CN113133283A - Heat dissipation device and manufacturing method thereof - Google Patents
Heat dissipation device and manufacturing method thereof Download PDFInfo
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- CN113133283A CN113133283A CN202110395385.6A CN202110395385A CN113133283A CN 113133283 A CN113133283 A CN 113133283A CN 202110395385 A CN202110395385 A CN 202110395385A CN 113133283 A CN113133283 A CN 113133283A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
- H01S5/187—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL] using Bragg reflection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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Abstract
The application provides a heat dissipation device and manufacturing method thereof, treat heat dissipation part and evaporation zone contact, the coolant liquid in the evaporation intracavity is heated the vaporization and forms steam, the condensation intracavity liquefaction that transmits to the condensation zone through steam spreads the pipeline and is liquid, the evaporation chamber is because liquid reduces and gaseous spreads, atmospheric pressure reduces, the coolant liquid in the condensation intracavity flows to the evaporation chamber through condensation liquid backflow pipeline under the pressure effect, realizes the self-loopa of the inside coolant liquid of heat dissipation device. Therefore, the circulating heat dissipation of the liquid is realized through the air pressure change, the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary pipeline in the vapor chamber, and compared with the capillary pipeline, the condensed liquid backflow pipeline and the vapor outgoing pipeline in the embodiment of the application can have larger sizes, and the manufacturing process cost is reduced.
Description
Technical Field
The invention relates to the field of device manufacturing, in particular to a heat dissipation device and a manufacturing method thereof.
Background
In today's society, the development of electronic devices is increasing rapidly. Whether the electronic device has good heat dissipation performance or not is one of the core focuses of users in the use process of the electronic device. The existing heat dissipation technology of electronic equipment mainly utilizes graphite heat sinks or vapor chambers to dissipate heat. Although the heat spreader plate has a higher heat dissipation efficiency than the graphite heat sink, the manufacturing cost of the heat spreader plate is also high.
Therefore, there is an urgent need for a heat dissipation device with lower manufacturing cost.
Disclosure of Invention
In view of the above, the present application is directed to a heat dissipation device and a method for manufacturing the same.
An embodiment of the present application provides a heat dissipation device, including: an evaporation zone, a vapor transfer zone, a condensation zone, and a liquid reflux zone;
the vapor transfer zone having a vapor exit conduit, the liquid return zone having a condensed liquid return conduit, the evaporation zone having an evaporation chamber, the condensation zone having a condensation chamber; the vapor outlet pipe, the condensed liquid return pipe, the evaporation cavity and the condensation cavity are formed by utilizing a first substrate, a second substrate and an isolation structure between the first substrate and the second substrate, and the cross-sectional dimension of the vapor outlet pipe is smaller than that of the condensed liquid return pipe;
the evaporation cavity and the condensation cavity are provided with cooling liquid; the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is contacted with a part to be cooled, the steam is introduced into the condensation cavity from the steam outlet pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensed liquid return pipeline to form self-circulation of the cooling liquid.
Optionally, the vapor outlet conduit and/or the condensed liquid return conduit comprises a plurality of side-by-side conduits.
Optionally, the first substrate is a dielectric substrate, the second substrate is a metal substrate, and the isolation structure is a metal component formed on the dielectric substrate.
Optionally, the metal substrate located in the evaporation area is used for contacting with the component to be radiated.
Optionally, the dielectric substrate is a glass substrate.
Optionally, the isolation structure is copper.
Optionally, the length of the vapor outlet conduit in a direction perpendicular to the conduit cross-section is less than the length of the condensed liquid return conduit in a direction perpendicular to the conduit cross-section.
Optionally, the vapor outlet conduit and/or the condensed liquid return conduit have a cross-sectional dimension or depth in a direction perpendicular to the surface of the substrate in a range of 10 to 100 microns.
Optionally, the depth of the condensed liquid return conduit in the direction perpendicular to the substrate surface is smaller than the depth of the vapor outlet conduit in the direction perpendicular to the substrate surface.
Optionally, a hydrophilic membrane layer covers the inside of the condensed liquid return pipeline, and a hydrophobic membrane layer covers the inside of the steam outlet pipeline.
Optionally, the evaporation cavity is not filled with the cooling liquid in the evaporation cavity.
Optionally, the condensation chamber is provided with a metal layer on one side of the first substrate, and a depth of the condensation chamber in a direction perpendicular to the substrate surface is smaller than a depth of the evaporation chamber in a direction perpendicular to the substrate surface.
The embodiment of the present application further provides a method for manufacturing a heat dissipation device, including:
forming an isolation structure on a first substrate; the first substrate having an evaporation region, a vapor transfer region, a condensation region, and a liquid return region;
covering a second substrate over the isolation structure such that the first substrate, the second substrate, and the isolation structure between the first substrate and the second substrate form an evaporation chamber at the evaporation region, a condensation chamber at the condensation region, a vapor exit conduit at the vapor delivery region, and a condensed liquid return conduit at the liquid return region, the vapor exit conduit having a smaller cross-sectional dimension than the condensed liquid return conduit;
and filling cooling liquid into the evaporation cavity and the condensation cavity.
Optionally, after covering the second substrate over the isolation structure, the evaporation cavity and the condensation cavity are formed with openings;
the to fill coolant liquid in evaporation chamber with the condensation chamber includes:
filling the cooling liquid into the evaporation cavity and the condensation cavity through the opening of the condensation cavity;
the method further comprises the following steps:
and filling the cooling liquid into the condensed liquid return pipeline through the opening of the condensation cavity, and sealing the openings of the evaporation cavity and the condensation cavity.
Optionally, the method further includes:
heating the vapor outlet conduit of the vapor transfer region to vaporize the coolant liquid within the vapor outlet conduit and transfer to the condensing chamber.
Optionally, the method further includes:
and a hydrophilic membrane layer is formed inside the condensed liquid return pipeline, and a hydrophobic membrane layer is formed inside the steam outlet pipeline.
Optionally, the method further includes:
and forming a metal layer on one side of the first substrate of the condensation cavity.
Optionally, the vapor outlet conduit and/or the condensed liquid return conduit comprises a plurality of side-by-side conduits.
Optionally, the first substrate is a dielectric substrate, the second substrate is a metal substrate, and the isolation structure is a metal component formed on the dielectric substrate.
Optionally, the metal substrate located in the evaporation area is used for contacting with the component to be radiated.
Optionally, the dielectric substrate is a glass substrate.
Optionally, the isolation structure is copper.
Optionally, the length of the vapor outlet conduit in a direction perpendicular to the conduit cross-section is less than the length of the condensed liquid return conduit in a direction perpendicular to the conduit cross-section.
Optionally, the vapor outlet conduit and/or the condensed liquid return conduit have a cross-sectional dimension or depth in a direction perpendicular to the surface of the substrate in a range of 10 to 100 microns.
Optionally, the depth of the condensed liquid return conduit in the direction perpendicular to the substrate surface is smaller than the depth of the vapor outlet conduit in the direction perpendicular to the substrate surface.
Optionally, a hydrophilic membrane layer covers the inside of the condensed liquid return pipeline, and a hydrophobic membrane layer covers the inside of the steam outlet pipeline.
Optionally, the evaporation cavity is not filled with the cooling liquid in the evaporation cavity.
The heat dissipation device provided by the embodiment of the application comprises: an evaporation zone, a vapor transfer zone, a condensation zone, and a liquid reflux zone; the vapor transfer zone having a vapor exit conduit, the liquid return zone having a condensed liquid return conduit, the evaporation zone having an evaporation chamber, the condensation zone having a condensation chamber; the vapor outlet pipe, the condensed liquid return pipe, the evaporation cavity and the condensation cavity are formed by utilizing a first substrate, a second substrate and an isolation structure between the first substrate and the second substrate, and the cross-sectional dimension of the vapor outlet pipe is smaller than that of the condensed liquid return pipe; the evaporation cavity and the condensation cavity are provided with cooling liquid; the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is connected with a part to be cooled, the steam is introduced into the condensation cavity from the steam outlet pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensed liquid return pipeline to form self-circulation of the cooling liquid.
The heat dissipation device that this application embodiment provided, treat heat dissipation part and evaporation zone contact, the coolant liquid in the evaporation intracavity is heated the vaporization and forms steam, the condensation intracavity liquefaction that transmits to the condensation zone through steam spreads the pipeline and is liquid, the evaporation chamber is because liquid reduces and gaseous spreads out, atmospheric pressure reduces, the coolant liquid in the condensation intracavity passes through condensation liquid backflow pipeline flow direction evaporation chamber under the pressure effect, realizes the self-loopa of the inside coolant liquid of heat dissipation device. Therefore, the circulating heat dissipation of the liquid is realized through the air pressure change, the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary pipeline in the vapor chamber, and compared with the capillary pipeline, the condensed liquid backflow pipeline and the vapor outgoing pipeline in the embodiment of the application can have larger sizes, and the manufacturing process cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating a top view of a heat dissipation device according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram showing the structure of an AA section of a heat dissipation device according to an embodiment of the present application;
FIG. 3 is a schematic view showing a BB cross section of a heat dissipating device according to an embodiment of the present disclosure;
fig. 4 is a flow chart illustrating a method for manufacturing a heat dissipation device according to an embodiment of the present application.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways than those described herein, and it will be apparent to those of ordinary skill in the art that the present application is not limited by the specific embodiments disclosed below.
Next, the present application will be described in detail with reference to the drawings, and in the detailed description of the embodiments of the present application, the cross-sectional views illustrating the structure of the device are not enlarged partially according to the general scale for convenience of illustration, and the drawings are only examples, which should not limit the scope of the protection of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
At present, the development of electronic devices is more and more rapid. Whether the electronic device has good heat dissipation performance or not is one of the core focuses of users in the use process of the electronic device. The existing heat dissipation technology of electronic equipment mainly utilizes graphite heat sinks or vapor chambers to dissipate heat.
The vapor chamber is a vacuum chamber with a fine structure on the inner wall, and is usually made of copper. When heat is conducted to the evaporation zone from the heat source, the cooling liquid in the vacuum cavity starts to generate the vaporization phenomenon of the cooling liquid after being heated in the environment with low vacuum degree, at the moment, the heat energy is absorbed, the volume is rapidly expanded, the whole cavity is rapidly filled with the gaseous cooling medium, and the condensation phenomenon can be generated when the gaseous cooling medium is contacted with a relatively cold area. The heat accumulated during evaporation is released by the condensation phenomenon, the condensed cooling liquid returns to the evaporation heat source through the capillary tube of the microstructure, and the process is repeated in the vacuum cavity. The heat dissipation efficiency of the soaking plate is higher than that of a graphite heat dissipation sheet, but the soaking plate needs to be provided with a vacuum cavity and a fine structure in the vacuum cavity, so that the manufacturing cost of the soaking plate is higher.
Therefore, a heat dissipation device with low manufacturing cost and good heat dissipation effect is urgently needed.
Based on this, this application embodiment provides a heat dissipation device, includes: an evaporation zone, a vapor transfer zone, a condensation zone, and a liquid reflux zone; the vapor transfer zone having a vapor exit conduit, the liquid return zone having a condensed liquid return conduit, the evaporation zone having an evaporation chamber, the condensation zone having a condensation chamber; the vapor outlet pipe, the condensed liquid return pipe, the evaporation cavity and the condensation cavity are formed by utilizing a first substrate, a second substrate and an isolation structure between the first substrate and the second substrate, and the cross-sectional dimension of the vapor outlet pipe is smaller than that of the condensed liquid return pipe; the evaporation cavity and the condensation cavity are provided with cooling liquid; the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is connected with a part to be cooled, the steam is introduced into the condensation cavity from the steam outlet pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensed liquid return pipeline to form self-circulation of the cooling liquid.
The heat dissipation device that this application embodiment provided, treat heat dissipation part and evaporation zone contact, the coolant liquid in the evaporation intracavity is heated the vaporization and forms steam, the condensation intracavity liquefaction that transmits to the condensation zone through steam spreads the pipeline and is liquid, the evaporation chamber is because liquid reduces and gaseous spreads out, atmospheric pressure reduces, the coolant liquid in the condensation intracavity passes through condensation liquid backflow pipeline flow direction evaporation chamber under the pressure effect, realizes the self-loopa of the inside coolant liquid of heat dissipation device. Therefore, the circulating heat dissipation of the liquid is realized through the air pressure change, the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary pipeline in the vapor chamber, and compared with the capillary pipeline, the condensed liquid backflow pipeline and the vapor outgoing pipeline in the embodiment of the application can have larger sizes, and the manufacturing process cost is reduced.
For a better understanding of the technical solutions and effects of the present application, specific embodiments will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a heat dissipation device 100 provided for an embodiment of the present application may include: evaporation zone 110, vapor transfer zone 120, condensation zone 130, and liquid return zone 140, as described with reference to fig. 1.
Fig. 1 is a schematic top view of a heat dissipation device according to an embodiment of the present disclosure, and as shown in the drawings, a vapor delivery region 120 has a vapor outlet conduit 121, and a liquid return region 140 has a condensed liquid return conduit 141. Specifically, the vapor outlet pipe 121 and the condensed liquid return pipe 141 may be a plurality of pipes arranged side by side so as to provide various paths and improve heat dissipation efficiency. The evaporation area 110 has an evaporation chamber 111 and the condensation area 130 has a condensation chamber 131. In particular, the evaporation chamber 111 and the condensation chamber 131 are connected by a vapor outgoing conduit 121 and a condensed liquid return conduit 141.
In an embodiment of the present application, the vapor outlet pipe 121, the condensed liquid return pipe 141, the evaporation chamber 111, and the condensation chamber 131 may be formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, as shown with reference to fig. 2 and 3. The materials of the first substrate 150 and the second substrate 160 may be the same or different. Specifically, the first substrate 150 may be a dielectric substrate, such as a glass substrate, and the second substrate 160 may be a metal substrate. The material of the isolation structure 170 may be a metal material, and specifically, the isolation structure 170 may be a metal component formed on the first substrate 160, for example, the material of the isolation structure may be copper metal.
In practical applications, because the heat dissipation effect of the metal material is good, one side of the metal substrate may be in contact with a component to be dissipated, specifically, one side of the metal substrate located in the evaporation region 110 may be in contact with the component to be dissipated. The component to be dissipated may be a chip or a battery within the electronic device.
In the embodiment of the present application, the evaporation cavity 111 and the condensation cavity 131 can be filled with cooling liquid, when the evaporation area 110 contacts with a component to be radiated, the component to be radiated generates heat, the heat is conducted to the evaporation area 110, the cooling liquid in the evaporation cavity 111 is heated to form steam, and a large amount of heat is absorbed in the vaporization process, so as to radiate the component to be radiated. The vapor in the evaporation chamber 111 is introduced into the condensation chamber 131 through the vapor outlet pipe 121, the temperature in the condensation chamber 131 is low, the vaporized vapor enters the condensation chamber 131 to be liquefied, and the heat accumulated during vaporization is released by the liquefaction phenomenon. Because the cooling liquid in the evaporation cavity 111 is partially changed into steam and is delivered out, the pressure in the evaporation cavity 111 is reduced, and at the moment, the cooling liquid in the condensation cavity 131 flows to the evaporation cavity 111 through the condensed liquid return pipeline 141 under the action of the pressure, and based on the steps, self-circulation of the cooling liquid in the evaporation cavity 111, the steam delivery pipeline 121, the condensation cavity 131 and the condensed liquid return pipeline 141 is formed, so that the effect of circulating heat dissipation is achieved. Specifically, to save manufacturing costs, the coolant may be purified water.
In practical applications, the condensed liquid return line 141 may be filled with the cooling liquid in advance, so that the vapor in the evaporation chamber 111 does not move to the condensation chamber 131 through the condensed liquid return line 141, and the self-circulation of the cooling liquid in the evaporation chamber 111, the vapor outlet line 121, the condensation chamber 131, and the condensed liquid return line 141 can be further maintained.
In an embodiment of the present application, the vapor outlet conduit 121 has a smaller cross-sectional dimension than the condensed liquid return conduit 141. The vapor outlet pipe 121 is adapted to discharge the vapor in the evaporation chamber 111, and the condensed liquid return pipe 141 is adapted to supply the evaporation chamber 111 with the cooling liquid, so that the vapor outlet pipe 121 may have a smaller cross-sectional size than the condensed liquid return pipe 141. The cross-sectional size of the vapor outlet pipe 121 is smaller than that of the condensed liquid return pipe 141, so that the cooling liquid in the condensing chamber 131 can be prevented from flowing into the evaporating chamber 111 through the vapor outlet pipe 121, and the cooling liquid in the condensing chamber 131 can flow into the evaporating chamber 111 through the condensed liquid return pipe 141 more easily.
In an embodiment of the present application, the vapor outlet conduit 121 and the condensed liquid return conduit 141 may be parallel to the substrate, i.e. the substrate is perpendicular to the conduit cross section of the vapor outlet conduit 121 and the condensed liquid return conduit 141. The length of the vapor outlet pipe 121 in the direction perpendicular to the cross section of the pipe is smaller than the length of the condensed liquid return pipe 141 in the direction perpendicular to the cross section of the pipe, that is, the length of the vapor outlet pipe 121 in the direction parallel to the substrate is smaller than the length of the condensed liquid return pipe 141, so that the vapor in the evaporation chamber 111 can be prevented from being liquefied during the outlet through the vapor outlet pipe 121.
In embodiments of the present application, the vapor outlet conduit 121 and the condensed liquid return conduit 141 may have cross-sectional dimensions in the range of 10 to 100 microns. The vapor outlet conduit 121 and the condensed liquid return conduit 141 have a depth in a direction perpendicular to the substrate surface, which may be in the range of 10-100 microns. That is, the vapor outlet conduit 121 and the condensed liquid return conduit 141 may have cross-sectional dimensions and depths in the range of 10 to 100 micrometers, and the conduits may have small dimensions, and a plurality of conduits may be arranged side by side on the substrate, increasing heat dissipation efficiency. Because the pipe size is small, when the air pressure inside the heat dissipation device is not changed, the cooling liquid in the evaporation cavity 111 does not flow into the condensation cavity 131 through the vapor outlet pipe 121 due to gravity and the like, and the cooling liquid in the condensation cavity 131 does not flow into the evaporation cavity 111 through the vapor outlet pipe 121 due to gravity and the like.
In practical applications, the plurality of vapor outlet pipes 121 and the plurality of condensed liquid return pipes 141 may be formed by using the insulation structure, the first substrate, and the second substrate. In particular, the width of the spacer structure in a direction parallel to the cross-section of the duct may be in the range 5-20 microns.
In practical applications, the depth of the condensed liquid return conduit 141 may be less than the depth of the vapor outlet conduit 121, so that the condensed liquid return conduit 141 is more easily filled with the cooling liquid in the condensation chamber 131.
In the embodiment of the present application, a hydrophilic film layer may be covered inside the condensed liquid return conduit 141, so that the condensed liquid return conduit 141 is more easily filled with the cooling liquid in the condensation chamber 131 by using the hydrophilicity of the hydrophilic film layer. It is also possible to cover the inside of the vapor outlet conduit 121 with a hydrophobic film layer in order to prevent the coolant in the condensation chamber 131 or the evaporation chamber 111 from entering the vapor outlet conduit 121 by using the hydrophobicity of the hydrophobic film layer. Specifically, the hydrophilic film layer may be silicon oxide, and the hydrophobic film layer may be Polytetrafluoroethylene (PTFE) or fluororesin (1-butyl vinyl ether) polymer, CYTOP).
In the embodiment of the present application, the condensate in the evaporation cavity 111 does not fill the evaporation cavity 111, and a part of space may be reserved for the evaporation cavity 111 for the cooling liquid in the evaporation cavity 111 to be heated to form steam.
In practical applications, a metal layer 180 may be further disposed on a side of the condensing cavity 141 on the first substrate, and the metal layer 180 occupies a part of the space of the condensing cavity 141, where a depth of the condensing cavity 141 in a direction perpendicular to the substrate surface is smaller than a depth of the evaporating cavity in a direction perpendicular to the substrate surface, so that the condensing cavity 141 is more easily filled with the condensate, and the evaporating cavity 111 is not filled with the condensate and a part of the gas space is reserved. Specifically, the material of the metal layer 180 may be copper.
The heat dissipation device that this application embodiment provided, treat heat dissipation part and evaporation zone contact, the coolant liquid in the evaporation intracavity is heated the vaporization and forms steam, the condensation intracavity liquefaction that transmits to the condensation zone through steam spreads the pipeline and is liquid, the evaporation chamber is because liquid reduces and gaseous spreads out, atmospheric pressure reduces, the coolant liquid in the condensation intracavity passes through condensation liquid backflow pipeline flow direction evaporation chamber under the pressure effect, realizes the self-loopa of the inside coolant liquid of heat dissipation device. Therefore, the circulating heat dissipation of the liquid is realized through the air pressure change, the liquid heat dissipation circulation is not required to be carried out through the vacuum chamber and the capillary pipeline in the vapor chamber, and compared with the capillary pipeline, the condensed liquid backflow pipeline and the vapor outgoing pipeline in the embodiment of the application can have larger sizes, and the manufacturing process cost is reduced.
The heat dissipation device according to the embodiment of the present application is described in detail above, and in addition, the embodiment of the present application also provides a manufacturing method of the heat dissipation device.
Referring to fig. 4, a method for manufacturing a heat dissipation device according to an embodiment of the present application may include:
s401, forming an isolation structure 170 on the first substrate 150; the first substrate has an evaporation region 110, a vapor transmission region 120, a condensation region 130, and a liquid return region 140.
In an embodiment of the present application, the isolation structure 170 may be formed on the first substrate 150 such that the isolation structure 170 forms the evaporation region 110, the vapor transmission region 120, the condensation region 130, and the liquid reflow region 140 on the first substrate 150. In particular, the first substrate may be a dielectric substrate, such as a glass substrate. The material of the isolation structure may be a metallic material, for example, metallic copper. The isolation structure can be formed on the first substrate by electroplating or chemical plating.
S402, covering a second substrate 160 above the isolation structure 170, so that the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160 form an evaporation cavity 111 located in the evaporation area 110, a condensation cavity 131 located in the condensation area 130, a vapor outlet conduit 121 located in the vapor transmission area 120, and a condensed liquid return conduit 141 located in the liquid return area 140, wherein the cross-sectional size of the vapor outlet conduit 121 is smaller than the cross-sectional size of the condensed liquid return conduit 141.
In an embodiment of the present application, the second substrate 160 may be a metal substrate, the isolation structure 170 may be a metal material, and the second substrate 160 may be covered over the isolation structure 170 by using a bonding process, so that the isolation structure 170 and the second substrate 160 are in close contact. The vapor outlet pipe 121, the condensed liquid return pipe 141, the evaporation chamber 111, and the condensation chamber 131 may be formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, as shown with reference to fig. 2 and 3. Specifically, when the isolation structures 170 are formed on the first substrate 160, the isolation structures 170 form metal parts spaced apart in the vapor transmission region 120 and the liquid return region 140, so that adjacent metal parts form the vapor outlet conduit 121 and the condensed liquid return conduit 141, and the cross-sectional dimensions of the formed conduits may range from 10 microns to 100 microns, i.e., the spacing of the metal parts may range from 10 microns to 100 microns. The width of the metal part in a direction parallel to the cross-section of the pipe may be in the range of 5-20 microns.
In an embodiment of the present application, the vapor outlet conduit 121 is formed with a smaller cross-sectional size than the condensed liquid return conduit 141. The vapor outlet pipe 121 is adapted to discharge the vapor in the evaporation chamber 111, and the condensed liquid return pipe 141 is adapted to supply the evaporation chamber 111 with the cooling liquid, so that the vapor outlet pipe 121 may have a smaller cross-sectional size than the condensed liquid return pipe 141. The cross-sectional size of the vapor outlet pipe 121 is smaller than that of the condensed liquid return pipe 141, so that the cooling liquid in the condensing chamber 131 can be prevented from flowing into the evaporating chamber 111 through the vapor outlet pipe 121, and the cooling liquid in the condensing chamber 131 can flow into the evaporating chamber 111 through the condensed liquid return pipe 141 more easily.
In an embodiment of the present application, the vapor outlet conduit 121 and the condensed liquid return conduit 141 may be parallel to the substrate, i.e. the substrate is perpendicular to the conduit cross section of the vapor outlet conduit 121 and the condensed liquid return conduit 141. The length of the vapor outlet pipe 121 in the direction perpendicular to the cross section of the pipe is smaller than the length of the condensed liquid return pipe 141 in the direction perpendicular to the cross section of the pipe, that is, the length of the vapor outlet pipe 121 in the direction parallel to the substrate is smaller than the length of the condensed liquid return pipe 141, so that the vapor in the evaporation chamber 111 can be prevented from being liquefied during the outlet through the vapor outlet pipe 121.
In practical applications, the depth of the condensed liquid return conduit 141 may be less than the depth of the vapor outlet conduit 121, so that the condensed liquid return conduit 141 is more easily filled with the cooling liquid in the condensation chamber 131.
S403, filling the evaporation cavity 111 and the condensation cavity 131 with cooling liquid.
In the embodiment of the present application, after the vapor outlet conduit 121, the condensed liquid return conduit 141, the evaporation chamber 111, and the condensation chamber 131 are formed using the first substrate 150, the second substrate 160, and the isolation structure 170 between the first substrate 150 and the second substrate 160, a cooling liquid may be filled into the evaporation chamber 111 and the condensation chamber 131, so as to implement a self-circulating heat dissipation device using vaporization and liquefaction phenomena of the cooling liquid.
In practical applications, openings may be formed in advance at the boundary between the evaporation chamber 111 and the condensation chamber 131, so that the evaporation chamber 111, the condensation chamber 131, and the condensed liquid return pipe 141 are filled with the cooling liquid using the openings. Specifically, the opening of the condensation chamber 131 contacts with the liquid pool of the cooling liquid, so as to fill the cooling liquid into the evaporation chamber 111, the condensation chamber 131 and the condensed liquid return pipeline 141 by using the opening of the condensation chamber 131, but since the condensed liquid return pipeline 141 is relatively fine, the condensed liquid return pipeline 141 may not be filled with the cooling liquid, and at this time, the cooling liquid can be pumped into the condensed liquid return pipeline 141 under the pressure change through the opening of the evaporation chamber 111. After the cooling liquid fills the condensing chamber 131 and the condensed liquid return pipe 141 and the evaporation chamber 111 has a portion of the cooling liquid therein, the openings of the evaporation chamber 111 and the condensing chamber 131 are sealed.
In practical applications, when the opening of the evaporation cavity 111 is evacuated so that the cooling liquid is drawn into the condensed liquid return pipe 141 under pressure variation, the cooling liquid may also be partially drawn into the vapor outlet pipe 121, so that the vapor outlet pipe 121 of the vapor transmission region 120 can be heated to vaporize the cooling liquid in the vapor outlet pipe 121 and transmit the cooling liquid to the condensation cavity 131.
In the embodiment of the present application, a hydrophilic film layer may be formed inside the condensed liquid return conduit 141, so that the condensed liquid return conduit 141 is more easily filled with the cooling liquid in the condensation chamber 131 by using the hydrophilicity of the hydrophilic film layer. A hydrophobic film layer may also be formed inside the vapor outlet duct 121 so as to prevent the cooling liquid in the condensation chamber 131 or the evaporation chamber 111 from entering the vapor outlet duct 121 by using the hydrophobicity of the hydrophobic film layer. Specifically, the hydrophilic film layer may be silicon oxide, and the hydrophilic film layer may be formed by Plasma Enhanced Chemical Vapor Deposition (PECVD), and the hydrophobic film layer may be Polytetrafluoroethylene (PTFE) or fluororesin (1-butyl vinyl ether) polymer (CYTOP), and the hydrophobic film layer may be formed by spraying.
As an example, a hydrophobic film layer and a hydrophilic film layer are formed on the vapor transmission region 120 and the liquid reflow region 140 of the first substrate, respectively, before the second substrate 160 is covered over the isolation structure 170.
In practical applications, a metal layer may be further formed on the side of the condensing cavity 141 on the first substrate 150, and the metal layer occupies a part of the space of the condensing cavity 141, and at this time, the depth of the condensing cavity 141 in the direction perpendicular to the substrate surface is smaller than the depth of the evaporating cavity in the direction perpendicular to the substrate surface, so that the condensing cavity 141 is more easily filled with the condensate, and the evaporating cavity 111 is not filled with the condensate, and a part of the gas space is reserved. Specifically, the material of the metal layer may be copper. A metal layer may be formed in the condensation chamber 141 of the first substrate 150 by means of electroplating.
When introducing elements of various embodiments of the present application, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements. The terms "comprising," "including," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements.
It should be noted that, as one of ordinary skill in the art would understand, all or part of the processes of the above method embodiments may be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when executed, the computer program may include the processes of the above method embodiments. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, the method embodiments are substantially similar to the apparatus embodiments, so that the description is simple, and reference may be made to some descriptions of the method embodiments for relevant points.
The foregoing is merely a preferred embodiment of the present application and, although the present application discloses the foregoing preferred embodiments, the present application is not limited thereto. Those skilled in the art can now make numerous possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, using the methods and techniques disclosed above, without departing from the scope of the claimed embodiments. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application still fall within the protection scope of the technical solution of the present application without departing from the content of the technical solution of the present application.
Claims (17)
1. A heat dissipating device, comprising: an evaporation zone, a vapor transfer zone, a condensation zone, and a liquid reflux zone;
the vapor transfer zone having a vapor exit conduit, the liquid return zone having a condensed liquid return conduit, the evaporation zone having an evaporation chamber, the condensation zone having a condensation chamber; the vapor outlet pipe, the condensed liquid return pipe, the evaporation cavity and the condensation cavity are formed by utilizing a first substrate, a second substrate and an isolation structure between the first substrate and the second substrate, and the cross-sectional dimension of the vapor outlet pipe is smaller than that of the condensed liquid return pipe;
the evaporation cavity and the condensation cavity are provided with cooling liquid; the cooling liquid in the evaporation cavity is heated to form steam when the evaporation area is contacted with a part to be cooled, the steam is introduced into the condensation cavity from the steam outlet pipeline and is liquefied, and the cooling liquid in the condensation cavity flows to the evaporation cavity through the condensed liquid return pipeline to form self-circulation of the cooling liquid.
2. The device according to claim 1, wherein the vapor outlet conduit and/or the condensed liquid return conduit comprises a plurality of side-by-side conduits.
3. The device of claim 1, wherein the first substrate is a dielectric substrate, the second substrate is a metal substrate, and the isolation structure is a metal feature formed on the dielectric substrate.
4. The device of claim 3, wherein the metal substrate in the evaporation region is configured to contact the component to be dissipated.
5. The device of claim 3, wherein the dielectric substrate is a glass substrate.
6. The device of claim 3, wherein the isolation structure is metallic copper.
7. The device according to any of claims 1-6, wherein the length of the vapor outlet conduit in a direction perpendicular to the cross-section of the conduit is smaller than the length of the condensed liquid return conduit in a direction perpendicular to the cross-section of the conduit.
8. The device according to any of claims 1-6, wherein the vapor outlet conduit and/or the condensed liquid return conduit has a cross-sectional dimension or depth in a direction perpendicular to the substrate surface in the range of 10-100 micrometers.
9. The device according to any of claims 1-6, wherein the depth of the condensed liquid return conduit in a direction perpendicular to the substrate surface is smaller than the depth of the vapor outlet conduit in a direction perpendicular to the substrate surface.
10. The device according to any one of claims 1 to 6, wherein the condensed liquid return conduit is internally covered with a hydrophilic membrane layer and the vapor outlet conduit is internally covered with a hydrophobic membrane layer.
11. The device of any of claims 1-6, wherein the evaporation cavity is not filled with the cooling fluid within the evaporation cavity.
12. The device according to any of claims 1-6, wherein the condensation chamber has a metal layer on the side of the first substrate, and the depth of the condensation chamber in the direction perpendicular to the substrate surface is smaller than the depth of the evaporation chamber in the direction perpendicular to the substrate surface.
13. A method of manufacturing a heat dissipating device, comprising:
forming an isolation structure on a first substrate; the first substrate having an evaporation region, a vapor transfer region, a condensation region, and a liquid return region;
covering a second substrate over the isolation structure such that the first substrate, the second substrate, and the isolation structure between the first substrate and the second substrate form an evaporation chamber at the evaporation region, a condensation chamber at the condensation region, a vapor exit conduit at the vapor delivery region, and a condensed liquid return conduit at the liquid return region, the vapor exit conduit having a smaller cross-sectional dimension than the condensed liquid return conduit;
and filling cooling liquid into the evaporation cavity and the condensation cavity.
14. The method of claim 13, wherein the evaporation chamber and the condensation chamber are formed with openings after covering a second substrate over the isolation structure;
the to fill coolant liquid in evaporation chamber with the condensation chamber includes:
filling the cooling liquid into the evaporation cavity and the condensation cavity through the opening of the condensation cavity;
the method further comprises the following steps:
and filling the cooling liquid into the condensed liquid return pipeline through the opening of the condensation cavity, and sealing the openings of the evaporation cavity and the condensation cavity.
15. The method of claim 14, further comprising:
heating the vapor outlet conduit of the vapor transfer region to vaporize the coolant liquid within the vapor outlet conduit and transfer to the condensing chamber.
16. The method according to any one of claims 13-15, further comprising:
and a hydrophilic membrane layer is formed inside the condensed liquid return pipeline, and a hydrophobic membrane layer is formed inside the steam outlet pipeline.
17. The method according to any one of claims 13-15, further comprising:
and forming a metal layer on one side of the first substrate of the condensation cavity.
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| CN113133283B (en) | 2023-10-20 |
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