TWM558388U - Heat-dissipation module - Google Patents

Abstract

The present invention relates to a heat dissipation module comprising a heat conducting seat, a plurality of heat pipes and a fin set, the heat conducting seat having an upper surface, a lower surface, a left side surface and a right side surface, and the lower surface is provided through the left side a plurality of grooves on the surface and the right side; each heat pipe has an evaporation section which is tightly embedded in each groove and a two condensation section extending from the both ends of the evaporation section toward the upper surface, and a cross-sectional area of the diameter of each evaporation section The cross-sectional area of the pipe diameter is larger than each of the condensation sections, and the lower surface and the bottom of each evaporation section together form a flat surface; the fin group is connected to the plurality of condensation sections. Thereby, the heat dissipation module of the present invention has excellent heat dissipation efficiency.

Description

Thermal module

The present invention relates to a heat dissipation structure for electronic components such as a central processing unit, and more particularly to a heat dissipation module.

With the development of modern technology, the performance of electronic components such as central processing units in 3C products is getting higher and higher, resulting in higher heat of electronic components such as central processing units, so they will be on electronic components such as central processing units. A heat dissipation structure is added to help dissipate heat from electronic components such as the central processing unit.

The conventional heat dissipation structure mainly comprises a heat pipe, a heat conducting block and a fin group, wherein the heat conducting block is inserted into the heat conducting block, and the heat conducting block is further arranged in the heat pipe, and the heat conducting block is attached to the electronic component such as the central processing unit, thereby The heat of electronic components such as the central processing unit is dissipated through the heat pipe and the fin group to the external environment. Therefore, how to improve the heat dissipation efficiency of the heat dissipation structure is the focus of the manufacturers' desire to develop.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The present invention provides a heat dissipation module which utilizes a pipe diameter cross-sectional area of each evaporation section to be larger than a pipe diameter cross-sectional area of each condensation section, so that the evaporation section has a larger space to provide a gaseous working fluid accommodation to achieve the present. The creation of the thermal module has excellent heat dissipation efficiency.

In the present invention, the present invention provides a heat dissipation module, comprising: a heat conduction seat having an upper surface, a lower surface, a left side surface and a right side surface, wherein the lower surface is provided through the left side surface and the right side surface a plurality of grooves; each of the heat pipes having an evaporation section that is tightly embedded in each of the grooves and two condensation sections extending from the ends of the evaporation section toward the upper surface, each of the evaporation sections The cross-sectional area of the pipe diameter is larger than the cross-sectional area of the pipe diameter of each of the condensing sections, and the lower surface and the bottom of each of the evaporating sections together form a flat surface; and a fin group is connected to the plurality of condensing sections.

Based on the above, the cross-sectional area of each evaporating section is larger than the cross-sectional area of each condensing section, so that a large space inside the evaporating section provides a gaseous working fluid accommodation, so as to prevent the gaseous working fluid from entering the condensing section too quickly. The problem of liquid and gaseous working fluid overlapping and heat accumulation causes the working fluid to have sufficient time to cool during the condensation section, thereby improving the heat dissipation efficiency of the heat dissipation module.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

Referring to FIG. 1 to FIG. 4 , the present invention provides a heat dissipation module. The heat dissipation module 10 mainly includes a heat conduction seat 1 , a plurality of heat pipes 2 , and a fin group 3 .

The heat conducting base 1 has an upper surface 11, a lower surface 12, a left side surface 13 and a right side surface 14. The lower surface 12 is provided with a plurality of grooves 121 penetrating the left side surface 13 and the right side surface 14, and the plurality of grooves 121 are equidistant from each other. Arranged side by side. The upper surface 11 extends with a plurality of heat dissipation fins 111 , and each of the heat dissipation fins 111 is disposed perpendicular to the upper surface 11 , thereby improving the heat dissipation efficiency of the heat conduction seat 1 .

Each heat pipe 2 has an evaporation section 21 and two condensation sections 22 extending from both ends of the evaporation section 21. Each evaporation section 21 is tightly embedded in each groove 121, and each condensation section 22 is extended toward the upper surface 11 The cross-sectional area of each evaporating section 21 is larger than the cross-sectional area of each of the condensing sections 22, and the lower surface 12 and the bottom 211 of each evaporating section 21 together form a flat surface s.

In addition, one of the condensation sections 22 of each heat pipe 2 of the present embodiment is vertically disposed with respect to the evaporation section 21, and the other condensation section 22 is disposed obliquely with respect to the evaporation section 21, so that each heat pipe 2 has a U shape. Word shape.

In addition, each heat pipe 2 has a metal pipe body (not shown) and a capillary structure (not shown) which is coated on the inner wall of the metal pipe body (not shown), and the capillary structure (not shown) is a groove. A combination of one or more of a shape, a mesh shape, a fibrous shape, a sintered powder, and a wavy sheet.

The fin group 3 is connected to the plurality of condensation sections 22, as described in detail below. The fin group 3 includes a plurality of fins 31. Each of the fins 31 is respectively provided with a plurality of through holes 32, and the two condensation sections 22 of each heat pipe 2 are respectively The plurality of fins 31 are connected to each other, so that the plurality of fins 31 are stacked on each other and sleeved on the condensation section 22 .

As shown in FIG. 2, the state of use of the heat dissipation module 10 is such that the cross-sectional area of each of the evaporation sections 21 is larger than the cross-sectional area of each of the condensation sections 22, so that the interior of the evaporation section 21 has a comparison. The large space provides a gaseous working fluid accommodation, avoiding the problem that the gaseous working fluid enters the condensation section 22 too quickly, causing liquid and gaseous working fluid to overlap and heat accumulation, so that the working fluid has sufficient time to cool in the condensation section 22, The heat dissipation efficiency of the heat dissipation module 10 is further improved.

In addition, the lower surface 12 of the thermal conductive seat 1 and the bottom portion 211 of each evaporation section 21 together form a flat surface s, so that the thermal conductive seat 1 and each evaporation section 21 are more reliably attached to electronic components such as a central processing unit (not shown). The heat of the electronic components such as the central processing unit (not shown) is more quickly transmitted to the heat conducting seat 1 and the heat pipe 2.

In summary, the thermal module of this creation can achieve the intended purpose of use, and solve the lack of conventional knowledge, and has industrial utilization, novelty and progress, fully comply with the requirements of new patent applications, and is proposed according to the patent law. To apply, please check and grant the patent in this case to protect the rights of the creator.

10‧‧‧ Thermal Module

1‧‧‧thermal seat

11‧‧‧ upper surface

111‧‧‧Heat fins

12‧‧‧ Lower surface

121‧‧‧ Groove

13‧‧‧left side

14‧‧‧ right side

2‧‧‧heat pipe

21‧‧‧Evaporation section

211‧‧‧ bottom

22‧‧‧Condensation section

3‧‧‧Fin group

31‧‧‧Fins

32‧‧‧Perforation

S‧‧‧ flat surface

Figure 1 is an exploded perspective view of the heat dissipation module of the present invention.

Figure 2 is a three-dimensional combination of the creative cooling module.

FIG. 3 is a schematic cross-sectional view of the heat dissipation module of the present invention.

FIG. 4 is another schematic cross-sectional view of the heat dissipation module of the present invention.

Claims (8)

A heat dissipation module comprising: a heat conducting seat having an upper surface, a lower surface, a left side surface and a right side surface, wherein the lower surface is provided with a plurality of grooves extending through the left side surface and the right side surface; The heat pipe has a two-condensing section which is tightly embedded in each of the grooves and extends from both ends of the evaporation section toward the upper surface, and each of the evaporation sections has a pipe diameter cross-sectional area larger than each of the condensation sections The cross-sectional area of the tube, the lower surface and the bottom of each of the evaporation sections together form a flat surface; and a fin group connected to the plurality of condensation sections. The heat dissipation module of claim 1, wherein one of the condensation sections of the heat pipe is vertically disposed with respect to the evaporation section, and the other condensation section is inclined with respect to the evaporation section, thereby The heat pipe has a U-shape. The heat dissipation module of claim 1 or 2, wherein the plurality of grooves are arranged side by side at equal intervals. The heat dissipation module of claim 3, wherein the upper surface has a plurality of heat dissipation fins, and each of the heat dissipation fins is disposed perpendicular to the upper surface. The heat dissipation module of claim 4, wherein the fin set comprises a plurality of fins, and the plurality of fins are stacked on each other and sleeved on the condensation section. The heat dissipation module of claim 5, wherein each of the fins is provided with a plurality of perforations on each side thereof, and the two condensation sections of each of the heat pipes are respectively connected to the perforations. The heat dissipation module of claim 6, wherein each of the heat pipes has a metal pipe body and a capillary structure covering the inner wall of the metal pipe. The heat dissipation module according to claim 7, wherein the capillary structure is a composite of one or more of a groove shape, a mesh shape, a fiber shape, a sintered powder body, and a wavy sheet shape.