TWI715094B - Composite water-cooling radiator structure - Google Patents

Abstract

A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.

Description

Composite water cooling row structure

The present invention relates to the field of heat dissipation, in particular to a composite water cooling row structure.

When a computer is operating, many internal components generate a lot of heat. Therefore, a good heat dissipation system is a key factor that determines the operating performance and reliability of the computer. Among all the components that generate heat, the central processing unit (CPU) and the graphics chip processor (GPU) with the highest workload generally have the most difficult heat dissipation problems. In particular, the screens of various computer games are becoming more and more delicate, and the functions of computer-aided graphics software are becoming more powerful. Such software often puts the central processing unit and graphics chip processor in a high load state when operating, and it also causes a large number of If the heat energy cannot be effectively dissipated, the performance of the central processing unit or graphics chip processor will decrease, and in severe cases, it will be more likely to cause damage to the central processing unit or graphics chip processor or greatly reduce its service life.

As shown in Figures 1A and 1B, in order to reduce the operating temperature of heating electronic components, generally water-cooled devices on the market are connected to a water pump 1a (Pump) and a water cooling head 1b through two water pipes to touch a heating element ( Such as the central processing unit), through the water pump 1a (Pump) to drive the water cooling liquid (or working liquid) to the water cooling row 1 to dissipate heat and continuously circulate the cooling to quickly dissipate heat. The aforementioned water pump 1a is installed outside the water block 1b (as shown in Figure 1A), or the water pump 1a may be installed inside the water block 1b (as shown in Figure 1B). The water cooling row 1 is composed of a plurality of radiating fins 11, a plurality of straight flat tubes 12 and two side water tanks 13. The radiating fins 11 are arranged between the straight flat tubes 12, and the aforementioned two sides The water tank 13 and the radiating fins 11 and the two sides of the straight flat tubes 12 are welded by soldering, so that the two-side water tank 13 and the radiating fins 11 and the straight flat tubes 12 Connected to form the water cooling row 1, and one side of the water tank 13 is provided There is a water inlet 131 and a water outlet 132, and the water inlet 131 and the water outlet 132 are respectively used to connect the opposite two water pipes (not shown in the figure).

Since the working fluid flowing in from the water inlet 13 flows into the water tank 13 on one side, it flows through the straight flat tubes 12 to the other side water tank 13, and then through the straight flat tubes 12 The tube 12 quickly flows directly into the water tank 13 on the side of the channel, and then is discharged from the water outlet 132. Because the overall structure of the conventional water-cooled radiator is larger, it will occupy a larger installation space. If the volume of the water-cooled radiator is reduced, The heat dissipation efficiency is reduced, resulting in poor anti-heat effect. Therefore, how to provide a heat dissipation structure with a small volume and high heat dissipation efficiency is the direction that the inventor of the present application and related manufacturers engaged in the industry urgently want to study and improve.

One objective of the present invention is to provide a water cooling row structure arranged in a composite layer.

One objective of the present invention is to provide a composite water cooling row structure that is compact and reduces thermal resistance to improve heat dissipation efficiency.

An object of the present invention is to provide a composite water cooling row structure in which the cooling plate utilizes a uniform cooling chip unit to transfer heat to a uniform temperature plate.

An object of the present invention is to provide a composite water cooling row structure optionally provided with at least one heat dissipation fin block, through which at least one heat dissipation fin set increases the area in contact with air and improves the heat dissipation efficiency.

To achieve the above objective, the present invention provides a composite water cooling row structure, which includes: a cooling plate having a first upper surface and a first lower surface, and a liquid flow part for a working liquid to flow, the liquid flow part communicating An outlet and an inlet: a uniform cold chip unit, arranged under the cooling plate, has a cold end and a hot end, the cold end is in contact with the first lower surface of the cooling plate; a uniform temperature plate is arranged on the cold end There is a second upper surface and a second lower surface under the cold chip, and the second upper surface contacts the hot end of the cold chip.

In one embodiment, the first upper surface and the second lower surface of the cooling plate are respectively located on both sides of the cooling plate, and any one of the first upper surface and the second lower surface is provided with a groove, the liquid The flow part is arranged in the groove.

In one embodiment, the flow part is a liquid guide tube, and both ends of the liquid guide tube form the outlet and the inlet.

In one embodiment, the cooling plate has a first upper plate body butted with a first lower plate body, the first upper surface is formed on the first upper plate body, and the first lower surface is formed on the first lower plate body The liquid flow position is a guiding channel located between the first upper plate body and the first lower plate body, and both ends of the guiding channel form the outlet and the inlet.

In one embodiment, the cooling chip unit includes one or more cooling chips, and the cooling chips are arranged in parallel.

In one embodiment, the inlet and the outlet are connected to a water block module, and the water block module includes a water block and a pump.

In one embodiment, the first upper surface of the cooling plate is provided with a first heat dissipation fin group, and the second lower surface of the uniform temperature plate is provided with a second heat dissipation fin group.

In one embodiment, the uniform temperature plate has a closed chamber for accommodating a second working fluid, a capillary structure layer is arranged on an inner wall of the closed chamber, and at least one supporting column is arranged in the closed chamber.

In one embodiment, the first heat dissipation fin group and the second heat dissipation fin group are connected to a protection unit, and the protection unit is connected to at least one fan.

20: Water cooling row structure

21, 21a: cooling plate

2101: The first upper board

2102: The first lower board

211: first upper surface

212: first lower surface

213: entrance

214: Export

215, 215a: Liquid flow part

217: Groove

22: Refrigeration chip unit

220: Refrigeration chip

221: Cold End

222: hot end

23: uniform temperature plate

2031, 2302: plate body

231: second upper surface

232: second lower surface

233: closed chamber

234: Capillary structure layer

235: Second working fluid

236: Support Column

241: First cooling fin set

242: Second cooling fin set

30: Water block module

31: Protection unit

311: Part One

312: Part Two

32: Fan

The purpose of the following figures is to make the present invention easier to understand, and these figures will be described in detail in this article and will constitute a part of the specific embodiments. Through the specific embodiments in this text and referring to the corresponding drawings, the specific embodiments of the present invention are explained in detail, and the principle of the invention is explained.

Figures 1A and 1B are schematic diagrams of conventional technologies; Figure 2A is a three-dimensional exploded schematic view of the present invention; Figure 2B is a three-dimensional assembly schematic view of the present invention; Figure 2C is a three-dimensional exploded schematic view of an alternative implementation of the present invention; Figure 2D is a partial cross-sectional schematic view of the uniform temperature plate of the present invention; Figure 3A is a perspective schematic view of the first type of cooling plate of the present invention; Figure 3B is a perspective schematic view of the first type of cooling plate of the present invention from another perspective; Figure 3C is an exploded perspective view of the second type of cooling plate of the present invention Schematic diagram; Figures 4A and 4B are schematic diagrams of connecting a water-cooling head module of the present invention; Figure 4C is a schematic partial cross-sectional view of Figure 4A; Figure 4D is a partial cross-sectional schematic diagram of Figure 4B; Figure 5 is this The schematic diagram of the first and second radiating fin groups of the water cooling row group connected to the protection unit and the fan.

The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Fig. 2A for a three-dimensional exploded schematic view of the present invention; Fig. 2B is a three-dimensional assembly schematic diagram of the present invention; and Fig. 2C is a three-dimensional exploded schematic view of an alternative implementation of the present invention; Schematic. As shown in the figure, a water cooling row structure 20 includes a cooling plate 21, a uniform cooling chip unit 22 and a uniform temperature plate 23. The cooling plate 21 has a first upper surface 211 and a first lower surface 212 respectively located on two sides of the cooling plate 21, a liquid flow portion 215 is provided between the first upper surface 211 and the first lower surface 212, The liquid flow part 215 communicates with an inlet 213 and an outlet 214 to guide a first working liquid (such as pure water) to flow.

The refrigerating chip unit 22 is arranged below the cooling plate 21 and has a cold end (heat-absorbing surface) 221 and a hot end (heat-radiating surface) 222 located on both sides of the refrigerating chip unit 22 after being energized. end 221 is in contact with the first lower surface 212 of the cooling plate 21. The cooling chip unit 22 includes one or more cooling chips 220, and the cooling chips 220 are arranged in parallel. In this embodiment, six refrigerating chips 220 are arranged in parallel, but it is not limited to this. The user can set the number of refrigerating chips 220 according to requirements such as the area of the cooling plate 21 and the uniform temperature plate 23.

The temperature equalizing plate 23 is disposed under the refrigerating chip unit 22, and includes two plate bodies 2301, 2302 butted into one body (as shown in Figure 2D), and has a second upper surface 231 and a second lower surface 232, respectively Located on the outer side of the two plates 2301 and 2302, the second upper surface 231 contacts the hot end 222 of the refrigerating chip unit 22. As shown in Figure 2D, the uniform temperature plate 23 has a closed chamber 233 between the two plate bodies 2301, 2302 and contains a second working liquid 235 (such as pure water, methanol, acetone, cold coal or ammonia, etc.). One is not restricted by any liquid) and a capillary structure layer 234, the capillary structure layer 234 is disposed on an inner wall of the closed chamber 233. Optionally, at least one supporting column 236 is arranged in the enclosed cavity 233 to stand vertically between the two plates 2031 and 2302 to support the enclosed cavity 233. The uniform temperature plate 23 is a two-dimensional heat transfer element. The second working fluid 235 circulates the vapor and liquid phase heat transfer in the closed chamber 233, and rapidly expands the heat source transferred from the refrigerating chip unit 22 into a surface heat source , To reduce the heat transfer per unit area to remove the hot spot (heat concentration) problem, the temperature equalization effect is good and the contact area is larger, which directly reduces the overall thermal resistance of the water cooling row structure 20.

In an alternative implementation, as shown in FIG. 2C, the first upper surface 211 of the cooling plate 21 is provided with a first heat dissipation fin set 241, and the second lower surface 232 of the temperature equalizing plate 23 is provided with a second heat dissipation fin In the group 242, the contact area between the first upper surface 211 and the second lower surface 232 and the air is increased by the first heat dissipation fin group 241 and the second heat dissipation fin group 242 to help heat dissipation.

Furthermore, please continue to refer to Figure 3A for a perspective view of the first type of cooling plate of the present invention; Figure 3B is a perspective view of the first type of cooling plate for another view of the present invention; Figure 3C is a perspective view of the second type of cooling plate of the present invention An exploded perspective view of the type cooling plate. As shown in Figures 3A and 3B, the cooling plate 21 is a plate with good thermal conductivity, and either the first upper surface 211 and the first lower surface 212 is provided with a groove 217, The liquid flow part 215 is disposed in the groove 217. In this embodiment, the groove 217 is provided on the first lower surface 212 and extends in a serpentine manner to cover the first lower surface 212. The liquid flow portion 215 is a liquid guide tube buried in the groove 217 and does not exceed the first lower surface 212. The side of the liquid flow portion 215 opposite to the groove 217 and the first lower surface 212 form a line Co-plane, and the liquid guide tube has two ends to form the inlet 213 and the outlet 214. The liquid flow part 215 is arranged in a serpentine manner in cooperation with the groove 217 to cover the first lower surface 212, thereby prolonging the flow time of the first working liquid in the liquid flow part 215 and allowing the first working liquid to carry The heat is evenly distributed on the cooling plate 21 to achieve the purpose of uniform temperature.

In an alternative implementation, as shown in Figure 3C, the cooling plate 21a has a first upper plate body 2101 butting a first lower plate body 2102, the first upper surface 211 is formed on the first upper plate body 2101, and the The lower surface 212 is formed on the first lower plate 2102, and the liquid flow portion 215a is a guiding channel located between the first upper plate 2101 and the first lower plate 2102. The guiding channel The inlet 213 and the outlet 214 are formed at both ends. In this embodiment, it is shown that the liquid flow part 215a is provided on the side of the first lower plate 2102 that abuts the first upper plate 2101. And the liquid flow part 215a extends in a serpentine manner and is covered with the first lower plate 2102, thereby prolonging the flow time of the first working liquid in the liquid flow part 215a and uniforming the heat carried by the first working liquid The distribution on the cooling plate 21a.

Please continue to refer to FIGS. 4A and 4B for a schematic diagram of connecting a water block module of the present invention; FIG. 4C is a schematic partial cross-sectional view of FIG. 4A; FIG. 4D is a partial cross-sectional schematic diagram of FIG. 4B. As shown in these figures, in conjunction with the aforementioned figures 2A, 2B, 2C, 3A, 3B and 3C, the inlet 213 and outlet 214 of the cooling plate 21 of the water-cooled row structure 20 are connected to a water-cooled head module 30. The head module 30 is, for example, the water block and pump described in the prior art, and the pump is arranged outside or inside the water block. The first working liquid in the liquid flow parts 215, 215a flows into the water block module 30 through the outlet 214 and exchanges heat with a heating element to increase the temperature, and the warmed first working liquid flows out of the water block module 30 Then, it flows into the cooling plate 21 of the water cooling row structure 20 from the inlet 213, and the heat carried by the first working fluid follows along The liquid flow parts 215, 215a flow in the direction of the outlet 214, and conduct heat to the cooling plates 21, 21a and distribute evenly. When the heat is transferred to the first upper surface 211 of the cooling plate 21, 21a, the heat is dissipated through the first upper surface 211. After the heat transferred to the first lower surface 212 of the cooling plate 21, 21a absorbs heat through the cold end 221 of the cooling chip unit 22, the heat is released from the hot end 222 to the second upper surface 231 of the uniform temperature plate 231, and then The heat is transferred to the second lower surface 232 through the vapor and liquid phase transformation of the second working fluid 235 in the closed chamber 233 to dissipate heat.

In another alternative implementation, when heat is transferred to the first upper surface 211 of the cooling plate 21, 21a, the heat is dissipated through the first heat dissipation fin set 241, and when the heat is transferred to the second lower surface 232 of the temperature equalizing plate 231 At this time, heat is dissipated through the second heat dissipation fin set 242.

In addition, it should be noted that the aforementioned cooling plates 21, 21a, liquid flow parts 215, 215a, uniform temperature plate 231, first heat dissipation fin group 241, and second heat dissipation fin group 242 are, for example, gold or silver or copper or iron or Made of titanium or aluminum or stainless steel or alloys of these metals. Among them, the titanium material has the characteristics of high strength, light weight and good thermal conductivity, so as to effectively improve the effect of heat conduction efficiency and reduce the overall weight.

Furthermore, as shown in FIG. 5, the first heat dissipation fin set 241 and the second heat dissipation fin set 242 are connected to a protection unit 31, which has a first part 311 and a second part 312 from the water cooling exhaust The first heat dissipation fin group 241 and the second heat dissipation fin group 242 are covered above and below the structure 20 to protect the first and second heat dissipation fin groups 241 and 242 from damage. In addition, the protection unit 31 can also optionally be connected to the at least one fan 32, and the at least one fan 32 helps the first and second heat dissipation fin sets 241 and 242 to dissipate heat.

Through the above implementation, the uniform cooling chip unit 22 is used to transfer the heat of the cooling plates 21, 21a to a uniform temperature plate 23 to dissipate heat. In addition, the first and second heat dissipation fin sets 241, 242 are selected to pass through the first And the second heat dissipation fin group 241, 242 to increase the contact area of the cooling plate 21 and the uniform temperature plate 23 with the air, such as The composite water-cooled row structure 20 is arranged in layers to provide a compact composite water-cooled row structure that reduces thermal resistance and improves heat dissipation efficiency.

The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention. That is to say, all equal changes and modifications made in accordance with the scope of application of the present invention should still be covered by the patent of the present invention.

20: Water cooling row structure

21: Cooling plate

211: first upper surface

212: first lower surface

213: entrance

214: Export

215: Liquid flow part

22: Refrigeration chip unit

221: Cold End

222: hot end

23: uniform temperature plate

231: second upper surface

232: second lower surface

Claims (10)

A composite water cooling row structure includes: a cooling plate having a first upper surface, a first lower surface, and a liquid flow part for a first working liquid to flow; the liquid flow part communicates with an outlet and an inlet, the The inlet and the outlet are connected to a water-cooling head module, which exchanges heat with a heating element and then conducts heat to the cooling plate through the first working fluid; the same cooling chip unit is arranged on the cooling plate The lower part has a cold end and a hot end, and the cold end is in contact with the first lower surface of the cooling plate; a uniform temperature plate is arranged under the refrigerating chip unit and has a second upper surface and a second The lower surface and the second upper surface contact the hot end of the refrigerated chip unit. The composite water cooling row structure according to claim 1, wherein the first upper surface and the second lower surface of the cooling plate are respectively located on both sides of the cooling plate, and either of the first upper surface and the first lower surface One is provided with a groove, and the liquid flow part is arranged in the groove. The composite water-cooled row structure according to claim 2, wherein the liquid flow part is a liquid diversion tube with two ends forming the outlet and the inlet. The composite water cooling row structure according to claim 1, wherein the cooling plate has a first upper plate body butted with a first lower plate body, the first upper surface is formed on the first upper plate body, and the first lower surface Formed on the first lower plate body, the liquid flow position is a guiding channel located between the first upper plate body and the first lower plate body, and both ends of the guiding channel form the outlet and the Entrance. The composite water-cooled row structure according to claim 1, wherein the cooling chip unit includes one or more cooling chips, and the cooling chips are arranged in parallel. The composite water cooling row structure according to claim 1, wherein the water cooling head module includes a water cooling head and a pump. The composite water cooling row structure according to claim 1, wherein the uniform temperature plate has a closed chamber for accommodating a second working fluid, and a capillary structure layer is arranged on an inner wall of the closed chamber. The composite water cooling row structure according to claim 7, wherein at least one supporting column is provided in the enclosed cavity. The composite water cooling row structure according to any one of claims 1 to 8, wherein the first upper surface of the cooling plate is provided with a first heat dissipation fin group, and the second lower surface of the uniform temperature plate is provided with a second heat sink Fin group. The composite water cooling row structure according to claim 9, wherein the first heat dissipation fin group and the second heat dissipation fin group are connected to a protection unit, and the protection unit is connected to at least one fan.

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