CN104244581A - High heat conduction apparatus for multilayer circuit - Google Patents
High heat conduction apparatus for multilayer circuit Download PDFInfo
- Publication number
- CN104244581A CN104244581A CN201310222349.5A CN201310222349A CN104244581A CN 104244581 A CN104244581 A CN 104244581A CN 201310222349 A CN201310222349 A CN 201310222349A CN 104244581 A CN104244581 A CN 104244581A
- Authority
- CN
- China
- Prior art keywords
- heat
- multilayer circuit
- transfer device
- high heat
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a high heat conduction apparatus for a multilayer circuit. The high heat conduction apparatus comprises a heat conduction substrate, a multi-layer circuit board, and a chip packaging module. The heat conduction substrate includes a setting surface and at least one boss protruded from the setting surface. The multi-layer circuit board is arranged at the heat conduction substrate and has at least one through hole; and the boss passes through the through hole correspondingly. The chip packaging module has at least one hear radiation zone and a plurality of pins; the heat radiation zone is contacted to the boss correspondingly; and the pins arranged around the heat radiation zone are electrically connected to the multi-layer circuit board.
Description
Technical field
The present invention is about a kind of high heat-transfer device of multilayer circuit, and espespecially a kind of boss by heat-conducting substrate is arranged in the perforation of multilayer circuit board, to make the high heat-transfer device of the multilayer circuit of wafer package module installation on boss and multilayer circuit board.
Background technology
Along with day by day progressing greatly of present technical development, LED luminescence technology is day by day ripe and become the necessity of mankind's daily life.But its power consumption and caloric value also significantly improve thereupon, if effectively cannot reduce or fall apart except heat, LED luminance can be caused to reduce and acceleration components deterioration; Therefore, the quality of heat-radiating substrate is an important ring of LED heat management.
In existing technology, metallic printed circuit board (MCPCB; Mental Core PCB) be the best solution of current high heat-radiating substrate, common MCPCB form comprises the diaphragm type PCB frameworks such as one-sided individual layer, one-sided bilayer or bilateral individual layer, to shorten the path by high thermal resistance material.So now illumination with or the LED lamp panel that uses of display backlight plate or lamp bar be all for circuit board with individual layer or Double-layer aluminum substrate or copper base.
From the above, although aluminium base has had quite superior thermal conduction characteristic, alternating floor insulating barrier between often wanting between substrate and electrode, but the thermal resistance of insulating barrier is high, therefore can reduce the radiating effect between circuit.In the MCPCB that heat conduction demand is higher makes, usually in advance the region that metal substrate will paste film PCB can be etched, just PCB be pasted afterwards; By this, the heat dissipation path of PCB just can shorten, and effectively increases the ability of heat radiation.But, to make more than 4 layers even 8 layers of PCB time, just cannot complete with film PCB, and metal substrate and PCB be combined with certain difficulty.
Summary of the invention
Because in the prior art, typically use metal base printed circuit board (MCPCB; Mental Core PCB) solve the problem of heat radiation, but the technology of metal base printed circuit board is mostly limited to the framework of the diaphragm type PCB such as one-sided individual layer, one-sided bilayer or bilateral individual layer, cannot be applied on the multilayer circuit board more than 4 layers.
Edge this, main purpose of the present invention is to provide a kind of high heat-transfer device of multilayer circuit, and it utilizes the boss of heat-conducting substrate to be arranged in multilayer circuit board, and makes the direct contact wafer package module of boss to dispel the heat.
From the above, the necessary technology means that the problem that the present invention is solution prior art adopts are to provide a kind of high heat-transfer device of multilayer circuit, comprise a heat-conducting substrate, a multilayer circuit board and a wafer package module.Heat-conducting substrate has an installation surface and at least one boss outstanding from installation surface; Multilayer circuit board is arranged on heat-conducting substrate, and has at least one perforation, and boss wears out from perforation accordingly; Wafer package module has at least one radiating area and multiple pin, and radiating area fits in boss accordingly, and pin is arranged at around radiating area, and pin is electrically connected at multilayer circuit board.
By above-mentioned necessary technology means the attached technological means that derives be that boss has a heat-absorbent surface, multilayer circuit board has a circuit printing surface, and circuit printing surface and heat-absorbent surface are copline.Preferably, the area of radiating area is greater than the area of heat-absorbent surface.
By above-mentioned necessary technology means the attached technological means that derives be that heat-conducting substrate produces boss by an etch process.
By above-mentioned necessary technology means the attached technological means that derives be that heat-conducting substrate also comprises a radiating surface, radiating surface and installation surface lay respectively at two sides of heat-conducting substrate.Preferably, the high heat-transfer device of multilayer circuit also comprises a cooling wafer, and it fits in the radiating surface of heat-conducting substrate; And the high heat-transfer device of multilayer circuit also comprises a temperature-uniforming plate, and it fits in cooling wafer; Further, the high heat-transfer device of multilayer circuit also comprises a radiating fin, is arranged on temperature-uniforming plate; In addition, the high heat-transfer device of multilayer circuit also comprises a fan, is arranged on radiating fin.
By above-mentioned necessary technology means the attached technological means that derives be that wafer package module is the light-emitting diode (LED) module of wafer package on a substrate (Chip on Board, COB).
Specific embodiment of the present invention, by by following embodiment and to be graphicly further described.
Accompanying drawing explanation
Fig. 1 shows the high heat-transfer device schematic perspective view of the multilayer circuit that the present invention first preferred embodiment provides;
Fig. 2 shows the high heat-transfer device perspective exploded view of the multilayer circuit that the present invention first preferred embodiment provides;
Fig. 3 shows the perspective exploded view at high another visual angle of heat-transfer device of the multilayer circuit that the present invention first preferred embodiment provides;
Fig. 4 shows the high heat-transfer device generalized section of the multilayer circuit that the present invention first preferred embodiment provides; And
Fig. 5 shows the high heat-transfer device generalized section of the multilayer circuit that the present invention second preferred embodiment provides.
100, the high heat-transfer device of 200 multilayer circuits
1,1a heat-conducting substrate
11,11a installation surface
12 boss
121 heat-absorbent surfaces
13a radiating surface
2,2a multilayer circuit board
21 printed circuit faces
22 perforation
3,3a wafer package module
31 radiating areas
32 pins
4 cooling wafers
5 temperature-uniforming plates
6 radiating fins
7 fans
S1, S2 soldering-tin layer
Embodiment
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Refer to Fig. 1 to Fig. 4, Fig. 1 shows the high heat-transfer device schematic perspective view of the multilayer circuit that the present invention first preferred embodiment provides; Fig. 2 shows the high heat-transfer device perspective exploded view of the multilayer circuit that the present invention first preferred embodiment provides; Fig. 3 shows the perspective exploded view at high another visual angle of heat-transfer device of the multilayer circuit that the present invention first preferred embodiment provides; Fig. 4 shows the high heat-transfer device generalized section of the multilayer circuit that the present invention first preferred embodiment provides.As shown in the figure, a kind of high heat-transfer device 100 of multilayer circuit comprises heat-conducting substrate 1, multilayer circuit board 2 and four wafer package modules 3.
Heat-conducting substrate 1 has an installation surface 11 and four boss 12, and boss 12 stretches out from installation surface 11, and boss 12 has a heat-absorbent surface 121.In this enforcement, heat-conducting substrate 1 is a copper base, and boss 12 formed via etch process, and uses CNC (Computer Numerical Control) mode to repair.In addition, in other embodiments, heat-conducting substrate 1 also can be the metal substrate of other high heat-conduction coefficients.
Multilayer circuit board 2 is arranged on heat-conducting substrate 1, and there is a circuit printing surface 21 and four bore a hole 22.Perforation 22 is distributed on multilayer circuit board 2, and boss 12 corresponds respectively to perforation 22 and wears out from perforation 22.Wherein, when multilayer circuit board 2 is arranged on heat-conducting substrate 1, heat-absorbent surface 121 and circuit printing surface 21 are copline.
Wafer package module 3 has at least one radiating area 31 and multiple pin 32, and radiating area 31 fits in the heat-absorbent surface 121 of boss 12 accordingly.Pin 32 distributes equably and is arranged at radiating area 31 around, and pin 32 is electrically connected at multilayer circuit board 2.Wherein, weld earthing connection between radiating area 31 and heat-absorbent surface 121 with a soldering-tin layer S1, in general the area of radiating area 31 can be greater than the area of heat-absorbent surface 121, and using the heat produced when wafer package module 3 is operated can be taken away significantly by heat-absorbent surface 121; Also be provided with a soldering-tin layer S2 between pin 32 and multilayer circuit board 2, use and make wafer package module 3 can be electrically connected at circuit (not shown) on multilayer circuit board 2.
In the present embodiment, wafer package module 3 is (the Chip on Board of wafer package on a substrate, COB) light-emitting diode (LED) module, it is packaged on ceramic substrate by multiple LED wafer, and LED wafer is then be electrically connected at multilayer circuit board 2 by pin 32.
As mentioned above, the high heat-transfer device of multilayer circuit of the present invention is by the radiating area of the direct contact wafer package module of boss of heat-conducting substrate, effectively heat can be guided out, and there is perforation due to multilayer circuit board, therefore can through boss for wafer package module installation, by this, only metal base printed circuit board can be applied to the printed circuit type structure of diaphragm type compared to prior art, the present invention is by arranging perforation at multilayer circuit, and utilize the boss of heat-conducting substrate to be arranged in perforation, really the radiating efficiency of wafer package module can effectively be increased.
Refer to Fig. 1 to Fig. 5, Fig. 5 shows the high heat-transfer device generalized section of the multilayer circuit that the present invention second preferred embodiment provides.As shown in the figure, a kind of high heat-transfer device 200 of multilayer circuit comprises a heat-conducting substrate 1a, a multilayer circuit board 2a, two wafer package module 3a, multiple cooling wafer 4, temperature-uniforming plate 5, radiating fin 6 and a fan 7.Wherein, heat-conducting substrate 1a, multilayer circuit board 2a and wafer package module 3a are all similar to the heat-conducting substrate 1 of above-mentioned first preferred embodiment, multilayer circuit board 2 and wafer package module 3, its difference is only, heat-conducting substrate 1a is except having an installation surface 11a similar to above-mentioned installation surface 11, also there is a radiating surface 13a, and radiating surface 13a and installation surface 11a lays respectively at two sides of heat-conducting substrate 1a.
Above-mentioned multiple cooling wafer 4 fits in the radiating surface 13a of heat-conducting substrate 1a dispersedly, for the reduction of the active control temperature of user.Temperature-uniforming plate 5 fits in cooling wafer 4, with the block thermal source rapid diffusion produced by multiple cooling wafer 4 for face shape thermal source.Radiating fin 6 is arranged on temperature-uniforming plate 5, goes out in order to the conduct heat away transmitted by temperature-uniforming plate 5, and fan 7 is arranged on radiating fin 6, uses the rate of heat dispation accelerating radiating fin 6.
As mentioned above, above utilizes the mode of cooling wafer, temperature-uniforming plate, radiating fin and fan, more can effectively make the radiating efficiency of the high heat-transfer device of multilayer circuit of the present invention promote.
By the above detailed description of preferred embodiments, it is desirable to clearly to describe feature of the present invention and spirit, and not with above-mentioned disclosed preferred embodiment, category of the present invention is limited.On the contrary, its objective is wish to contain various change and tool equality be arranged in the present invention institute in the category of the scope of the claims applied for.
Claims (10)
1. a high heat-transfer device for multilayer circuit, is characterized in that, comprise:
One heat-conducting substrate, has an installation surface and at least one boss outstanding from this installation surface;
One multilayer circuit board, is arranged on this heat-conducting substrate, and has at least one perforation, and this boss wears out from this perforation accordingly; And
At least one wafer package module, have at least one radiating area and multiple pin, this radiating area fits in this boss accordingly, and described pin is arranged at around this radiating area, and described pin is electrically connected at this multilayer circuit board.
2. the high heat-transfer device of multilayer circuit according to claim 1, is characterized in that, this boss has a heat-absorbent surface, and this multilayer circuit board has a circuit printing surface, and this circuit printing surface and this heat-absorbent surface are copline.
3. the high heat-transfer device of multilayer circuit according to claim 2, is characterized in that, the area of this radiating area is greater than the area of this heat-absorbent surface.
4. the high heat-transfer device of multilayer circuit according to claim 1, is characterized in that, this heat-conducting substrate produces this boss by an etch process.
5. the high heat-transfer device of multilayer circuit according to claim 1, is characterized in that, this heat-conducting substrate also comprises a radiating surface, and this radiating surface and this installation surface lay respectively at two sides of this heat-conducting substrate.
6. the high heat-transfer device of multilayer circuit according to claim 5, is characterized in that, also comprises a cooling wafer, and it fits in the radiating surface of this heat-conducting substrate.
7. the high heat-transfer device of multilayer circuit according to claim 6, is characterized in that, also comprises a temperature-uniforming plate, and it fits in this cooling wafer.
8. the high heat-transfer device of multilayer circuit according to claim 7, is characterized in that, also comprises a radiating fin, is arranged on this temperature-uniforming plate.
9. the high heat-transfer device of multilayer circuit according to claim 8, is characterized in that, also comprises a fan, is arranged on this radiating fin.
10. the high heat-transfer device of multilayer circuit according to claim 1, is characterized in that, this wafer package module is the light-emitting diode (LED) module of wafer package on a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310222349.5A CN104244581A (en) | 2013-06-06 | 2013-06-06 | High heat conduction apparatus for multilayer circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310222349.5A CN104244581A (en) | 2013-06-06 | 2013-06-06 | High heat conduction apparatus for multilayer circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104244581A true CN104244581A (en) | 2014-12-24 |
Family
ID=52231662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310222349.5A Pending CN104244581A (en) | 2013-06-06 | 2013-06-06 | High heat conduction apparatus for multilayer circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104244581A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934386A (en) * | 2015-06-16 | 2015-09-23 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| TWI715094B (en) * | 2019-07-01 | 2021-01-01 | 奇鋐科技股份有限公司 | Composite water-cooling radiator structure |
| CN113260139A (en) * | 2021-06-07 | 2021-08-13 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board with boss and processing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1021783A (en) * | 1996-06-28 | 1998-01-23 | Hatakeyama Seisakusho:Kk | Structure of fixing thin metal contact piece to printed board |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| EP1980142B1 (en) * | 2006-01-31 | 2009-05-13 | Häusermann GmbH | Printed circuit board with functional elements and selectively filled passage openings of good thermal conductivity and method of production and use |
| CN102062451A (en) * | 2009-11-17 | 2011-05-18 | 陈文进 | Cold and hot device |
| TW201223351A (en) * | 2010-10-11 | 2012-06-01 | Lg Innotek Co Ltd | Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight unit |
| CN202393078U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
| CN202955658U (en) * | 2012-10-22 | 2013-05-29 | 铜陵科海光电技术有限公司 | Installation structure of light-emitting diode (LED) lamp |
| CN103140036A (en) * | 2011-11-24 | 2013-06-05 | 先丰通讯股份有限公司 | Production method of cooling printed circuit board (PCB) |
-
2013
- 2013-06-06 CN CN201310222349.5A patent/CN104244581A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1021783A (en) * | 1996-06-28 | 1998-01-23 | Hatakeyama Seisakusho:Kk | Structure of fixing thin metal contact piece to printed board |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| EP1980142B1 (en) * | 2006-01-31 | 2009-05-13 | Häusermann GmbH | Printed circuit board with functional elements and selectively filled passage openings of good thermal conductivity and method of production and use |
| CN102062451A (en) * | 2009-11-17 | 2011-05-18 | 陈文进 | Cold and hot device |
| TW201223351A (en) * | 2010-10-11 | 2012-06-01 | Lg Innotek Co Ltd | Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight unit |
| CN202393078U (en) * | 2011-11-18 | 2012-08-22 | 苏州雪林电器科技有限公司 | Novel heat radiation assembly of semiconductor refrigeration chip of vehicle-mounted refrigerator |
| CN103140036A (en) * | 2011-11-24 | 2013-06-05 | 先丰通讯股份有限公司 | Production method of cooling printed circuit board (PCB) |
| CN202955658U (en) * | 2012-10-22 | 2013-05-29 | 铜陵科海光电技术有限公司 | Installation structure of light-emitting diode (LED) lamp |
| CN102938971A (en) * | 2012-11-20 | 2013-02-20 | 深圳市博敏电子有限公司 | Single-side printed circuit board with ultrahigh heat conducting performance and manufacturing method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934386A (en) * | 2015-06-16 | 2015-09-23 | 苏州旭创科技有限公司 | Packaging structure and optical module |
| CN105099564A (en) * | 2015-06-16 | 2015-11-25 | 苏州旭创科技有限公司 | Encapsulation structure and optical module |
| CN104934386B (en) * | 2015-06-16 | 2017-11-28 | 苏州旭创科技有限公司 | Encapsulating structure and optical module |
| TWI715094B (en) * | 2019-07-01 | 2021-01-01 | 奇鋐科技股份有限公司 | Composite water-cooling radiator structure |
| CN113260139A (en) * | 2021-06-07 | 2021-08-13 | 四川英创力电子科技股份有限公司 | Copper-based printed circuit board with boss and processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2170024B1 (en) | Backlight unit equipped with light emitting diodes | |
| US7677899B2 (en) | LED light source module and LED backlight module using the same | |
| TWI322915B (en) | Heat dissipation structure of backliht module | |
| JP5097127B2 (en) | Light emitting device, display device, and solid light emitting element substrate | |
| US8998450B2 (en) | Bendable luminous modules and method for producing bendable luminous modules | |
| US7538356B2 (en) | Combination assembly of LED and liquid-vapor thermally dissipating device | |
| JP2009522804A (en) | Light emitting diode package, method for manufacturing the same, and backlight unit including the same | |
| KR101130137B1 (en) | Led module | |
| KR20070094384A (en) | Anodized metal substrate module | |
| TWI423421B (en) | A light emitting device and a manufacturing method thereof | |
| US20100020553A1 (en) | Passive heat sink and light emitting diode lighting device using the same | |
| TWI312046B (en) | Led base with heat fins | |
| CN203339226U (en) | Heat radiation structure of micro projector | |
| US9004721B2 (en) | Light source heat dissipation structure and backlight module | |
| CN104244581A (en) | High heat conduction apparatus for multilayer circuit | |
| JP2006269078A (en) | Led light source module | |
| TW201349577A (en) | Illuminating device | |
| KR20120100303A (en) | Printed circuit board, light emitting module having the same, lighting unit having the light emitting unit and method of manufacturing the light emitting mudule | |
| KR101875499B1 (en) | Metal printed circuit board enhancing radiation of heat for outdoor led lighting | |
| KR20120018014A (en) | Heat spreading printed circuit board and method for fabricating the same | |
| TWI449226B (en) | Thermal structure for led device | |
| KR101049887B1 (en) | Metal pcb structure for radiant heat improvement and circuit protection of led lighting device | |
| CN210670727U (en) | Quick heat dissipation type multilayer PCB board | |
| US7436669B2 (en) | 3D multi-layer heat conduction diffusion plate | |
| KR101766462B1 (en) | Printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141224 |