CN112105223A

CN112105223A - Heat dissipation device for electronic equipment and electronic equipment

Info

Publication number: CN112105223A
Application number: CN202010908913.9A
Authority: CN
Inventors: 冯斌
Original assignee: Oppo Chongqing Intelligent Technology Co Ltd
Current assignee: Oppo Chongqing Intelligent Technology Co Ltd
Priority date: 2020-09-02
Filing date: 2020-09-02
Publication date: 2020-12-18
Anticipated expiration: 2040-09-02
Also published as: CN112105223B

Abstract

The application discloses heat abstractor and electronic equipment for electronic equipment, heat abstractor includes: the metal plate is internally provided with an evaporation cavity and a condensation cavity which are separated from each other, a communication channel is also formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity; and the cooling liquid is filled in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel. The heat dissipation device can be arranged in the electronic equipment, the heat dissipation efficiency can be improved, and in the closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel, the cooling liquid seal cannot flow outwards to cause circuit damage of the electronic equipment.

Description

Heat dissipation device for electronic equipment and electronic equipment

Technical Field

The present application relates to the field of electronic devices, and in particular, to a heat dissipation device for an electronic device and an electronic device.

Background

In the related art, the heat dissipation is performed in the electronic device such as a mobile phone by arranging the stacked heat dissipation fins, but the stacked heat dissipation fins have low heat dissipation efficiency, and the heat pipe device with high heat dissipation efficiency has a thick pipe body due to the integration of the pipe shell and the pipe core, and cannot be directly stacked in the electronic device.

Disclosure of Invention

The application provides a heat abstractor for electronic equipment, heat abstractor is convenient for set up in electronic equipment, and the radiating efficiency is high.

The application also provides electronic equipment, and the electronic equipment comprises the heat dissipation device for the electronic equipment.

The heat dissipation device for the electronic equipment according to the embodiment of the application comprises: the metal plate is internally provided with an evaporation cavity and a condensation cavity which are separated from each other, a communication channel is further formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity; and the cooling liquid is filled in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel.

According to the heat dissipation device for the electronic equipment, the heat dissipation device is arranged to be of the metal plate-shaped structure, the heat dissipation device can be internally stacked in the electronic equipment, the heat dissipation efficiency can be improved, the cooling liquid seal is arranged in the closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel, the circuit of the electronic equipment cannot be damaged due to outflow, and the working reliability of the electronic equipment is guaranteed. In addition, the heat dissipation device can take away the redundant heat generated by the heating element of the electronic equipment, and dissipate the heat in the transmission process, so that the overhigh temperature around the component is avoided, and the problem of fever of the electronic equipment is solved. In addition, evaporation chamber, condensation chamber, intercommunication passageway and capillary channel all place in the metal sheet in, and each part size can be adjusted according to electronic equipment inner space, strengthens the universality of using. In addition, the heat dissipation device is not provided with a fan and other devices to increase the power consumption of the electronic equipment, is not provided with a water pump to control liquid to move, is a passive device, and is effective and energy-saving in the aspect of heat dissipation increase.

According to the electronic equipment of this application embodiment, include: a housing; the main board is arranged in the shell; in the above heat dissipation device for electronic equipment, the heat dissipation device is disposed in the housing, and the portion of the metal plate having the evaporation cavity is attached to the main board.

According to the electronic equipment of this application embodiment, through setting heat abstractor to metal platelike structure, can make the heat abstractor built-in pile up in electronic equipment to can improve the radiating efficiency, and in the coolant liquid seal had the closed cavity that evaporation chamber, condensation chamber, intercommunication passageway and capillary channel constitute, can not outflow lead to electronic equipment's circuit to damage, guarantee electronic equipment reliability of working. In addition, the heat dissipation device can take away the redundant heat generated by the heating element of the electronic equipment, and dissipate the heat in the transmission process, so that the overhigh temperature around the component is avoided, and the problem of fever of the electronic equipment is solved. In addition, evaporation chamber, condensation chamber, intercommunication passageway and capillary channel all place in the metal sheet in, and each part size can be adjusted according to electronic equipment inner space, strengthens the universality of using. In addition, the heat dissipation device is not provided with a fan and other devices to increase the power consumption of the electronic equipment, is not provided with a water pump to control liquid to move, is a passive device, and is effective and energy-saving in the aspect of heat dissipation increase.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a heat dissipation device for an electronic apparatus according to an embodiment of the present application;

FIG. 2 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the application;

fig. 3 is a schematic diagram of an internal structure of an electronic device according to an embodiment of the present application.

Reference numerals:

the electronic device 100 is provided with a display device,

the heat-dissipating device 10 is provided with a heat-dissipating structure,

a metal plate 1, an evaporation cavity 11, a heat exchange channel 111, a baffle plate 112, a condensation cavity 12, a communication channel 13, a capillary channel 14, a capillary structure 141, a cooling liquid inlet 15,

housing 20, motherboard 30, and battery 40.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

A heat sink 10 for an electronic device 100 according to an embodiment of the present application is described below with reference to fig. 1.

As shown in fig. 1, a heat sink 10 for an electronic apparatus 100 according to an embodiment of the present application includes a metal plate 1.

Specifically, evaporation chamber 11 and condensation chamber 12 are formed in metal sheet 1, evaporation chamber 11 and condensation chamber 12 are spaced apart, intercommunication passageway 13 is still formed in metal sheet 1, the one end of intercommunication passageway 13 and the one end intercommunication in evaporation chamber 11, the other end of intercommunication passageway 13 and the one end intercommunication in condensation chamber 12, capillary passage 14 still is injectd in metal sheet 1, be equipped with capillary structure 141 in capillary passage 14, the one end of capillary passage 14 and the other end intercommunication in evaporation chamber 11, the other end of capillary passage 14 and the other end intercommunication in condensation chamber 12. It can be understood that the metal plate 1 is a metal plate-shaped structure, the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are arranged at intervals in the plane of the metal plate 1, and the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 form a closed-loop closed cavity.

The cooling liquid is filled in a closed cavity formed by the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14. The part of the metal plate 1 with the evaporation cavity 11 can be attached to a heating element of the electronic device 100, the heating element transfers heat to the cooling liquid in the evaporation cavity 11, the liquid evaporates to remove the heat, then the water vapor is transferred into the condensation cavity 12 through the communication channel 13, the heat released in the condensation cavity 12 is condensed into liquid drops again, and then the liquid flows back into the evaporation cavity 11 through the capillary channel 14 again. This process is repeated, and the heat generated by the heat generating component of the electronic device 100 is continuously taken out, so as to solve the heat generating problem of the electronic device 100.

The capillary structure 141 is a conventional structure that can draw liquid to the evaporation cavity 11 and is known to those skilled in the art, and has a fine gap along which the liquid rises or permeates in case of wetting, and will not be described in detail herein.

Alternatively, the heat generating elements of the electronic device 100 may be a processor chip, a memory chip, and the like of the electronic device 100.

Alternatively, the metal plate 1 may be a metal plate 1 such as a copper plate or an aluminum plate.

According to the heat dissipation device 10 for the electronic device 100 of the embodiment of the application, the heat dissipation device 10 is configured to be the metal plate-shaped structure, so that the heat dissipation device 10 can be internally stacked in the electronic device 100, and the heat dissipation efficiency can be improved, and the cooling liquid is sealed in the closed cavity formed by the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14, so that the circuit of the electronic device 100 cannot be damaged due to outflow, and the reliability of the operation of the electronic device 100 is ensured. In addition, the heat dissipation device 10 can take away the excess heat generated by the heating element of the electronic device 100, and dissipate the heat in the transmission process, so as to avoid the over-high temperature around the component and solve the problem of fever of the electronic device 100. In addition, the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are all arranged in the metal plate 1, and the sizes of all parts can be adjusted according to the internal space of the electronic device 100, so that the application universality is enhanced. In addition, the heat dissipation device 10 does not have a device such as a fan or the like to increase power consumption of the electronic apparatus 100, does not have a water pump to control liquid movement, is a passive device, and is effective in increasing heat dissipation and energy-saving.

In some embodiments of the present application, at least one of the evaporation chamber 11 and the condensation chamber 12 is provided with a cooling liquid inlet 15. Thereby facilitating the filling of the cooling liquid, which can be filled into the evaporation chamber 11 or the condensation chamber 12 through the cooling liquid inlet 15 after the cooling liquid is consumed at the beginning of use or during the use of the cooling liquid. For example, in the example shown in fig. 1, the end of the evaporation chamber 11 remote from the condensation chamber 12 is provided with a cooling liquid inlet 15.

Further, the heat sink 10 further includes a plug for plugging the coolant inlet 15, so as to prevent the coolant from leaking. Of course, the coolant inlet 15 may be sealed by welding or the like during the manufacturing process of the heat sink 10.

Alternatively, as shown in fig. 1, the cooling liquid inlet 15 is opposite to the capillary passage 14, in order to prevent the cooling liquid injected into the evaporation cavity 11 from entering the capillary passage 14 or damaging the capillary structure 141 in the capillary passage 14, a baffle plate 112 is provided in the evaporation cavity 11, and the baffle plate 112 is located between the capillary passage 14 and the cooling liquid inlet 15 to prevent the cooling liquid injected into the evaporation cavity 11 from the cooling liquid inlet 15 from impacting the capillary passage 14.

Alternatively, as shown in FIG. 1, the capillary passage 14 extends in a straight line. Therefore, the cooling liquid in the condensation cavity 12 is favorably drained into the evaporation cavity 11 through the capillary phenomenon, the circulation efficiency of the cooling liquid is improved, and the heat dissipation efficiency of the electronic device 100 is improved. Of course, the present application is not limited thereto, and the capillary channel 14 may also extend along a curve, which is not limited herein.

As shown in fig. 1, the evaporation chamber 11 has a plurality of heat exchange channels 111 therein, one end of each heat exchange channel 111 is communicated with the capillary channel 14, and the other end of each heat exchange channel 111 is communicated with the communication channel 13. A plurality of heat transfer passageways 111 are injectd by metal sheet 1, and every heat transfer passageway 111's internal perisporium is the metalwork, and a plurality of heat transfer passageways 111 can increase the heat transfer area of coolant liquid and metal sheet 1 to improve the heat exchange efficiency of coolant liquid and metal sheet 1, improve the efficiency of coolant liquid vaporization, and then improve electronic equipment 100's radiating efficiency.

In the description of the present application, "a plurality" means two or more unless otherwise specified.

Further, as shown in fig. 1, a plurality of heat exchange channels 111 may be disposed in parallel, thereby facilitating the flow of the cooling liquid. For example, in the example shown in fig. 1, each heat exchange channel 111 extends in the direction from the condensation chamber 12 to the evaporation chamber 11 (up-down direction as shown in fig. 1), and the plurality of heat exchange channels 111 are arranged in parallel in the left-right direction.

In the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

Alternatively, the heat exchange channels 111 extend along straight lines, or along broken lines, with curved lines. Thereby increasing the versatility of the structure of the heat sink 10.

In the example shown in fig. 1, the evaporation chamber 11 and the condensation chamber 12 are respectively located at opposite ends of the metal plate 1, and the communication passage 13 and the capillary passage 14 are respectively located at the other opposite ends of the metal plate 1. The evaporation chamber 11, the condensation chamber 12, the communication channel 13 and the capillary channel 14 form a substantially rectangular closed loop type, thereby accommodating more shapes of the electronic apparatus 100. Of course, the present application is not limited thereto, and the positions of the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 may be flexibly adjusted according to the internal structure of the electronic device 100.

As shown in fig. 1, a hollow area is formed on the metal plate 1 except for the evaporation chamber 11, the condensation chamber 12, the communication channel 13 and the capillary channel 14. It is understood that the portion of the metal plate 1 excluding the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 has no structure of the metal plate 1, so that the area of the metal plate 1 can be reduced, the weight of the heat sink 10 can be reduced, the weight of the electronic device 100 can be reduced, and the material cost of the heat sink 10 can be saved.

Of course, the present application is not limited to this, the metal plate 1 may be a complete flat plate structure, and the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are disposed in the metal plate 1 and occupy a portion of the metal plate 1, so that the other components of the electronic device 100 may be contacted by other structures on the metal plate 1 to dissipate heat.

Optionally, the cooling liquid is a mixed liquid of glycol and water, and the mixed liquid of glycol and water has a wider use temperature range than water liquid and a higher specific heat capacity than organic liquid. Wherein, the proportion of glycol in the cooling liquid can be 50-60%, and the working temperature range is-35-110 ℃.

An electronic device 100 according to an embodiment of the application is described below with reference to fig. 2 and 3.

As shown in fig. 2 and 3, the electronic device 100 according to the embodiment of the present application includes a housing 20, a main board 30, and the heat dissipation apparatus 10 for the electronic device 100.

Specifically, the main board 30 is arranged in the housing 20, the heat dissipation device 10 is arranged in the housing 20, the portion of the metal plate 1 with the evaporation cavity 11 is attached to the main board 30, the processor chip and the memory chip can be arranged on the main board 30, heat on the main board 30 can be transferred to cooling liquid in the evaporation cavity 11, the liquid can be vaporized to take away the heat, then the water vapor can be transmitted to the condensation cavity 12 through the communication channel 13, the heat released in the condensation cavity 12 is condensed into liquid drops again, and then the liquid flows back to the evaporation cavity 11 through the capillary channel 14 again. This process is repeated, and the heat generated by the main board 30 of the electronic device 100 is continuously taken out, so as to solve the problem of heat generation of the electronic device 100.

According to the electronic device 100 of the embodiment of the application, the heat dissipation device 10 is set to be the metal plate 1-shaped structure, so that the heat dissipation device 10 can be internally stacked in the electronic device 100, the heat dissipation efficiency can be improved, and the cooling liquid is sealed in the closed cavity formed by the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14, so that the circuit of the electronic device 100 cannot be damaged due to outflow, and the reliability of the operation of the electronic device 100 is ensured. In addition, the heat dissipation device 10 can take away the excess heat generated by the heating element of the electronic device 100, and dissipate the heat in the transmission process, so as to avoid the over-high temperature around the component and solve the problem of fever of the electronic device 100. In addition, the evaporation cavity 11, the condensation cavity 12, the communication channel 13 and the capillary channel 14 are all arranged in the metal plate 1, and the sizes of all parts can be adjusted according to the internal space of the electronic device 100, so that the application universality is enhanced. In addition, the heat dissipation device 10 does not have a device such as a fan or the like to increase power consumption of the electronic apparatus 100, does not have a water pump to control liquid movement, is a passive device, and is effective in increasing heat dissipation and energy-saving.

Optionally, the electronic device 100 further includes a battery 40, the battery 40 is disposed in the housing 20 and spaced apart from the main board 30, the metal plate 1 is located on the same side of the main board 30 and the battery 40, a portion of the metal plate 1 having the communication channel 13 is attached to the battery 40, and a portion of the metal plate 1 having the condensation chamber 12 is spaced apart from both the battery 40 and the main board 30. The battery 40 can provide power for the electronic device 100, so that the electronic device 100 is more convenient to use, and no power plug is needed, and in addition, the part of the metal plate 1 with the communication channel 13 is attached to the battery 40, so that heat on the battery 40 can be further dissipated through the heat dissipation device 10.

By way of example, the electronic device 100 may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. Specifically, the electronic device 100 may be a mobile phone or smart phone (e.g., an iPhone (TM) based, Android (TM) based phone), a Portable gaming device (e.g., a Nintendo DS (TM), a PlayStation Portable (TM), a Game Advance (TM), an iPhone (TM)), a laptop, a PDA, a Portable Internet device, a music player and data storage device, other handheld devices and headsets such as watches, in-ear headphones, pendant, headphones, etc., and the electronic device 100 may also be other wearable devices (e.g., a Head Mounted Device (HMD) such as electronic glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).

The electronic device 100 may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving Picture experts group (MPEG-1 or MPEG-2) Audio layer (MP3) players, portable medical devices, and digital cameras, and combinations thereof.

In some cases, electronic device 100 may perform multiple functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device 100 may be a portable device such as a cellular telephone, media player, other handheld device, wrist watch device, pendant device, earpiece device, or other compact portable device.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation device for an electronic device, comprising:

the metal plate is internally provided with an evaporation cavity and a condensation cavity which are separated from each other, a communication channel is further formed in the metal plate, one end of the communication channel is communicated with one end of the evaporation cavity, the other end of the communication channel is communicated with one end of the condensation cavity, a capillary channel is further defined in the metal plate, a capillary structure is arranged in the capillary channel, one end of the capillary channel is communicated with the other end of the evaporation cavity, and the other end of the capillary channel is communicated with the other end of the condensation cavity;

and the cooling liquid is filled in a closed cavity formed by the evaporation cavity, the condensation cavity, the communication channel and the capillary channel.

2. The heat dissipating device for electronic equipment according to claim 1, wherein at least one of the evaporation chamber and the condensation chamber is provided with a cooling liquid inlet.

3. The heat dissipating device for an electronic apparatus according to claim 1, wherein the capillary channel extends in a straight line.

4. The heat dissipating device for electronic equipment according to claim 1, wherein the evaporation chamber has a plurality of heat exchanging channels therein, one end of each heat exchanging channel communicates with the capillary channel, and the other end of each heat exchanging channel communicates with the communicating channel.

5. The heat dissipating device for electronic equipment as claimed in claim 4, wherein the heat exchanging channel extends along a straight line or along a broken line, or along a curved line.

6. The heat dissipating device for electronic equipment as claimed in claim 1, wherein the evaporation cavity and the condensation cavity are respectively located at opposite ends of the metal plate, and the communication passage and the capillary passage are respectively located at the other opposite ends of the metal plate.

7. The heat dissipating device for an electronic apparatus according to claim 1, wherein a portion of the metal plate excluding the evaporation chamber, the condensation chamber, the communication channel, and the capillary channel forms a hollow-out region.

8. The heat dissipating device for electronic equipment according to claim 1, wherein the coolant is a mixture of ethylene glycol and water.

9. An electronic device, comprising:

a housing;

the main board is arranged in the shell;

the heat dissipating apparatus for an electronic device as claimed in any one of claims 1 to 8, the heat dissipating apparatus being provided in the case, the portion of the metal plate having the evaporation cavity being attached to the main board.

10. The electronic device of claim 9, further comprising:

the battery is arranged in the shell and is spaced from the main board, the metal plate is positioned on the same side of the main board and the battery, the part of the metal plate with the communication channel is attached to the battery, and the part of the metal plate with the condensation cavity is spaced from the battery and the main board.