CN102345992A - Low pressure loop type thermosyphon device driven by pressure gradient - Google Patents
Low pressure loop type thermosyphon device driven by pressure gradient Download PDFInfo
- Publication number
- CN102345992A CN102345992A CN2010102449854A CN201010244985A CN102345992A CN 102345992 A CN102345992 A CN 102345992A CN 2010102449854 A CN2010102449854 A CN 2010102449854A CN 201010244985 A CN201010244985 A CN 201010244985A CN 102345992 A CN102345992 A CN 102345992A
- Authority
- CN
- China
- Prior art keywords
- low pressure
- pressure loop
- drives
- siphon device
- thermal siphon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Jet Pumps And Other Pumps (AREA)
Abstract
The invention provides a low pressure loop type thermosyphon device driven by a pressure gradient. The low pressure loop type thermosyphon device comprises a shell, a plate body, a pipe body and at least one radiating component, wherein the shell has a cavity; an evaporation part is arranged in the cavity; the evaporation part is provided with a plurality of first flow guide parts which comprise a plurality of first flow guide bodies arranged at intervals; at least one first flow channel is formed among the plurality of flow guide bodies; at least one end of the first flow channel is a free end and connected with a free region; the plate body correspondingly covers the shell and seals the cavity; the pipe body is provided with a second flow channel; two ends of the pipe body are connected with the shell; the second flow channel is communicated with the evaporation part; the radiating component is sleeved in series with the exterior of the pipe body; the pipe body and the radiating component together define a condensation part; the condensation part is subjected to proper pressure reduction to produce a low pressure end so as to form the pressure gradient required by steam and water cycle in the low pressure loop type thermosyphon device driven by the pressure gradient; and working fluid can be driven to circularly transmit heat in the pipe body and the shell without any capillary structure.
Description
Technical field
The present invention relates to the low pressure loop formula thermal siphon device that a kind of barometric gradient drives, refer to a kind of vapour-liquid circulation that does not need any capillary structure can strengthen loop-type thermal siphon device especially, reduce the low pressure loop formula thermal siphon device of the barometric gradient driving of thermal resistance.
Background technology
In recent years along with the progress of flourish, the process technique of electronic semi-conductor's industry; And under the trend of the market demand; Electronic equipment gradually move towards compact kenel, but in the diminishing process of overall dimensions, function and operational capability but are growing on and on.For example family expenses or business computer and communication cabinet and family expenses or industrial heat exchanger/device its during in actual operation; Its inside just has multinomial electronic component to produce heat; Wherein maximum with the heat that electron crystal or assembly were produced of carrying out computing again; The radiator that this moment, fin cooperated fan to form provides heat sinking function promptly to play the part of the key player who protects said a plurality of electronic building bricks, makes said a plurality of electronic building brick can maintain normal working temperature to bring into play due function.
And Water Cooling Technology its only begin to be used in widely on the personal computer; But not by with active use in other such as communication and family expenses or industrial heat exchanger/device; Though seeming, Water Cooling Technology saved bulky fin; But be that the heat of system's endogenous pyrogen was collected in the working fluid in fact, and then do the action of heat exchange with air, can change voluntarily because manage Lu Changdu through heat exchanger is unified; So the position of heat exchanger is elasticity comparatively also, also lets the design of heat exchanger (radiating fin) can not receive the restriction on the space; Fluid flows but pumping of water-cooling system needs pushes the work forward; But also need a storage tank, so whole system still has pumping reliability issues, pipe land leakage problem ... Deng, but because the heat of the heat generating component in the personal computer constantly increases; So though the water-cooled heat dissipation technology is not all roses; Remain heat management and control in the market optimal selection one, but, this be because personal computer to get volume huger; And the outside does not have the space limit yet; But just different at communication cabinet and family expenses or industrial heat exchanger/device, above-mentioned multiple arrangement is at present all towards compact more characteristic development, the limited heat dissipation technology that at all just can't use water-cooled of its overall space; Use heat pipe or directly do the heat transfer so remain at present, and then use radiating fin to do the action of heat exchange with small-sized radiator; In view of this, industry is actively sought the higher heat dissipation technology of heat flux invariably, to tackle following one by one huge radiating requirements.
Prior art also can see through radiating subassemblies such as heat pipe, temperature-uniforming plate and use as heat conducting component, and is to manage one sintered body of wall moulding within it when making heat pipe and temperature-uniforming plate, uses as capillary structure; Its main processing procedure is earlier copper particle or powder to be filled in this inwall; With its metal (copper) particle or powder densification compacting, send at last and impose sintering processing in the sintering furnace again, make this copper particle or powder form the capillary structure of porous character; What make can get capillary force through this sintered body; But also because of this sintered body, make the volume of this heat pipe and temperature-uniforming plate exist certain thickness, and effectively slimming; Said in addition VC (Vapor chamber) thing is used the core or the structures such as grid or groove of sintering; And then the carbonated drink that produces among capillary force phenomenon driving heat pipe or the VC (Vapor chamber) is circulated; But the structural application manufacture of this item is quite complicated, increases manufacturing cost, so very inappropriate.
Can use traditional loop-type thermal siphon device to use in addition, pass effect, because it mainly uses capillary and weight-driven vapour, liquid circulation though should tradition loop-type thermal siphon device can reach heat as heat conducting component; Therefore being vulnerable to weight-driven must limit, and except that this overall thermal resistance of outer ring siphoning installation was higher, the canting angle limits of loop-type thermal siphon device was also higher, and the restriction when design is used increases.
Therefore; All in one PC in the market; Or communication RRU module; But all use heatpipe cooler solution. heat pipe that heat load restriction is arranged, must use many and then cause the higher shortcoming of cost, and this heat radiation thermal resistance also not necessarily can reach the CPU thermal resistance requirement of dispelling the heat simultaneously.
Moreover the selection of steam core is a knowledge, selects suitable steam core quite important, and this steam core need keep the flow velocity of condensate liquid and keep enough capillary pressure to overcome the influence of gravity.
So the heat pipe of prior art or VC (Vapor chamber) have disadvantage:
1. inconvenient machining;
2. can't realize slimming;
3. cost is higher;
4. expend man-hour.
Summary of the invention
The present invention mainly is to provide a kind of vapour-liquid that strengthens loop-type heat pipe circulation that provides, and reduces the low pressure loop formula thermal siphon device of the barometric gradient driving of thermal resistance.
The present invention also is to provide a kind of processing procedure that need not to use the sintering capillary, the low pressure loop formula thermal siphon device that the barometric gradient that reduces cost drives.
For reaching above-mentioned purpose, the low pressure loop formula thermal siphon device that the present invention provides a kind of barometric gradient to drive is to comprise: housing, plate body, body, at least one radiating subassembly; Said housing has chamber; Has the evaporation part in this chamber; This evaporation part has a plurality of first diversion divisions; Said first diversion division is spaced institute by a plurality of first baffles to be formed, and forms at least one first flow between said a plurality of first baffles, and at least one end of this first flow is free end and connects a free space; Said plate body correspondence covers aforementioned housing, and seals this chamber; This body has second runner, and said body two ends connect aforementioned housing, and said second runner is communicated with aforementioned evaporation portion; This radiating subassembly string is placed in the light-emitting diode body outside, and said body and this radiating subassembly define a condensation part jointly.
Low pressure loop formula thermal siphon device through barometric gradient driving of the present invention; In the low pressure loop formula thermal siphon device that barometric gradient drives, set out suitable first flow between with first baffle and another first baffle; The first flow that limitation contacts with thermal source produces overheated vapour, sets up to drive the required high pressure of carbonated drink circulation; Before the condensation part, design through suitable decompression; Produce low-pressure end; The required barometric gradient of carbonated drink circulation in the low pressure loop formula thermal siphon device of formation driving pressure gradient-driven; Promptly do not need any capillary structure can drive working fluid and in body and body, transmit heat, and significantly promote hot transfer efficiency and reduce manufacturing cost.
Description of drawings
Fig. 1 is the low pressure loop formula thermal siphon device first embodiment three-dimensional exploded view that barometric gradient of the present invention drives;
Fig. 2 is the low pressure loop formula thermal siphon device first embodiment three-dimensional combination figure that barometric gradient of the present invention drives;
Fig. 3 is the low pressure loop formula thermal siphon device first embodiment cutaway view that barometric gradient of the present invention drives;
Fig. 4 is another aspect evaporation part front view of low pressure loop formula thermal siphon device first embodiment that barometric gradient of the present invention drives;
Fig. 5 is another aspect evaporation part front view of low pressure loop formula thermal siphon device first embodiment that barometric gradient of the present invention drives;
Fig. 6 is the low pressure loop formula thermal siphon device second embodiment evaporation part front view that barometric gradient of the present invention drives;
Fig. 7 is another aspect evaporation part front view of low pressure loop formula thermal siphon device second embodiment that barometric gradient of the present invention drives;
Fig. 8 is another aspect evaporation part front view of low pressure loop formula thermal siphon device first embodiment that barometric gradient of the present invention drives;
Fig. 9 is another aspect three-dimensional combination figure of low pressure loop formula thermal siphon device first embodiment that barometric gradient of the present invention drives.
Among the figure:
Housing 1
Chamber 11
The first drift angle 1211a
The first sword limit 1211b
The second sword limit 1211c
First spacing 1214
Radiating subassembly 4
Pumping 6
The specific embodiment
According to the characteristic on above-mentioned purpose of the present invention and its structure and the function, will explain according to appended illustrated preferred embodiment.
See Fig. 1,2,3, low pressure loop formula thermal siphon device first embodiment that barometric gradient of the present invention as shown in the figure drives, the low pressure loop formula thermal siphon device that said barometric gradient drives comprises: housing 1, plate body 2, body 3, at least one radiating subassembly 4;
Said housing 1 has chamber 11; Chamber 11 has: evaporation part 12; Said evaporation part 12 is located in the chamber 11, and evaporation part 12 has a plurality of first diversion divisions 121, and said first diversion division 121 is spaced institute by a plurality of first baffles 1211 and forms; 1211 of said a plurality of first baffles form at least one first flow 1212, and first flow 1212 at least one ends are free end 1212a and connect a free space 1213.
Said in the present embodiment first baffle 1211 is a strip rib, and arrange said a plurality of strip ribs lateral separation, said first flow 1212 be formed at said a plurality of strip ribs between, this strip rib also can be wavy (as shown in Figure 4).
But said first baffle 1211 also longitudinal separation is arranged, and promptly vertical discontinuous formula is arranged (as shown in Figure 5).
Said plate body 2 correspondences cover housing 1, and sealing chamber 11.
Said body 3 has second runner 31, and said body 3 two ends connect housing 1, the second runner 31 and are communicated with aforementioned evaporation portion 12.
Radiating subassembly 4 strings are placed in light-emitting diode body 3 outsides, and said body 3 and radiating subassembly 4 define a condensation part 5 jointly, can be equiped with the fan (not shown) on the condensation part 5.
Said radiating subassembly 4 can be radiating fin group and radiator wherein any one, be in the present embodiment with the radiating fin group as explanation, do not exceed but do not regard it as.
See Fig. 6,7; Low pressure loop formula thermal siphon device second embodiment that barometric gradient of the present invention as shown in the figure drives; The association of present embodiment part-structure and inter-module is identical with first embodiment; Repeat no more at this, present embodiment is different with aforementioned first embodiment locates first baffle, 1 drift angle 1211a and the first sword limit 1211b and the second sword limit 1211c for evaporation part 12, and said first and second sword limit 1211b, 1211c intersect at the first drift angle 1211a; Said a plurality of first flow 1212 is formed at 1211 of said a plurality of first baffles, and 121 of said a plurality of first diversion divisions have first spacing 1214.
The first sword limit 1211b also can be discontinuous arrangement, and the said second sword limit 1211c also can be discontinuous arrangement (as shown in Figure 7).
See Fig. 8; As shown in the figure, 1211 of first baffles among aforementioned first embodiment have a plurality of pits 1215, rounded and square and triangle of said pit 1215 and fish scale shape and geometry wherein any one; At present embodiment is to adopt the fish scale shape as explanation; Do not exceed but do not regard it as, the be equidistance or the non-isometric arrangement mode of said pit 1215 arrangement mode to each other, said second embodiment also can be provided with a plurality of pits 1215 1211 of said a plurality of first baffles certainly.
See Fig. 4 to 9; As shown in the figure; The first embodiment of the invention and second embodiment propose the low pressure loop formula thermal siphon device recirculation refrigerating technology of two phase pressure gradient-driven; The method is that the oneself drives endless form, the working fluid of use can be refrigerants such as pure water, methyl alcohol, acetone, R134A wherein any one, the state for vacuumizing in the chamber 11 of the low pressure loop formula thermal siphon device that barometric gradient drives; So the working fluid of filling in inside is spent the saturation temperature that is working fluid Celsius 20～30; Evaporation bubble 7 is after the free end 1212a of evaporation part 12 confluxes, and flow through free space 1213 and step-down produce and drive the required barometric gradient of carbonated drink circulation; Receive in addition in the condensation part 5 because of the gas condensation specific volume formed local decompression that rises sharply and attracting; Help the carbonated drink circulation; Certainly also can pumping 6 be set in addition again, can avoid working fluid that the phenomenon (as shown in Figure 9) of dry combustion method takes place in chamber 11 at said body 1 and 2 of bodys.
In the evaporation part 12 of the low pressure loop formula thermal siphon device that barometric gradient drives and (or) in condensation part 13 and the body 2; First and second suitable runner 1212,31 is set in evaporation part 12, utilizes the pressure that improves working fluid near the mode of constant volume heating, produce and drive vapour, the required high pressure of liquid circulation; And (or) utilize free wxpansion and condensation the mode of pressing to be reduced the pressure of vapour, liquid circulation low-pressure end in the exit of steam state working fluid; And (or) evaporation part 12 heating surfaces are processed the surface (like squamous surface, squamous and rib composite surface etc.) that is beneficial to lifting boiling heat transfer property ability, reduce boiling temperature, raising heat biography coefficient, guiding steam flow; And (or) condensing surface is processed water-repellent surface, promote that working fluid leaves cooling surface; Strengthen the vapour-liquid circulation of the low pressure loop formula thermal siphon device of barometric gradient driving, reduce thermal resistance.
The external form of the low pressure loop formula thermal siphon device that barometric gradient drives, evaporation part 12 place the below, and condensation part 41 places the top, connects to a loop with body 3; Working fluid is 12 superchargings of being heated in the evaporation part, and gas is pushed to the condensation part 41 of top through body 3, are condensed into liquid; Relend gravity and go back to evaporation part 12, when working fluid 12 is heated manyly more in the evaporation part, gas pressure is high more; Short beginning carbonated drink circulation rate is fast more, and thermal resistance is also just low more, yet electronic building brick is at the environment of the high heat of high temperature; Life-span all can shorten, and utilizes high temperature or high thermogenetic high pressure, and is unsatisfactory; So the present invention utilizes the mode near the constant volume heating in cold evaporation part 12, improve the pressure of working fluid, produce and drive vapour, the required high pressure of liquid circulation; And (or) utilize free wxpansion and condensation the mode of pressing to be reduced the pressure of vapour, liquid circulation low-pressure end in the exit of steam state working fluid.There is advantage this evaporation part 12 with respect to existing loop-type heat-pipe apparatus:
1, under the situation of low-heat, thermal resistance is lower, can provide electronic devices and components preferable heat-sinking capability.
2, thermal resistance is little with respect to the variable effect of evaporation part storing angle with the condensation part; That is, angle 90 degree drop to 30 degree at the elevation angle in the variation of thermal resistance, and thermal resistance has only rising about 20%; Biggest advantage of the present invention is condensation part when very little with respect to the elevation angle of evaporation part, and the carbonated drink circulation just can start.
3. need not in the body that any capillary structure is set and to drive working fluid cycles.
Claims (10)
1. the low pressure loop formula thermal siphon device that barometric gradient drives is characterized in that, comprising:
Housing; Has chamber; Have the evaporation part in this chamber, this evaporation part has a plurality of first diversion divisions, and said first diversion division is spaced institute by a plurality of first baffles and forms; Form at least one first flow between said a plurality of first baffle, at least one end of this first flow is free end and connects a free space;
Plate body, correspondence cover said housing, and seal said chamber;
Body has one second runner, and said body two ends connect said housing, and said second runner is communicated with aforementioned evaporation portion;
At least one radiating subassembly, string is enclosed within the light-emitting diode body outside, and said body and said radiating subassembly define a condensation part jointly.
2. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives is characterized in that, said radiating subassembly be radiating fin group and radiator wherein any one.
3. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives; It is characterized in that; First baffle is a strip rib, and arrange said a plurality of strip ribs lateral separation, said first flow be formed at said a plurality of strip ribs between.
4. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 3 drives is characterized in that, the said first baffle longitudinal separation is arranged.
5. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives; It is characterized in that; Said first baffle is a rib, and said a plurality of ribs have first drift angle and the first sword limit and the second sword limit, and said first and second sword limit intersects at said first drift angle; Said a plurality of first flow is formed between said a plurality of rib, and has first spacing between said a plurality of first diversion division.
6. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 5 drives is characterized in that the said first sword limit is discontinuous arrangement, and the said second sword limit is discontinuous arrangement.
7. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives is characterized in that having a plurality of pits between said a plurality of first baffles.
8. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 7 drives is characterized in that, rounded and square and triangle of said pit and fish scale shape and geometry wherein any one.
9. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives is characterized in that, more is provided with a pumping between said body and body.
10. the low pressure loop formula thermal siphon device that barometric gradient as claimed in claim 1 drives is characterized in that, can install fan on the said condensation part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102449854A CN102345992A (en) | 2010-07-30 | 2010-07-30 | Low pressure loop type thermosyphon device driven by pressure gradient |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102449854A CN102345992A (en) | 2010-07-30 | 2010-07-30 | Low pressure loop type thermosyphon device driven by pressure gradient |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102345992A true CN102345992A (en) | 2012-02-08 |
Family
ID=45544887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102449854A Pending CN102345992A (en) | 2010-07-30 | 2010-07-30 | Low pressure loop type thermosyphon device driven by pressure gradient |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102345992A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103593026A (en) * | 2012-08-17 | 2014-02-19 | 双鸿科技股份有限公司 | Bi-phase variation circulation type water cooling module and method for applying same |
| CN107801351A (en) * | 2016-09-05 | 2018-03-13 | 宏碁股份有限公司 | Evaporator and preparation method thereof |
| CN109990630A (en) * | 2017-12-29 | 2019-07-09 | 核工业西南物理研究院 | A kind of suitable high temperature and pressure heat exchange runner structure |
| CN113133283A (en) * | 2021-04-13 | 2021-07-16 | 上海天马微电子有限公司 | Heat dissipation device and manufacturing method thereof |
| TWI744984B (en) * | 2020-07-15 | 2021-11-01 | 兆亮科技股份有限公司 | Laminated heat sink structure |
| CN115143821A (en) * | 2022-06-17 | 2022-10-04 | 北京理工大学 | Phase change heat transfer mechanism and device capable of utilizing heat-power conversion effect |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020062648A1 (en) * | 2000-11-30 | 2002-05-30 | Ghoshal Uttam Shyamalindu | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
| US20030079865A1 (en) * | 2001-10-29 | 2003-05-01 | Samsung Electronics Co., Ltd. | Heat transferring device having adiabatic unit |
| US6827134B1 (en) * | 2002-04-30 | 2004-12-07 | Sandia Corporation | Parallel-plate heat pipe apparatus having a shaped wick structure |
| CN1697170A (en) * | 2004-05-12 | 2005-11-16 | 王训忠 | Transmission canal with diphasic heat sink |
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
| CN201059899Y (en) * | 2007-06-04 | 2008-05-14 | 邢耘 | Working substance phase inversion heat apparatus |
| CN101210784A (en) * | 2006-12-29 | 2008-07-02 | 财团法人工业技术研究院 | Modified duct heater heat dispersion system |
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| CN101655328A (en) * | 2008-08-19 | 2010-02-24 | 何昆耀 | Flat plate type loop heat conducting device and manufacturing method thereof |
| CN201892455U (en) * | 2010-07-30 | 2011-07-06 | 奇鋐科技股份有限公司 | Low-pressure loop thermosyphon device driven by pressure gradient |
-
2010
- 2010-07-30 CN CN2010102449854A patent/CN102345992A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020062648A1 (en) * | 2000-11-30 | 2002-05-30 | Ghoshal Uttam Shyamalindu | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
| US20030079865A1 (en) * | 2001-10-29 | 2003-05-01 | Samsung Electronics Co., Ltd. | Heat transferring device having adiabatic unit |
| US6827134B1 (en) * | 2002-04-30 | 2004-12-07 | Sandia Corporation | Parallel-plate heat pipe apparatus having a shaped wick structure |
| CN1697170A (en) * | 2004-05-12 | 2005-11-16 | 王训忠 | Transmission canal with diphasic heat sink |
| CN1786647A (en) * | 2004-12-06 | 2006-06-14 | 乐金电子（昆山）电脑有限公司 | Heat pipe |
| CN101210784A (en) * | 2006-12-29 | 2008-07-02 | 财团法人工业技术研究院 | Modified duct heater heat dispersion system |
| CN101307996A (en) * | 2007-05-17 | 2008-11-19 | 私立淡江大学 | Flat-plate evaporators structure and loop type hot pipe possessing flat-plate evaporators structure |
| CN201059899Y (en) * | 2007-06-04 | 2008-05-14 | 邢耘 | Working substance phase inversion heat apparatus |
| CN101655328A (en) * | 2008-08-19 | 2010-02-24 | 何昆耀 | Flat plate type loop heat conducting device and manufacturing method thereof |
| CN201892455U (en) * | 2010-07-30 | 2011-07-06 | 奇鋐科技股份有限公司 | Low-pressure loop thermosyphon device driven by pressure gradient |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103593026A (en) * | 2012-08-17 | 2014-02-19 | 双鸿科技股份有限公司 | Bi-phase variation circulation type water cooling module and method for applying same |
| CN107801351A (en) * | 2016-09-05 | 2018-03-13 | 宏碁股份有限公司 | Evaporator and preparation method thereof |
| CN107801351B (en) * | 2016-09-05 | 2023-08-01 | 宏碁股份有限公司 | Evaporator and manufacturing method thereof |
| CN109990630A (en) * | 2017-12-29 | 2019-07-09 | 核工业西南物理研究院 | A kind of suitable high temperature and pressure heat exchange runner structure |
| TWI744984B (en) * | 2020-07-15 | 2021-11-01 | 兆亮科技股份有限公司 | Laminated heat sink structure |
| CN113133283A (en) * | 2021-04-13 | 2021-07-16 | 上海天马微电子有限公司 | Heat dissipation device and manufacturing method thereof |
| CN113133283B (en) * | 2021-04-13 | 2023-10-20 | 上海天马微电子有限公司 | Heat dissipation device and manufacturing method thereof |
| CN115143821A (en) * | 2022-06-17 | 2022-10-04 | 北京理工大学 | Phase change heat transfer mechanism and device capable of utilizing heat-power conversion effect |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102338584B (en) | The radiator structure of improvement | |
| CN103629963B (en) | Multi-scale capillary core flat plate loop heat pipe type heat-dissipation device | |
| CN201819597U (en) | Pressure-driven loop type thermosyphon device | |
| CN102345992A (en) | Low pressure loop type thermosyphon device driven by pressure gradient | |
| US9441888B2 (en) | Loop type pressure-gradient-driven low-pressure thermosiphon device | |
| CN103200803B (en) | A kind of heat radiation device for loop heat pipe having pool boiling | |
| CN102723316A (en) | Loop heat pipe structure | |
| US8973646B2 (en) | Slim type pressure-gradient-driven low-pressure thermosiphon plate | |
| CN102338583B (en) | Pressure difference driving heat plate | |
| CN1929727A (en) | Remote passive circulating phase-change heat-diffusing method and system | |
| CN102646651B (en) | Thin hot plate structure | |
| CN201830599U (en) | Improvement of heat-radiating structure | |
| CN201892455U (en) | Low-pressure loop thermosyphon device driven by pressure gradient | |
| CN202008994U (en) | Loop heat pipe structure | |
| CN202142519U (en) | Thin type hot plate structure | |
| CN102338581B (en) | Thermo-siphon plate structure | |
| CN102736711B (en) | Structure improvement of condensation device and heat dissipation module of condensation device | |
| CN201532140U (en) | Circular thermosiphon loop heat pipe radiator | |
| CN106440906A (en) | Spiral type liquid cooling uniform temperature plate composite radiator | |
| CN104315618B (en) | Heat abstractor | |
| CN201837286U (en) | Structural improvement of thermal siphon plate | |
| CN201837285U (en) | Pressure difference driven hot plate | |
| CN201828174U (en) | Thin plate type low pressure thermosyphon plate driven by pressure gradient | |
| CN209232773U (en) | Two-fluid self-circulating radiating device | |
| CN102338582B (en) | Thin plate type low-pressure thermosyphon plate driving by pressure gradient |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120208 |
|
| RJ01 | Rejection of invention patent application after publication |