with the upper side of the first soaking plate;
and the second heat pipe is connected with the lower side of the first soaking plate.
Preferably, the heat dissipation fins include first height fins and second height fins forming steps to give way to the second heat pipe.
Preferably, the upper cover of the fan is a second soaking plate, and the second soaking plate is connected with the first soaking plate.
Preferably, the second soaking plate and the first soaking plate are of an integrally formed structure.
Preferably, the second soaking plate is fixed with the bottom shell of the fan in a hot melting mode or in a locking mode.
Preferably, the first soaking plate is welded with the heat pipe.
An electronic product comprises a heat dissipation device, wherein the heat dissipation device is any one of the heat dissipation devices.
The heat dissipation device provided by the invention realizes the connection of the heat pipe and the heat dissipation fins through the first vapor chamber, and utilizes the ultrahigh heat conduction performance of the first vapor chamber to quickly transfer the heat of the heat pipe to the whole first vapor chamber, and simultaneously transfers the heat to the heat dissipation fins through the whole first vapor chamber.
Compared with the prior art that heat conduction is carried out through the contact area between the heat pipe and the radiating fins, the radiating device provided by the invention has the advantages that the radiating area is increased, the radiating area is not limited to the width or the pipe diameter of the heat pipe, and the conducting path between the heat pipe and the radiating fins is reduced, so that the integral radiating capacity is improved, and the radiating effect is better.
The electronic product provided by the invention comprises the heat dissipation device and has a better heat dissipation effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
FIG. 2 is a schematic view of the heat dissipation device shown in FIG. 1 from another perspective;
fig. 3 is a structural schematic diagram of the heat dissipation fin in fig. 1.
The reference numerals in fig. 1 to 3 are as follows:
1 is a heat pipe, 11 is a first heat pipe, 12 is a second heat pipe, 2 is a first vapor chamber, 3 is a heat sink, 31 is a first height fin, 32 is a second height fin, 4 is a fan, 41 is a second vapor chamber, and 5 is a heat source.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a heat dissipation device with better heat dissipation capability. Another core of the present invention is to provide an electronic product including the heat dissipation device, which has a better heat dissipation effect.
Referring to fig. 1 to fig. 3, fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention; FIG. 2 is a schematic view of the heat dissipation device shown in FIG. 1 from another perspective; fig. 3 is a structural schematic diagram of the heat dissipation fin in fig. 1.
The invention provides a heat dissipation device, which comprises a heat pipe 1, a first vapor chamber 2, heat dissipation fins 3 and a fan 4.
Specifically, one end of the heat pipe 1 is used for being connected with the heat source 5, the other end of the heat pipe 1 is connected with the first vapor chamber 2, the first vapor chamber 2 is connected with the heat dissipation fins 3, and the fan 4 is used for blowing air to the heat dissipation fins 3.
When the heat pipe works, the heat pipe 1 transfers the heat of the heat source 5 to the first soaking plate 2, and the heat conductivity coefficient of the first soaking plate 2 is very high, so that the first soaking plate 2 participates in heat dissipation, the heat of the heat pipe 1 is instantly transferred to the whole first soaking plate 2, and the first soaking plate 2 is connected with the heat dissipation fins 3, so that the heat of the whole first soaking plate 2 can be simultaneously transferred to the heat dissipation fins 3 connected with the heat dissipation plates, and then the heat dissipation fins 3 are blown by the fan 4 to blow away the heat on the heat dissipation fins 3, and the purpose of quickly cooling the heat source 5 is achieved.
Therefore, the heat pipe 1 and the radiating fins 3 are connected through the first vapor chamber 2, and the heat of the heat pipe 1 is rapidly transferred to the whole first vapor chamber 2 by utilizing the ultrahigh heat conduction performance of the first vapor chamber 2, and is simultaneously transferred to the radiating fins 3 through the whole first vapor chamber 2. Compared with the prior art that heat conduction is carried out through the contact area between the heat pipe 1 and the radiating fins 3, the radiating device provided by the invention has the advantages that the radiating area is increased, the radiating area is not limited by the width or the pipe diameter of the heat pipe 1, and the conducting path between the heat pipe 1 and the radiating fins 3 is reduced, so that the integral radiating capacity is improved, and the radiating effect is better.
In order to sufficiently dissipate heat from the heat source 5, the heat pipe 1 includes a first heat pipe 11 and a second heat pipe 12, the first heat pipe 11 being connected to the upper side of the first soaking plate 2, and the second heat pipe 12 being connected to the lower side of the first soaking plate 2, on the basis of the above-described embodiment.
That is to say, the number of the heat pipes 1 in this embodiment is plural, and the heat pipes include the first heat pipe 11 and the second heat pipe 12, and the first heat pipe 11 and the second heat pipe 12 are respectively connected to the upper side and the lower side of the first soaking plate 2, so that the first soaking plate 2 is heated more uniformly, and the heat of each heat pipe 1 can be absorbed better.
It should be noted that, the number of the first heat pipe 11 and the second heat pipe 12 is not limited in the present invention, and the number of the first heat pipe 11 and the second heat pipe 12 may be multiple or one, and may be set by a person skilled in the art according to actual needs.
It should be noted that, in view of the convenience of connection, the heat sink fin 3 is connected to the lower side of the first soaking plate 2, that is, the second heat pipe 12 and the heat sink fin 3 are located on the same side of the first soaking plate 2, and in order to avoid the interference between the second heat pipe 12 and the heat sink fin 3, on the basis of the above embodiment, the heat sink fin 3 includes the first height fin 31 and the second height fin 32 forming a step to allow the second heat pipe 12 to be located.
That is, in the present embodiment, the heat dissipation fins 3 include two fins with different heights, for example, the height of the first height fin 31 is greater than the height of the second height fin 32, so that the first height fin 31 and the second height fin 32 form a step surface, thereby leaving a space for the second heat pipe 12.
Preferably, the thickness dimension of the second heat pipe 12 is equal to the height difference between the first height fins 31 and the second height fins 32. That is, in the preferred embodiment, the second heat pipe 12 is in contact with not only the first soaking plate 2 but also the second height fins 32, so that it is more advantageous to conduct the heat of the heat pipe 1 to the radiator fins 3.
In order to improve the heat dissipation effect of the first soaking plate 2, on the basis of any one of the above embodiments, the upper cover of the fan 4 is the second soaking plate 41, and the second soaking plate 41 is connected to the first soaking plate 2.
That is, in the present embodiment, the upper cover of the fan 4 is also designed as the soaking plate, for convenience of description, the soaking plate connected to the heat dissipating fin 3 is referred to as a first soaking plate 2, and the soaking plate as the upper cover of the fan 4 is referred to as a second soaking plate 41, and by the connection of the first soaking plate 2 and the second soaking plate 41, heat transfer between the two soaking plates is realized, so that the heat absorbing area of the first soaking plate 2 is increased, so that the heat of the heat pipe 1 is better transferred to the first soaking plate 2.
On the other hand, because the thickness of first soaking board 2 will be greater than the thickness of the conventional upper cover of fan 4, after the installation, first soaking board 2 will shelter from partial amount of wind, makes the radiating effect not good, otherwise need change the mounted position of fan 4 etc. and cause the installation inconvenient. And design the fan 4 upper cover into the soaking plate too, the thickness of first soaking plate 2 and second soaking plate 41 is equal, like this, after the installation, the amount of wind of fan 4 can not sheltered from to first soaking plate 2 to fully blow to heat radiation fin 3, make the radiating effect better.
In view of the simplicity of the structure and the ease of implementation, the second soaking plate 41 is integrally formed with the first soaking plate 2 on the basis of the above-described embodiment.
That is, the first soaking plate 2 and the second soaking plate 41 are an integral piece, in other words, in this embodiment, after the upper cover of the fan 4 is designed as the soaking plate, the area of the upper cover of the fan 4 is increased, so that the upper cover of the fan 4 extends to the position of the heat dissipating fin 3, at this time, a portion corresponding to the conventional upper cover of the fan 4 in the prior art is referred to as the second soaking plate 41, and a portion connected to the heat dissipating fin 3 after extending is referred to as the first soaking plate 2, so as to achieve connection with the heat dissipating fin 3.
In consideration of the specific implementation manner of the fixed connection between the second soaking plate 41 and the bottom case of the fan 4, on the basis of the above embodiments, the second soaking plate 41 is fixed to the bottom case of the fan 4 by thermal fusion or locking.
That is, the second soaking plate 41 and the bottom case of the fan 4 may be connected into a whole by means of thermal fusion, or the second soaking plate 41 and the bottom case of the fan 4 may be connected by means of screw locking.
In consideration of the specific implementation of the fixed connection of the first soaking plate 2 and the heat pipe 1, as a preferable scheme, on the basis of the above-mentioned embodiments, the first soaking plate 2 is welded with the heat pipe 1.
In addition to the heat dissipation device, the invention also provides an electronic product including the heat dissipation device disclosed in the above embodiment.
It should be noted that, in this embodiment, a specific structure of the body of the electronic product is not limited, for example, the electronic product may be a notebook computer, and at this time, a main structure of the body of the electronic product is the same as a main structure of a conventional notebook computer in the prior art, that is, a person skilled in the art may design the structure of the body of the electronic product according to a specific type of the electronic product, which may specifically refer to the prior art, and details are not repeated herein.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The heat dissipation device and the electronic product having the heat dissipation device provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (5)

1. A heat dissipating device, comprising:
one end of the heat pipe (1) is connected with a heat source (5);
the first soaking plate (2) is connected with the other end of the heat pipe (1);
the heat dissipation fins (3) are connected with the first soaking plate (2);
the fan (4) is used for blowing air to the radiating fins (3), the upper cover of the fan (4) is a second soaking plate (41), and the second soaking plate (41) is connected with the first soaking plate (2);
wherein the heat pipe (1) comprises:
a first heat pipe (11) connected to the upper side of the first vapor chamber (2);
a second heat pipe (12) connected to the lower side of the first vapor chamber (2);
the heat radiation fins (3) comprise a first height fin (31) and a second height fin (32) which form a step to give way to the second heat pipe (12).
2. The heat sink according to claim 1, wherein the second soaking plate (41) is of an integrally formed structure with the first soaking plate (2).
3. The heat sink according to claim 2, characterized in that the second vapor chamber (41) is heat-fused or locked to the bottom shell of the fan (4).
4. The heat sink according to claim 1, wherein the first soaking plate (2) is welded to the heat pipe (1).
5. An electronic product comprising a heat dissipation device, wherein the heat dissipation device is the heat dissipation device of any one of claims 1-4.
CN201911374197.4A 2019-12-24 2019-12-24 Heat dissipation device and electronic product with same Active CN110996629B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911374197.4A CN110996629B (en) 2019-12-24 2019-12-24 Heat dissipation device and electronic product with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911374197.4A CN110996629B (en) 2019-12-24 2019-12-24 Heat dissipation device and electronic product with same

Publications (2)

Publication Number Publication Date
CN110996629A CN110996629A (en) 2020-04-10
CN110996629B true CN110996629B (en) 2021-09-03

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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103517610B (en) * 2012-06-18 2017-12-22 蒋友兰 Heat abstractor
CN106332517A (en) * 2015-07-08 2017-01-11 超众科技股份有限公司 Thin heat dissipating device
TWM545288U (en) * 2017-04-11 2017-07-11 Sunon Electronics (Kunshan) Co Ltd Heat-dissipation module
CN207854383U (en) * 2018-01-12 2018-09-11 双鸿电子科技工业(昆山)有限公司 Radiator
CN108716869A (en) * 2018-07-04 2018-10-30 奇鋐科技股份有限公司 Equalizing plate structure
CN110389642A (en) * 2019-08-27 2019-10-29 广东虹勤通讯技术有限公司 Radiator fan, radiator and electronic equipment for electronic equipment

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