CN202008994U - Loop heat pipe structure - Google Patents
Loop heat pipe structure Download PDFInfo
- Publication number
- CN202008994U CN202008994U CN2011200867723U CN201120086772U CN202008994U CN 202008994 U CN202008994 U CN 202008994U CN 2011200867723 U CN2011200867723 U CN 2011200867723U CN 201120086772 U CN201120086772 U CN 201120086772U CN 202008994 U CN202008994 U CN 202008994U
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- Prior art keywords
- heat pipe
- loop circuit
- pipe structure
- capillary layer
- chamber
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a loop heat pipe structure, comprising a pipe body, a cavity body, a first capillary layer, a second capillary layer and a plurality of grooves, wherein the pipe body is communicated with the cavity body; the cavity body is provided with a first chamber, a second chamber, working fluid and a bottom; the first and the second capillary layers are arranged at the bottom in an overlapped way, and the plurality of grooves are arranged at any one of the first capillary layer and the bottom; and the over-high vapor pressure can be avoided generating in the chambers through the first and the second capillary layers so as to increase the overall heat radiation efficiency of the loop heat pipe.
Description
Technical field
The utility model relates to a kind of loop circuit heat pipe structure, refers in chamber the capillary structure layer laminate setting with how different conductive coefficients and permeability especially, to avoid producing too high vapour pressure in the chamber, to promote the loop circuit heat pipe structure of loop circuit heat pipe integral heat sink efficient.
Background technology
Along with the progress of semiconductor science and technology, integrated circuit (IC) has been used in the wafer of electronic installations such as PC, notebook computer and network server in large quantities.Yet, because the processing speed and the function of integrated circuit significantly improve, make the corresponding used heat that produces of integrated circuit also significantly increase, if can not effectively this used heat be got rid of, cause electronic installation to lose efficacy easily.Therefore, various radiating modes are to be suggested, so that the used heat that can promptly integrated circuit be produced is got rid of, avoid taking place the facts that electronic installation lost efficacy.
Design has container or additional chamber (resevior/compensation chamber) to store an amount of working fluid (fluid) with regard to traditional loop circuit heat pipe (Loop Heat Pipe LHP), making evaporator (evaporator) can obtain suitable fluid replenishes and can hold the change in volume that working fluid causes because of variable density, and further filter gas (gas) or bubble (bubble), make it unlikelyly hindered and damaged by it.
Although loop circuit heat pipe (Loop Heat Pipe LHP) has numerous advantages, but because traditional loop circuit heat pipe adopts the cylindrical structure evaporator, make the evaporator of loop circuit heat pipe need bigger space, simultaneously because its cylindrical outer surface is an arc surface, therefore can't directly contact with thermal source, in view of this develop another flat type loop heat pipe, and the capillary structure that adopts single kind is as core (Wick) structure, and the capillary structure of single kind can make the heat of heating fumigators enter at an easy rate in the additional chamber (resevior/compensation chamber) as core (Wick) structure, serious heat leak phenomenon promptly appears, then must will adopt the capillary structure of low thermal conductivity if will prevent serious heat leak as core (Wick) structure, then can make evaporator produce very big local thermal resistance, and if adopt the words of the individual layer capillary structure of high heat conduction as core (Wick) structure, the quite difficulty that then can make the flat type loop heat pipe initial start become, promptly need excessive startup critical power, under some particular job situation even can't start.
In addition, classic flat-plate formula loop circuit heat pipe case material is general to be identical material with this base plate, and the evaporator base plate is pursued high-termal conductivity, moreover, the particularity of this flat type loop heat pipe structure, so when the evaporator baseplate heated, it is very serious by the inner working fluid problem in the heat conduction heat make-up chamber (resevior/compensation chamber) of other walls except that base plate, sometimes this portion of hot even can be suitable by core (Wick) the heat leak phenomenon that structure produced with evaporator inside, when the hot property of above-mentioned two kinds of information summary effect flat type loop heat pipes of following time becomes very poor, can not bring into play the advantage of flat type loop heat pipe fully.
Summary of the invention
Main purpose of the present utility model is to provide a kind of heat leak phenomenon that prevents to influence the loop circuit heat pipe structure of the heat dissipation of loop circuit heat pipe.
Provide a kind of loop circuit heat pipe structure for reaching above-mentioned purpose the utility model, comprise: a body, a cavity, one first capillary layer, one second capillary layer and many grooves; Described body has one first end, one second end and a passage, described first end of this channel connection and described second end; This cavity has one first chamber, one second chamber, working fluid and a bottom, described first chamber has one first connecting hole, described second chamber has one second connecting hole, and a side of this second chamber extends a support column, and described first connecting hole, described two connecting holes are connected with first end, second end of described body respectively; Described first capillary layer is located at the bottom of described cavity; This second capillary layer is covered in described first capillary layer top, and these many grooves select to be located at this bottom or this first capillary layer.
Described first capillary layer can provide loop circuit heat pipe structure when running required enough capillary forces and reduce the pressure loss that working fluid flows through this first capillary layer; Second capillary layer effectively serves as the effect of lock heat in the loop circuit heat pipe structure, and then effectively prevent from the working fluid in second chamber to be heated to the vapour-liquid biphase equilibrium that very high temperature produced high temperature from the heat leak of first capillary layer, and in second chamber, produce too high saturated vapor pressure, stop in liquid return to the second chamber in this steam pressure body; Can make by above-mentioned loop circuit heat pipe structure and to avoid producing too high vapour pressure in this chamber, to promote loop circuit heat pipe integral heat sink efficient.
The utility model provides a kind of loop circuit heat pipe structure, comprises:
One body has one first end, one second end and a passage, described first end of this channel connection and described second end;
One cavity, have one first chamber, one second chamber, working fluid and a bottom, described first chamber has one first connecting hole, described second chamber has one second connecting hole, and a side of this second chamber extends a support column, and described first connecting hole, described second connecting hole are connected with first end, second end of described body respectively;
One first capillary layer is covered in top, described bottom;
One second capillary layer is covered in described first capillary layer top;
Many grooves, selection is arranged at the bottom of this first capillary layer or described cavity.
During enforcement, described cavity has more a lid and a base plate, cover corresponding with this base plate of described lid defined described first chamber and second chamber, described first capillary layer, described second capillary layer are located on the described base plate, and these many grooves select to be arranged at the base plate of this first capillary layer or described cavity.
During enforcement, this cavity has more a work body, and described work body is selected to be connected with described first chamber or described second chamber.
During enforcement, described first capillary layer and described two capillary layers are chosen as agglomerated powder opisthosoma, grid body, carbon fiber or graphite.
During enforcement, effective capillary radius of described second capillary layer is greater than effective capillary radius of this first capillary layer.
During enforcement, the described second capillary layer conductive coefficient is lower than the conductive coefficient of this first capillary layer.
During enforcement, described body string overlaps many radiating fins.
During enforcement, described lid and this base plate are xenogenesis material or material of the same race.
During enforcement, the material of described lid is stainless steel and carbon steel or macromolecular material.
During enforcement, the permeability of described second capillary layer is greater than the permeability of this first capillary layer.
During enforcement, described body connects establishes a condensing unit.
During enforcement, described body connects establishes a water cooling plant.
Compared with prior art, loop circuit heat pipe structure described in the utility model, the capillary structure layer laminate with how different conductive coefficients and permeability in chamber is provided with, to avoid producing too high vapour pressure in the chamber, to promote loop circuit heat pipe integral heat sink efficient.
Description of drawings
Fig. 1 is the first embodiment three-dimensional exploded view of the utility model loop circuit heat pipe structure;
Fig. 2 is the first embodiment assembled sectional view of the utility model loop circuit heat pipe structure;
Fig. 3 is the A-A cutaway view of first embodiment Fig. 2 of the utility model loop circuit heat pipe structure;
Fig. 3 a is another A-A cutaway view of first embodiment Fig. 2 of the utility model loop circuit heat pipe structure;
Fig. 4 is the second embodiment three-dimensional exploded view of the utility model loop circuit heat pipe structure;
Fig. 5 is the B-B profile of second embodiment Fig. 4 of the utility model loop circuit heat pipe structure;
Fig. 5 a is another B-B profile of second embodiment Fig. 4 of the utility model loop circuit heat pipe structure;
Fig. 6 is the 3rd an embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure;
Fig. 7 is the 4th an embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure;
Fig. 8 is the 5th an embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure.
Description of reference numerals: loop circuit heat pipe structure-1; Body-11; First end-111; Second end-112; Passage-113; Cavity-12; Lid-12a; Base plate-12b; First capillary layer-121; Second capillary layer-122; First chamber-123; First connecting hole-1231; Second chamber-124; Second connecting hole-1241; Support column-1242; Bottom-125; Work body-126; Groove-13; Working fluid-2; Radiating fin-3; Condensing unit-4; Water cooling plant-5.
Embodiment
Characteristic on above-mentioned purpose of the present utility model and structure thereof and the function will be illustrated according to appended graphic preferred embodiment.
See also Fig. 1, Fig. 2, Fig. 3, be the three-dimensional decomposition of first embodiment and the assembled sectional view and the A-A cutaway view of the utility model loop circuit heat pipe structure, as shown in the figure, loop circuit heat pipe structure 1 of the present utility model comprises: a body 11, a cavity 12, one first capillary layer 121, one second capillary layer 122 and many grooves 13;
Described body 11 has one first end 111 and one second end 112 and a passage 113, and this passage 113 is communicated with described first and second end 111,112.
Described cavity 12 has one first chamber 123 and one second chamber 124 and a working fluid 2 and a bottom 125, described first chamber 123 has one first connecting hole 1231, described second chamber 124 has one second connecting hole 1241, and a side of this second chamber 124 extends a support column 1242, and described first and second connecting hole 1231,1241 is connected with first and second end 111,112 of described body 11 respectively.
This first capillary layer 121 is located at described bottom 125 and top.
This second capillary layer 122 is covered in described first capillary layer 121 tops, these many grooves 13 select to be located at described first capillary layer 121 and this bottom 125 wherein arbitrary, the groove 13 of present embodiment is located at this bottom 125 as an illustration, do not exceed but do not regard it as, these many grooves 13 also can be arranged at this first capillary layer, 121 1 sides (shown in Fig. 3 a).
Described first and second capillary layer 121,122 may be selected to be agglomerated powder opisthosoma, grid body or carbon fiber and graphite, and present embodiment with the agglomerated powder opisthosoma as an illustration but do not regard it as and exceed.
The permeability of described second capillary layer 122 is greater than this first capillary layer 121, and described second capillary layer, 122 conductive coefficients are lower than the conductive coefficient of this first capillary layer 121.
This cavity 12 has more a work body 126, described work body 126 selects with described first chamber 123 and second chamber 124 is wherein arbitrary is connected, present embodiment is connected but does not regard it as with second chamber 124 and exceeds, when making this loop circuit heat pipe structure 1, can vacuumize and inject work such as working fluid 2 by 126 pairs of these cavitys 12 of this work body, again this work body 126 is an open end at last and seal.
See also Fig. 4, Fig. 5, be the second embodiment three-dimensional exploded view and the B-B profile of the utility model loop circuit heat pipe structure, as shown in the figure, the part-structure of present embodiment is identical with described first embodiment, therefore then repeat no more at this, only not existing together of present embodiment and described first embodiment is that the described cavity 12 of present embodiment has more a lid 12a and a base plate 12b, described lid 12a defines described first with corresponding the covering of this base plate 12b, two chambers 123,124, described first, two capillary layers 121,122 are located on the described base plate 12b, these many grooves 13 can select to be located at this first capillary layer 121 and this base plate 12b is wherein arbitrary, present embodiment should many grooves 13 be located on this base plate 12b as an illustration, do not exceed but do not regard it as, these many grooves 13 also can be arranged at this first capillary layer, 121 1 sides (shown in Fig. 4 a).
Described lid 12a and this base plate 12b are that xenogenesis material and material of the same race are wherein arbitrary, and present embodiment does not exceed but do not regard it as with the xenogenesis material as an illustration; The material of this lid 12a is that stainless steel and carbon steel and macromolecular material are wherein arbitrary, present embodiment is selected low heat-conducting compatible with this working fluid 2 such as stainless steel for use as an illustration, do not exceed but do not regard it as, described base plate 12b then selects high heat conductive metal material such as copper material for use as an illustration.
See also Fig. 6, it is the 3rd embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure, as shown in the figure, the part-structure of present embodiment is identical with described first embodiment, so then repeat no more at this, only not existing together of present embodiment and described first embodiment is the many radiating fins 3 of body 11 string covers of present embodiment.
See also Fig. 7, it is the 4th embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure, as shown in the figure, the part-structure of present embodiment is identical with described first embodiment, so then repeat no more at this, only not existing together of present embodiment and described first embodiment is that the body 11 of present embodiment connects and establishes a condensing unit 4.
See also Fig. 8, it is the 5th embodiment three-dimensional combination figure of the utility model loop circuit heat pipe structure, as shown in the figure, the part-structure of present embodiment is identical with described first embodiment, so then repeat no more at this, only not existing together of present embodiment and described first embodiment is that the body 11 of present embodiment connects and establishes a water cooling plant 5.
Please cover and consult Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6, as shown in the figure, when described loop circuit heat pipe structure 1 is used, the capillary radius of described first capillary layer 121 (effectively capillary radius) is smaller than the capillary radius (effectively capillary radius) of second capillary layer 122, and second capillary layer 122 of selecting for use conductive coefficient to be lower than this first capillary layer 121 can increase by first in this cavity 12, two chambers 123,124 thermal resistance, and produce the less pressure loss when making working fluid 2 pass through second capillary layer 122, and second capillary layer 122 can produce heat lock (heat lock) effect, the heat leak situations that the heat that effectively prevents first capillary layer 121 enters in second cavity 124 take place, thereby the working fluids 2 in second chamber 124 are heated to high temperature, make the vapour-liquid biphase equilibrium that forms excessive temperature in second chamber 124, thereby produce too high saturated vapour pressure, stop the liquid working fluid 2 in the body 11 to be got back in second chamber 124, this structure not only can satisfy provides this loop circuit heat pipe structure 1 whole required capillary force, can make the loop circuit heat pipe structure 1 can be again, and produce less local thermal resistance in running smoothly under the standard or under the weightless condition.
The above is preferred embodiment of the present utility model only, is not to be used for limiting the scope that the utility model is implemented.So be that all equalizations of doing according to described feature of the utility model application range and spirit change or modification, all should be included in the claim of the present utility model.
Claims (12)
1. a loop circuit heat pipe structure is characterized in that, comprises:
One body has one first end, one second end and a passage, described first end of this channel connection and described second end;
One cavity, have one first chamber, one second chamber, working fluid and a bottom, described first chamber has one first connecting hole, described second chamber has one second connecting hole, and a side of this second chamber extends a support column, and described first connecting hole, described second connecting hole are connected with first end, second end of described body respectively;
One first capillary layer is covered in top, described bottom;
One second capillary layer is covered in described first capillary layer top;
Many grooves, selection is arranged at the bottom of this first capillary layer or described cavity.
2. loop circuit heat pipe structure as claimed in claim 1, it is characterized in that, described cavity has more a lid and a base plate, cover corresponding with this base plate of described lid defined described first chamber and second chamber, described first capillary layer, described second capillary layer are located on the described base plate, and these many grooves select to be arranged at the base plate of this first capillary layer or described cavity.
3. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, this cavity has more a work body, and described work body is selected to be connected with described first chamber or described second chamber.
4. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described first capillary layer and described two capillary layers are chosen as agglomerated powder opisthosoma, grid body, carbon fiber or graphite.
5. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, effective capillary radius of described second capillary layer is greater than effective capillary radius of this first capillary layer.
6. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, the described second capillary layer conductive coefficient is lower than the conductive coefficient of this first capillary layer.
7. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described body string overlaps many radiating fins.
8. loop circuit heat pipe structure as claimed in claim 2 is characterized in that, described lid and this base plate are xenogenesis material or material of the same race.
9. loop circuit heat pipe structure as claimed in claim 2 is characterized in that, the material of described lid is stainless steel and carbon steel or macromolecular material.
10. loop circuit heat pipe structure as claimed in claim 1 is characterized in that the permeability of described second capillary layer is greater than the permeability of this first capillary layer.
11. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described body connects establishes a condensing unit.
12. loop circuit heat pipe structure as claimed in claim 1 is characterized in that, described body connects establishes a water cooling plant.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200867723U CN202008994U (en) | 2011-03-29 | 2011-03-29 | Loop heat pipe structure |
| TW100209287U TWM414570U (en) | 2011-03-29 | 2011-05-24 | Loop-configured heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200867723U CN202008994U (en) | 2011-03-29 | 2011-03-29 | Loop heat pipe structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202008994U true CN202008994U (en) | 2011-10-12 |
Family
ID=44750653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200867723U Expired - Fee Related CN202008994U (en) | 2011-03-29 | 2011-03-29 | Loop heat pipe structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202008994U (en) |
| TW (1) | TWM414570U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616871A (en) * | 2015-01-14 | 2015-05-13 | 东南大学 | Winding type iron core magnetically controlled saturated reactor |
| CN109545597A (en) * | 2018-11-28 | 2019-03-29 | 广东电网有限责任公司电力科学研究院 | A kind of radiator of solid-state switch |
| CN110118501A (en) * | 2018-02-05 | 2019-08-13 | 新光电气工业株式会社 | Loop circuit heat pipe and its manufacturing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI573975B (en) * | 2014-02-18 | 2017-03-11 | Liquid - air split - type heat exchange chamber | |
| TW201538913A (en) * | 2014-04-11 | 2015-10-16 | Auras Technology Co Ltd | Loop type uniform temperature plate |
-
2011
- 2011-03-29 CN CN2011200867723U patent/CN202008994U/en not_active Expired - Fee Related
- 2011-05-24 TW TW100209287U patent/TWM414570U/en not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104616871A (en) * | 2015-01-14 | 2015-05-13 | 东南大学 | Winding type iron core magnetically controlled saturated reactor |
| CN110118501A (en) * | 2018-02-05 | 2019-08-13 | 新光电气工业株式会社 | Loop circuit heat pipe and its manufacturing method |
| CN110118501B (en) * | 2018-02-05 | 2022-02-08 | 新光电气工业株式会社 | Loop heat pipe and manufacturing method thereof |
| CN109545597A (en) * | 2018-11-28 | 2019-03-29 | 广东电网有限责任公司电力科学研究院 | A kind of radiator of solid-state switch |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM414570U (en) | 2011-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING QIHONG TECHNOLOGY R+D CENTER CO., LTD. Free format text: FORMER OWNER: ASIA VITAL COMPONENTS (SHENZHEN) CO., LTD. Effective date: 20120329 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518100 SHENZHEN, GUANGDONG PROVINCE TO: 100085 HAIDIAN, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120329 Address after: 100085, Beijing, Haidian District on the five street, No. five high building 3 on the eastern side of the two thousand Patentee after: Beijing Qihong Technology Research & Development Center Co., Ltd. Address before: 518100, Shenzhen, Guangdong province Baoan District manhole street, Xin Miao District, Western Industrial Park Patentee before: Qihong Electronics (Shenzhen) Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: 100100, Beijing, Wangjing, Chaoyang District new industrial zone 3 block, Wangjing science and technology development building, four floor, A3A01 Patentee after: Beijing Qihong Technology Research & Development Center Co., Ltd. Address before: 100085, Beijing, Haidian District on the five street, No. five high building 3 on the eastern side of the two thousand Patentee before: Beijing Qihong Technology Research & Development Center Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111012 Termination date: 20190329 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |