TWM624377U - Heat dissipation module - Google Patents

Abstract

A heat dissipation module includes a vapor chamber, a fin set and a heat pipe set. The vapor chamber is used for thermally contacting a heat source. The first fin set includes a plurality of first fins arranged in parallel. The heat pipe set includes a first heat pipe and the first heat pipe is sandwiched between the vapor chamber and the first fin set. In addition, the first heat pipe is in thermal contact with the vapor chamber and the first fins.

Description

cooling module

The present invention relates to a heat dissipation module, in particular to a heat dissipation module with a heat pipe.

With the increasing computing power of computers, the temperature control of electronic components such as central processing units is becoming more and more important. However, when the operation speed of the working chip (ie, the heat source) in the computer system continues to increase, the ambient temperature in the system increases, thereby reducing the system stability. In order to solve the above problem, the industry uses a heat dissipation module composed of a heat pipe and a cooling fin to contact the working chip, so that the heat energy of the working chip can be discharged out of the system through the heat dissipation module to control the computer system. internal temperature, thereby maintaining the stability of the computer system.

Generally speaking, the heat pipe of the heat dissipation module is connected to the heat source that needs to be dissipated, and the heat pipe is connected to the heat dissipation fins, so as to transfer the heat to the heat dissipation fins through the heat pipe, and then take the heat out of the computer system to improve the work of electronic components reliability.

However, in the face of increasing technological progress, the thermal conductivity of the existing heat dissipation modules is still ineffective, and there is still room for improvement, so that the performance of the heat dissipation modules in the computer system can be improved. challenge.

One objective of the present invention is to provide a heat dissipation module for solving the above-mentioned difficulties in the prior art.

An embodiment of the present invention provides a heat dissipation module. The heat dissipation module includes a uniform temperature plate, a first fin group and a heat pipe group. The temperature equalizing plate is used for thermally contacting a heat source, the first fin group includes a plurality of first fins, which are arranged in parallel in sequence, and the heat pipe group includes a first heat pipe, and the first heat pipe is sandwiched between the temperature equalizing plate and the heat pipe. between the first fin group. Wherein, the first heat pipe thermally contacts the vapor chamber and the first fins.

According to one or more embodiments of the present invention, the surface of the first heat pipe facing the first fin group is a flat bottom surface.

According to one or more embodiments of the present invention, the temperature chamber includes an upper plate, a lower plate and a plurality of capillary layers. A cavity is formed between the upper plate and the lower plate, the lower plate includes a heat source area for contacting the heat source, and the capillary layer is formed on the inner surfaces of the upper plate and the lower plate.

According to one or more embodiments of the present invention, the temperature equalizing plate further includes a plurality of powder columns formed in the cavity and connected to the capillary layers in the upper plate and the lower plate. In addition, the vapor chamber further includes a plurality of metal structures formed between the powder columns to divide the cavity into a plurality of regions.

According to one or more embodiments of the present invention, the temperature equalizing plate further includes a plurality of vermicelli strips formed in the cavity and located in a part of the region away from the heat source region.

According to one or more embodiments of the present invention, the upper plate of the temperature equalizing plate includes a first groove, the first groove is formed on a surface of the upper plate facing the first fin group, and the first heat pipe is U-shaped, and the first groove is formed in a U-shape. A heat pipe includes a first section and two second sections, the first section is connected to the second sections, and the first section of the first heat pipe is sandwiched between the first fin set and the temperature equalizing plate, and is in direct contact with The first groove and the first fin group of the vapor chamber.

According to one or more embodiments of the present invention, the temperature equalizing plate further includes a second groove, the second groove is formed on the surface of the upper plate facing the first fin group, and the first fin group further includes two first through holes. The channel, the first through channel penetrates the first fin, and the heat pipe group further includes a second heat pipe, the second heat pipe includes a first U-shaped section and two first bending sections, and the first U-shaped section is located in the second concave The grooves are respectively connected to the first bending sections, and a part of the first bending sections extends into the first through channel and directly contacts the first fins.

According to one or more embodiments of the present invention, the vapor chamber further includes a third groove, the third groove is formed on the surface of the upper plate facing the first fin group, and the heat pipe group further includes a third heat pipe, the third The heat pipe includes a second U-shaped section and two second bending sections. The second U-shaped sections are located in the third groove and are respectively connected to the second bending sections.

According to one or more embodiments of the present invention, the heat dissipation module further includes a second fin group, and the second fin group includes a plurality of second fins and two second through-channels. The second fins are arranged side by side at intervals, and the second through channel penetrates the second fins. Wherein, a part of the second bending section extends into the second through channel and directly contacts the second fin.

According to one or more embodiments of the present invention, the upper plate of the temperature equalizing plate includes a fifth groove, the fifth groove is formed on the surface of the upper plate facing the first fin group, and the heat pipe group further includes a fifth heat pipe, the first The five heat pipes include a third U-shaped section and two third bending sections. The third U-shaped section is connected to the third bending section and is located between the third bending sections. The third U-shaped section includes a first section and Two second sections, the first section of the third U-shaped section is located between the second sections of the third U-shaped section, and the first section of the third U-shaped section is located in the fifth groove and fits the fifth groove The inner wall of the groove, the first section of the third U-shaped section and the second section of the third U-shaped section directly contact the first fin group, and the second section of the third U-shaped section exposes the fifth groove. In addition, the second fin group further includes two fifth through-channels, the fifth through-channels penetrate through the second fins, and a part of the third bending section of the fifth heat pipe extends into the fifth through-channels , and directly contact the second fin.

In this way, through the structures of the above embodiments, the present invention makes the heat pipe, the temperature equalizing plate and the fin set closely fit, so as to improve the heat dissipation efficiency of the heat dissipation module.

The above descriptions are only used to describe the problems to be solved by the present invention, the technical means for solving the problems, and the effects thereof. The specific details of the present invention will be described in detail in the following embodiments and related drawings.

Several embodiments of the present invention will be disclosed in the drawings below. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in the novel embodiments, these practical details are unnecessary. In addition, for the purpose of simplifying the drawings, some well-known structures and elements will be shown in a simple and schematic manner in the drawings.

FIG. 1 is a three-dimensional schematic diagram of a heat dissipation module, and FIG. 2 is a three-dimensional schematic diagram of another angle, wherein part of the fins are omitted in FIG. 1 to facilitate the description of the configuration of the heat pipe group. FIG. 3 is an exploded schematic diagram of the heat dissipation module of FIG. 1 . FIG. 4 is a three-dimensional schematic diagram of a vapor chamber of the heat dissipation module. FIG. 5 is a cross-sectional view of the heat dissipation module of FIG. 1 taken along section line 5-5, and FIG. 6 is a cross-sectional view of the heat dissipation module of FIG. 1 drawn along section line 6-6. In addition, FIG. 7 is a perspective view of the upper plate of the vapor chamber of the heat dissipation module of FIG. 1 .

As shown in FIG. 1 and FIG. 2 , the heat dissipation module 100 includes a uniform temperature plate 200 , a first fin group 300 and a heat pipe group 500 . The vapor chamber 200 is used for thermally contacting a heat source 262 . The first fin group 300 includes a plurality of first fins 310 . The first fins 310 are arranged in parallel and spaced in sequence. The heat pipe group 500 includes a first heat pipe 510 . A part of the first heat pipe 510 is sandwiched between the temperature equalizing plate 200 and the first fin group 300 , and another part of the first heat pipe 510 only directly contacts the first fins 310 , although the present invention is not limited to this.

In some embodiments, the first heat pipe 510 is U-shaped, and the first heat pipe 510 includes a first section 513 and two second sections 514 . The first segment 513 connects the second segments 514 and is located between the second segments 514 . The long axis direction of the first segment 513 and the long axis direction of the second segment 514 intersect, for example, orthogonal. The first section 513 is sandwiched between the first fin group 300 and the vapor chamber 200 for absorbing heat energy transmitted from the vapor chamber 200 . In addition, the longitudinal directions of the second sections 514 are parallel to each other, and two opposite ends of the first heat pipes 510 are located on the second sections 514 respectively. However, the present invention is not limited to this. In this way, since the first section 513 of the first heat pipe 510 can absorb the heat energy transmitted from the vapor chamber 200, and synchronously and bidirectionally transmit the heat energy to these second sections 514, and thus to the first fin group 300, so, It not only provides higher power performance, thereby achieving the purpose of quickly completing the heat exchange, but also can shorten the water return distance inside the first heat pipe 510 and improve the overall performance.

FIG. 5 is a cross-sectional view of the heat dissipation module 100 of FIG. 1 along the section line 5-5. FIG. 6 is a cross-sectional view of the heat dissipation module 100 of FIG. 1 along the section line 6-6.

In some embodiments, a linear groove 330 is formed on the first fin group 300 and is formed on a surface of the first fin group 300 facing the vapor chamber 200 . The linear groove 330 has a flat bottom surface 331 , and the flat bottom surfaces 331 are parallel to each other. Each of the flat bottom surfaces 331 is about the same width as the second section 514 of the first heat pipe 510 . A first groove 220 is formed on the upper plate 210 of the temperature equalizing plate 200 , facing a surface of the first fin group 300 , such as the surface 211 in FIG. 4 .

In some embodiments, as shown in FIGS. 1 to 5 , the first section 513 of the first heat pipe 510 is located in the first groove 220 . More specifically, the portion of the first section 513 of the first heat pipe 510 is located in the first groove 220 and directly contacts the vapor chamber 200 , which means that it matches its shape and fits the inner wall of the first groove 220 . Part of the first segment 513 also directly contacts the first fin group 300 . In addition, the second section 514 of the first heat pipe 510 is located in the linear groove 330 .

Additionally, in some embodiments, the heat pipe group 500 includes a second heat pipe 520 . A part of the second heat pipe 520 is also sandwiched between the temperature equalizing plate 200 and the first fin group 300 , and the other part of the second heat pipe 520 is inserted into the first fins 310 . For example, the second heat pipe 520 includes a first U-shaped section 523 and two first bending sections 524 . The first U-shaped section 523 is connected to the first bending section 524 and located between the first bending sections 524 , and the first U-shaped section 523 is sandwiched between the first fin set 300 and the temperature equalizing plate 200 .

In some embodiments, as shown in FIGS. 1 to 5 , the vapor chamber 200 further includes a second groove 230 . The second groove 230 is formed on the surface 211 of the upper plate 210 . The first fin group 300 further includes two first through-channels 340 . The first through-channels 340 penetrate the first fins 310 . The first U-shaped section 523 is located in the second groove 230, and a part of the first bending section 524 of the second heat pipe 520 extends into the first through channel 340 and directly contacts the first fins 310, which means That is, it directly contacts the inner wall of the first through-channel 340 .

The outer surface of the first U-shaped section 523 is in direct contact with the temperature equalizing plate 200 and is attached to the inner wall of the second groove 230 . The first U-shaped section 523 of the second heat pipe 520 can absorb the heat energy transmitted from the vapor chamber 200 , and synchronously and bidirectionally transmit the heat energy to the first bending sections 524 , so as to be transmitted to the first fin group 300 , and so on. , not only to achieve the purpose of quickly completing the heat exchange, but also to improve the overall performance.

In some embodiments, the vapor chamber 200 further includes a third groove 240 . The third groove 240 is formed on the surface 211 of the upper plate 210 , and the heat pipe group 500 further includes a third heat pipe 530 . The third heat pipe 530 includes a second U-shaped section 533 and two second bending sections 534 . The second U-shaped section 533 connects the second bending sections 534 and is located between the second bending sections 534 , and the second U-shaped section 533 is sandwiched between the first fin set 300 and the temperature equalizing plate 200 . More specifically, the second U-shaped section 533 is located in the third groove 240 . In addition, the outer surface of the second U-shaped section 533 also directly contacts the first fin 310 to closely fit the first fin 310 and the temperature uniformity. The inner wall of the third groove 240 of the plate 200 .

In some embodiments, the vapor chamber 200 further includes a fifth groove 270 . The fifth groove 270 is formed on the surface 211 of the upper plate 210 , and the heat pipe group 500 further includes a fifth heat pipe 550 . The fifth heat pipe 550 includes a third U-shaped section 553 and two third bending sections 554 . The third U-shaped section 553 connects the third bending sections 554 and is located between the third bending sections 554 , and the third U-shaped section 553 is sandwiched between the first fin set 300 and the temperature equalizing plate 200 . Therefore, the third U-shaped section 553 is located in the fifth groove 270 , and the outer surface of the third U-shaped section 553 also directly contacts the first fins 310 to closely fit the first fins 310 and the temperature equalizing plate 200 the inner wall of the fifth groove 270.

More specifically, the third U-shaped section 553 includes a first section 555 and two second sections 556, and the first section 555 is located between the second sections 556, and the first section 555 of the third U-shaped section 553 is located at the first section 556. The inside of the five grooves 270 is in direct contact with the temperature equalizing plate 200 , which means that it matches the shape of the chamber and fits the inner wall of the fifth groove 270 . The first segment 555 and the second segment 556 of the third U-shaped segment 553 directly contact the first fin group 300 . In addition, the second section 556 of the third U-shaped section 553 is exposed to the fifth groove 270 .

Referring to FIGS. 1 , 2 and 6 again, the heat dissipation module 100 further includes a second fin group 400 . The second fin group 400 is adjacent to the first fin group 300 . The second fin group 400 includes a plurality of second fins 410 . The second fins 410 are arranged in parallel and spaced in sequence, and the second fin group 400 further includes two second through-channels 420 . The second through-channels 420 pass through the second fins 410 in sequence. A part of the second bending section 534 protrudes into the second through-channel 420 and directly contacts the second fins 410 , that is, abuts the inner wall of the second through-channel 420 . Therefore, the second U-shaped section 533 of the third heat pipe 530 can absorb the heat energy transmitted from the vapor chamber 200 , and synchronously and bidirectionally transmit the heat energy to the second bending sections 534 , so as to be transmitted to the second fin group 400 .

Also referring to FIG. 4 , the vapor chamber 200 includes two fourth grooves 250 . The fourth grooves 250 are parallel to each other, and are formed on the surface 211 of the upper plate 210 and connected to the second grooves 230 , and the long axes of the fourth grooves 250 are parallel to each other.

Referring to FIG. 5 and FIG. 6 at the same time, the first fin group 300 further includes at least one third through-channel 350 , for example, two, although the present invention is not limited thereto. The third through-channels 350 penetrate the first fins 310 . The second fin group 400 further includes at least one fourth through-channel 430 , for example, two, although the present invention is not limited thereto. The fourth through channel 430 penetrates the second fin 410 and is coaxially aligned with the third through channel 350 . The heat pipe group 500 further includes at least one fourth heat pipe 540 , for example, two, although the present invention is not limited to this. The second fin group 400 further includes at least one fifth through-channel 440 , for example, two, although the present invention is not limited to this. The third bent section 554 of the fifth heat pipe 550 penetrates through the second fin 410 through the fifth through channel 440 .

In addition, a part of the fourth heat pipe 540 is press-fitted between the first fin group 300 and the temperature equalizing plate 200 , that is, located in the fourth groove 250 of the first fin group 300 and the temperature equalizing plate 200 , so that It directly contacts the inner wall of the fourth groove 250 of the first fin group 300 and the vapor chamber 200 . Another part of each fourth heat pipe 540 passes through the third through-channel 350 and the fourth through-channel 430 at the same time, and directly contacts the first fins 310 and the second fins 410 , which means matching its shape and fitting the first fins 310 and 410 . Through the inner walls of the channel 340 and the second through channel 420 .

In some embodiments, please refer to FIG. 1 , FIG. 2 , FIG. 4 , and FIG. 7 at the same time, wherein FIG. 7 is a bottom view of the upper plate 210 . As shown in the figure, the vapor chamber 200 includes an upper plate 210 , a lower plate 260 and a plurality of capillary layers 610 . A cavity 660 is formed between the upper plate 210 and the lower plate 260 . The lower plate 260 includes a heat source area 630 for contacting a heat source 262 , such as a heating element such as a central processing unit. The capillary layer 610 is formed on the inner surface of the upper plate 210 and the inner surface of the lower plate 260 respectively.

In addition, the vapor chamber 200 further includes a plurality of powder pillars 620 and a plurality of metal structures 640 formed in the cavity 660 . The powder pillars 620 are connected to the capillary layers 610 in the upper plate 210 and the lower plate 260 . The metal structure 640 can be a metal block or a metal capillary structure. The metal structure 640 is formed between the powder pillars 620 along the shape of the heat pipe to divide the cavity 660 into a plurality of regions. In addition, the vermicelli 650 is also formed in the cavity 660 . Preferably, the vermicelli 650 is formed in a region away from the heat source region 630 . The powder pillars 620 and the powder bars 650 may be metal capillary structures formed by powder metallurgy, but the present invention is not limited thereto. In some embodiments, the powder column 620 may be a cylinder, a square column, a triangular column or a polygonal column, and the powder bar 650 may be a rectangular column, an elliptical column or a polygonal long column, all of which do not depart from the scope of the present invention. spirit and protection.

The capillary layer 610 contacts the metal structure 640 , so that the metal structure 640 can serve as the boundary of the capillary layer 610 , thereby achieving the effect of partitioning the capillary layer 610 . The structure of this partition can separate the working fluid (ie, liquid working fluid) into a plurality of specific regions of the capillary layer 610 through the metal structure 640 and are separated from each other to a certain extent, but the present invention is not limited to this.

In some embodiments, the powder pillars 620 , the metal structures 640 or the powder bars 650 may be interposed between the plurality of capillary layers 610 , or may be directly formed on the surfaces of the upper plate 210 and the lower plate 260 , all without departing from the spirit and protection of the present invention. scope.

In some embodiments, the surfaces of the first heat pipe 510 , the second heat pipe 520 , the third heat pipe 530 and the fifth heat pipe 550 facing the first fin group 300 are preferably flat bottom surfaces, while the fourth heat pipe 540 faces the first fin group 300 . The surface of the fin group 300 is preferably circular, but the present invention is not limited to this. In this way, through the structures of the above embodiments, the present invention allows the heat pipe to be closely attached to the vapor chamber and the fin set, so as to improve the heat dissipation efficiency of the heat dissipation module.

Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone who is familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. new type. Therefore, the scope of protection of this new model should be determined by the scope of the appended patent application.

100: cooling module 200: uniform temperature plate 210: Upper Board 211: Surface 220: First groove 230: Second groove 240: Third groove 250: Fourth groove 260: Lower Board 262: heat source 270: Fifth groove 300: The first fin group 310: First Fin 330: Linear groove 331: Flat bottom surface 340: The first through passage 350: The third through passage 400: Second fin group 410: Second fin 420: Second through channel 430: Fourth Through Passage 440: Fifth through passage 500: Heat pipe group 510: First heat pipe 513: first paragraph 514: Second paragraph 520: Second heat pipe 523: The first U-shaped segment 524: First bending segment 530: Third heat pipe 533: Second U-shaped segment 534: Second bending segment 540: Fourth heat pipe 550: Fifth heat pipe 553: The third U-shaped segment 554: Third bending segment 555: first paragraph 556: Second paragraph 610: capillary layer 620: Powder column 630: Heat source area 640: Metal Structure 650: Vermicelli 660: Cavity 5-5, 6-6: hatching

In order to make the above-mentioned and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: FIG. 1 is a three-dimensional schematic diagram of a heat dissipation module according to an embodiment of the present invention; FIG. 2 is a perspective view of the heat dissipation module of FIG. 1 from another angle; Figure 3 is an exploded schematic diagram of the heat dissipation module of Figure 1; FIG. 4 is a three-dimensional schematic diagram of the vapor chamber of the heat dissipation module of FIG. 1; Fig. 5 is a cross-sectional view of the heat dissipation module of Fig. 1 drawn along section line 5-5; FIG. 6 is a cross-sectional view of the heat dissipation module of FIG. 1 taken along section line 6-6; and FIG. 7 is a perspective view of the upper plate of the vapor chamber of the heat dissipation module of FIG. 1 .

100: cooling module

200: uniform temperature plate

210: Upper Board

260: Lower Board

300: The first fin group

310: First Fin

400: Second fin group

410: Second fin

500: Heat pipe group

510: First heat pipe

513: first paragraph

514: Second paragraph

520: Second heat pipe

523: The first U-shaped segment

524: First bending segment

530: Third heat pipe

533: Second U-shaped segment

534: Second bending segment

540: Fourth heat pipe

5-5, 6-6: hatching

Claims (10)

A heat dissipation module, comprising: a uniform temperature plate for thermally contacting a heat source; a first fin group, including a plurality of first fins, arranged in parallel in sequence; and A heat pipe group includes a first heat pipe sandwiched between the temperature equalizing plate and the first fin group, wherein the first heat pipe thermally contacts the temperature equalizing plate and the first fins. The heat dissipation module of claim 1, wherein a surface of the first heat pipe facing the first fin set is a flat bottom surface. The heat dissipation module according to claim 1, wherein the vapor chamber comprises: a board; a lower plate, wherein a cavity is formed between the upper plate and the lower plate, and the lower plate includes a heat source area for contacting the heat source; and A plurality of capillary layers are formed on the inner surfaces of the upper plate and the lower plate. The heat dissipation module according to claim 3, wherein the vapor chamber further comprises: A plurality of powder pillars are formed in the cavity and connect the capillary layers in the upper plate and the lower plate; and A plurality of metal structures are formed between the powder pillars to divide the cavity into a plurality of regions. The heat dissipation module according to claim 4, wherein the vapor chamber further comprises: A plurality of vermicelli bars are formed in the cavity and located in an area away from the heat source area. The heat dissipation module of claim 3, wherein the upper plate of the temperature equalizing plate comprises a first groove, the first groove is formed on a surface of the upper plate facing the first fin set, and the The first heat pipe is U-shaped, the first heat pipe includes a first section and two second sections, the first section is connected to the second sections, and the first section of the first heat pipe is clamped to the first fin Between the fin set and the temperature-spreading plate, and directly contact the first groove of the temperature-spreading plate and the first fin set. The heat dissipation module of claim 6, wherein the vapor chamber further comprises a second groove, the second groove is formed on the surface of the upper plate facing the first fin group, the first fin The group further includes two first through channels, each of the first through channels penetrates the first fins, and the heat pipe group further includes a second heat pipe, the second heat pipe includes a first U-shaped section and two a first bending section, the first U-shaped section is located in the second groove, and is connected to the first bending sections respectively, and a part of each of the first bending sections extends into the first bending sections A through channel is in one of the channels and directly contacts the first fins. The heat dissipation module of claim 7, wherein the vapor chamber further comprises a third groove, the third groove is formed on the surface of the upper plate facing the first fin set, and the heat pipe set is further Including a third heat pipe, the third heat pipe includes a second U-shaped section and two second bending sections, the second U-shaped section is located in the third groove, and is connected to the second bending sections respectively . The heat dissipation module according to claim 8, further comprising a second fin group, wherein the second fin group includes: a plurality of second fins, spaced side by side in sequence; and Two second through-channels, the second through-channels pass through the second fins, wherein a part of the second bending sections protrudes into the second through-channels and directly contacts the second through-channels second fin. The heat dissipation module according to claim 9, wherein the upper plate of the temperature equalizing plate comprises a fifth groove, and the fifth groove is formed on the surface of the upper plate facing the first fin set , Wherein, the heat pipe group further includes a fifth heat pipe, the fifth heat pipe includes a third U-shaped section and two third bending sections, the third U-shaped section is connected to the third bending sections and is located in the Between the third bending sections, the third U-shaped section includes a first section and two second sections, and the first section of the third U-shaped section is located in the third U-shaped section Between the second sections, the first section of the third U-shaped section is located in the fifth groove and abuts the inner wall of the fifth groove, and the first section of the third U-shaped section and the The second sections of the third U-shaped section directly contact the first fin set, and the second sections of the third U-shaped section expose the fifth groove, Wherein, the second fin group further includes two fifth through passages, the fifth through passages pass through the second fins, wherein a part of the third bending sections of the fifth heat pipe extending into the fifth through-channels and directly contacting the second fins.

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