CN114599201B - Micro-spray phase change liquid cooling vapor chamber for server, heat dissipation operation system and control method - Google Patents
Micro-spray phase change liquid cooling vapor chamber for server, heat dissipation operation system and control method Download PDFInfo
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- CN114599201B CN114599201B CN202210094752.3A CN202210094752A CN114599201B CN 114599201 B CN114599201 B CN 114599201B CN 202210094752 A CN202210094752 A CN 202210094752A CN 114599201 B CN114599201 B CN 114599201B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20345—Sprayers; Atomizers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The invention discloses a micro-spraying phase change liquid cooling soaking plate for a server, a heat dissipation operation system and a control method, wherein the micro-spraying phase change liquid cooling soaking plate comprises a micro-spraying liquid cooling module and a soaking plate body; the micro-spray liquid cooling module comprises an upper cover plate, a spray plate, a condensing plate, a liquid inlet pipeline, an air inlet pipeline and a fluid outlet pipeline, wherein the upper cover plate, the spray plate and the condensing plate are sequentially stacked; the vapor chamber body comprises a condensing plate, a liquid absorption core, an evaporating plate and a liquid injection pipeline; the invention adopts the array spraying holes, reduces the spraying height and reduces the volume of the micro-spraying cooling module on the premise of ensuring the spraying efficiency so as to adapt to the heat dissipation requirements of a CPU or other chips with high heat flow density in a narrow space of a server.
Description
Technical Field
The invention relates to the technical field of server chip heat dissipation, in particular to a micro-spray phase change liquid cooling soaking plate for a server, a heat dissipation operation system and a control method.
Background
In recent years, the number and scale of global data centers are rapidly increasing, and the number of high-density server devices in a computer room is increasing, and the number of built-in CPU chips or other heat generating chips is increasing exponentially in the direction of miniaturization, high frequency and high power density, so that the heat generation amount is increasing rapidly.
For a server micro chip with high heat flux density, a liquid cooling heat dissipation mode gradually becomes a mainstream heat dissipation means, but a direct liquid cooling mode is easy to cause cold leakage and cause the risk of short circuit of a printed circuit, so that the liquid cooling heat dissipation is often combined with other heat transfer components. The soaking plate is a heat transfer component with excellent performance and has the characteristics of small heat loss, high efficiency and quick response. The combination of heat dissipation modules such as liquid cooling plates and the like outside the vapor chamber condensation plate is a common heat dissipation combination method. In a high heat flow density environment, the combination of micro-jet single-phase liquid cooling and a soaking plate can often obtain excellent heat dissipation performance, but the mode still has the following defects: on one hand, the cooling liquid in the spraying cavity is unevenly pressed, so that heating hot spots are generated due to uneven spraying; on the other hand, cooling liquid is easy to accumulate in the injection cavity, so that a circulating dead angle is caused.
Disclosure of Invention
In order to overcome the defects and shortcomings of the prior art, the invention provides the micro-spray phase change liquid cooling vapor chamber for the server.
A second object of the present invention is to provide a heat dissipation operation system for a server.
A third object of the present invention is to provide a method for controlling a radiating operation of a server.
The first purpose of the invention adopts the following technical scheme:
a micro-spray phase change liquid cooling vapor chamber for a server is arranged on the upper part of a heating chip of the server and comprises a micro-spray liquid cooling module, a vapor chamber body, an air inlet pipeline, a liquid inlet pipeline and a fluid outlet pipeline;
the micro-spray liquid cooling module comprises an upper cover plate, a spray plate and a condensing plate which are sequentially stacked;
the micro-spray liquid cooling module comprises an upper cover plate, a spray plate and a condensing plate which are sequentially stacked; the upper cover plate is provided with a gas medium inlet and a fluid medium outlet; the gas medium inlet is communicated with a gas inlet pipeline, and the fluid medium outlet is communicated with a fluid outlet pipeline;
the spray plate comprises a liquid medium inlet, a liquid cavity, an array of spray holes, a gas cavity and a fluid medium outlet; the liquid medium inlet is respectively communicated with the liquid inlet pipeline and the liquid cavity to form a channel for conveying liquid cooling medium; the liquid cavity is used for temporarily storing a liquid cooling medium and is also a place for preliminarily mixing the liquid cooling medium and high-pressure air; the array spray holes are communicated with the liquid cavity and are channels for fully mixing gas-liquid two-phase media, and the gas cavity is communicated with the gas medium inlet and is used for containing high-pressure air; the fluid medium outlet of the spraying plate is correspondingly communicated with the fluid medium outlet of the upper cover plate in the up-down position;
the condensing plate comprises a spray cavity and a flow collecting cavity, the spray cavity is used for providing sufficient space for atomization of fine liquid drop groups, the bottom of the spray cavity is used for receiving spray impact, and the flow collecting cavity is communicated with a fluid medium outlet on the spray plate up and down.
Further, the distance between the array spray holes and the spray chamber is calculated as follows:
the relation between the theoretical spray height H of a single spray hole in the array spray holes, the theoretical spray circle diameter D and the spray cone angle theta is set as follows: h =0.5D/tan (θ/2);
when the area of the spraying cavity covers the heated surface of the spraying cavity, the spraying cooling efficiency is optimal, and therefore the length L and the width W of the spraying cavity are used as the boundaries of the array spraying area;
the spraying area of the whole array is calculated by using a single spraying circle, under the condition of the same nozzle inlet pressure, the diameter of the spraying circle generated on the ground of the spraying cavity by adopting the 7 multiplied by 6 array spraying hole layout needs to meet the requirements that D is larger than L/6 and D is larger than W/7 at the same time, the minimum critical spraying height value of a spraying space is obtained, a condensation plate structure is determined, the vertical distance from the bottom end of an outlet of the array spraying hole to the bottom surface of the spraying cavity is larger than the obtained minimum critical spraying height value, and the sufficient space for atomizing the liquid cooling medium is ensured.
Furthermore, the sectional area of the array spraying hole is reduced from top to bottom and then is increased.
Further, the closer the distance between the spray plate and the condensation plate is, the larger the number of holes of the array spray holes is or the smaller the hole diameter is.
Further, the inner surfaces of the spray cavity and the flow collecting cavity are provided with a three-dimensional complex surface structure, and the three-dimensional complex surface structure comprises a micro-channel array or a micro-turbulence column array.
Further, in the present invention,
the vapor chamber body comprises a condensing plate, a liquid absorption core, an evaporation plate and a liquid inlet degassing pipeline; the liquid absorption cores are provided with Y-shaped grooves and are respectively sintered on the bottom surfaces of the vacuum cavities of the evaporation plates and the lower surfaces of the condensation plates at corresponding positions.
The evaporating plate is provided with a Y-shaped supporting column, a vacuum cavity and a liquid inlet degassing hole for injecting liquid phase change working medium and pumping the vacuum cavity into a low pressure state or a vacuum state, the Y-shaped supporting column is processed by integrally forming the evaporating plate, and the liquid inlet degassing hole is communicated with a liquid inlet degassing pipeline.
The second purpose of the invention adopts the following technical scheme:
a heat dissipation operation system composed of micro-spray phase change liquid cooling soaking plates for servers comprises a micro-spray phase change liquid cooling soaking plate, a gas flow loop and a liquid cooling circulation loop,
further, the liquid cooling circulation system comprises a liquid heat exchange circulation loop through which a liquid cooling medium flows, and the liquid heat exchange circulation loop comprises a liquid storage tank, a gear pump, a filter, a plate heat exchanger, a control needle valve, a liquid flowmeter, a pressure transmitter and a temperature sensor;
and the liquid cooling medium flows back to the liquid storage tank through the bypass valve after flowing out of the filter.
Furthermore, the gas medium in the gas flow loop is non-condensable air and is used for assisting the liquid cooling medium entering the micro-spray phase-change liquid cooling soaking plate to realize atomization.
The third purpose of the invention adopts the following technical scheme:
a control method of a heat dissipation operation system comprises the following steps:
when the server operates, after an evaporation plate of the micro-spray phase-change liquid cooling vapor chamber which is in contact with the heating chip is heated, a liquid working medium in a vacuum chamber of the vapor chamber is heated and evaporated to fill the whole vacuum chamber, and the evaporated gas is condensed into a liquid state when meeting a condensing plate with a lower temperature and releases heat energy; at the moment, air in the environment is continuously compressed by an air compressor and then enters an air storage tank to form high-pressure gas, and the high-pressure gas is conveyed into a micro-spray phase change liquid cooling soaking plate through a pipeline to provide high-pressure gas conditions for atomizing a liquid cooling medium;
meanwhile, liquid cooling media participating in heat exchange circulation are conveyed into the micro-spray phase-change liquid cooling soaking plate through a gear pump, after high-pressure air is met in the array spray holes, the liquid cooling media are crushed into fine liquid drop groups under the action of high pressure and are quickly sprayed into the spray cavities filled with low-speed flowing or static air from the tail ends of the array spray holes, the fine liquid drop groups are gradually converted into fog-shaped fine groups through dropping, smooth flow and wave-shaped flow under the mutual action of liquid surface tension, viscosity and air resistance and impact on the inner surface of the spray cavities, and heat of the server chip is taken away through the soaking plate through spray impact and liquid drop phase change; and the gas-liquid two-phase medium after heat exchange enters a gas-liquid separation device, the separated high-pressure air is directly discharged to the environment to be cooled, and the liquid cooling medium enters a heat exchanger to be cooled and then flows back to the liquid storage tank, so that the circulation is performed.
The invention has the beneficial effects that:
(1) The invention adopts air as non-condensable high-pressure gas, has the advantages of easy acquisition and no need of additional device for collection after separation, and uses the high-pressure air to assist the liquid cooling medium to realize atomization, so that the generated spray is more uniform, the spray impact is intensified, and the cooling effect is better;
(2) The invention adopts the array spraying holes, reduces the spraying height and reduces the volume of the micro-spraying cooling module on the premise of ensuring the spraying efficiency so as to adapt to the heat dissipation requirements of a CPU or other chips with high heat flow density in a narrow space of a server;
(3) The invention combines the vapor chamber technology capable of rapidly and uniformly conducting heat with spray impact cooling with high heat exchange coefficient, not only effectively solves the problem of local hot spots caused by uneven heating on the surface of a server chip, but also greatly improves the heat dissipation efficiency and performance of the micro-spray phase-change liquid cooling vapor chamber.
Drawings
FIG. 1 is a schematic structural diagram of a micro-spray phase change liquid cooling vapor chamber heat dissipation operation system for a server;
FIG. 2 is a schematic structural view of the micro-spray phase change liquid cooling soaking plate of the present invention;
FIG. 3 is a schematic cross-sectional view of a micro-spray phase change liquid cooled vapor chamber of the present invention;
FIG. 4 is a schematic illustration of a theoretical spray pattern of a single spray orifice of the present invention;
fig. 5 is a schematic diagram of the critical situation of the array of the invention with the spray circles tangent at the bottom of the spray chamber.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
Examples
As shown in fig. 1, a heat dissipation operation system of a micro-spray phase-change liquid cooling vapor chamber for a server comprises a micro-spray phase-change liquid cooling vapor chamber 1, a gas flow loop 2 and a liquid cooling circulation loop 3; the micro-spraying phase change liquid cooling soaking plate 1 is arranged on the upper part of a heating chip of a server, and the contact surface is uniformly coated with heat-conducting silicone grease, and comprises a micro-spraying liquid cooling module 11, a soaking plate body 12, an air inlet pipeline 13, an air inlet pipeline 14 and a fluid outlet pipeline 15; the air inlet pipeline 13, the liquid inlet pipeline 14 and the fluid outlet pipeline 15 can be arranged on the same side or different sides of the micro-spray phase-change liquid cooling soaking plate 1 according to requirements and can be arranged in parallel or vertically.
As shown in fig. 2 and 3, the micro-spray liquid cooling module 11 includes an upper cover plate 111, a spray plate 112, and a condensation plate 113, which are sequentially stacked.
The upper cover plate 111 is provided with a gas medium inlet 1111 and a fluid medium outlet 1112, wherein the gas medium inlet 1111 is communicated with the gas inlet pipeline 13, and the fluid medium outlet 1112 is communicated with the fluid outlet pipeline 15.
The spray plate 112 comprises a liquid medium inlet 1121, a liquid chamber 1122, an array of spray holes 1123, a gas chamber 1124 and a fluid medium outlet 1125; the liquid medium inlet 1121 is respectively communicated with the liquid inlet pipeline 14 and the liquid cavity 1122 to form a channel for conveying a liquid cooling medium; the liquid chamber 1122 is used for temporarily storing a liquid cooling medium, which is also a place where the liquid cooling medium is primarily mixed with high-pressure air; the array spray holes 1123 are communicated with the liquid cavity 1122, the sectional area of the array spray holes is firstly reduced and then increased from top to bottom, and the array spray holes are passages for fully mixing gas-liquid two-phase media and are also a necessary condition for forming fine liquid drop groups by early atomizing liquid cooling media; the gas cavity 1124 is communicated with the gas medium inlet 1111 and is used for containing high-pressure air; continuous high-pressure air enters the gas cavity 1124 from the gas inlet pipe 13 and the gas medium inlet 1111 and is rapidly pressed into the array spraying holes 1123, the gas speed is increased and the pressure is reduced along with the gradual reduction of the sectional area of the array spraying holes 1123, so that a low-pressure area is formed, at the moment, the liquid cooling medium entering the liquid cavity 1122 through the liquid inlet pipe 14 and the liquid medium inlet 1121 is sucked into the array spraying holes 1123 of the formed low-pressure area, the gas and the liquid are partially mixed on the array spraying holes 1123, the sectional area of the lower part of the array spraying holes 1123 is gradually increased along the speed direction of the gas-liquid mixed medium, so that the gas flow speed is gradually reduced and the pressure is gradually increased, and under the action of the high gas pressure, the liquid cooling medium is crushed into fine liquid drop groups and is rapidly ejected from the tail ends of the array spraying holes 1123; the fluid medium outlet 1125 is in communication with the fluid medium outlet 1112 of the upper cover plate 111 at a corresponding upper and lower position.
The condensing plate 113 includes a spray chamber 1131 and a manifold chamber 1132; the spray cavity 1131 provides sufficient space for atomization of the fine droplet clusters, and the bottom of the spray cavity 1131 is the main position for receiving the impact of the spray; the manifold 1132 is communicated with the fluid medium outlet 1125 on the spray plate 112 up and down, the manifold 1132 is a position where the gas-liquid mixed fluid medium is merged, and the fluid medium is discharged through the fluid medium outlets 1125 and 1112 and the fluid medium outlet 15 after being merged in the manifold 1132.
Further, spray cooling efficiency is best when the spray area covers the entire heated surface of the spray cavity 1131. The spray coverage area is related to the spray cone angle and spray height, and the same series of identically configured arrays of spray holes 1123 produce a spray cone angle that is affected by the inlet flow rate and system pressure, so the optimum spray height also varies. The theoretical spray pattern of a single spray hole 1123 is shown in fig. 4, where the theoretical spray height H is related to the theoretical spray circle diameter D and the spray cone angle θ by: h =0.5D/tan (θ/2). The calculation of the spray height H is described by adopting a 7 × 6 array layout in this case, the bottom surface of the spray cavity 1131 is rectangular and is in borderless communication with the manifold 1132, and the area of the spray cavity 1131 covers the area of the vapor chamber vacuum cavity 1221 (the main heat transfer area of the vapor chamber body 12), so that when the height of the spray cavity 1131 is designed, the area of the whole array spray is calculated by adopting the theoretical area of a single spray circle by taking the length L and the width W of the spray cavity 1131 as the boundary of the array spray area, so that the spray cavity 1131 covers the bottom surface as much as possible. The critical situation of the array spray circle tangent to the bottom surface of the spray cavity 1131 is as shown in fig. 5, and the minimum spray height needs to be greater than the theoretical spray height H calculated at this time, so as to ensure that the array spray circles intersect and overlap, thereby covering the area of the bottom surface of the spray cavity 1131 as much as possible, and with the structure of the array spray holes 1123, under the same nozzle inlet pressure condition, the diameter D of the spray circle needs to satisfy at the same time: d > L/6 and D > W/7. Substituting into a formula: h =0.5D/tan (θ/2), the minimum critical spray height value of the spray space can be calculated. Therefore, the vertical distance from the bottom end of the outlet of the array of spray holes 1123 to the bottom surface of the spray cavity 1131 needs to be greater than the calculated theoretical height hMIN critical spray height value to ensure sufficient space for atomization of the liquid cooling medium.
The condensation plate 113 is one of the components of the micro-spray liquid cooling module 11 and one of the components of the vapor chamber body 12, and has the functions of storing the spray cooling medium and liquefying the gas working medium in the vapor chamber.
The vapor chamber body 12 is used as a phase change element for transferring heat of the heating chip of the server to the micro-spray liquid cooling module 11, can realize rapid and uniform heat conduction, and comprises a condensation plate 113, a liquid absorption core 121, an evaporation plate 122 and a liquid inlet and degassing pipeline 123.
The liquid suction core 121 is provided with a Y-shaped groove for accommodating the Y-shaped supporting column 1221 and providing a capillary action for the evaporation rise and the liquid cooling reflux of the liquid phase change working medium in the vacuum cavity 1222; the wicks 121 are sintered to the bottom surface of the vacuum chamber 1222 of the evaporation plate 122 and to the lower surface of the condensation plate 113 at corresponding locations, respectively.
The evaporation plate 122 is provided with a Y-shaped support column 1221, a vacuum cavity 1222 and a liquid inlet and air outlet 1223 for injecting liquid phase-change working medium and pumping the vacuum cavity 1222 to a low pressure or vacuum state; the liquid inlet degassing hole 1223 is communicated with the liquid inlet degassing pipeline 123; the Y-shaped supporting column 1221 is integrally formed with the evaporation plate 122 and is positioned in the vacuum chamber 1221 to support the vapor chamber body assembly 12 and prevent the vacuum chamber 1221 from collapsing due to cooling, and can also be used as an auxiliary flow channel for backflow of the liquid phase change working medium in the vapor chamber body 12.
As shown in fig. 1, the gas flow circuit 2 includes an air compressor 21, a gas storage tank 22, a control needle valve 23, a gas flow meter 24, a pressure transmitter 25, a pressure transmitter 28, a temperature sensor 26, a temperature sensor 27, and a gas-liquid separation device 29; the gas medium in the gas flow loop 2 is non-condensable air, has the advantages of easy acquisition and direct discharge to the atmosphere without collection after separation, and has the main function of assisting the liquid cooling medium entering the micro-spray phase-change liquid cooling soaking plate 1 to realize atomization; the air compressor 21 is used for compressing air in the environment, increasing air pressure, and the compressed air enters the air storage tank 22; the control valve 23 and the gas flowmeter 24 are used for adjusting and measuring the volume flow of air in the gas flow loop, so as to control the gas pressure in the loop; the pressure transmitter 25 and the temperature sensor 26 are respectively used for monitoring the gas pressure value and the temperature value at the gas inlet pipeline 13; the pressure transmitter 28 and the temperature sensor 27 are respectively used for monitoring the pressure value and the temperature value of the gas-liquid mixed medium at the fluid outlet pipeline 15; the gas-liquid separation device 29 is used for separating the gas-liquid two-phase medium after heat exchange, the separated air can be directly discharged into the atmosphere, and the separated liquid returns to the liquid circulation loop 3 again.
As shown in fig. 1, the liquid cooling circulation system 3 includes a liquid heat exchange circulation loop through which a liquid cooling medium sequentially flows, the liquid heat exchange circulation loop being composed of a liquid storage tank 31, a gear pump 32, a filter 33, a plate heat exchanger 34, a control needle valve 35, a liquid flow meter 36, a pressure transmitter 37, and a temperature sensor 38, and a liquid pressure relief circulation loop through which the liquid cooling medium flows back to the liquid storage tank 31 through a bypass valve after passing through the liquid storage tank 31, the gear pump 32, and the filter 33; the liquid storage tank 31 is used for storing and recovering a liquid cooling medium; the gear pump 32 is used for pumping the liquid cooling medium in the liquid storage tank 31; the filter 33 is used for filtering the mixed impurities in the liquid cooling medium after the circulation for many times; the plate heat exchanger 34 is used for cooling the heated liquid after participating in heat exchange and can also preheat the liquid cooling medium entering the micro-spray phase-change liquid cooling vapor chamber 1; the control needle valve 35 and the liquid flow meter 36 are used for adjusting and monitoring the liquid flow; the pressure transmitter 37 and the temperature sensor 38 are respectively used for monitoring the pressure value and the temperature value at the liquid inlet pipe 112.
The working process of the embodiment is as follows:
when the server operates, after the micro-spray phase-change liquid cooling vapor chamber 1 evaporation plate 122 which is in contact with the heating chip is heated, the liquid phase-change working medium in the vapor chamber 1222 is heated and evaporated and quickly fills the whole vacuum chamber 1222, and the evaporated gas is condensed into a liquid state and releases heat energy after meeting the condensing plate 113 with lower temperature; at the moment, air in the environment is continuously compressed by an air compressor 21 and then enters an air storage tank 22 to form high-pressure air, the volume flow of the air in the loop is adjusted to a volume flow preset value obtained by reading of an air flow meter 24 by adjusting an air flow meter 23, the high-pressure air is conveyed through a pipeline and enters the micro-spray phase-change liquid cooling soaking plate 1 through an air inlet pipeline 13, and the air pressure value and the air temperature value at the air inlet pipeline 13 are read by a pressure transmitter 25 and a temperature sensor 26; meanwhile, the liquid cooling medium in the liquid storage tank 31 is conveyed by the gear pump 32, after passing through the filter 33, a part of the liquid cooling medium is conveyed to a liquid circulation loop participating in heat exchange, and the liquid flows through the plate type heat exchanger 34 before entering the micro-spray phase-change liquid cooling vapor chamber 1, and the liquid is preheated therein; the liquid flow in the liquid circulation loop is adjusted by controlling the needle valve 35, so that the flow in the liquid circulation loop reaches a preset value and then flows into the micro-spray phase-change liquid-cooling soaking plate 1 through the liquid inlet pipeline 14, and the liquid flow, the pressure and the temperature value at the liquid inlet pipeline 14 can be respectively obtained by reading through the liquid flowmeter 36, the pressure transmitter 37 and the temperature sensor 38; the other part is sent to the liquid pressure relief circulation loop and flows back to the reservoir 31 through a bypass valve 39 to prevent the gear pump 32 from burning out when the liquid flow in the liquid cooling circulation system 3 is small.
The high pressure gas entering from the gas medium inlet 13 fills the gas chamber 1124 rapidly, the gas medium is high pressure and continuous, and flows into the array spray holes 1123 with the cross-sectional area decreasing from top to bottom and then increasing, the gas accelerates and decelerates first, so the gas pressure decreases and then increases gradually, a low pressure region is formed at the minimum of the cross-sectional area of the array spray holes 1123, at this time, the liquid cooling medium entering the liquid chamber 1122 through the liquid inlet pipe 14 and the liquid medium inlet 1121 is sucked into the array spray holes 1123 of the formed low pressure region, the gas and the liquid are mixed in the upper portion of the array spray holes 1123, at the lower portion of the array spray holes 1123, because the cross-sectional area thereof increases gradually along the gas-liquid mixed medium speed direction, so under the high pressure of the gas, the liquid cooling medium is broken into fine droplet clusters and is ejected from the end of the array spray holes 1123 into the spray chamber 1131 filled with low speed or static air rapidly, under the interaction of the liquid surface tension, viscosity and air resistance, the liquid drops are gradually carried away by the drop falling, smooth flow, changed into fine clusters and impact to the fine liquid spray clusters and impact the inner surface of the liquid condensation plate 1131, and the liquid condensation plate is heated liquid condensation plate, and the liquid is heated and the liquid vapor-cooling medium evaporates, and the liquid drops are returned to the vapor-liquid condensation plate 113, and the vapor-liquid condensation plate, and the vapor-condensation plate, thereby the vapor-condensation plate is heated liquid condensation plate. After the gas-liquid mixed medium subjected to heat exchange in the micro-spray phase-change liquid-cooling soaking plate 1 is collected in the collecting cavity 1132, the collected gas-liquid mixed medium is discharged to the gas-liquid separating device 29 through the fluid medium outlets 1125 and 1112 and the fluid outlet pipeline 15 for separation, the separated high-pressure air is directly discharged to the environment to be cooled, and the liquid cooling medium flows back to the liquid storage tank 31 after being cooled in the plate heat exchanger 34 to participate in the next heat exchange. The heat dissipation of the heating chip of the server is completed in the continuous repetition of the phase change heat transfer of the soaking plate body 12 and the continuous circulation process of the external gas and liquid of the server.
The above-mentioned embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and they are intended to be included in the scope of the present invention.
Claims (9)
1. A micro-spray phase change liquid cooling vapor chamber for a server is arranged on the upper part of a heating chip of the server and is characterized by comprising a micro-spray liquid cooling module, a vapor chamber body, an air inlet pipeline, a liquid inlet pipeline and a fluid outlet pipeline;
the micro-spray liquid cooling module comprises an upper cover plate, a spray plate and a condensing plate which are sequentially stacked; the upper cover plate is provided with a gas medium inlet and a fluid medium outlet; the gaseous medium inlet is communicated with the gas inlet pipeline, and the fluid medium outlet is communicated with the fluid outlet pipeline;
the spray plate comprises a liquid medium inlet, a liquid cavity, an array of spray holes, a gas cavity and a fluid medium outlet; the liquid medium inlet is respectively communicated with the liquid inlet pipeline and the liquid cavity, the array spraying holes are communicated with the liquid cavity, and the gas cavity is communicated with the gas medium inlet; the fluid medium outlet of the spraying plate is correspondingly communicated with the upper and lower positions of the fluid medium outlet of the upper cover plate;
the condensation plate comprises a spray cavity and a flow collecting cavity, the spray cavity is used for providing a space for atomizing fine liquid drop groups, the bottom of the spray cavity is used for receiving spray impact, and the flow collecting cavity is communicated with a fluid medium outlet on the spray plate up and down;
the distance between the array spray holes and the spray chamber is calculated as follows:
in the array of spray holes, the relation between the theoretical spray height H of a single spray hole and the theoretical spray circle diameter D and the spray cone angle theta is as follows: h =0.5D/tan (θ/2);
when the area of the spraying cavity covers the heated surface of the spraying cavity, the spraying cooling efficiency is optimal, and therefore the length L and the width W of the spraying cavity are used as the boundaries of the array spraying area;
the spray area of the whole array is calculated by using a single spray circle, under the condition of the same nozzle inlet pressure, the diameter of the spray circle generated on the ground of the spray cavity by adopting the 7 multiplied by 6 array spray hole layout needs to simultaneously meet the requirement that D is larger than L/6 and D is larger than W/7 to obtain the minimum critical spray height value of the spray space, so that the structure of the condensation plate is determined, the vertical distance from the bottom end of the outlet of the array spray hole to the bottom surface of the spray cavity is larger than the obtained minimum critical spray height value, and the sufficient space for atomizing the liquid cooling medium is ensured.
2. The micro-spray phase-change liquid-cooled soaking plate for servers according to claim 1, wherein the cross-sectional area of the array of spray holes is reduced from top to bottom and then increased.
3. A micro-spray phase change liquid cold soaking plate for server according to any one of claims 1-2, wherein the closer the distance between the spraying plate and the condensing plate, the larger the number of holes of the array spraying holes or the smaller the hole diameter.
4. The micro-spray phase-change liquid cooling vapor chamber for the server as claimed in claim 1, wherein the inner surfaces of the spray chamber and the current collecting chamber are provided with a three-dimensional complex surface structure, and the three-dimensional complex surface structure comprises a micro-channel array or a micro-turbulence column array.
5. The micro-spray phase change liquid cold soaking plate for server in claim 1,
the vapor chamber body comprises a condensing plate, a liquid absorption core, an evaporation plate and a liquid inlet degassing pipeline; the liquid absorption cores are provided with Y-shaped grooves and are respectively sintered on the bottom surfaces of the vacuum cavities of the evaporation plates and the lower surfaces of the condensation plates at corresponding positions;
the evaporating plate is equipped with Y shape support column, vacuum cavity and is used for injecting into liquid phase transition working medium and taking out the feed liquor degasification hole of becoming low pressure or vacuum state with the vacuum cavity, Y shape support column is processed with evaporating plate integrated into one piece, the feed liquor degasification hole is linked together with feed liquor degasification pipeline.
6. A heat sink operating system comprising the micro-spray phase change liquid thermal spreader of any of claims 1-5, a gas flow loop, and a liquid cooling circulation loop.
7. The heat dissipation operation system according to claim 6, wherein the liquid cooling circulation system comprises a liquid heat exchange circulation loop through which a liquid cooling medium flows, and the liquid heat exchange circulation loop comprises a liquid storage tank, a gear pump, a filter, a plate heat exchanger, a control needle valve, a liquid flow meter, a pressure transmitter and a temperature sensor;
and the liquid cooling medium flows out of the filter and then flows back to the liquid storage tank through the bypass valve in the liquid pressure relief circulation loop.
8. The heat dissipation operation system of claim 6, wherein the gas medium in the gas flow loop is non-condensable air, and is used for assisting in atomizing the liquid cooling medium entering the micro-spray phase-change liquid cooling soaking plate.
9. A control method of the cooling operation system according to any one of claims 6 to 8, comprising:
when the server operates, after an evaporation plate of the micro-spray phase-change liquid cooling vapor chamber which is in contact with the heating chip is heated, a liquid working medium in a vacuum chamber of the vapor chamber is heated and evaporated to fill the whole vacuum chamber, and the evaporated gas is condensed into a liquid state when meeting a condensing plate with a lower temperature and releases heat energy; at the moment, air in the environment is continuously compressed by an air compressor and then enters an air storage tank to form high-pressure gas, and the high-pressure gas is conveyed into a micro-spray phase change liquid cooling soaking plate through a pipeline to provide high-pressure gas conditions for atomizing a liquid cooling medium;
meanwhile, liquid cooling media participating in heat exchange circulation are conveyed into the micro-spray phase-change liquid cooling soaking plate through a gear pump, after high-pressure air is met in the array spray holes, the liquid cooling media are crushed into fine liquid drop groups under the action of high pressure and are quickly sprayed into the spray cavities filled with low-speed flowing or static air from the tail ends of the array spray holes, the fine liquid drop groups are gradually converted into fog-shaped fine groups through dropping, smooth flow and wave-shaped flow under the mutual action of liquid surface tension, viscosity and air resistance and impact on the inner surface of the spray cavities, and heat of the server chip is taken away through the soaking plate through spray impact and liquid drop phase change; and the gas-liquid two-phase medium after heat exchange enters a gas-liquid separation device, the separated high-pressure air is directly discharged to the environment to be cooled, and the liquid cooling medium flows back to the liquid storage tank after entering the heat exchanger to be cooled, so that the circulation is carried out.
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