201041492 - 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置’特別涉及一種適用於 電子元件散熱的散熱裝置。 【先前技術】 隨著電腦產業的迅速發展，CPU追求高速度化， 多功能化及小型化所衍生的散熱問題越來越嚴重， ° 故，必須將熱量及時有效地散發出去，否則會極大 地影響電子元件的工作性能，同時還會縮減電子元 件的使用壽命。 目前的散熱裝置大多採用實心金屬吸熱底板配 &圓型熱管與散熱籍片的組合，其中，熱管的蒸發 端與該吸熱底板相連，冷凝端穿設於散熱鰭片中。 吸熱底板吸收發熱電子元件產生的熱量，再藉由熱 ❹ 官將熱1傳導至散熱鰭片上。然，吸熱底板的導熱 能力有限，且熱管與吸熱底板之間存在熱阻，阻礙 了熱量傳輸，從而降低了散熱裝置的散熱性能。 【發明内容】 繁於此’有必要提供一種高效率的散熱裝置。 一種政熱襞置，包括一傳熱體及一散熱體，該傳 熱體内為中空結構且設有毛細結構及工作液體，該 傳熱體包括中空且相互連通的蒸發腔體及冷凝腔 4 201041492 體’該冷凝腔體自該蒸發腔體向上延伸，該毛細結 構包括水平部及豎直部，該水平部貼設於該蒸發腔 體的内壁，該豎直部自該水平部向上延伸至該冷凝 腔體内並與冷凝腔體的内壁相間隔，該豎直部的外 圍與冷凝腔體的内壁之間形成蒸汽通道，該冷凝腔 體穿設於該散熱體内。 上述散熱裝置中，3亥傳熱體的蒸發腔體與發熱電 ❹ 子兀件直接接觸吸熱，並藉由其内工作液體的相變 化迅速將熱量帶至冷凝腔體，與習知的散敎裝 比，該傳熱體的吸熱效果更好，且該傳熱體= 習知散熱裝置的實心吸熱底板和熱管的功能，減少 了傳熱部件，從而減少了熱阻，提高了散熱效率。 【實施方式】 請一併參閱圖1及圖2,該散熱模組包括一傳埶 〇 體10及一散熱體20。 該散熱體20由複數相互平行的散熱鰭片22自上 而下堆疊而成，這些散熱鰭片22相互間隔設置，從 而於相鄰散熱鰭片22間形成空隙。每一散熱 大致呈平板形’其中部設有兩相鄰的條形孔似，該 兩條形孔222大致呈“八，，字形相對。所有散熱鰭片 22上的條形孔222位置自上而下相互對準，從而共 同構成沿散熱縛片22堆疊方向貫穿整個散熱體2q 的兩貫穿孔。每-條形孔222的外圍向上凸設一環緣 5 201041492 • 224。 • 请一併參閱圖3及圖4,該傳熱體1〇内為中空 結構，其内部設有毛細結構18及適量工作液體。該 傳熱體10由導熱性能良好的材料比如銅製成，可迅 速也傳遞熱里，使其内部和外部快速地進行熱交換。 所述工作液體為低沸點液體，比如水、酒精等，受熱 易蒸發汽化，遇冷易液化凝結。 <3 該傳熱體10包括一水平的蒸發腔體14及兩豎直 的冷凝腔體16，該蒸發腔體14與冷凝腔體16相互 垂直。該蒸發腔體14大致呈中空的板型，包括上下 相對的一上殼142及一下殼144,該上殼142和下殼 144合圍形成一中空的蒸發腔室。該蒸發腔體14具 有上下相對的一頂面143及一底面145，該頂面143 位於該上殼142的頂部，該底面145位於該下殼 Q 的底部。該頂面143的中部向上延伸形成兩個呈條形 環狀的凸壁141，該兩凸壁141結構相似大致呈“八，， 字形相對。每一凸壁141包圍形成一中空結構，並在 其頂端形成開口 140。該两冷凝腔體16形狀結構相 同，都呈縱長的中空扁平狀。該冷凝腔體16的頂端 封閉’底端敞開’每一冷凝腔體16的内部形成一中 空的冷凝腔室。該兩冷凝腔體16分別與該蒸發腔體 14的頂面143垂直。該兩冷凝腔體16的底端分別插 設於該蒸發腔體14的兩個凸壁141的頂端的開口 6 201041492 ： 140内，並與凸壁141的内壁相貼合，從而可使該两 ； 冷凝腔體16和蒸發腔體14的内部連通，從而該蒸發 腔體14和冷凝腔體16共同構成一密閉腔室。 4毛細結構18的整體輪廓與傳熱體的整體輪 廓相似。該毛細結構18包括水平部181和兩個豎直 部182。該水平部181呈板狀，鋪設於該蒸發腔體14 内。該水平部181貼設於該蒸發腔體14的底部，與 〇 =蒸發腔體14的頂部相間隔以形成供蒸汽運動的蒸 汽，間147。該兩豎直部182呈縱長狀，分別自該水 平部181❺中部垂直向上延伸至該兩冷凝腔體16的 頂部，並與冷凝腔體16的整個内壁相間隔，從而於 豎直部182的外圍與冷凝腔體16的内壁之間形成蒸 汽通道148，使蒸汽可運動至冷凝腔體16的頂部。 該蒸汽空間147與該蒸汽通道148相連通。該水平部 181和豎直部182 一體成型。所述工作液體蘊含在該 〇 毛細結構18中。該毛細結構18可由絲網等編織而 成，該毛細結構18的内部可形成複數細小的孔隙以 提供毛細力幫助工作液體回流。 成型該傳熱體10時，該兩冷凝腔體16的底端分 另J與5亥蒸發腔體14的上殼142的兩個凸壁密封 接合，從而使該兩冷凝腔體16與蒸發腔體14的上嗖 I42連接於一體，並藉由開口 14〇與蒸發腔體u相 連通，該兩冷凝腔體16大致組合呈“八，，字形。該毛 7 201041492 ； 細結構18的兩個豎直部182分別收容於該兩冷凝腔 ； 體16内，最後蒸發腔體14的上殼142和下殼144 接合密封，形成該傳熱體10。 組裝該散熱裝置時，該兩冷凝腔體16分別與該 散熱體20内由該條形孔222形成的兩個貫穿孔位置 對準，並穿設於該兩貫穿孔内，固定時，可藉由焊接 等方式使該傳熱體10與散熱體2〇牢固地連接在一 办起。 〇 該散熱裝置工作時，該傳熱體10的蒸發腔體14 的底面145與發熱電子元件（圖未示）接觸，吸收發 熱電子兀件產生的熱量，並迅速將熱量傳遞至其内 部，使位於水平部181内的工作液體受熱蒸發汽化， 釋放至水平部181上部的蒸汽空間147内，並經由蒸 汽通道148在冷凝腔體16内向上運動至冷凝腔體16 的頂部，同時將熱量藉由冷凝腔體16傳遞給冷凝腔 體16外圍的散熱鰭片22，利用散熱鰭片22較大的 散熱面積將熱量散發至外界，從而使冷凝腔體16的 溫度降低，進而使冷凝腔體16内的蒸氣液化凝結， 亚在豎直部182的毛細力作用下回流到水平部181， 最後至蒸發腔體14的底部，然後繼續蒸發汽化、液 化凝結如此循環工作，從而將發熱電子元件產生的熱 量源源不斷地散發出去。 該政熱震置中，該傳熱體1〇用於直接與發熱電 8 201041492 Ο 子元件接觸吸熱，並藉由其内部的毛細結構μ及工 作液體快速地傳熱，與習知散熱裝置所採用的實心吸 熱底板相比，該傳熱體10吸熱能力更加優越；且該 散熱裝置的傳熱體10集成了習知散熱裝置的實心吸 熱底板和熱管的功能，減少了傳熱部件，從而減少了 熱阻，提高了散熱效率；此外，該冷凝腔體16呈爲 平狀，且該兩條形孔222外圍設有環緣似，大大辦 加了該冷凝腔體16與散熱韓片22的接觸面積，有‘ 於提局傳熱效率，進-步提高散熱裝置的散熱效率。 另傳熱體10的兩個冷凝腔體呈八字形排 列，在其他實施例中，當該散熱體2〇的侧 熱風扇時，該兩冷凝腔體還具有導流的作用，進一二 優化散熱裝置的性能。 乂201041492 - VI. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device', and more particularly to a heat dissipating device suitable for dissipating heat of an electronic component. [Prior Art] With the rapid development of the computer industry, the CPU pursues high speed, and the heat dissipation problem caused by multi-function and miniaturization becomes more and more serious. Therefore, heat must be dissipated in a timely and effective manner, otherwise it will be greatly Affect the performance of electronic components, while also reducing the life of electronic components. Most of the current heat sinks are made of a solid metal heat sink and a combination of a circular heat pipe and a heat sink. The evaporation end of the heat pipe is connected to the heat sink bottom plate, and the condensation end is disposed in the heat sink fin. The heat absorbing substrate absorbs the heat generated by the heat-generating electronic components, and then heats the heat 1 to the heat radiating fins. However, the heat transfer capability of the heat absorbing substrate is limited, and there is a thermal resistance between the heat pipe and the heat absorbing substrate, which hinders heat transfer, thereby reducing the heat dissipation performance of the heat sink. SUMMARY OF THE INVENTION It is necessary to provide a highly efficient heat sink. The utility model relates to a political heat device, comprising a heat transfer body and a heat dissipating body, wherein the heat transfer body has a hollow structure and is provided with a capillary structure and a working liquid, and the heat transfer body comprises a hollow and interconnected evaporation chamber and a condensation chamber 4 201041492 The body of the condensation chamber extends upward from the evaporation chamber, the capillary structure includes a horizontal portion and a vertical portion, the horizontal portion is attached to an inner wall of the evaporation chamber, and the vertical portion extends upward from the horizontal portion to The condensation chamber is spaced apart from the inner wall of the condensation chamber, and a vapor passage is formed between the periphery of the vertical portion and the inner wall of the condensation chamber, and the condensation chamber is disposed in the heat dissipation body. In the above heat dissipating device, the evaporation chamber of the 3H heat transfer body is in direct contact with the heat generating electric pick-up element, and the heat is brought to the condensation chamber by the phase change of the working liquid therein, and the conventional heat sink The heat transfer body has better heat absorption effect, and the heat transfer body=the function of the solid heat absorption base plate and the heat pipe of the conventional heat sink device reduces the heat transfer member, thereby reducing the heat resistance and improving the heat dissipation efficiency. [Embodiment] Referring to FIG. 1 and FIG. 2 together, the heat dissipation module includes a transmitting body 10 and a heat sink 20. The heat dissipating body 20 is formed by stacking a plurality of mutually parallel heat dissipating fins 22 from top to bottom. The heat dissipating fins 22 are spaced apart from each other to form a gap between the adjacent heat dissipating fins 22. Each heat dissipation is substantially in the shape of a flat plate. The middle portion is provided with two adjacent strip-shaped holes. The two-shaped holes 222 are substantially eight-shaped, and the shape is opposite. The strip-shaped holes 222 on all the heat-dissipating fins 22 are located from above. The lower sides are aligned with each other to form two through holes extending through the entire heat dissipating body 2q along the stacking direction of the heat dissipating fins 22. A peripheral edge 5 is protruded upward from the periphery of each strip hole 222. 201041492 • 224. 3 and Fig. 4, the heat transfer body 1 has a hollow structure, and has a capillary structure 18 and an appropriate amount of working liquid inside. The heat transfer body 10 is made of a material having good thermal conductivity, such as copper, and can quickly transfer heat. The internal and external parts are rapidly exchanged for heat. The working liquid is a low-boiling liquid, such as water, alcohol, etc., which is easily evaporated and vaporized by heat, and liquefied and condensed when it is cold. <3 The heat transfer body 10 includes a horizontal evaporation The chamber 14 and the two vertical condensing chambers 16 are perpendicular to the condensing chamber 16. The evaporation chamber 14 has a substantially hollow plate shape, and includes an upper shell 142 and a lower shell 144 which are opposed to each other. The upper shell 142 and the lower shell 144 are enclosed The evaporation chamber 14 has a top surface 143 and a bottom surface 145 opposite to each other. The top surface 143 is located at the top of the upper shell 142, and the bottom surface 145 is located at the bottom of the lower shell Q. The middle portion of the face 143 extends upward to form two convex walls 141 having a strip shape, and the two convex walls 141 are similar in structure and are substantially eight-shaped. Each of the convex walls 141 surrounds and forms a hollow structure, and an opening 140 is formed at the top end thereof. The two condensation chambers 16 have the same shape and structure, and each has a longitudinally hollow flat shape. The top end of the condensing chamber 16 is closed & the bottom end is open. The interior of each condensing chamber 16 forms a hollow condensing chamber. The two condensation chambers 16 are perpendicular to the top surface 143 of the evaporation chamber 14, respectively. The bottom ends of the two condensation chambers 16 are respectively inserted into the openings 6 201041492 : 140 of the top ends of the two convex walls 141 of the evaporation chamber 14 and are adhered to the inner walls of the convex walls 141, so that the two can be The condensation chamber 16 communicates with the interior of the evaporation chamber 14, such that the evaporation chamber 14 and the condensation chamber 16 together form a closed chamber. The overall profile of the capillary structure 18 is similar to the overall profile of the heat transfer body. The capillary structure 18 includes a horizontal portion 181 and two vertical portions 182. The horizontal portion 181 has a plate shape and is laid in the evaporation chamber 14. The horizontal portion 181 is attached to the bottom of the evaporation chamber 14 and spaced apart from the top of the 〇 = evaporation chamber 14 to form steam for steam movement, 147. The two vertical portions 182 are elongated and extend vertically upward from the middle portion of the horizontal portion 181 to the top of the two condensation chambers 16 and are spaced apart from the entire inner wall of the condensation chamber 16 so as to be perpendicular to the vertical portion 182. A vapor passage 148 is formed between the periphery and the inner wall of the condensation chamber 16 to allow steam to move to the top of the condensation chamber 16. The vapor space 147 is in communication with the steam passage 148. The horizontal portion 181 and the vertical portion 182 are integrally formed. The working fluid is contained in the capillary structure 18. The capillary structure 18 can be woven from a wire mesh or the like, and the inside of the capillary structure 18 can form a plurality of fine pores to provide capillary force to assist the return of the working fluid. When the heat transfer body 10 is formed, the bottom ends of the two condensation chambers 16 are sealingly engaged with the two convex walls of the upper casing 142 of the evaporation chamber 14 such that the two condensation chambers 16 and the evaporation chamber The upper jaw I42 of the body 14 is integrally connected and communicates with the evaporation chamber u through the opening 14 ,. The two condensation chambers 16 are substantially combined in an "eight," shape. The hair 7 201041492; The vertical portions 182 are respectively received in the two condensation chambers; in the body 16, the upper casing 142 and the lower casing 144 of the evaporation chamber 14 are joined and sealed to form the heat transfer body 10. When the heat dissipating device is assembled, the two condensation chambers are assembled. The two through holes formed by the strip holes 222 in the heat dissipating body 20 are respectively aligned and penetrated in the through holes. When being fixed, the heat transfer body 10 can be welded or the like. The heat sink 2 is firmly connected to the start. When the heat sink is in operation, the bottom surface 145 of the evaporation chamber 14 of the heat transfer body 10 is in contact with a heat-generating electronic component (not shown) to absorb the heat generated electronic components. Heat and quickly transfer heat to its interior, allowing work in the horizontal portion 181 The body is vaporized by heat evaporation, released into the vapor space 147 in the upper portion of the horizontal portion 181, and moved upward through the vapor passage 148 in the condensation chamber 16 to the top of the condensation chamber 16, while transferring heat to the condensation through the condensation chamber 16. The heat dissipation fins 22 on the periphery of the cavity 16 use the large heat dissipation area of the heat dissipation fins 22 to dissipate heat to the outside, thereby lowering the temperature of the condensation chamber 16, and thereby liquefying and condensing the vapor in the condensation chamber 16. The capillary force of the vertical portion 182 is returned to the horizontal portion 181, and finally to the bottom of the evaporation chamber 14, and then the evaporation vaporization and liquefaction condensation are continued, so that the heat generated by the heat-generating electronic components is continuously emitted. In the thermal shock, the heat transfer body 1〇 is used for directly contacting the heat generating element 8 201041492, and the heat transfer is quickly performed by the internal capillary structure μ and the working liquid, and is adopted by the conventional heat sink device. The heat transfer body 10 has a heat absorbing capability superior to that of the solid heat absorbing substrate; and the heat transfer body 10 of the heat sink integrates a solid heat absorbing substrate of a conventional heat sink. The function of the heat pipe reduces the heat transfer component, thereby reducing the thermal resistance and improving the heat dissipation efficiency; in addition, the condensation cavity 16 is formed in a flat shape, and the two holes 222 are provided with a ring-like edge on the periphery, which greatly increases The contact area between the condensing cavity 16 and the heat dissipating film 22 has a heat transfer efficiency to improve the heat dissipation efficiency of the heat dissipating device. The two condensing cavities of the heat transfer body 10 are arranged in a figure-eight shape. In other embodiments, when the heat sink 2 is side-heated, the two condensation chambers also have a diversion function to optimize the performance of the heat sink.
本實施例中， 在其他實施例中， 熱需求適當增減。 °亥冷凝腔體16為兩個，事實上， 該冷凝腔體16的數量可依實際散 、綜上所述，本發明確已符合發明專利之要件，遂 =提出專射請。惟，以上所述者僅為本發明之較 實施方式’自不能以此限制本案之中請專利範圍。 =凡熟悉本案技藝之人士援依本發明之精神所作之 、欢修飾或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 9 201041492 圖1為本發明散熱裝置較佳實施例的立體組合 圖。 圖2為圖1所示散熱裝置的立體分解圖。 圖3為圖2所示傳熱體的立體分解圖。 圖4為圖1沿IV—IV線的剖面示意圖。 【主要元件符號說明】 傳熱體 10 蒸發腔體 14 開口 140 凸壁 141 上殼 142 頂面 143 下殼 144 底面 145 蒸汽空間 147 蒸汽通道 148 冷凝腔體 16 毛細結構 18 水平部 181 豎直部 182 散熱體 20 散熱鰭片 22 條形孔 222 環緣 224In this embodiment, in other embodiments, the heat demand is appropriately increased or decreased. There are two condensation chambers 16 in the °H. In fact, the number of the condensation chambers 16 can be dissipated according to the actual situation. In summary, the present invention has indeed met the requirements of the invention patent, and 遂 = proposes a special shot. However, the above description is only a comparative embodiment of the present invention. Any person who is familiar with the skill of the present invention, which is modified or changed in accordance with the spirit of the present invention, should be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS 9 201041492 FIG. 1 is a perspective assembled view of a preferred embodiment of a heat sink according to the present invention. 2 is an exploded perspective view of the heat sink shown in FIG. 1. Fig. 3 is an exploded perspective view of the heat transfer body shown in Fig. 2; Figure 4 is a cross-sectional view taken along line IV-IV of Figure 1. [Main component symbol description] Heat transfer body 10 Evaporation chamber 14 Opening 140 Projection wall 141 Upper shell 142 Top surface 143 Lower shell 144 Bottom surface 145 Steam space 147 Steam passage 148 Condensation chamber 16 Capillary structure 18 Horizontal portion 181 Vertical portion 182 Heat sink 20 heat sink fin 22 strip hole 222 loop edge 224