CN108716869A - Equalizing plate structure - Google Patents
Equalizing plate structure Download PDFInfo
- Publication number
- CN108716869A CN108716869A CN201810724999.2A CN201810724999A CN108716869A CN 108716869 A CN108716869 A CN 108716869A CN 201810724999 A CN201810724999 A CN 201810724999A CN 108716869 A CN108716869 A CN 108716869A
- Authority
- CN
- China
- Prior art keywords
- chamber
- equalizing plate
- plate structure
- structure according
- extended
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Abstract
The present invention provides a kind of equalizing plate structure, including:One ontology;The ontology has:One first part, a second part, a capillary structure, a working fluid;The first part has a first chamber;There is the second part second chamber, the second part to be formed from the first part one end and to extending far from the first part direction;The capillary structure is set to the first chamber, second chamber interior surface;The working fluid is filled in the first chamber, in second chamber, and equalizing plate structure can have the effect of that samming and distal end radiate simultaneously through the invention.
Description
Technical field
The present invention relates to a kind of equalizing plate structure, samming espespecially a kind of while that there is plane samming and distal end heat dissipation effect
Harden structure.
Background technology
What is be often used in existing heat dissipation element has the heat dissipation elements such as radiator, heat pipe, hot plate, temperature-uniforming plate, wherein radiator
It is used mainly as auxiliary heat dissipation, and the elements such as heat pipe, hot plate, temperature-uniforming plate with thermal conduction rate because pretending soon as heat transfer member
Part, heat-conduction component are imitated mainly because thermal coefficient height system is directly as the main element contacted with heat source in addition combined with heat dissipation
The stronger radiator of fruit is as increase radiating efficiency.
Temperature-uniforming plate and heat pipe as described above are mainly the preferable element of heat-conducting effect, and the heat dissipation effect that need in addition arrange in pairs or groups is preferable
Element such as radiating fin or radiator more preferably to radiate to reach, and temperature-uniforming plate is a kind of heat transfer in large area face and face,
Heat pipe is then a kind of heat conducting and radiating of axial distal end, and temperature-uniforming plate is identical as the operation principle of heat pipe, but the direction of heat transfer is then
It is different, generally there is dealer to carry out heat transfer by overlapping or overlapping or welding both temperature-uniforming plate and heat pipe, enables while having
There is the effect of large area heat transfer and distal end heat transfer, but since temperature-uniforming plate and heat pipe have gap between the two by solder bond
Thermal resistance, which certainly will then be will produce, reduces hot transfer efficiency.
Therefore how will the effect of temperature-uniforming plate and heat pipe or other heat dissipation elements integrate again not generate thermal resistance, then for it is existing this
The target that dealer payes attention to the most.
Invention content
Hence this, to solve the disadvantage that the above-mentioned prior art, the main object of the present invention provides a kind of while having big face
The equalizing plate structure of product samming and distal end heat transfer.
In order to achieve the above object, the present invention provides a kind of equalizing plate structure, it is characterized in that comprising:
One ontology, the ontology are superimposed with each other and are formed by one first plate body and one second plate body, which has:
One first part has a first chamber;
One second part has a second chamber, and the second part is from the first part one end to far from the first part
Direction extends and is formed;
One capillary structure is set to the first chamber, second chamber interior surface;
One working fluid is filled in the first chamber, in second chamber.
The equalizing plate structure, wherein:Described first part one end is extended with a Part III, the Part III tool
There are a third chamber, the capillary structure to be also extended in the third chamber interior surface, partial working stream is filled in this
In third chamber.
The equalizing plate structure, wherein:The second part, Part III and the first part be not in same level
Face.
The equalizing plate structure, wherein:The first part is in flat rectangular body shape, and the second part is in strip
Cuboid or cylinder.
The equalizing plate structure, wherein:The second part connects a Part IV, and the Part IV is in long template
Shape and with the second part vertical connection, to the second part arranged on left and right sides extend, the Part IV have one the 4th chamber
Room, the capillary structure are extended in the inner wall surface of the 4th chamber, and the Part III connects a Part V, described
Part V extends in elongated plate and with the Part III vertical connection and to the Part III arranged on left and right sides, and described the
There is one the 5th chamber, the capillary structure to be extended in the inner wall surface of the 5th chamber for five parts.
The equalizing plate structure, wherein:The first part, second part, Part III, Part IV, the 5th
Divide and is not located at same level.
The equalizing plate structure, wherein:It is in elongated plate two that the ontology, which has a Part VI, the Part VI,
End is respectively with the first part and the Part IV vertical connection, and the Part VI is with one the 6th chamber, the capillary structure
It is extended in the inner wall surface of the 6th chamber.
The equalizing plate structure, wherein:The first chamber~the 6th chamber is interconnected.
The equalizing plate structure, wherein:The Part IV vertically bends extension close to end, and extends in bending
Place's string set plurality of radiating fins.
The equalizing plate structure, wherein:The first part side is provided with plurality of radiating fins.
Equalizing plate structure through the invention can provide large area samming and remote respectively by first part and second part
The synergy of heat conducting and radiating is held, while being occurred without thermal chocking, and then reaches heat radiation efficiency.
Description of the drawings
Fig. 1 is the first embodiment three-dimensional cutaway view of equalizing plate structure of the present invention;
Fig. 2 is the second embodiment three-dimensional cutaway view of equalizing plate structure of the present invention;
Fig. 2 a are the second embodiment three-dimensional cutaway views of equalizing plate structure of the present invention;
Fig. 3 is the 3rd embodiment three-dimensional cutaway view of equalizing plate structure of the present invention;
Fig. 4 is the fourth embodiment three-dimensional cutaway view of equalizing plate structure of the present invention;
Fig. 4 a are the fourth embodiment three-dimensional cutaway views of equalizing plate structure of the present invention.
Reference sign:Ontology 1;First plate body 1a;Second plate body 1b;First part 11;First chamber 111;Second
Part 12;Second chamber 121;Capillary structure 13;Working fluid 14;Part III 15;Third chamber 151;Part IV 16;The
Four chambers 161;Part V 17;5th chamber 171;Part VI 18;6th chamber 181;Radiating fin 2.
Specific implementation mode
The above-mentioned purpose and its structure of the present invention and characteristic functionally will give according to the preferred embodiment of institute's accompanying drawings
Explanation.
Referring to Fig. 1, be the first embodiment three-dimensional cutaway view of equalizing plate structure of the present invention, as shown, the present invention
Equalizing plate structure, including:One ontology 1;
The ontology 1 is superimposed with each other and is formed by one first plate body 1a and one second plate body 1b, which has:One
A part of 11, one second part 12, a capillary structure 13, a working fluid 14;
The first part 11 have a first chamber 111, the first part 11 be in flat rectangular body shape, this first
Divide 11 use as large area heat transfer.
The second part 12 has a second chamber 121, and the second part 12 is by 11 one end of first part (or one
Side) it is formed to far from first part's 11 direction extension, the second part 12 compares the external shape of aforementioned first part 11
Shape, the second part 12 is in the cuboid or cylinder of strip or arbitrary solid any of which.
The capillary structure 13 is set to the first chamber, second chamber 111,121 interior surfaces, that is, indicates described
One, the chamber surfaces inside two parts 111,121 are provided with the capillary structure 13, the working fluid 14 be then filled in this
In one chamber, second chamber 111,121.
The second part 12 can be directed to user's occupation mode to being extended everywhere, first and second part 11,12
Setting predominantly meet while having the effect of the structural integrity of large area samming and distal end heat transfer, therefore outside first part 11
Type, which is set as flat rectangular body shape, can provide the heat transfer even temperature effect in large area face and face, and 12 external form of second part is arranged
Cuboid or cylinder in strip or arbitrary solid any of which, main purpose are to provide the heat of first part 11
Amount is transferred to distal end and carries out heat exchange heat dissipation simultaneously, then so design provides integration temperature-uniforming plate large area and heat pipe distal end heat conduction
Advantage improves the existing missing for using temperature-uniforming plate and heat pipe combination by way of overlapping or welding and generating thermal chocking.
Fig. 2, Fig. 2 a are please referred to, is the second embodiment three-dimensional cutaway view of equalizing plate structure of the present invention, as shown, this reality
It is identical as aforementioned first embodiment to apply a part-structure, therefore will not be described in great detail herein, only the present embodiment and aforementioned second embodiment
Difference be in and be extended with a Part III 15 in, 11 one end of the first part, the Part III 15 has a third chamber
Room 151, the capillary structure 13 are also extended in 151 interior surface of third chamber, and partial working stream 14 is filled in this
In third chamber 151, the second part, Part III 12,15 parts and the first part 11 be not in same level, so
There are the obstruction of different height, the second part, Part III 12,15 that setting may be selected if the place being arranged can be directed to by being arranged
Obstruction is avoided to be configured.
Fig. 2 a are another state sample implementations of the present embodiment, as shown, the second part, Part III 12,15 are located at together
One horizontal plane but it is located at different level with first part 11, and second part, Part III 12,15 are by the first part 11
The left and right or upper and lower both sides that the first part 11 is respectively facing after extending outwardly extend.
Referring to Fig. 3, being the 3rd embodiment three-dimensional cutaway view of equalizing plate structure of the present invention, as shown, the present embodiment
Part-structure is identical as aforementioned first embodiment, therefore will not be described in great detail herein, and only the present embodiment and aforementioned second embodiment be not
It exists together and is, the second part 12 connects a Part IV 16, and the Part IV 16 is in elongated plate and the second part
12 vertical connections extend to 12 arranged on left and right sides of the second part, and the Part IV 16 has one the 4th chamber 161 and should
Capillary structure 13 is extended in the inner wall surface of the 4th chamber 161, and the Part III 15 connects a Part V 17,
The Part V 17 extends in elongated plate and 15 vertical connection of Part III to 15 arranged on left and right sides of the Part III,
The Part V 17 has one the 5th chamber 171 and the capillary structure 13 is extended in the inner wall of the 5th chamber 171
Surface, described first, second, third and fourth, five parts 11,12,15,16,17 are not located at same level (difference in height is presented).
Fig. 4, Fig. 4 a are please referred to, is the fourth embodiment three-dimensional cutaway view of equalizing plate structure of the present invention, as shown, this reality
It is identical as aforementioned first embodiment to apply a part-structure, therefore will not be described in great detail herein, only the present embodiment and aforementioned third embodiment
Difference be in there is a Part VI 18 in, the ontology 1, the Part VI 18 in elongated plate both ends respectively with this
A part 11 and 16 vertical connection of Part IV, the Part VI 18 have one the 6th chamber 181 and the capillary structure 13
Be extended in the inner wall surface of the 6th chamber 181, the first~six chamber 111,121,141,151,161,171,
181 are interconnected.
Fig. 4 a are another state sample implementations of the present embodiment, as shown, the Part IV 16 divides into two by central part
Part, 16 part of Part IV are connect with the Part VI 18, another part of Part IV 16 and the second part 12
Connection, i.e., the Part IV 16 of this state sample implementation is independently connect with second, six part 12,18.
The Part IV 16 vertically bends extension close to end, and is gone here and there in the part and cover plurality of radiating fins 2, this reality
Applying the Part IV 16 of example and the Part V 17, there is a difference in height, the difference in height can be directed to the sky to be designed by designer
Between and the pyrotoxin of corresponding collocation freely adjust position and height, in addition the present embodiment system uses space caused by difference of height
Setting radiating fin 2, which is gone here and there, to be placed on outside fourth, fifth part 16,17, and is set to the contact heating source of the first part 11
The other side at position, the setting by the radiating fin 2 increase heat dissipation effect, and due to the radiating fin set by each position
2 directions are different, can get different directions heat loss through radiation effect and do not generate thermal phenomena.
Equalizing plate structure sets temperature-uniforming plate to two large divisions and provides large area and distal end heat biography simultaneously through the invention
The conductive structure led so solve it is existing by temperature-uniforming plate and heat pipe by overlapping or welding lacking for thermal chocking caused by setting
It loses, and the chamber of these part interiors is interconnected can enable the more rapid person of heat transfer efficiency, and in addition to providing
Outside the heat transfer that large area is absorbed heat and distal end guides, while arranging in pairs or groups its heat dissipation element (such as radiating fin or radiator) also can be fast
Heat is conducted to arranged in pairs or groups heat dissipation element and accelerates radiating efficiency by speed.
Claims (10)
1. a kind of equalizing plate structure, it is characterized in that comprising:
One ontology, the ontology are superimposed with each other and are formed by one first plate body and one second plate body, which has:
One first part has a first chamber;
One second part has a second chamber, and the second part is from the first part one end to far from the first part direction
Extension is formed;
One capillary structure is set to the first chamber, second chamber interior surface;
One working fluid is filled in the first chamber, in second chamber.
2. equalizing plate structure according to claim 1, it is characterised in that:Described first part one end is extended with a third portion
Point, there is the Part III third chamber, the capillary structure to be also extended in the third chamber interior surface, part
Working fluid is filled in the third chamber.
3. equalizing plate structure according to claim 2, it is characterised in that:The second part, Part III and this first
Part is not in same level.
4. equalizing plate structure according to claim 2, it is characterised in that:The first part is in flat rectangular body shape, should
Second part is in the cuboid or cylinder of strip.
5. equalizing plate structure according to claim 2, it is characterised in that:The second part connects a Part IV, institute
State Part IV in elongated plate and with the second part vertical connection, extend to the second part arranged on left and right sides, described the
There is one the 4th chamber, the capillary structure to be extended in the inner wall surface of the 4th chamber, the Part III for four parts
Connect a Part V, the Part V is in elongated plate and with the Part III vertical connection and to the Part III
Arranged on left and right sides extends, and there is the Part V one the 5th chamber, the capillary structure to be extended in the 5th chamber
Wall surface.
6. equalizing plate structure according to claim 5, it is characterised in that:The first part, second part, third portion
Divide, Part IV, Part V are not located at same level.
7. equalizing plate structure according to claim 5, it is characterised in that:The ontology has a Part VI, and described the
In elongated plate both ends respectively with the first part and the Part IV vertical connection, the Part VI has one for six parts
Six chambers, the capillary structure are extended in the inner wall surface of the 6th chamber.
8. equalizing plate structure according to claim 7, it is characterised in that:The chamber of the first chamber~the 6th mutually interconnects
It is logical.
9. equalizing plate structure according to claim 7, it is characterised in that:The Part IV is vertically bent close to end
Extend, and plurality of radiating fins is covered in bending extended spot string.
10. equalizing plate structure according to claim 1, it is characterised in that:The first part side is provided with plural number and dissipates
Hot fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810724999.2A CN108716869A (en) | 2018-07-04 | 2018-07-04 | Equalizing plate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810724999.2A CN108716869A (en) | 2018-07-04 | 2018-07-04 | Equalizing plate structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108716869A true CN108716869A (en) | 2018-10-30 |
Family
ID=63913360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810724999.2A Pending CN108716869A (en) | 2018-07-04 | 2018-07-04 | Equalizing plate structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108716869A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110996629A (en) * | 2019-12-24 | 2020-04-10 | 无锡睿勤科技有限公司 | Heat dissipation device and electronic product with same |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2775836Y (en) * | 2005-03-15 | 2006-04-26 | 珍通科技股份有限公司 | Multidirection radiator |
CN201207780Y (en) * | 2008-05-26 | 2009-03-11 | 索士亚科技股份有限公司 | Sectional temperature equalization board |
TWM383283U (en) * | 2010-03-03 | 2010-06-21 | Celsia Technologies Taiwan Inc | Slimming uniform temperature board and heat dissipating module with the uniform temperature board |
CN202083258U (en) * | 2011-05-19 | 2011-12-21 | 索士亚科技股份有限公司 | Tabular heat pipe with enlarged single side |
CN203120347U (en) * | 2012-12-07 | 2013-08-07 | 奇鋐科技股份有限公司 | Heat dissipation apparatus |
TWM472181U (en) * | 2013-11-22 | 2014-02-11 | Asia Vital Components Co Ltd | Heat-spreading board structure |
CN205980889U (en) * | 2016-07-29 | 2017-02-22 | 迈萪科技股份有限公司 | Temperature -uniforming plate and heat pipe integrated configuration |
CN107148192A (en) * | 2016-03-01 | 2017-09-08 | 讯凯国际股份有限公司 | Heat pipe module and apply its heat abstractor |
CN208704509U (en) * | 2018-07-04 | 2019-04-05 | 奇鋐科技股份有限公司 | Equalizing plate structure |
-
2018
- 2018-07-04 CN CN201810724999.2A patent/CN108716869A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2775836Y (en) * | 2005-03-15 | 2006-04-26 | 珍通科技股份有限公司 | Multidirection radiator |
CN201207780Y (en) * | 2008-05-26 | 2009-03-11 | 索士亚科技股份有限公司 | Sectional temperature equalization board |
TWM383283U (en) * | 2010-03-03 | 2010-06-21 | Celsia Technologies Taiwan Inc | Slimming uniform temperature board and heat dissipating module with the uniform temperature board |
CN202083258U (en) * | 2011-05-19 | 2011-12-21 | 索士亚科技股份有限公司 | Tabular heat pipe with enlarged single side |
CN203120347U (en) * | 2012-12-07 | 2013-08-07 | 奇鋐科技股份有限公司 | Heat dissipation apparatus |
TWM472181U (en) * | 2013-11-22 | 2014-02-11 | Asia Vital Components Co Ltd | Heat-spreading board structure |
CN107148192A (en) * | 2016-03-01 | 2017-09-08 | 讯凯国际股份有限公司 | Heat pipe module and apply its heat abstractor |
CN205980889U (en) * | 2016-07-29 | 2017-02-22 | 迈萪科技股份有限公司 | Temperature -uniforming plate and heat pipe integrated configuration |
CN208704509U (en) * | 2018-07-04 | 2019-04-05 | 奇鋐科技股份有限公司 | Equalizing plate structure |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110996629A (en) * | 2019-12-24 | 2020-04-10 | 无锡睿勤科技有限公司 | Heat dissipation device and electronic product with same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPWO2019151291A1 (en) | heatsink | |
CN106922108B (en) | Cooling component and its manufacturing method | |
CN108271332A (en) | Radiator | |
TWM526264U (en) | Liquid-cooled heat dissipation device and heat dissipation structure thereof | |
CN107421364A (en) | Equalizing plate structure and its manufacture method | |
CN108716869A (en) | Equalizing plate structure | |
CN208704509U (en) | Equalizing plate structure | |
US11143460B2 (en) | Vapor chamber structure | |
CN101431878A (en) | Single plate cooling device and its production method, box type electronic equipment and communication cabinet | |
TWM566351U (en) | Heat-spreading board structure | |
CN100471374C (en) | Heat pipe radiator | |
CN102012183B (en) | Heat radiator and manufacturing method thereof | |
US10132571B2 (en) | Knockdown heat dissipation unit | |
CN104080313A (en) | Heat dissipation module | |
TW202001177A (en) | Vapor chamber structure | |
CN203369041U (en) | Heat-dissipating module | |
CN108151565B (en) | Three-dimensional temperature equalization system | |
TWI606225B (en) | Vapor chamber having telescopic capillary structure | |
CN203788635U (en) | Heat-dissipating module | |
TW201701112A (en) | Vapor chamber having telescopic heated element | |
CN205847821U (en) | Heat sink device | |
CN105722371B (en) | Heat transfer assembly and heat abstractor | |
TWI691256B (en) | Duel vapor chamber heat dissipation module | |
TWI620910B (en) | A three dimensional vapor chamber device | |
CN204697452U (en) | There is the radiator structure separating double-layer overlapping heat pipe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181030 |