TW201538913A - Loop type uniform temperature plate - Google Patents

Abstract

The present invention provides a loop type uniform temperature plate, which includes two plate bodies and a plurality of ring slots formed between the two plate bodies. A separation part is arranged in the ring slot. The ring slots at two ends of the separation part are in communication with each other only through the micro channels of the separation part. Working fluid is provided in the ring slot. In use, a heat source corresponds to one end of the separation part of each ring slot, so that the working fluid around the end is vaporized as gas while the working fluid around the other end remains to be fluid. Therefore, the two ends of the separation part have temperature difference and pressure difference for further driving the gas to move for one circle along the ring slot. At the time of circularly moving the gas, heat energy is distributed to various portions of the plate bodies, and the gas is cooled to be liquid that arrives at the other end of the separation part and finally returns to the starting end through the micro channels. Because the speed of moving heat energy by the working fluid is much faster than the heat conduction of the material itself, the heat conducting speed can be effectively increased.

Description

Loop type uniform temperature plate

The present invention relates to a heat conduction device for an electronic product, and more particularly to a temperature equalization plate for a computer or a communication product.

In the prior art electronic products, in order to prevent the heat radiated from various components such as the processor from being concentrated in one place and being too hot, the user feels uncomfortable when touching, so a uniform temperature plate is often provided to uniformly heat the heat. The prior art temperature equalizing plate is a metal foil, wherein the heat source is contacted near one side, and the heat of the heat source is transmitted to the entire temperature equalizing plate through the heat conduction property of the material to achieve uniform heat of the heat source. The purpose of the transfer.

However, with the rapid development of technology, more and more heat is emitted from components such as processors in electronic products, and the prior art uniform temperature plate only transmits heat through its own material, and its heat conduction speed is insufficient to cope with the new high. Components such as power processors are therefore subject to improvement.

In view of the shortcomings and deficiencies of the prior art described above, the present invention provides a loop type temperature equalizing plate which can effectively increase the speed of heat conduction.

In order to achieve the above-mentioned creative purposes, the technical means adopted in this creation is to design a loop type temperature equalizing plate, which comprises: two plates, which are fixedly fixed on the upper and lower sides, each plate body comprises an inner side surface and an outer side surface, two boards The inner side of the body is in contact with each other; at least one annular groove is formed between the two plates, and each ring groove is provided with a partition portion, and at least one fine passage is penetrated through the partition portion, and the ring groove at the two ends of the partition portion only transmits the same The microchannels are connected; the working fluid is provided in each ring groove.

In the present application, the position of the heat source corresponds to one end of the partition of each ring groove, so that the working fluid at the end is evaporated into gas by heat, and the working fluid at the other end of the partition is not directly heated. Still liquid, so the two ends of the partition cause a temperature difference to produce a different saturated vapor pressure, which drives the gas to move to the liquid, but the capillary pressure is generated by the fine passage of the partition, so that the gas does not Entering the micro-channel, and going around the ring groove to reach the other end of the partition, the gas simultaneously dissipates heat to the whole body during the surrounding movement, and thus cools into a liquid and comes to the partition. At one end, at this time, the fine passage of the partition again generates capillary pressure, so that the liquid is backfilled to the starting end of the partition through the fine passage to be heated and evaporated; this creation uses the circulating fluid of the working fluid to move the heat and evenly transfer the heat. The working fluid moves the heat much faster than the material itself, so the purpose of improving the thermal conductivity can be achieved.

Further, the circuit type temperature equalizing plate has a bottom surface of each annular groove protruding from an outer side surface of the corresponding plate body. Thereby, the ring groove has a larger space, or the plate body can be made thinner than the ring groove.

The technical means adopted by the present invention for achieving the intended purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.

Referring to FIG. 1 to FIG. 3 , the following is a first embodiment of the loop type temperature equalizing plate of the present invention, which comprises two plates 10 and a ring groove 20 .

The two boards 10 are vertically and affixed to each other, and each of the boards 10 includes an inner side surface and an outer side surface. The inner side surfaces of the two board bodies 10 are fitted together; each of the board bodies 10 is rectangular, but not limited thereto.

The ring groove 20 is formed between the two plates 10, and the ring groove 20 is concavely formed on the inner side surface of the two plate bodies 10, and the bottom surface of the ring groove 20 protrudes from the outer side surfaces of the two plate bodies 10, so that the ring groove 20 is formed. There is a larger space, or the plate body 10 can be thinned except for the ring groove 20, but the shape of the ring groove 20 is not limited thereto; for example, as shown in FIG. 4, it is the second of the creation. In an embodiment, the bottom surface of the annular groove 20A does not protrude from the outer side surface of the two plate bodies 10A; or, as shown in FIG. 5, which is a third embodiment of the present invention, wherein the annular groove 20B is only concavely formed The inner side of one of the plates 10B, and the bottom surface of the annular groove 20B protrudes from the outer side of the plate 10B; or, please refer to FIG. 6, which is a fourth embodiment of the present invention, wherein the ring groove 20C Only the inner side surface of one of the plate bodies 10C is concavely formed, and the bottom surface of the ring groove 20C does not protrude from the outer side surface of the plate body 10C.

Referring to FIG. 1 to FIG. 3, back to the first embodiment, the ring groove 20 is surrounded by the outer contour of the rectangular plate body 10, and is also rectangular, but not limited thereto, the ring groove 20 can also be used regardless of the plate. The shape of the body 10 is other shapes.

A partitioning portion 30 is defined in the ring groove 20, and a plurality of microchannels 31 are formed in the partitioning portion 30. The annular groove 20 at the two ends of the partitioning portion 30 communicates only through the microchannels 31. In the embodiment, the partitioning portion 30 is The material of the low heat conductive material, and further, the partition portion 30 is a material having a thermal conductivity lower than 100, but is not limited thereto. In addition, in the embodiment, the partition portion 30 is a capillary structure, and specifically, the partition portion 30 may be a block having a plurality of linear passages, as shown in FIG. 2, or the partition 30 may be a block made of a porous material, and the irregular holes may also be used as a fine track, thus having the same The function of the capillary structure is also to directly weld the low-heat-conducting metal between the two plates 10, so that it can also be used as the partition portion 30, and the hole formed by the metal welding is a fine track, so that the capillary is also the same. The function of the structure; working fluid is arranged in each ring groove 20, and the working fluid can be water or refrigerant.

In the present use, the position of the heat source corresponds to one end of the partition 30 of the ring groove 20, for example, the end is abutted against the heat source, so that the working fluid at the end is heated to be vaporized by the heat, and the partition 30 The working fluid at the other end is not directly heated and remains liquid, so that the temperature difference between the two ends of the partition 30 produces a different saturated vapor pressure, which drives the gaseous working fluid to move to the liquid working fluid, but Since the microchannel 31 of the partition 30 generates capillary pressure, the high temperature and high pressure gaseous working fluid cannot enter the microchannel 31, and will surround the annular groove 20, and the gaseous working fluid will simultaneously move during the surrounding movement. The heat is dissipated to all parts of the plate body 10, and thus cooled to the other end of the partition portion 30, at which time the microchannel 31 of the partition portion 30 again generates capillary pressure, and the liquid working fluid is backfilled through the microchannel 31 to The starting end of the partition 30 is again heated and evaporated; the creation is thereby circulated through the working fluid to move the heat and evenly transfer the heat, and the working fluid is moved. The speed of the moving heat is much faster than that of the plate 10 through its own material, so that the purpose of improving the heat transfer speed can be achieved.

In addition, in the present embodiment, the center of the two plates 10 has a through hole 11 penetrating vertically, and the two plates 10 are annular, and the shapes and sizes of the two holes 11 are the same, and the positions of the two holes 11 are corresponding; In one case, the space occupied by the creation can be effectively reduced, and the various components in the electronic product can be arranged in the perforation 11; however, as shown in FIG. 7, which is the fifth embodiment of the creation, the board 10D itself It also has a certain heat conduction function. Therefore, if there is no need to avoid the position, the perforation may not be provided, and the heat of the heat source may be transmitted to the center of the plate body 10D.

Furthermore, if it is desired to efficiently transfer heat to the center of the plate body, please refer to FIG. 8 , which is a sixth embodiment of the present invention, wherein the ring groove 20E is substantially rectangular, but the ring groove 20E includes a plurality of curved sections 21E, the curved sections 21E are connected to each other, and each curved section 21E is bent and extended into a position surrounded by the annular groove 20E, and then bent and extended to join the next curved section 21E, thereby effectively lengthening The length of the path is to accommodate more working fluid, and the heat of the heat source can be quickly transmitted to the center of the plate body 10E through the working fluid, thereby making the heat conduction more uniform.

Moreover, in addition to the above-mentioned heat transfer to the center of the plate body in a curved section, a plurality of ring grooves may be provided to achieve a similar effect, for example, the following seventh embodiment, as shown in FIG. 9, which includes There are three annular grooves 20F, and further includes two communicating chambers 40F; the annular grooves 20F are sleeved with each other concentrically; each of the communicating chambers 40F is connected between the adjacent two ring grooves 20F, and adjacent to the two The ring grooves 20F are connected to each other; and the partition portions 30F of the ring grooves 20F extend into the communication chamber 40F so that the partition portions 30F of the ring grooves 20F can be integrally connected to each other; thus, the heat of the heat source can also pass through the communication chamber 40F. It moves into different annular grooves 20F and can be transferred to all parts of the plate body 10F for uniform heat transfer.

In addition, if the communication room of the seventh embodiment is removed, please refer to FIG. 10, which is an eighth embodiment of the present invention. Thus, the three ring grooves 20G can be respectively used for three heat sources, and respectively three The heat of one heat source is transmitted evenly.

Finally, when the heat source is located at the center of the board body 10, please refer to FIG. 11, which is a ninth embodiment of the present invention, in which there are two ring slots 20H, which are connected and connected, and have a The central portion of the common portion 22H and the common portion 22H are used together for the two ring grooves 20H; the two ring grooves 20H have a partition portion 30H, and the partition portion 30H is located in the common portion 22H and is used together by the two ring grooves 20H. The heat at the center of the plate body 10H can be transmitted outward.

The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.

10‧‧‧ board
11‧‧‧Perforation
20‧‧‧ Ring groove
30‧‧‧Departure
31‧‧‧Micro-channel
10A‧‧‧ board
20A‧‧‧ Ring groove
10B‧‧‧ board
20B‧‧‧ Ring groove
10C‧‧‧ board
20C‧‧‧ Ring groove
10D‧‧‧ board
10E‧‧‧ board
20E‧‧‧ ring groove
21E‧‧‧Bend section
10F‧‧‧ board
20F‧‧‧ ring groove
30F‧‧‧Departure
40F‧‧‧Connecting room
20G‧‧‧ ring groove
10H‧‧‧ board
20H‧‧‧ Ring groove
22H‧‧‧Shared section
30H‧‧‧Departure

Figure 1 is a perspective view of the first embodiment of the present invention. Figure 2 is an exploded perspective view of the first embodiment of the present invention. Figure 3 is a schematic cross-sectional view of the first embodiment of the present invention. Figure 4 is a schematic end elevational view of a second embodiment of the present invention. Figure 5 is a schematic cross-sectional view showing the third embodiment of the present invention. Figure 6 is a schematic cross-sectional view showing the fourth embodiment of the present invention. Fig. 7 is a perspective view showing the appearance of a fifth embodiment of the present invention. Figure 8 is a top plan view of the ring groove of the sixth embodiment of the present invention. Figure 9 is a top plan view of the ring groove of the seventh embodiment of the present invention. Figure 10 is a top plan view of the ring groove of the eighth embodiment of the present invention. Figure 11 is a top plan view of the ring groove of the ninth embodiment of the present invention.

10‧‧‧ board

11‧‧‧Perforation

20‧‧‧ Ring groove

30‧‧‧Departure

Claims (10)

A circuit type temperature equalizing plate comprises: two plates, which are fixedly attached to each other, each plate body comprises an inner side surface and an outer side surface, and the inner side surfaces of the two plate bodies are fitted together; at least one ring groove is formed on the two plate bodies A partitioning portion is disposed in each of the annular grooves, and at least one fine passage is formed in the partitioning portion. The annular groove at the two ends of the partitioning portion communicates only through the fine passages; and the working fluid is disposed in each annular groove. The circuit type temperature equalizing plate according to claim 1, wherein each of the ring grooves is concavely formed on the inner side surfaces of the two plates. The circuit type temperature equalizing plate according to claim 1, wherein each of the ring grooves is only concavely formed on an inner side surface of one of the plates. The circuit type temperature equalizing plate according to any one of claims 1 to 3, wherein a bottom surface of each annular groove protrudes from an outer side surface of the corresponding plate body. The circuit type temperature equalizing plate according to any one of claims 1 to 3, wherein a plurality of annular grooves are included, and the annular grooves are concentrically arranged with each other. The circuit type temperature equalizing plate according to claim 5, further comprising at least one communication chamber, wherein each of the communication chambers is connected between the adjacent two ring grooves and communicates with the adjacent two ring grooves; each ring groove The partitions extend into the communication chamber, and the partitions of the respective ring grooves are connected to each other. The loop type temperature equalizing plate according to any one of claims 1 to 3, wherein the two ring grooves are connected and communicated, and have a common section, the two ring grooves have a partition And the partition is located in the common section. The circuit type temperature equalizing plate according to any one of claims 1 to 3, wherein a ring groove comprises a plurality of curved segments which are connected to each other, and each of the curved segments is bent and extended into the ring groove, and then The bend extends. The loop type temperature equalizing plate according to any one of claims 1 to 3, wherein a center of the two plates penetrates a perforation at a center. The circuit type temperature equalizing plate according to any one of claims 1 to 3, wherein the partition is a capillary structure.