TWM578370U - Vapor chamber and heat dissipation device having the same - Google Patents

Abstract

This present invention discloses a vapor chamber and heat dissipation device having the same. The vapor chamber includes a first plate, a second plate. A chamber is formation between the first plate and second plate. A capillary structure bar is disposed in the chamber to formation a first zone and a second zone. A connection structure disposed is disposed in the capillary structure bar and connected the first zone and a second zone. A working fluid disposed in the chamber and flow between the first zone and a second zone through the connection structure.

Description

Temperature equalization plate and heat dissipation device with the temperature equalization plate

The present invention relates to a heat dissipation device, in particular to a temperature equalizing plate.

Many processor chips and image processor chips are usually installed in computer equipment. Because these chips often generate extremely high temperatures during operation, heat dissipation devices are required to dissipate heat to prevent chip damage. The most common Thermal contact of the temperature equalizing plate allows the heat energy generated by the wafer to be transferred to the temperature equalizing plate, and then the working medium inside the temperature equalizing plate takes the thermal energy away from the position of the wafer, and releases the heat energy through the working medium to keep the wafer and surrounding area maintained At the right temperature.

The conventional temperature equalizing plate has a cavity inside, and a working medium is contained in the cavity. After the working medium absorbs the heat energy of the chip, it will diffuse into the cavity in all directions. If it spreads to a position that is unfavorable for heat dissipation, or if multiple chips use the same temperature equalization plate at the same time, the working medium cannot effectively diffuse to a position that is easy to dissipate And release the heat energy, so the heat dissipation effect is not good. There is still room for improvement in the conventional thermostat.

In order to solve the problems of the conventional technology, the present invention provides a temperature equalizing plate and a heat dissipation device with the temperature equalizing plate. The temperature equalizing plate of the new type has a working medium, a capillary strip body and a communication structure, and the communication structure is arranged in the capillary strip body. So after the working medium absorbs the heat energy It can be guided to a position suitable for heat dissipation by the capillary strip, and the working medium can be mixed through the connecting structure to accelerate the release of heat energy of the working medium and make the temperature inside the temperature equalizing plate more uniform, which can improve the heat dissipation effect.

In order to achieve the above object, the present invention provides a temperature-equalizing plate, including: a first plate body and a second plate body, the first plate body and the second plate body are sealed corresponding to each other, and the first plate body and the A chamber is formed between the second plates; a first capillary strip is arranged in the chamber, the first capillary strip is sandwiched between the first plate and the second plate and the The compartment area separates at least a first area and a second area; a first communication structure is formed in the first capillary strip and connects the first area and the second area; and, a working medium, Accommodated in the chamber, the working medium can pass through the first communication structure and flow between the first area and the second area.

Preferably, the first communication structure is formed in the entire section of the first capillary strip or in the partial section of the first capillary strip.

Preferably, the first capillary strip includes a bottom and a top, the bottom contacts the first plate, and the top contacts the second plate.

Preferably, the first communication structure includes a plurality of first grooves, and the plurality of first grooves extend from the top of the first capillary strip to the bottom, and the plurality of first grooves communicate The first area and the second area.

Preferably, the plurality of first grooves are not recessed to penetrate the bottom of the first capillary strip, so that the bottom maintains a continuous structure.

Preferably, the working medium can flow between the first area and the second area through the plurality of first grooves.

Preferably, the first plate body includes a first capillary structure, and the first capillary structure contacts the bottom of the first capillary strip body.

Preferably, the second plate body includes a second capillary structure, and the second capillary structure contacts the top of the first capillary strip.

Preferably, the first communication structure includes a plurality of through holes, the plurality of through holes are disposed inside the first capillary strip, and the plurality of through holes communicate with the first area and the second area.

Preferably, the temperature equalizing plate further includes a plurality of support columns, the plurality of support columns are disposed in the chamber and sandwiched between the first plate body and the second plate body, the plurality of support columns do not contact the first A capillary strip, and the position of the plurality of support columns may correspond to the position of the first communication structure.

Preferably, the temperature equalizing plate further includes a second capillary strip body and a second communication structure, the second capillary strip body is disposed in the first area or the second area of the chamber, the second communication structure is formed In the second capillary strip.

Preferably, the second capillary strip body and the first capillary strip body are not in contact with each other, and the positions where the second communication structure is formed and the positions where the first communication structure is formed are alternately spaced from each other.

Preferably, the chamber of the temperature equalizing plate includes a heat absorption area and a condensation area, and the first capillary strip extends from the heat absorption area to the condensation area.

In order to achieve the above purpose, the present invention provides a heat dissipation device with a temperature equalizing plate. The heat dissipation device can make thermal contact with a first heat source. The heat dissipation device includes: A temperature equalizing board, the temperature equalizing board includes: a first plate body and a second plate body, the first plate body and the second plate body are sealed corresponding to each other, and the first plate body and the second plate A chamber is formed between the bodies, the chamber includes a heat absorption area and a condensation area; a first capillary strip body is disposed in the chamber and sandwiched between the first plate body and the second plate body , The first capillary strip extends from the heat absorption area of the chamber to the condensation area and separates the chamber area from at least a first area and a second area; a first communication structure is formed in the first A capillary strip connected to the first area and the second area; a working medium is contained in the chamber, the working medium can pass through the first communication structure and flow in the first area and the first area Between the two regions; and, the first heat source thermally contacts the temperature equalizing plate and corresponds to the position of the heat absorption region of the chamber.

Preferably, after the working medium absorbs the heat generated by the first heat source, the first capillary strip guides the working medium to flow from the heat absorption area to the condensation area.

Preferably, the first communication structure of the temperature equalizing plate is formed in all sections of the first capillary strip body or a partial section of the first capillary strip body.

Preferably, the temperature equalizing plate includes a liquid storage structure, which is disposed in the chamber and located in the heat absorption area.

Preferably, the first capillary strip includes a bottom and a top, the bottom contacts the first plate, and the top contacts the second plate.

Preferably, the first communication structure includes a plurality of first grooves, and the plurality of first grooves extend from the top to the bottom of the first capillary strip, and do not penetrate the first The bottom of the capillary strip maintains the bottom in a continuous structure, and the plurality of first grooves connect the first area and the second area.

Preferably, the working medium may pass through the plurality of first grooves and flow between the first area and the second area.

Preferably, the first plate body includes a first capillary structure, and the first capillary structure contacts the bottom of the first capillary strip body.

Preferably, the second plate body includes a second capillary structure, and the second capillary structure contacts the top of the first capillary strip.

Preferably, the first communication structure includes a plurality of through holes, the plurality of through holes are disposed inside the first capillary strip, and the plurality of through holes communicate with the first area and the second area.

Preferably, the temperature equalizing plate further includes a plurality of support columns, the plurality of support columns are disposed in the chamber and sandwiched between the first plate body and the second plate body, the plurality of support columns do not contact the first A capillary strip, and the position of the plurality of support columns may correspond to the position of the first communication structure.

Preferably, the temperature equalizing plate further includes a second capillary strip body and a second communication structure, the second capillary strip body is disposed in the first area or the second area of the chamber, the second communication structure is formed In the second capillary strip body, the second capillary strip body and the first capillary strip body are not in contact with each other, and the positions where the second communication structure is formed and the positions where the first communication structure is formed are alternately spaced from each other.

Preferably, the heat dissipation device can make thermal contact with a second heat source, the second heat source thermally contacts the temperature equalizing plate and corresponds to the position of the heat absorption area of the chamber, and the second heat source does not contact the first heat source .

1, 3‧‧‧ temperature board

2‧‧‧radiating device

10.60‧‧‧Room

101, 601‧‧‧ First area

102, 602‧‧‧ second area

103、603‧‧‧Endothermic area

104, 604‧‧‧ heat dissipation area

11, 61‧‧‧ First board

111、611‧‧‧First capillary structure

112、612‧‧‧First inner surface

12, 62‧‧‧Second plate

121、621‧‧‧Second capillary structure

122、622‧‧‧Second inner surface

13, 64‧‧‧support column

20、70‧‧‧The first capillary strip

21, 71‧‧‧ bottom

22, 72‧‧‧ top

30、80‧‧‧The first connection structure

31, 81‧‧‧ First groove

32、82‧‧‧Through hole

40, 90‧‧‧ working medium

50、73‧‧‧Second capillary strip

51、731‧‧‧Second connected structure

63‧‧‧ liquid storage structure

G1, G4‧‧‧First mixed flow direction

G2, G5‧‧‧second mixed flow direction

G3, G6‧‧‧cooling direction

H‧‧‧The first heat source

I‧‧‧Second heat source

FIG. 1 is a three-dimensional schematic diagram of a temperature equalizing plate according to a first preferred embodiment of the new type.

FIG. 2 is a three-dimensional exploded view of the temperature equalizing plate of the first preferred embodiment of the new type.

FIG. 3 is a three-dimensional exploded view of a temperature equalizing plate with different structural changes in which the first communication structure of the first preferred embodiment of the present invention is formed in the first capillary strip.

4 is a side view of the first plate body, the second plate body and the first capillary strip body of the first preferred embodiment of the new type.

FIG. 5 is a schematic perspective view of a partial area of the temperature equalizing plate of the first preferred embodiment of the new type.

6 is a side view of the first plate body, the second plate body and the first capillary strip body of the second preferred embodiment of the new type.

7 is a side view of the first plate body, the second plate body and the first capillary strip body of the third preferred embodiment of the new type.

8 is a side view of the first plate body, the second plate body and the first capillary strip body of the fourth preferred embodiment of the new type.

9 is a side view of the first plate body and the second plate body and the first capillary strip body of the fifth preferred embodiment of the new type.

10 is a schematic perspective view of a partial area of a temperature equalizing plate of a fifth preferred embodiment of the new type.

11 is a schematic perspective view of a partial area of a temperature equalizing plate of a sixth preferred embodiment of the new type.

12 is a schematic perspective view of a partial area of a temperature equalizing plate according to a seventh preferred embodiment of the new model.

13 is a schematic perspective view of a heat dissipation device of the eighth preferred embodiment of the new model.

14 is an exploded perspective view of the heat dissipation device of the eighth preferred embodiment of the new model.

15 is a side view of the first plate body, the second plate body, and the first capillary strip body of the ninth preferred embodiment of the present invention.

16 is a schematic perspective view of a partial area of a heat dissipation device of the tenth preferred embodiment of the new model.

17 is a schematic perspective view of a partial area of a heat dissipation device according to an eleventh preferred embodiment of the new model.

18 is a schematic perspective view of a partial area of a heat dissipation device according to a twelfth preferred embodiment of the new model.

The following is a description of preferred embodiments of the present invention and accompanying drawings.

First, the first preferred embodiment of the present invention will be described. Please refer to FIG. 1 a three-dimensional schematic view of the temperature equalizing plate of the first preferred embodiment of the present invention, and FIG. 2 that the first communication structure of the first preferred embodiment of the new form of the temperature equalizing plate is formed in all sections of the first capillary strip 3D exploded view and FIG. 3 is a 3D exploded view of the temperature equalizing plate of the first communication structure of the first preferred embodiment of the present invention formed in a portion of the first capillary strip. The temperature equalizing plate 1 of the present invention includes a chamber 10, a first plate body 11, a second plate body 12, a first capillary strip body 20, a first communication structure 30, and a working medium 40. The chamber 10 includes a heat absorption area 103 and a condensation area 104. The first communication structure 30 includes a plurality of first grooves 31. The first plate body 11 and the second plate body 12 are sealed corresponding to each other, and a chamber 10 is formed between the first plate body 11 and the second plate body 12. The first capillary strip body 20 is disposed in the chamber 10 and sandwiched between the first plate body 11 and the second plate body 12, and the first capillary strip body 20 extends from the heat absorption area 103 of the chamber 10 to the condensation area 104, so that The first capillary strip body 20 defines a first area 101 and a second area 102 in the chamber 10. The first communication structure 30 is formed in the first capillary strip body 20 and communicates the first region 101 and the second region 102. In detail, the plurality of first grooves 31 of the first communication structure 30 are recessed in the first capillary strip body 20 and allow the plurality of first grooves 31 to communicate between the first region 101 and the second region 102. The working medium 40 is accommodated in the chamber 10 and can flow through the first area through the first communication structure 30 Between 101 and the second area 102.

The first communication structure 30 may be formed in all sections of the first capillary strip 20 (as shown in FIG. 2) or may have other different structures. For example, as shown in FIG. 3, the first communication structure 30 may be formed only on a partial section of the first capillary strip body 20. In detail, the first communication structure 30 is formed in all sections of the first capillary strip body 20. The first communication structure 30 is formed in all sections of the first capillary strip body 20 extending from the heat absorption area 103 to the condensation area 104 . For another variation structure, the first communication structure 30 is formed in the partial section of the first capillary strip body 20 only when the first capillary strip body 20 is located in the portion corresponding to the condensation region 104 to form the first communication structure 30. Subsequent descriptions and other embodiments and drawings will be explained by taking the first communication structure 30 formed on all sections of the first capillary strip body 20 as an example.

The structure of the first capillary strip 20 and the first communication structure 30 will be described later. Please refer to FIGS. 2 and 4 for the first plate body and the second plate body and the first capillary strip body side of the first preferred embodiment of the present invention. view. The first capillary strip body 20 includes a bottom 21 and a top 22. The bottom 21 contacts and fits the first plate 11, and the top 22 contacts and fits the second plate 12. The first capillary strip body 20 can support the first plate body 11 and the second plate body 12 and keep the chamber 10 formed between the first plate body 11 and the second plate body 12 from being depressed. The plurality of first grooves 31 of the first communication structure 30 extends from the top 22 of the first capillary strip 20 toward the bottom 21, and communicates with the first region 101 and the second region 102. No recesses penetrate the bottom 21 of the first capillary strip 20, so the bottom 21 maintains a continuous structure. The working medium 40 may flow between the first area 101 and the second area 102 through the plurality of first grooves 31, and the working medium 40 may also enter the first capillary strip body 20 and flow at the bottom 21.

For the description of the working state of the working medium 40, please refer to FIG. 5 A three-dimensional schematic view of the partial area of the temperature-averaging plate of the preferred embodiment. After absorbing thermal energy, the working medium 40 will change from a liquid state to a gaseous state, and after the gaseous working medium 40 releases the heat energy, it will be recondensed from the gaseous state back to the liquid state. When the working medium 40 absorbs heat energy in the heat absorption region 103 of the chamber 10, it will change to a gaseous state and begin to diffuse in the chamber 10. The first capillary strip body 20 can guide or restrict the working medium 40 to flow in a heat dissipation direction G3. The heat dissipation direction G3 is a direction extending from the heat absorption area 103 to the condensation area 104. 40 reaches the condensation area 104 more quickly, so that the working medium 40 releases heat energy in the condensation area 104 to dissipate heat. At the same time, the working medium 40 does not diffuse uniformly in the chamber 10, the first area 101 of the chamber 10 may concentrate a large amount of working medium 40, but the working medium 40 flowing to the second area 102 is relatively small, or vice versa The working medium 40 may also be concentrated in the second area 102 and flow less to the first area 101. At this time, since the plurality of first grooves 31 of the first communication structure 30 on the first capillary strip body 20 communicate with the first region 101 and the second region 102, a first mixed flow direction G1 and A second mixed flow direction G2. The first mixed flow direction G1 is a direction extending from the first region 101 to the second region 102, and the second mixed flow direction G2 is a direction extending from the second region 102 to the first region 101. In this way, the working medium 40 in the first area 101 can flow from the first area 101 to the second area 102 through the first groove 31 along the first mixing direction G1, and the working medium 40 in the second area 102 can also The second mixed flow direction G2 flows from the second region 102 to the first region 101 through the first groove 31, so that the fluidity and diffusibility of the working medium 40 are increased to improve the heat dissipation effect. After the working medium 40 releases heat energy in the condensation area 104 and condenses and returns to a liquid state, the first capillary strip 20 can absorb the working medium 40 and cause the working medium 40 to flow back to the heat absorption area along the bottom 21 of the first capillary strip 20 Near 103.

To continue the description of the second preferred embodiment of the present invention, please refer to FIG. 6 Side view of the first plate body and the second plate body and the first capillary strip body in the embodiment. The second preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the first plate body 11 includes a first capillary structure 111. The first capillary structure 111 is disposed on a first inner surface 112 of the first plate body 11 and contacts the bottom 21 of the first capillary strip body 20. The first capillary structure 111 can allow the liquid working medium 40 to enter and assist the first capillary strip body 20 to transport the liquid working medium 40, increasing the circulation of the liquid working medium 40.

To continue the description of the third preferred embodiment of the present invention, please refer to the side view of the first and second plates and the first capillary strip in the third preferred embodiment of FIG. 7. The third preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the second plate body 12 includes a second capillary structure 121. The second capillary structure 121 is disposed on a second inner surface 122 of the second plate body 12 and contacts the top 22 of the first capillary strip body 20. The second capillary structure 121 can allow the working medium 40 to enter and assist the first capillary strip 20 to transport the liquid working medium 40, increasing the circulation of the working medium 40.

To continue the description of the fourth preferred embodiment of the present invention, please refer to FIG. 8 which is a side view of the first and second plates and the first capillary strip of the fourth preferred embodiment of the present invention. The fourth preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the first plate body 11 includes a first capillary structure 111, and the second plate body 12 includes a second capillary structure 121. The first capillary structure 111 is disposed on a first inner surface 112 of the first plate body 11 and contacts the bottom 21 of the first capillary strip body 20, and the second capillary structure 121 is disposed on a second of the second plate body 12 The inner surface 122 is in contact with the top 22 of the first capillary strip 20. The first capillary structure 111 and the second capillary structure 121 sandwich the first capillary strip body 20, and both the first capillary structure 111 and the second capillary structure 121 can allow the working medium 40 to enter and assist the first capillary strip body 20 The liquid working medium 40 is transported to increase the circulation of the working medium 40.

For a description of the fifth preferred embodiment of the present invention, please refer to FIG. 9 a side view of the first and second plates and the first capillary strip of the fifth preferred embodiment of the present invention and FIG. 10 of the fifth preferred embodiment of the present invention An example is a three-dimensional schematic view of a local area of a temperature-averaging plate. The fifth preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the first communication structure 30 includes a plurality of through holes 32. The through hole 32 is provided inside the first capillary structure 20 and communicates with the first area 101 and the second area 102, and the through hole 32 does not contact the first plate body 11 or the second plate body 12. The working medium 40 in the chamber 10 may flow between the first region 101 and the second region 102 along the first mixed flow direction G1 or the second mixed flow direction G2 through the through hole 21.

For the description of the sixth preferred embodiment of the present invention, please refer to FIG. 11, which is a perspective view of a partial area of the temperature equalizing plate of the sixth preferred embodiment of the present invention. The sixth preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the temperature equalizing plate 1 includes a plurality of support columns 13. The support column 13 is disposed inside the chamber 10 and sandwiched between the first plate body 11 and the second plate body (not shown in FIG. 10), and the support column 13 does not contact the first capillary strip body 20. The position of the partial support column 13 may correspond to the position of the first communication structure 30. In detail, the support column 13 is disposed in front of the position corresponding to the recess of the first communication structure 30, when the working medium 40 flows along the first mixed flow direction G1 or the second mixed flow direction G2 in the first area 101 and the second area Between 102, the working medium 40 can bypass the supporting column 13 in front of the first communication structure 30, so that the flow of the working medium 40 is more dispersed and the uniformity of the flow of the working medium 40 is increased. The support column 13 can also be used to support the chamber 10 so that the space of the chamber 10 is not easily deformed. The support column 13 may be a capillary powder column or a metal column.

For the description of the seventh preferred embodiment of the present invention, please refer to FIG. 12, which is a perspective view of a partial area of the temperature equalizing plate of the seventh preferred embodiment of the present invention. The seventh preferred embodiment of the present invention is substantially the same as the first preferred embodiment, except that the temperature equalizing plate 1 includes a first capillary strip 20 and a first The through structure 30, a second capillary strip 50 and a second communication structure 51. The first capillary strip body 20 and the first communication structure 30 are the same as the first embodiment. The second capillary strip body 50 corresponds to the first capillary strip body 20, and the second communication structure 51 is formed in the second capillary strip body 50. The second capillary strip 50 can be disposed in the first area 101 or the second area 102 partitioned by the first capillary strip 20 in the chamber 10. In this embodiment, the second capillary strip 50 is disposed in the first The second area 102 will be described. The structure of the second capillary strip body 50 is the same as the structure of the first capillary strip body 20, and the second capillary strip body 50 and the first capillary strip body 20 are not separated from each other. The second communication structure 51 and the first communication structure 30 are not in contact with each other, and the position where the second communication structure 51 is recessed does not correspond to the position where the first communication structure 30 is recessed, so that the second communication structure 51 and the first The recessed positions of a communication structure 30 are alternately arranged at intervals. When the working medium 40 flows between the first region 101 and the second region 102 along the first mixed flow direction G1 or the second mixed flow direction G2, the working medium 40 passes through the first communication structure 30 and the second communication structure 51 , And can alternately flow between the first communication structure 30 and the second communication structure 51 to increase the uniformity of the working medium 40 flow.

For the heat dissipation device 2 of the eighth preferred embodiment of the present invention, please refer to FIG. 13 is a perspective schematic view of the heat dissipation device of the eighth preferred embodiment of the present invention and FIG. 14 is a perspective exploded view of the heat dissipation device of the eighth preferred embodiment of the present invention. The heat dissipation device 2 with a temperature equalizing plate of the present invention can make thermal contact with a first heat source H and / or a second heat source I. The heat dissipation device 2 includes a temperature equalizing plate 3, the temperature equalizing plate 3 includes a chamber 60, a first plate 61, a second plate 62, a first capillary strip 70, a first communication structure 80, A liquid storage structure 63 and a working medium 90. The first plate 61 and the second plate 62 are sealed corresponding to each other, and a chamber 60 is formed between the first plate 61 and the second plate 62. The chamber 60 includes a heat absorption area 603 and a condensation area 604. The first capillary strip 70 is disposed in the chamber 60 and sandwiched between the first plate 61 and the second plate 62, and the first capillary strip 70 is removed from the heat absorption area of the chamber 60 The area 603 extends to the condensation area 604, so that the first capillary strip 70 partitions a first area 601 and a second area 602 in the chamber 60. The first communication structure 80 is formed in the first capillary strip 70 and connects the first area 601 and the second area 602. The first communication structure 80 may be formed in all sections of the first capillary strip 70 or only The partial sections formed in the first capillary strip body 70 will be described in this embodiment and the drawings with the first communication structure 80 formed in all sections of the first capillary strip body 70. The working medium 90 is accommodated in the chamber 60 and can flow between the first region 601 and the second region 602 through the first communication structure 80. The liquid storage structure 63 is provided at the position of the heat absorption area 603 of the chamber 60 for storing the working medium 90. When the liquid working medium 90 in the chamber 60 is insufficient, the liquid storage structure 63 can release the liquid working medium 90, or The working medium 90 whose condensation is restored to a liquid state may enter the liquid storage structure 63 for storage. The first heat source H and / or the second heat source I are in thermal contact with the temperature equalizing plate 3 and are located in the heat absorption area 603 of the corresponding chamber 60, and the first heat source H and / or the second heat source I may preferably be located in the corresponding first capillary strip 70 locations around. The first heat source H and the second heat source I are not in contact with each other. The first heat source H and / or the second heat source I conduct heat energy to the temperature equalizing plate 3, and when the working medium 90 in the temperature equalizing plate 3 absorbs the heat generated by the first heat source H and / or the second heat source I, it is converted into a gaseous state And the first capillary strip body 70 guides the working medium 90 to flow from the heat absorption area 603 to the condensation area 604.

The structure of the first capillary strip body 70 and the first communication structure 80 will be continuously described. The first capillary strip body 70 includes a bottom 71 and a top 72. The bottom 71 contacts and fits the first plate 61, the top 72 contacts and fits the second plate 62, and the first capillary strip 70 can support the first plate 61 and the second plate 62 and maintain the first plate The chamber 60 formed between the body 61 and the second plate body 62 will not be recessed. The first communication structure 80 includes a plurality of first grooves 81. The plurality of first grooves 81 of the first communication structure 80 extends from the top 72 of the first capillary strip 70 toward the bottom 71, and communicates with the first region 601 and the second region 602. No recesses penetrate the first capillary strip 70 The bottom 71 of the bottom, so the bottom 71 maintains a continuous structure. The working medium 90 may flow between the first area 601 and the second area 602 through the plurality of first grooves 81, and the working medium 90 may also enter the first capillary strip 70 and flow at the bottom 71.

The flow working state of the working medium 90 will be continued. After the working medium 90 absorbs the heat energy, it will change from the liquid state to the gas state, and after the gas state working medium 90 releases the heat energy, it will be recondensed from the gas state to the liquid state again. After the working medium 90 absorbs heat energy in the heat absorption area 603 and changes into a gas state, the first capillary strip 70 guides or restricts the working medium 90 to flow in a heat dissipation direction G6, which is a direction extending from the heat absorption area 603 to the condensation area 604 Through the guidance or restriction of the first capillary strip 70, the working medium 90 reaches the condensation area 604 more quickly, so that the working medium 90 releases thermal energy in the condensation area 604 for heat dissipation. At the same time, since the plurality of first grooves 81 of the first communication structure 80 on the first capillary strip body 70 communicates the first region 601 and the second region 602, a plurality of first grooves 81 can form a first mixing direction G4 and A second mixed flow direction G5. The first mixed flow direction G4 is a direction extending from the first area 601 to the second area 602, and the second mixed flow direction G5 is a direction extending from the second area 602 to the first area 601. In this way, the working medium 90 in the first area 601 can flow from the first area 601 to the second area 602 through the plurality of first grooves 81 along the first mixing direction G4, and the working medium 90 in the second area 602 can also The second mixed flow direction G5 flows through the plurality of first grooves 81 from the second region 602 to the first region 601, so that the flow diffusivity of the working medium 90 is increased to improve the effect of heat dissipation and condensation. After the working medium 90 releases heat energy in the condensation area 604 and returns to the liquid state, it can enter the first capillary strip 70 and flow back to the heat absorption area along the bottom 71 of the first capillary strip 70. The working medium 90 returned to the heat absorbing area may perform the heat dissipation working cycle again, or enter the liquid storage structure 63 for storage.

Please refer to FIG. 15 for the ninth preferred embodiment of the present invention. Side view of the first and second plates and the first capillary strip. The ninth preferred embodiment of the present invention is substantially the same as the eighth preferred embodiment, except that the first plate 61 includes a first capillary structure 611, and the second plate 62 includes a second capillary structure 621. The first capillary structure 611 is disposed on a first inner surface 612 of the first plate 61, and contacts the bottom 71 of the first capillary strip 70 attached, and the second capillary structure 621 is disposed on a second of the second plate 62 The inner surface 622 is in contact with the top 72 of the first capillary strip 70. The first capillary structure 611 and the second capillary structure 621 sandwich the first capillary strip 70, and both the first capillary structure 611 and the second capillary structure 621 can allow the working medium 90 to enter and assist the first capillary strip 70 The liquid working medium 90 is transported to increase the circulation of the working medium 90.

For the tenth preferred embodiment of the present invention, please refer to FIG. 16, which is a schematic perspective view of a partial area of the heat dissipation device of the tenth preferred embodiment of the present invention. The tenth preferred embodiment of the present invention is substantially the same as the eighth preferred embodiment, except that the first communication structure 80 includes a plurality of through holes 82. The through hole 82 is provided inside the first capillary structure 70 and communicates with the first region 601 and the second region 602, and the through hole 82 does not contact the first plate 61 or the second plate (not shown in FIG. 15). The working medium 90 in the chamber 60 may flow between the first region 601 and the second region 602 through the through hole 82.

For an explanation of the eleventh preferred embodiment of the present invention, please refer to FIG. 17, a perspective view of a partial area of the heat dissipation device of the eleventh preferred embodiment of the present invention. The eleventh preferred embodiment of the present invention is substantially the same as the eighth preferred embodiment, except that the temperature equalizing plate 3 includes a plurality of support columns 64. The support post 64 is disposed inside the chamber 60 and sandwiched between the first plate 61 and the second plate (not shown in FIG. 16), and the support post 64 does not contact the first capillary strip 70. The position of the partial support post 64 may correspond to the position of the first communication structure 80. In detail, the supporting column 64 is placed in front of the position corresponding to the recess of the first communication structure 80, when the working medium 90 flows in the first area 601 and the second area Between 602, the working medium 90 can bypass the support column 64 in front of the first communication structure 80, so that the flow of the working medium 90 is more dispersed and the uniformity of the flow of the working medium 90 is increased. The support column 64 can also be used to support the chamber 60 so that the space of the chamber 60 is not easily deformed. The support column 64 may be a capillary powder column or a metal column.

For the description of the twelfth preferred embodiment of the present invention, please refer to FIG. 18, which is a perspective view of a partial area of the heat dissipation device of the twelfth preferred embodiment of the present invention. The twelfth preferred embodiment of the present invention is substantially the same as the eighth preferred embodiment, except that the temperature equalizing plate 3 includes a first capillary strip body 70, a first communication structure 80, and a second capillary strip Body 73 and a second communication structure 731. The first capillary strip 70 and the first communication structure 80 are the same as the eighth embodiment. The second capillary strip body 73 corresponds to the first capillary strip body 70, and the second communication structure 731 is formed in the second capillary strip body 73. The second capillary strip 73 can be disposed in the first area 601 or the second area 602 partitioned by the first capillary strip 70 in the chamber 60. In this embodiment, the second capillary strip 73 is disposed in the first The second area 602 will be described. The structure of the second capillary strip body 73 is the same as the structure of the first capillary strip body 70, and the second capillary strip body 73 and the first capillary strip body 70 are not in contact with each other. The second communication structure 731 and the first communication structure 80 are not in contact with each other, and the concave position of the second communication structure 731 does not correspond to the concave position of the first communication structure 80, so that the second communication structure 731 and the first communication structure 80 The recessed positions of a communication structure 80 are alternately arranged at intervals. When the working medium 90 flows between the first region 601 and the second region 602, the working medium 90 passes through the first communication structure 80 and the second communication structure 731, and the first communication structure 80 and the second communication The structures 731 flow alternately, increasing the uniformity of the working medium 90 flow.

The temperature-equalizing plates 1 and 3 of the present invention may be a plate body with a regular symmetrical shape or an asymmetrical shape, and may be in thermal contact with more than one heat source H and I at the same time.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the claims of the present invention. Therefore, any other equivalent changes or modifications made without departing from the spirit of the present invention should be included in the present invention. New range.

Claims (26)

A temperature-equalizing plate includes: a first plate body and a second plate body, the first plate body and the second plate body are sealed corresponding to each other, and are formed between the first plate body and the second plate body A chamber; a first capillary strip body, disposed in the chamber, the first capillary strip body is sandwiched between the first plate body and the second plate body and separates the chamber area by at least one A first region and a second region; a first communication structure formed in the first capillary strip body and connecting the first region and the second region; and, a working medium contained in the chamber The working medium can pass through the first communication structure and flow between the first area and the second area. The temperature equalizing plate as described in item 1 of the scope of the patent application, wherein the first communication structure is formed in all sections of the first capillary strip body or a partial section of the first capillary strip body. The temperature equalizing plate as described in item 1 of the patent application range, wherein the first capillary strip includes a bottom and a top, the bottom contacts the first plate, and the top contacts the second plate. The temperature equalizing plate as described in item 3 of the patent application range, wherein the first communication structure includes a plurality of first grooves, the plurality of first grooves is directed from the top of the first capillary strip to the bottom The extension is concave, and the plurality of first grooves communicate the first area and the second area. The temperature equalizing plate as described in item 4 of the patent application range, wherein the plurality of first grooves are not recessed through the bottom of the first capillary strip body, so that the bottom maintains a continuous structure. The temperature equalizing plate as described in item 4 of the patent application range, wherein the working medium can flow between the first region and the second region through the plurality of first grooves. The temperature equalizing plate as described in item 3 of the patent application range, wherein the first plate body includes a first capillary structure, and the first capillary structure contacts the bottom of the first capillary strip body. The temperature equalizing plate as described in item 3 of the patent application scope, wherein the second plate body includes a second capillary structure, and the second capillary structure contacts the top of the first capillary strip body. The temperature equalizing plate as described in Item 1 of the patent application range, wherein the first communication structure includes a plurality of through holes, the plurality of through holes are disposed inside the first capillary strip, and the plurality of through holes communicate with the first Area and the second area. The temperature equalizing plate as described in item 1 of the patent application scope, wherein the temperature equalizing plate further includes a plurality of support columns, the plurality of support columns are disposed in the chamber and sandwiched between the first plate body and the second plate Between the bodies, the plurality of support pillars do not contact the first capillary strip, and the positions of the plurality of support pillars may correspond to the positions of the first communication structure. The temperature equalizing plate as described in item 1 of the patent application scope, wherein the temperature equalizing plate further includes a second capillary strip body and a second communication structure, the second capillary strip body is disposed in the first of the chamber In the region or the second region, the second communication structure is formed in the second capillary strip. The temperature equalizing plate as described in item 11 of the patent application range, wherein the second capillary strip body and the first capillary strip body are not in contact with each other, and the position where the second communication structure is formed is in contact with the first communication structure The positions formed are staggered and spaced from each other. The temperature equalizing plate as described in item 1 of the patent application scope, wherein the chamber of the temperature equalizing plate includes a heat absorption area and a condensation area, and the first capillary strip extends from the heat absorption area to the condensation area. A heat dissipation device with a temperature equalization plate, which can make thermal contact with a first heat source, the heat dissipation device includes: a temperature equalization plate, the temperature equalization plate includes: a first plate body and a second plate body, The first plate body and the second plate body are sealed corresponding to each other, and a chamber is formed between the first plate body and the second plate body, the chamber includes a heat absorption area and a condensation area; a first The capillary strip body is disposed in the chamber and sandwiched between the first plate body and the second plate body. The first capillary strip body extends from the heat absorption area of the chamber to the condensation area and the The compartment area separates at least a first area and a second area; a first communication structure is formed in the first capillary strip and connects the first area and the second area; and, a working medium, Accommodated in the chamber, the working medium can pass through the first communication structure and flow between the first area and the second area; the first heat source thermally contacts the temperature equalizing plate and corresponds to the chamber The location of the endothermic area. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein after the working medium absorbs the heat generated by the first heat source, the first capillary strip guides the working medium to flow from the heat absorption area to the Condensation area. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application range, wherein the first communication structure of the temperature equalizing plate is formed in all sections of the first capillary strip or formed in the first Part of the capillary strip. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein the temperature equalizing plate includes a liquid storage structure, is disposed in the chamber, and is located in the heat absorption area. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein the first capillary strip includes a bottom and a top, the bottom contacts the first plate, and the top contacts the second plate . The heat dissipation device with a temperature equalizing plate as described in Item 18 of the patent application range, wherein the first communication structure includes a plurality of first grooves, the plurality of first grooves is directed from the top of the first capillary strip The bottom extends in a concave direction and does not penetrate the bottom of the first capillary strip, so that the bottom maintains a continuous structure, and the plurality of first grooves connect the first area and the second area. The heat dissipation device with a temperature equalizing plate as described in item 19 of the patent application scope, wherein the working medium can pass through the plurality of first grooves and flow between the first area and the second area. The heat dissipation device with a temperature equalizing plate as described in Item 18 of the patent application range, wherein the first plate body includes a first capillary structure, and the first capillary structure contacts the bottom of the first capillary strip body. The heat dissipation device with a temperature equalizing plate as described in Item 18 of the patent application range, wherein the second plate body includes a second capillary structure, and the second capillary structure contacts the top of the first capillary strip body. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein the first communication structure includes a plurality of through holes, the plurality of through holes are disposed inside the first capillary strip body, and the plurality of through holes Connect the first area and the second area. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein the temperature equalizing plate further includes a plurality of support columns, the plurality of support columns are disposed in the chamber and sandwiched between the first plate body and Between the second plate bodies, the plurality of support pillars do not contact the first capillary strip, and the positions of the plurality of support pillars may correspond to the positions of the first communication structure. The heat dissipation device with a temperature equalizing plate as described in item 14 of the patent application scope, wherein the temperature equalizing plate further includes a second capillary strip body and a second communication structure, the second capillary strip body is disposed in the chamber The first area or the second area, the second communication structure is formed in the second capillary strip body, the second capillary strip body and the first capillary strip body are not in contact with each other, and the second communication structure is formed The position of the first communication structure and the position formed by the first communication structure are staggered and spaced from each other. The heat dissipation device with a temperature equalization plate as described in item 14 of the patent application range, wherein the heat dissipation device can make thermal contact with a second heat source, the second heat source thermally contacts the temperature equalization plate and corresponds to the The location of the heat absorption area, and the second heat source does not contact the first heat source.