TWI691256B - Duel vapor chamber heat dissipation module - Google Patents

Abstract

The present disclosure relates to a duel vapor chamber heat dissipation module having a lower vapor chamber, an upper vapor chamber, a heat pipe and a plurality of fins. The lower vapor chamber has a first chamber therein. The upper vapor chamber is arranged over the lower vapor chamber. The upper vapor chamber has a second chamber therein. The heat pipe is fixed between the lower vapor chamber and the upper vapor chamber, and the heat pipe has a third chamber therein. The first chamber, the second chamber and the third chamber are communicated with each other. The fins are juxtaposed and arranged upright between the lower vapor chamber and the upper vapor chamber. A top end and a lower end of each heat fin are respectively connected to the lower vapor chamber and the upper vapor chamber. Thereby, thermal conductivity and heat dissipation efficiency of the duel vapor chamber heat dissipation module are improved.

Description

Dual-average temperature plate cooling module

The invention relates to a heat dissipation module with a temperature equalization plate, and in particular to a double heat dissipation plate type heat dissipation module.

As the computing speed of electronic components continues to increase, the heat generated by them is getting higher and higher. In order to effectively solve the above problem of high heat generation, the industry will have heat pipes with good thermal conductivity (Heat Pipe) and even temperature plates (Vapor Chamber) ) Make up the application of heat sink to improve heat dissipation efficiency.

However, the existing radiators mostly use heat pipes or the condensation end of the temperature equalizing plate to thermally attach the heat dissipation fins, but the heat dissipation fins only use the pressure difference caused by the temperature change of the environment to conduct, so that the heat conduction efficiency of the heat dissipation fins is equivalent Due to the large limitation, heat is easily accumulated in the condensation end of the heat pipe or the temperature equalization plate, and finally the condensation effect fails, resulting in poor heat dissipation efficiency.

In view of this, the present inventors have made great efforts to study the above-mentioned prior art and cooperate with the application of academic principles, and try their best to solve the above-mentioned problems, which becomes the development goal of the present inventors.

The invention provides a dual-average temperature plate type heat dissipation module, which is fixedly connected between a lower average temperature plate and an upper average temperature plate by using heat pipes and heat dissipation fins, so as to improve the heat conduction efficiency and heat dissipation efficiency of the dual average temperature plate type heat dissipation module.

In an embodiment of the present invention, the present invention provides a dual temperature-equalizing plate type heat dissipation module, including: a lower temperature-equalizing plate, the lower temperature-equating plate has a first cavity therein; an upper temperature-equating plate is disposed under the lower Above the temperature equalization plate, the upper temperature equalization plate has a second cavity inside; at least one heat pipe is fixed between the lower temperature equalization plate and the upper temperature equalization plate, and the heat tube has a third cavity inside, The first cavity, the second cavity and the third cavity communicate with each other, the thickness of the third cavity is greater than 1.5 times the thickness of the first cavity, the thickness of the third cavity is greater than the second The thickness of the cavity is more than 1.5 times; and a plurality of fins are juxtaposed between the lower temperature equalization plate and the upper temperature equalization plate, and the bottom end of each heat dissipation fin is connected to the lower temperature equalization plate and the top connection On the upper temperature plate.

Based on the above, the heat pipe and the heat dissipation fin are fixedly connected between the lower temperature equalization plate and the upper temperature equalization plate, so that the heat absorbed by the lower temperature equalization plate is in addition to the heat conduction through the pressure difference caused by the temperature change of the heat dissipation fin, The heat pipe and the upper temperature equalization plate can also conduct heat quickly through the convection of the working fluid vapor back to the liquid, so that the heat of the lower temperature equalization plate quickly dissipates to the upper temperature equalization plate and the external environment, so as to achieve the dual average temperature plate type heat dissipation module with excellent heat conduction Efficiency and cooling efficiency.

10: Dual temperature plate cooling module

1: Lower temperature plate

11: The first cavity

12: First side

13: Second side

14: Middle section

2: Upper temperature board

21: Second cavity

3: heat pipe

31: Third volume

4: cooling fins

5: Capillary structure

100: heating element

FIG. 1 is a three-dimensional schematic diagram of a dual-average plate heat sink module of the present invention.

FIG. 2 is a schematic cross-sectional view of the dual-average plate heat sink module of the present invention.

FIG. 3 is another schematic cross-sectional view of the dual-average plate heat sink module of the present invention.

FIG. 4 is another schematic cross-sectional view of the dual-average plate heat sink module of the present invention.

FIG. 5 is a schematic cross-sectional view of another embodiment of the dual-average plate heat sink module of the present invention.

FIG. 6 is a schematic cross-sectional view of another embodiment of the dual-average plate heat sink module of the present invention.

FIG. 7 is a schematic cross-sectional view of another embodiment of the dual-average plate heat sink module of the present invention.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings. However, the drawings are only for illustrative purposes and are not intended to limit the present invention.

Please refer to FIG. 1 to FIG. 4, the present invention provides a dual-average temperature plate type heat dissipation module for a heating element 100. This dual-average temperature plate type heat dissipation module 10 mainly includes a temperature equalization plate 1 and an upper average Warm plate 2, a heat pipe 3 and a plurality of fins 4.

The lower temperature equalization plate 1 has a first cavity 11 inside, the upper temperature equalization plate 2 is arranged above the lower temperature equalization plate 1, the upper temperature equalization plate 2 has a second cavity 21 inside, and the heating element 100 is thermally attached to the lower Warm plate 1.

The heat pipe 3 is fixedly connected between the lower temperature equalizing plate 1 and the upper temperature equalizing plate 2, and the position of the heat pipe 3 is opposite to the position of the heating element 100 (as shown in FIG. 4 ). The heat pipe 3 has a third cavity 31 inside The first chamber 11, the second chamber 21 and the third chamber 31 communicate with each other. The shape of the heat pipe 3 is an upright elongated shape, but it is not limited to this.

The plurality of fins 4 are juxtaposed vertically between the lower temperature equalizing plate 1 and the upper temperature equalizing plate 2, the bottom end of each heat dissipation fin 4 is connected to the lower temperature equalizing plate 1 and the top is connected to the upper temperature equalizing plate 2, and the plurality of heat dissipation The part of the fin 4 is connected to the heat pipe 3. Wherein, each heat dissipation fin 4 of this embodiment is connected to the lower temperature equalization plate 1, the upper temperature equalization plate 2 and the heat pipe 3 in an integrated manner, but not limited to this, each heat dissipation fin 4 may also be used It is connected to the lower temperature equalizing plate 1, the upper temperature equalizing plate 2 and the heat pipe 3 in a plug-in or adhesive manner.

The detailed description is as follows. The lower temperature equalizing plate 1 has a first side 12 and a second side 13 facing each other. The lower temperature equalizing plate 1 further has a position between the first side 12 and the second side 13 In the middle section 14, the number of the heat pipes 3 is one, and the heat pipes 3 are arranged in the middle section 14.

The dual-average temperature plate type heat dissipation module 10 of the present invention further includes a capillary structure 5 and a working fluid. The capillary structure 5 coats the inner wall surfaces of the first, second, and third chambers 11, 21, and 31. The working fluid Accommodated in the first accommodating cavity 11, the second accommodating cavity 21 and the third accommodating cavity 31. Among them, the capillary structure 5 is a composite of one or more of groove-like, grid-like, fibrous, sintered powder, and wavy thin plates.

The use state of the dual temperature equalizing plate type heat dissipation module 10 of the present invention is that the heat pipe 3 and the heat dissipating fin 4 are fixedly connected between the lower temperature equalizing plate 1 and the upper temperature equalizing plate 2 to make the heat absorbed by the lower temperature equalizing plate 1, In addition to the heat dissipation of the heat dissipation fins 4 through the pressure difference caused by changes in the ambient temperature, the heat pipe 3 and the upper temperature equalization plate 2 can also conduct heat quickly through the convection of the working fluid vapor to the liquid, so that the heat of the lower temperature equalization plate 1 Quickly dissipate to the upper average temperature plate 2 and the external environment, so as to achieve that the dual average temperature plate type heat dissipation module 10 has excellent thermal conductivity and heat dissipation efficiency.

In addition, the capillary structure 5 coats the inner wall surfaces of the first, second, and third chambers 11, 21, and 31, so that the working fluid absorbs heat and vaporizes from the lower temperature equalizing plate 1 first, and then the working fluid passes through the heat pipe 3 to the top. The temperature plate 2 is condensed and liquefied, so that the dual-average temperature plate type heat dissipation module 10 has the characteristics of rapid temperature average.

Furthermore, the position of the heat pipe 3 is opposite to the position of the heating element 100 (as shown in FIG. 4 ), so as to accelerate the heat transfer from the heating element 100 to the heat pipe 3.

Please refer to FIG. 5, which is another embodiment of the dual-temperature-plate heat dissipation module 10 of the present invention. The embodiment of FIG. 5 is substantially the same as the embodiments of FIGS. 1 to 4, but the embodiment of FIG. 5 is the same as that of FIG. 1 The difference to the embodiment shown in FIG. 4 is that the shape of the heat pipe 3 is different. The shape of the heat pipe 3 is a horizontal strip, but it is not limited to this. The shape of the heat pipe 3 of the present invention can be any geometric shape.

Please refer to FIG. 6, which is another embodiment of the dual-average plate heat dissipation module 10 of the present invention. The embodiment of FIG. 6 is substantially the same as the embodiments of FIGS. 1 to 4, but the embodiment of FIG. 6 is the same as that of FIG. 1 The difference to the embodiment of FIG. 4 is that the number of heat pipes 3 is plural. The plural heat pipes 3 are arranged in the middle section 14 at equal intervals. Increasing the number of heat pipes 3 can quickly dissipate the heat of the temperature equalizing plate 1 to strengthen The heat dissipation efficiency of the dual average temperature plate type heat dissipation module 10.

Please refer to FIG. 7, which is another embodiment of the dual temperature-plate heat dissipation module 10 of the present invention. The embodiment of FIG. 7 is substantially the same as the embodiments of FIGS. 1 to 4, but the embodiment of FIG. 7 is the same as that of FIG. 1 The difference to the embodiment of FIG. 4 is that each heat dissipation fin 4 is connected to the lower temperature equalization plate 1, the upper temperature equalization plate 2 and the heat pipe 3 in a plug-in manner, but not limited to this, each heat dissipation fin 4 4 It can also be connected to the lower temperature equalizing plate 1, the upper temperature equalizing plate 2 and the heat pipe 3 by using an integral molding or bonding method.

In summary, the dual-average temperature plate type heat dissipation module of the present invention has not been seen in similar products and public use, and has industrial applicability, novelty and progress, and fully meets the patent application requirements. Please check and grant the patent in this case in detail to protect the rights of the inventor.

10: Dual temperature plate cooling module

1: Lower temperature plate

11: The first cavity

14: Middle section

2: Upper temperature board

21: Second cavity

3: heat pipe

31: Third volume

4: cooling fins

5: Capillary structure

Claims (7)

A dual-averaged-plate heat dissipation module is used for a heating element. The dual-averaged-plate heat dissipation module includes: a lower temperature-equalizing plate, the lower temperature-averaging plate has a first cavity inside, and the heating element is thermally attached On the lower temperature equalization plate; an upper temperature equalization plate is arranged above the lower temperature equalization plate; the upper temperature equalization plate has a second cavity inside; at least one heat pipe is fixedly connected to the lower temperature equalization plate and the Between the upper temperature-equalizing plates, the heat pipe has a third cavity, the first cavity, the second cavity and the third cavity communicate with each other, and the thickness of the third cavity is greater than the first cavity The thickness of the third chamber is more than 1.5 times the thickness of the second chamber; and the plurality of fins are juxtaposed between the lower temperature equalizing plate and the upper temperature equalizing plate, each The bottom end of the heat dissipation fin is connected to the lower temperature equalization plate and the top end is connected to the upper temperature equalization plate. The dual average temperature plate type heat dissipation module of claim 1, wherein a part of the plurality of heat dissipation fins is connected to the heat pipe. The dual temperature equalizing plate type heat dissipation module according to claim 1, wherein the lower temperature equalizing plate has a first side and a second side opposite to each other, and the lower temperature equalizing plate further has a position on the first side In a middle section between the second side, the number of heat pipes is one, and the heat pipe is disposed in the middle section. The dual temperature equalizing plate type heat dissipation module according to claim 1, wherein the lower temperature equalizing plate has a first side and a second side opposite to each other, and the lower temperature equalizing plate further has a first side In an intermediate section between the second side and the number of heat pipes, the number of heat pipes is a plurality, and the plurality of heat pipes are arranged in the middle section at equal intervals. The dual-averaged plate type heat dissipation module according to claim 1, further comprising a capillary structure and a working fluid, the capillary structure covering the first cavity, the second cavity and the third cavity On the inner wall surface, the working fluid is accommodated in the first accommodating cavity, the second accommodating cavity and the third accommodating cavity. The dual-average temperature plate type heat dissipation module according to claim 5, wherein the capillary structure is a composite of one or more of groove-like, grid-like, fibrous, sintered powder, and wavy thin plates. The dual temperature equalizing plate type heat dissipation module according to claim 1, wherein the position of the heat pipe is opposite to the position of the heating element.

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