CN113133283B

CN113133283B - Heat dissipation device and manufacturing method thereof

Info

Publication number: CN113133283B
Application number: CN202110395385.6A
Authority: CN
Inventors: 林柏全; 秦锋; 席克瑞; 朱清三; 欧阳珺婷; 贾振宇
Original assignee: Shanghai Tianma Microelectronics Co Ltd
Current assignee: Shanghai Tianma Microelectronics Co Ltd
Priority date: 2021-04-13
Filing date: 2021-04-13
Publication date: 2023-10-20
Anticipated expiration: 2041-04-13
Also published as: CN113133283A

Abstract

The application provides a heat dissipation device and a manufacturing method thereof, wherein a part to be heat-dissipated is contacted with an evaporation area, cooling liquid in an evaporation cavity is heated and vaporized to form steam, the steam is transmitted into a condensation cavity of a condensation area through a steam transmission pipeline to be liquefied into liquid, the evaporation cavity is reduced in liquid and gas is transmitted, the air pressure is reduced, and the cooling liquid in the condensation cavity flows to the evaporation cavity through a condensation liquid backflow pipeline under the action of pressure, so that the self circulation of the cooling liquid in the heat dissipation device is realized. Therefore, the embodiment of the application realizes the circulation heat dissipation of liquid through the air pressure change, and the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary channel in the vapor chamber.

Description

Heat dissipation device and manufacturing method thereof

Technical Field

The application relates to the field of device manufacturing, in particular to a heat dissipation device and a manufacturing method thereof.

Background

In today's society, electronic devices are evolving more and more rapidly. In the use process of the electronic device, whether the electronic device has good heat dissipation performance is one of core focuses of attention of users. The existing heat dissipation technology of electronic equipment mainly utilizes graphite heat dissipation fins or soaking plates to dissipate heat. Although the soaking plate has higher heat dissipation efficiency than the graphite heat sink, the manufacturing cost of the soaking plate is also high.

Therefore, there is an urgent need for a heat sink device that is less costly to manufacture.

Disclosure of Invention

Accordingly, an object of the present application is to provide a heat sink device with low manufacturing cost and a method for manufacturing the same.

The embodiment of the application provides a heat dissipation device, which comprises: an evaporation zone, a vapor transport zone, a condensation zone, and a liquid reflux zone;

the vapor transfer zone has a vapor outgoing conduit, the liquid return zone has a condensed liquid return conduit, the evaporation zone has an evaporation cavity, and the condensation zone has a condensation cavity; the vapor outgoing conduit, the condensed liquid return conduit, the evaporation chamber, and the condensation chamber are formed using a first substrate, a second substrate, and an isolation structure between the first substrate and the second substrate, the vapor outgoing conduit cross-sectional dimension being less than the condensed liquid return conduit cross-sectional dimension;

the evaporation cavity and the condensation cavity are provided with cooling liquid; and the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is contacted with the part to be cooled, the steam is introduced into the condensation cavity from the steam outgoing pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensation liquid return pipeline to form the self-circulation of the cooling liquid.

Optionally, the vapor outgoing conduit and/or the condensed liquid return conduit comprises a plurality of side-by-side conduits.

Optionally, the first substrate is a dielectric substrate, the second substrate is a metal substrate, and the isolation structure is a metal component formed on the dielectric substrate.

Optionally, the metal substrate located in the evaporation area is used for contacting with the component to be cooled.

Optionally, the dielectric substrate is a glass substrate.

Optionally, the isolation structure is metallic copper.

Optionally, the length of the vapor outgoing conduit in a direction perpendicular to the conduit cross section is smaller than the length of the condensed liquid return conduit in a direction perpendicular to the conduit cross section.

Optionally, the cross-sectional dimension of the vapor outgoing conduit and/or the condensed liquid return conduit or the depth in the direction perpendicular to the substrate surface is in the range of 10-100 microns.

Optionally, the depth of the condensed liquid return conduit perpendicular to the substrate surface is less than the depth of the vapor outlet conduit perpendicular to the substrate surface.

Optionally, the condensed liquid return pipeline is internally covered with a hydrophilic membrane layer, and the steam outgoing pipeline is internally covered with a hydrophobic membrane layer.

Optionally, the evaporation cavity is not filled with the cooling liquid in the evaporation cavity.

Optionally, the condensation cavity is located at one side of the first substrate and has a metal layer, and the depth of the condensation cavity in the direction perpendicular to the surface of the substrate is smaller than the depth of the evaporation cavity in the direction perpendicular to the surface of the substrate.

The embodiment of the application also provides a manufacturing method of the heat dissipation device, which comprises the following steps:

forming an isolation structure on a first substrate; the first substrate is provided with an evaporation area, a vapor transmission area, a condensation area and a liquid backflow area;

covering a second substrate over the isolation structure such that the first substrate, the second substrate, and the isolation structure between the first substrate and the second substrate form an evaporation cavity located in the evaporation region, a condensation cavity located in the condensation region, a vapor outgoing conduit located in the vapor transmission region, and a condensed liquid return conduit located in the liquid return region, the vapor outgoing conduit cross-sectional dimension being less than the condensed liquid return conduit cross-sectional dimension;

and filling cooling liquid into the evaporation cavity and the condensation cavity.

Optionally, after covering the second substrate above the isolation structure, openings are formed in the evaporation cavity and the condensation cavity;

the filling of the cooling liquid into the evaporation cavity and the condensation cavity comprises the following steps:

filling the evaporation cavity and the condensation cavity with the cooling liquid through the opening of the condensation cavity;

the method further comprises the steps of:

and filling the cooling liquid into the condensed liquid return pipeline through the opening of the condensing cavity, and sealing the openings of the evaporating cavity and the condensing cavity.

Optionally, the method further comprises:

and heating the vapor outgoing pipeline of the vapor transmission area so as to vaporize the cooling liquid in the vapor outgoing pipeline and transmit the cooling liquid to the condensation cavity.

Optionally, the method further comprises:

a hydrophilic film layer is formed inside the condensed liquid return pipeline, and a hydrophobic film layer is formed inside the steam outgoing pipeline.

Optionally, the method further comprises:

and forming a metal layer on one side of the condensation cavity, which is positioned on the first substrate.

Optionally, the dielectric substrate is a glass substrate.

Optionally, the isolation structure is metallic copper.

The heat dissipation device provided by the embodiment of the application comprises: an evaporation zone, a vapor transport zone, a condensation zone, and a liquid reflux zone; the vapor transfer zone has a vapor outgoing conduit, the liquid return zone has a condensed liquid return conduit, the evaporation zone has an evaporation cavity, and the condensation zone has a condensation cavity; the vapor outgoing conduit, the condensed liquid return conduit, the evaporation chamber, and the condensation chamber are formed using a first substrate, a second substrate, and an isolation structure between the first substrate and the second substrate, the vapor outgoing conduit cross-sectional dimension being less than the condensed liquid return conduit cross-sectional dimension; the evaporation cavity and the condensation cavity are provided with cooling liquid; and the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is connected with the part to be cooled, the steam is introduced into the condensation cavity from the steam outgoing pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensation liquid return pipeline to form the self-circulation of the cooling liquid.

According to the heat dissipation device provided by the embodiment of the application, the part to be heat-dissipated is contacted with the evaporation area, the cooling liquid in the evaporation cavity is heated and vaporized to form steam, the steam is transmitted into the condensation cavity of the condensation area through the steam transmission pipeline to be liquefied into liquid, the evaporation cavity is reduced in liquid and gas is transmitted, the air pressure is reduced, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensation liquid backflow pipeline under the action of pressure, so that the self circulation of the cooling liquid in the heat dissipation device is realized. Therefore, the embodiment of the application realizes the circulation heat dissipation of liquid through the air pressure change, and the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary channel in the vapor chamber.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the application and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of a heat dissipating device according to an embodiment of the present application;

FIG. 2 is a schematic view showing the structure of an AA cross section of a heat dissipating device according to an embodiment of the present application;

fig. 3 shows a schematic structural diagram of a BB cross section of a heat dissipating device according to an embodiment of the present application;

fig. 4 is a flowchart showing a method for manufacturing a heat sink according to an embodiment of the present application.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present application is not limited to the specific embodiments disclosed below.

In the following detailed description of the embodiments of the present application, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration only, and in which is shown by way of illustration only, and in which the scope of the application is not limited for ease of illustration. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.

Currently, electronic devices are evolving more and more rapidly. In the use process of the electronic device, whether the electronic device has good heat dissipation performance is one of core focuses of attention of users. The existing heat dissipation technology of electronic equipment mainly utilizes graphite heat dissipation fins or soaking plates to dissipate heat.

The vapor chamber is a vacuum chamber having a fine structure on the inner wall, and is usually made of copper. When heat is conducted from a heat source to an evaporation area, the cooling liquid in the vacuum cavity starts to generate vaporization phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, the cooling liquid absorbs heat energy and rapidly expands in volume, the whole cavity is rapidly filled with gas-phase cooling medium, and condensation phenomenon can be generated when the gas-phase cooling medium contacts a relatively cold area. By releasing heat accumulated during evaporation through condensation, the condensed cooling liquid returns to the evaporation heat source through the capillary channel of the microstructure, and the process is repeatedly performed in the vacuum cavity. The vapor chamber has higher heat dissipation efficiency than the graphite heat sink, but the vapor chamber needs to be manufactured as a vacuum chamber and a microstructure in the vacuum chamber, so the manufacturing cost of the vapor chamber is high.

Therefore, there is an urgent need for a heat sink device that is low in manufacturing cost and has a good heat dissipation effect.

Based on this, an embodiment of the present application provides a heat dissipating device, including: an evaporation zone, a vapor transport zone, a condensation zone, and a liquid reflux zone; the vapor transfer zone has a vapor outgoing conduit, the liquid return zone has a condensed liquid return conduit, the evaporation zone has an evaporation cavity, and the condensation zone has a condensation cavity; the vapor outgoing conduit, the condensed liquid return conduit, the evaporation chamber, and the condensation chamber are formed using a first substrate, a second substrate, and an isolation structure between the first substrate and the second substrate, the vapor outgoing conduit cross-sectional dimension being less than the condensed liquid return conduit cross-sectional dimension; the evaporation cavity and the condensation cavity are provided with cooling liquid; and the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is connected with the part to be cooled, the steam is introduced into the condensation cavity from the steam outgoing pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensation liquid return pipeline to form the self-circulation of the cooling liquid.

For a better understanding of the technical solutions and technical effects of the present application, specific embodiments will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, a heat dissipating device 100 according to an embodiment of the present application is shown, where the heat dissipating device 100 may include: the evaporation zone 110, vapor transport zone 120, condensation zone 130, and liquid return zone 140 are described with reference to fig. 1.

Fig. 1 is a schematic top view of a heat dissipating device according to an embodiment of the present application, where the vapor transmission area 120 has a vapor outgoing pipe 121, and the liquid return area 140 has a condensed liquid return pipe 141. In particular, the vapor outgoing conduit 121 and the condensed liquid return conduit 141 may be a plurality of side-by-side conduits to provide various pathways to enhance heat dissipation efficiency. The evaporation zone 110 has an evaporation chamber 111 and the condensation zone 130 has a condensation chamber 131. Specifically, the evaporation chamber 111 and the condensation chamber 131 are connected by a vapor outgoing line 121 and a condensed liquid return line 141.

In an embodiment of the present application, the vapor outgoing line 121, the condensed liquid return line 141, the evaporation chamber 111, and the condensation chamber 131 may be formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, as shown with reference to fig. 2 and 3. The materials of the first substrate 150 and the second substrate 160 may be the same or different. Specifically, the first substrate 150 may be a dielectric substrate, for example, a glass substrate, and the second substrate 160 may be a metal substrate. The material of the isolation structure 170 may be a metal material, and in particular, the isolation structure 170 may be a metal member formed on the first substrate 160, for example, the material of the isolation structure may be metallic copper.

In practical application, since the heat dissipation effect of the metal material is good, one side of the metal substrate may be contacted with the component to be cooled, and specifically, one side of the metal substrate located in the evaporation area 110 may be contacted with the component to be cooled. The component to be heat dissipated may be a chip or a battery within the electronic device.

In the embodiment of the present application, the evaporating cavity 111 and the condensing cavity 131 may be filled with a cooling liquid, when the evaporating area 110 contacts with a part to be cooled, the part to be cooled heats, heat is conducted to the evaporating area 110, and the cooling liquid in the evaporating cavity 111 heats to form steam, and absorbs a large amount of heat in the evaporating process so as to cool the part to be cooled. The vapor in the evaporation chamber 111 is introduced into the condensation chamber 131 from the vapor outlet pipe 121, the temperature in the condensation chamber 131 is low, and the vaporized vapor enters the condensation chamber 131 to be liquefied, thereby releasing heat accumulated during vaporization by the phenomenon of liquefaction. Since the cooling liquid in the evaporation cavity 111 becomes steam and is transferred out, the pressure in the evaporation cavity 111 is reduced, and the cooling liquid in the condensation cavity 131 flows to the evaporation cavity 111 through the condensation liquid return pipe 141 under the action of the pressure, based on the above steps, the self-circulation of the cooling liquid in the evaporation cavity 111, the steam transfer pipe 121, the condensation cavity 131 and the condensation liquid return pipe 141 is formed, and the effect of circulating heat dissipation is achieved. In particular, the cooling liquid may be purified water in order to save manufacturing costs.

In practical applications, the condensed liquid return line 141 may be filled with the cooling liquid in advance, so that the vapor in the evaporation chamber 111 does not move to the condensation chamber 131 through the condensed liquid return line 141, and the self-circulation of the cooling liquid in the evaporation chamber 111, the vapor delivery line 121, the condensation chamber 131, and the condensed liquid return line 141 can be further maintained.

In an embodiment of the present application, vapor outgoing conduit 121 has a cross-sectional dimension that is smaller than the cross-sectional dimension of condensed liquid return conduit 141. The condensed liquid return line 141 serves to supplement the cooling liquid to the evaporation chamber 111 by the vapor in the outgoing evaporation chamber 111 of the vapor outgoing line 121, and thus the cross-sectional size of the vapor outgoing line 121 may be smaller than the cross-sectional size of the condensed liquid return line 141. The smaller cross-sectional dimension of the vapor outgoing conduit 121 than the condensed liquid return conduit 141 also prevents the cooling liquid in the condensing chamber 131 from flowing into the evaporation chamber 111 through the vapor outgoing conduit 121, so that the cooling liquid in the condensing chamber 131 flows into the evaporation chamber 111 through the condensed liquid return conduit 141 more easily.

In an embodiment of the present application, the vapor outgoing conduit 121 and the condensed liquid return conduit 141 may be parallel to the base plate, i.e. the base plate is perpendicular to the conduit cross-sections of the vapor outgoing conduit 121 and the condensed liquid return conduit 141. The length of the vapor outgoing conduit 121 in the direction perpendicular to the conduit cross section is smaller than the length of the condensed liquid returning conduit 141 in the direction perpendicular to the conduit cross section, i.e., the length of the vapor outgoing conduit 121 in the direction parallel to the substrate is smaller than the length of the condensed liquid returning conduit 141, so that the vapor in the evaporation chamber 111 can be prevented from liquefying during the outgoing through the vapor outgoing conduit 121.

In embodiments of the present application, the cross-sectional dimensions of vapor outgoing conduit 121 and condensed liquid return conduit 141 may range from 10-100 microns. Vapor outgoing conduit 121 and condensed liquid return conduit 141 have a depth in a direction perpendicular to the substrate surface, which may range from 10-100 microns. That is, the cross-sectional size range and depth range of the vapor outgoing conduit 121 and the condensed liquid return conduit 141 may be 10-100 micrometers, the conduit size may be small, and a plurality of conduits may be arranged side by side on the substrate, increasing heat dissipation efficiency. Because the pipe size is small, when the air pressure inside the heat dissipating device is not changed, the cooling liquid in the evaporation chamber 111 does not flow into the condensation chamber 131 through the vapor outgoing pipe 121 due to gravity or the like, and the cooling liquid in the condensation chamber 131 does not flow into the evaporation chamber 111 through the vapor outgoing pipe 121 due to gravity or the like.

In practice, the plurality of vapor outgoing lines 121 and the plurality of condensed liquid return lines 141 may be formed using an isolation structure, a first substrate, and a second substrate. In particular, the width of the isolation structure in a direction parallel to the cross section of the conduit may range from 5 to 20 micrometers.

In practice, the depth of the condensed liquid return line 141 may be less than the depth of the vapor outgoing line 121 so that the cooling liquid in the condensing chamber 131 more easily fills the condensed liquid return line 141.

In an embodiment of the present application, a hydrophilic film layer may be coated inside the condensed liquid return pipe 141 so that the condensed liquid return pipe 141 is more easily filled with the cooling liquid in the condensing chamber 131 by using the hydrophilicity of the hydrophilic film layer. A hydrophobic membrane layer may also be covered inside the vapor outgoing conduit 121 in order to avoid the cooling liquid in the condensation chamber 131 or the evaporation chamber 111 from entering the vapor outgoing conduit 121 by utilizing the hydrophobicity of the hydrophobic membrane layer. Specifically, the hydrophilic film layer may be silicon oxide, and the hydrophobic film layer may be Polytetrafluoroethylene (PTFE) or a fluororesin (perfluor (1-butenyl vinyl ether) polymer, CYTOP).

In the embodiment of the present application, the condensate in the evaporation cavity 111 is not filled in the evaporation cavity 111, and a part of space may be reserved for the evaporation cavity 111 for heating the cooling liquid in the evaporation cavity 111 to form steam.

In practical applications, the condensation chamber 141 may be further provided with a metal layer 180 on one side of the first substrate, where the metal layer 180 occupies a part of the space of the condensation chamber 141, and at this time, the depth of the condensation chamber 141 in the direction perpendicular to the surface of the substrate is smaller than the depth of the evaporation chamber in the direction perpendicular to the surface of the substrate, so that the condensation chamber 141 is more easily filled with condensate, and the evaporation chamber 111 is not filled with condensate, so that a part of the gas space is reserved. Specifically, the material of the metal layer 180 may be copper.

The heat dissipation device of the embodiment of the application is described in detail above, and in addition, the embodiment of the application also provides a manufacturing method of the heat dissipation device.

Referring to fig. 4, a method for manufacturing a heat dissipating device according to an embodiment of the present application may include:

s401, forming an isolation structure 170 on the first substrate 150; the first substrate has an evaporation area 110, a vapor transmission area 120, a condensation area 130, and a liquid reflow area 140.

In an embodiment of the present application, the isolation structure 170 may be formed on the first substrate 150 such that the isolation structure 170 forms the evaporation region 110, the vapor transmission region 120, the condensation region 130, and the liquid reflow region 140 on the first substrate 150. Specifically, the first substrate may be a dielectric substrate, such as a glass substrate. The material of the isolation structure may be a metallic material, for example, metallic copper. The isolation structure may be formed on the first substrate by electroplating or electroless plating.

S402, covering the second substrate 160 above the isolation structure 170, such that the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160 form an evaporation chamber 111 located in the evaporation region 110, a condensation chamber 131 located in the condensation region 130, a vapor outgoing conduit 121 located in the vapor transmission region 120, and a condensed liquid return conduit 141 located in the liquid return region 140, the vapor outgoing conduit 121 having a cross-sectional dimension smaller than that of the condensed liquid return conduit 141.

In an embodiment of the present application, the second substrate 160 may be a metal substrate, the isolation structure 170 may be a metal material, and the second substrate 160 may be covered over the isolation structure 170 using a bonding process so that the isolation structure 170 and the second substrate 160 are in close contact. The vapor outgoing line 121, the condensed liquid return line 141, the evaporation chamber 111, and the condensation chamber 131 may be formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, as shown with reference to fig. 2 and 3. Specifically, when the isolation structures 170 are formed on the first substrate 160, the isolation structures 170 form metal parts spaced apart in the vapor transmission region 120 and the liquid reflux region 140 so that adjacent metal parts form the vapor outgoing conduit 121 and the condensed liquid reflux conduit 141, and the cross section of the formed conduit may have a size ranging from 10 to 100 micrometers, that is, the metal parts may have a spacing ranging from 10 to 100 micrometers. The width of the metal part in a direction parallel to the cross section of the pipe may range from 5 to 20 micrometers.

In an embodiment of the application, the cross-sectional dimension of the vapor outgoing conduit 121 is formed smaller than the cross-sectional dimension of the condensed liquid return conduit 141. The condensed liquid return line 141 serves to supplement the cooling liquid to the evaporation chamber 111 by the vapor in the outgoing evaporation chamber 111 of the vapor outgoing line 121, and thus the cross-sectional size of the vapor outgoing line 121 may be smaller than the cross-sectional size of the condensed liquid return line 141. The smaller cross-sectional dimension of the vapor outgoing conduit 121 than the condensed liquid return conduit 141 also prevents the cooling liquid in the condensing chamber 131 from flowing into the evaporation chamber 111 through the vapor outgoing conduit 121, so that the cooling liquid in the condensing chamber 131 flows into the evaporation chamber 111 through the condensed liquid return conduit 141 more easily.

S403, filling the evaporating chamber 111 and the condensing chamber 131 with a cooling liquid.

In an embodiment of the present application, after the vapor outgoing line 121, the condensed liquid return line 141, the evaporation chamber 111, and the condensation chamber 131 are formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, the evaporation chamber 111 and the condensation chamber 131 may be filled with a cooling liquid so as to realize a self-circulating heat dissipating device using vaporization and liquefaction phenomena of the cooling liquid.

In practical applications, openings may be formed in advance at the positions of the evaporation chamber 111 and the condensation chamber 131 near the boundary, so that the openings are used to fill the cooling liquid into the evaporation chamber 111, the condensation chamber 131, and the condensed liquid return line 141. Specifically, the opening of the condensation chamber 131 is in contact with the liquid pool of the cooling liquid, so that the opening of the condensation chamber 131 is used to fill the cooling liquid into the evaporation chamber 111, the condensation chamber 131 and the condensation liquid backflow pipeline 141, but because the condensation liquid backflow pipeline 141 is relatively small, the condensation liquid backflow pipeline 141 may not be full of the cooling liquid, and at this time, air suction can be performed at the opening of the evaporation chamber 111, so that the cooling liquid is pumped into the condensation liquid backflow pipeline 141 under the pressure change. After the cooling liquid fills the condensation chamber 131 and the condensed liquid return line 141 and the evaporation chamber 111 has a part of the cooling liquid therein, the openings of the evaporation chamber 111 and the condensation chamber 131 are sealed.

In practice, when the opening of the evaporation chamber 111 is pumped, so that the cooling liquid is pumped into the condensed liquid return pipe 141 under pressure change, the cooling liquid may be partially pumped into the vapor outgoing pipe 121, so that the vapor outgoing pipe 121 of the vapor transmission region 120 may be heated, so that the cooling liquid in the vapor outgoing pipe 121 is vaporized and transmitted to the condensation chamber 131.

In an embodiment of the present application, a hydrophilic film layer may be formed inside the condensed liquid returning tube 141 so that the condensed liquid returning tube 141 is more easily filled with the cooling liquid in the condensing chamber 131 by using the hydrophilicity of the hydrophilic film layer. A hydrophobic membrane layer may also be formed inside the vapor outgoing conduit 121 so that the cooling liquid in the condensation chamber 131 or the evaporation chamber 111 is prevented from entering the vapor outgoing conduit 121 by the hydrophobic property of the hydrophobic membrane layer. Specifically, the hydrophilic film layer may be silicon oxide, a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) may be used to form the hydrophilic film layer, the hydrophobic film layer may be Polytetrafluoroethylene (PTFE) or a fluororesin (1-butenyl vinyl ether) polymer, and a spray coating may be used to form the hydrophobic film layer.

As an example, before the second substrate 160 is covered over the isolation structure 170, a hydrophobic film layer and a hydrophilic film layer are formed at the vapor transmission region 120 and the liquid reflow region 140 of the first substrate, respectively.

In practical applications, a metal layer may be formed on a side of the condensation chamber 141 located on the first substrate 150, where the metal layer occupies a part of the space of the condensation chamber 141, and at this time, the depth of the condensation chamber 141 in the direction perpendicular to the substrate surface is smaller than the depth of the evaporation chamber in the direction perpendicular to the substrate surface, so that the condensation chamber 141 is more easily filled with condensate, the evaporation chamber 111 is not filled with condensate, and a part of the gas space is reserved. Specifically, the material of the metal layer may be copper. A metal layer may be formed in the condensation chamber 141 of the first substrate 150 by means of electroplating.

When introducing elements of various embodiments of the present application, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements.

It should be noted that, it will be understood by those skilled in the art that all or part of the above-mentioned method embodiments may be implemented by a computer program to instruct related hardware, where the program may be stored in a computer readable storage medium, and the program may include the above-mentioned method embodiments when executed. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a random-access Memory (Random Access Memory, RAM), or the like.

In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for the method embodiments, since they are substantially similar to the apparatus embodiments, the description is relatively simple, and reference is made to the description of the method embodiments in part.

The foregoing is merely a preferred embodiment of the present application, and the present application has been disclosed in the above description of the preferred embodiment, but is not limited thereto. Any person skilled in the art can make many possible variations and modifications to the technical solution of the present application or modifications to equivalent embodiments using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A heat sink device, comprising: an evaporation zone, a vapor transport zone, a condensation zone, and a liquid reflux zone;

the vapor transfer zone has a vapor outgoing conduit, the liquid return zone has a condensed liquid return conduit, the evaporation zone has an evaporation cavity, and the condensation zone has a condensation cavity; the vapor outgoing conduit, the condensed liquid return conduit, the evaporation chamber, the condensation chamber are formed with a first substrate, a second substrate, and an isolation structure between the first substrate and the second substrate, the vapor outgoing conduit cross-sectional dimension is smaller than the condensed liquid return conduit cross-sectional dimension, a length of the vapor outgoing conduit in a direction perpendicular to the conduit cross-section is smaller than a length of the condensed liquid return conduit in a direction perpendicular to the conduit cross-section, the vapor outgoing conduit and the condensed liquid return conduit are parallel to the first substrate;

the evaporation cavity and the condensation cavity are provided with cooling liquid; and the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is contacted with the part to be cooled, the steam is led into the condensation cavity from the steam outgoing pipeline and liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensation liquid return pipeline under the action of pressure, so that the self-circulation of the cooling liquid is formed.

2. The device of claim 1, wherein the vapor outgoing conduit and/or the condensed liquid return conduit comprises a plurality of side-by-side conduits.

3. The device of claim 1, wherein the first substrate is a dielectric substrate, the second substrate is a metal substrate, and the isolation structure is a metal feature formed on the dielectric substrate.

4. A device according to claim 3, wherein the metal substrate at the evaporation zone is for contact with the component to be heat dissipated.

5. A device according to claim 3, wherein the dielectric substrate is a glass substrate.

6. The device of claim 3, wherein the isolation structure is metallic copper.

7. The device according to any of claims 1-6, characterized in that the cross-sectional dimension of the vapor outgoing conduit and/or the condensed liquid return conduit or the depth in the direction perpendicular to the substrate surface is in the range of 10-100 micrometers.

8. The device of any of claims 1-6, wherein the depth of the condensed liquid return conduit is less in a direction perpendicular to the substrate surface than in a direction perpendicular to the substrate surface.

9. The device of any of claims 1-6, wherein the condensed liquid return conduit is internally covered with a hydrophilic membrane layer and the vapor outgoing conduit is internally covered with a hydrophobic membrane layer.

10. The device of any of claims 1-6, wherein the cooling fluid in the evaporation chamber does not fill the evaporation chamber.

11. The device of any of claims 1-6, wherein the condensation chamber has a metal layer on a side of the first substrate, and wherein a depth of the condensation chamber in a direction perpendicular to the substrate surface is less than a depth of the evaporation chamber in a direction perpendicular to the substrate surface.

12. A method of manufacturing a heat sink device, comprising:

covering a second substrate over the isolation structures such that the first substrate, the second substrate, and the isolation structures between the first substrate and the second substrate form an evaporation cavity located in the evaporation region, a condensation cavity located in the condensation region, a vapor outgoing conduit located in the vapor transmission region, and a condensed liquid return conduit located in the liquid return region, the vapor outgoing conduit cross-sectional dimension being smaller than the condensed liquid return conduit cross-sectional dimension, a length of the vapor outgoing conduit in a direction perpendicular to the conduit cross-section being smaller than a length of the condensed liquid return conduit in a direction perpendicular to the conduit cross-section, the vapor outgoing conduit and the condensed liquid return conduit being parallel to the first substrate;

13. The method of claim 12, wherein the evaporation chamber and the condensation chamber are formed with openings after covering a second substrate over the isolation structure;

the method further comprises the steps of:

14. The method of claim 13, wherein the method further comprises:

15. The method according to any one of claims 12-14, further comprising:

16. The method according to any one of claims 12-14, further comprising: